CN101990364A - Method for assembling assemblies to circuit board and relevant circuit board assembling system - Google Patents
Method for assembling assemblies to circuit board and relevant circuit board assembling system Download PDFInfo
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- CN101990364A CN101990364A CN2009101624270A CN200910162427A CN101990364A CN 101990364 A CN101990364 A CN 101990364A CN 2009101624270 A CN2009101624270 A CN 2009101624270A CN 200910162427 A CN200910162427 A CN 200910162427A CN 101990364 A CN101990364 A CN 101990364A
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- circuit board
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Abstract
The invention relates to a method for assembling assemblies to a circuit board and a relevant circuit board assembling system. The method for assembling assemblies to a circuit board comprises the following steps of: forming a groove on a circuit board; driving the circuit board in a first direction; when the circuit board is blocked by a positioning rod in a positioning point, driving the circuit board to an assembling position in a second direction different from the first direction; then assembling a first group of assemblies to a first block of the circuit board; adjusting the positioning rod to a second width smaller than a first width; after the first group of assemblies is assembled to the circuit board, driving the circuit board to the positioning point; driving the circuit board in the first direction until the positioning rod relatively moves to the bottom end of the groove in the groove; then driving the circuit board to the assembling position in the second direction; and when the circuit board is in the assembling position, assembling a second group of assemblies to a second block of the circuit board. The technology can break the using size limit of a machine at present so as to improve the equipment utilization rate, reduce the equipment purchase cost and improve the production efficiency.
Description
Technical field
The present invention relates to method and the associated circuit board package system of a kind of assembled components, especially, relate to method and the associated circuit board package system thereof of a kind of assembled components in batches to the different blocks of circuit board to circuit board.
Background technology
Surface mounting technology (Surface Mounting Technology, SMT) be the solder technology that was widely used in recent years, be to use certain instrument that the mounted on surface part is placed into exactly through on printing soldering paste or the printed circuit board pads through some glue, pass through wave-soldering or Reflow Soldering then, make part and circuit board set up favorable mechanical and be electrically connected.And main flow process is divided into flow processs such as paste solder printing, paste solder printing detection, high-speed assembly storing, general purpose module storing, reflow stove and optical detection in the present surface mounting technology processing procedure, in existing production procedure, the width dimensions of printed circuit board (PCB) can be subject to the width (being about 460mm usually) of track, and the width of track is to stipulate according to minimum widith in the equipment, therefore do not changing under the board situation, track width can't change; The length dimension of printed circuit board (PCB) then is subject to the flat roof area (being about 510mm usually) of high-speed assembly placement machine, that is to say that the use arrowhead to printed circuit board (PCB) is long 510mm and wide 460mm in the present surface mounting technology processing procedure, so just limited printed circuit board (PCB) production full-size.
For instance, when the operation principle of high-speed assembly placement machine touches cross bar for be transported to anchor point when printed circuit board (PCB) at present, after the below inductor confirms that printed circuit board (PCB) is arranged, by high-speed assembly placement machine platform printed circuit board (PCB) is connect away, with sending the original place behind the printed circuit board (PCB) piece again back to, run to next work station by conveyer belt again.And be subject to the flat roof area of high-speed assembly placement machine, if printed circuit board (PCB) production size promptly can't be produced greater than long 510mm and wide 460mm, this uses limitation reason to be the use restriction of assembly placement machine, because the assembly placing platform is limited in scope, if surpassing this size, the piece scope promptly can't produce, unless buy more new equipment, producing on the next work station of line as extra increase board, meaning is even desired in the original production mode, reach produce larger sized printed circuit board (PCB) required produce line change will spend up to ten million.And because the printed circuit board (PCB) of present server has function and performance demands, size constantly strengthens, and this restriction of production meeting causes the limitation of design end, if can strengthen the production size, will be three situations of winning to design, production, client.
Therefore, need a kind of circuit board group packing technique badly, breaking through the use size restrictions of present board, in that do not purchase under the production equipment situation can ordinary production elongated circuit board, thereby the lifting means utilance, reduce the equipment purchase cost, and promote production efficiency.
Summary of the invention
The invention provides method and the associated circuit board package system thereof of a kind of assembled components, to solve the above problems to circuit board.
The invention discloses a kind of method of assembled components to a circuit board, comprise: on this circuit board, form a groove; Drive this circuit board at a first direction; When this circuit board when an anchor point is stopped by a positioning rod, drive this circuit board to one assembling position in a second direction that is different from this first direction, wherein first width of this backstay before not adjusting width can't not pass through this groove greater than the width of this groove so that adjust this backstay of width; When this circuit board is positioned at this assembling position, one first group of component groups is filled to one first block of this circuit board; Adjust this backstay to one second width less than this first width, wherein this second width is less than this width of this groove; Finish this first group of assembly of assembling to this circuit board, drive this circuit board and get back to this anchor point; Drive this circuit board at this first direction, in this groove, relatively move to the bottom of this groove up to this backstay; When this backstay relatively moves to the bottom of this groove in this groove, drive this circuit board to this assembling position in this second direction; And when this circuit board is positioned at this assembling position, one second group of component groups is filled to one second block of this circuit board.
The invention also discloses on this circuit board to form on the side of a cutting edge that this groove is included in this circuit board and form this groove.
The invention also discloses this first direction in fact perpendicular to this second direction.
The invention also discloses this first block that this first group of component groups is filled to this circuit board comprises and utilizes surface mounting technology with this first group of assembly piece this first block to this circuit board.
The invention also discloses this first block that this first group of component groups is filled to this circuit board comprises and utilizes an assembly placement machine with this first group of assembly piece this first block to this circuit board.
The invention also discloses and adjust this backstay to this second width and comprise two of this backstay and articulate rod members and rotate, use this backstay of folding extremely less than this second width of this first width with respect to a rotating shaft less than this first width.
The two pivot joint rod members that the invention also discloses this backstay comprise two of this backstay with respect to this rotating shaft rotation and articulate past this first direction of rod members with respect to this rotating shaft rotation.
The invention also discloses this backstay relatively moves to the bottom of this groove in this groove after, pack up this backstay.
The invention also discloses this second block that this second group of component groups is filled to this circuit board comprises and utilizes surface mounting technology with this second group of assembly piece this second block to this circuit board.
The invention also discloses this second block that this second group of component groups is filled to this circuit board comprises and utilizes an assembly placement machine with this second group of assembly piece this second block to this circuit board.
The invention also discloses and detect whether correctly location of this circuit board.
The invention discloses a kind of circuit board group assembling system, comprise a circuit board, which is provided with a groove, this circuit board comprises one first block and one second block; One assembly placement machine, it is used for assembled components to this circuit board; A positioning rod, it is arranged at an anchor point in the mode that can adjust width, and wherein one first width of this backstay before not adjusting width can't not pass through this groove greater than a width of this groove so that adjust this backstay of width; One conveying device, it is used for driving this circuit board at a first direction and drives this circuit board to one assembling position to this anchor point and in a second direction that is different from this first direction; An and control unit, it is used at this circuit board when this anchor point is stopped by this backstay, control this conveying device and drive this circuit board to this assembling position and control this first block that this assembly placement machine is filled to one first group of component groups this circuit board in this second direction, simultaneously and control this backstay by this first width adjustment to one second width less than this width of this groove, and finish this first group of assembly of assembling to this circuit board, controlling this conveying device drives this circuit board and gets back to this anchor point and drive this circuit board at this first direction, up to this backstay relatively moves to the bottom of this groove in this groove after, control this conveying device and drive this circuit board to this assembling position and control this second block that this assembly placement machine is filled to one second group of component groups this circuit board in this second direction.
The invention also discloses and also be provided with a cutting edge on this circuit board, it is formed at a side of this groove.
The invention also discloses this assembly placement machine utilizes surface mounting technology respectively with this first group of assembly and this second group of assembly piece this first block and this second block to this circuit board.
The invention also discloses this assembly placement machine is a high-speed assembly placement machine or a general purpose module placement machine.
The invention also discloses this backstay and comprise two and articulate rod members, it is used for respect to rotating shaft rotation so that this backstay by this first width folding to this second width.
The invention also discloses this backstay this two articulate rod member be with this first direction of dealing with respect to this rotating shaft rotation so that this backstay by this first width folding to this second width.
The invention also discloses this control device is to be used for this backstay relatively moves to the bottom of this groove in this groove after, and this backstay is packed up in control.
The invention also discloses this circuit board group assembling system and also comprise a detection detecting unit, whether correctly it be used for detecting this circuit board location.
Compared to prior art, circuit board group packing technique of the present invention can be broken through the use size restrictions of present board, in that do not purchase under the production equipment situation can ordinary production elongated circuit board, but so just the lifting means utilance, reduce the equipment purchase cost, and promote production efficiency.
Description of drawings
Fig. 1 is the function block schematic diagram of the circuit board group assembling system of preferred embodiment of the present invention.
Fig. 2 is the flow chart of preferred embodiment assembled components of the present invention to circuit board.
Fig. 3 is the assembly schematic diagram of the circuit board of preferred embodiment of the present invention.
Fig. 4 is the assembly schematic diagram of the backstay of preferred embodiment of the present invention.
Fig. 5 to Figure 12 is the assembling process schematic diagram of preferred embodiment assembled components of the present invention to circuit board.
The primary clustering symbol description:
50 circuit board group assembling systems, 52 circuit boards
521 first blocks, 522 second blocks
523 cutting edges, 524 grooves
54 assembly placement machine are put in 525 optical alignments
58 second groups of assemblies of 56 first groups of assemblies
60 conveying devices, 62 detecting units
64 control units, 66 backstays
662 rotating shafts of 661 rod members
100,102,104, step
106、108、110、
112、114、116、
118、120、122
Embodiment
See also Fig. 1, Fig. 1 is the function block schematic diagram of a circuit board group assembling system 50 of preferred embodiment of the present invention, circuit board group assembling system 50 comprises a circuit board 52, and it can be a printed circuit board (PCB), and circuit board 52 comprises one first block 521 and one second block 522; Circuit board group assembling system 50 also comprises an assembly placement machine 54, it is used for assembled components to circuit board 52, assembly placement machine 54 can utilize surface mounting technology respectively with one first group of assembly 56 and one second group of assembly 58 piece to first block 521 and second block 522 of circuit board 52, wherein assembly placement machine 54 can be a high-speed assembly placement machine or is a general purpose module placement machine etc.; Circuit board group assembling system 50 also comprises a conveying device 60, and it is used for transporting circuit board 52 to one anchor points and be used for transporting circuit board 52 between an assembling position of this anchor point and assembly placement machine 54, and conveying device 60 can be a conveyer belt mechanism; Circuit board group assembling system 50 also comprises a detecting unit 62, and whether correctly it be used for testing circuit plate 52 location, and detecting unit 62 can be an optical sensor; Circuit board group assembling system 50 also comprises a control unit 64, it is used for detecting circuit board 52 correct location back control conveying devices 60 drive circuit boards 52 to this assembling position at detecting unit 62, control assembly placement machine 54 is assembled to first group of assembly 56 first block 521 of circuit board 52 again, and finish first group of assembly 56 of assembling to circuit board 52, control conveying device 60 drive circuit boards 52 are got back to this anchor point, control conveying device 60 drive circuit boards 52 to this assembling position and control assembly placement machine 54 afterwards once more second group of assembly 58 is assembled to second block 522 of circuit board 52, will be as for the detailed start principle of circuit board group assembling system 50 in the subsequent rows introduction.
See also Fig. 1 to Fig. 4, Fig. 2 is the flow chart of preferred embodiment assembled components of the present invention to circuit board 52, Fig. 3 is the assembly schematic diagram of the circuit board 52 of preferred embodiment of the present invention, Fig. 4 is the assembly schematic diagram of a positioning rod 66 of the circuit board group assembling system 50 of preferred embodiment of the present invention, and assembled components to the method for circuit board 52 comprises the following step:
Step 100: on a side of a cutting edge 523 of circuit board 52, form a groove 524;
Step 102: control unit 64 control conveying devices 60 at a first direction drive circuit board 52 to this anchor point;
Step 104: when circuit board 52 is stopped by backstay 66 at this anchor point, correctly whether detecting unit 62 testing circuit plates 52 location, wherein one first width W 1 of backstay 66 before folding not is greater than a width W 3 of groove 524, so that the backstay 66 of folding can't not pass through groove 524;
Step 106: behind the correct location of decision circuitry plate 52, control unit 64 control conveying devices 60 at a second direction drive circuit board 52 that is different from this first direction to this assembling position;
Step 108: when 52 of circuit boards during at this assembling position, control unit 64 control assembly placement machine 54 are assembled to first group of assembly 56 first block 521 of circuit board 52;
Step 110: folding backstay 66 is to one second width W 2 less than original first width W 1, and wherein second width W 2 is less than the width W 3 of groove 524;
Step 112: finish first group of assembly 56 of assembling to first block 521 of circuit board 52 when assembly placement machine 54, control unit 64 is controlled conveying devices 60 drive circuit boards 52 and is got back to this anchor point;
Step 114: control unit 64 control conveying devices 60 relatively move to the bottom of groove 524 at this first direction drive circuit board 52 in groove 524 up to backstay 66;
Step 116: when backstay 66 moved to the bottom of groove 524, correctly whether detecting unit 62 testing circuit plates 52 location;
Step 118: behind the correct location of decision circuitry plate 52, pack up backstay 66 and control unit 64 control conveying devices 60 at this second direction drive circuit board 52 to this assembling position;
Step 120: when circuit board 52 was positioned at this assembling position, control unit 64 control assembly placement machine 54 were assembled to second group of assembly 58 second block 522 of circuit board 52; And
Step 122: when assembly placement machine 54 is finished second group of assembly 58 of assembling to second block 522 of circuit board 52, control unit 64 control conveying devices 60 drive circuit boards 52 get back to this anchor point and drive circuit board 52 moves toward next work stations.
At this above-mentioned flow process is done one and describe in detail, see also Fig. 1 and Fig. 5 to Figure 12, Fig. 5 to Figure 12 is the assembling process schematic diagram of preferred embodiment assembled components of the present invention to circuit board 52.At first in step 100, the inboard of the cutting edge 523 of circuit board 52 is formed with groove 524 as shown in Figure 3, the cutting edge 523 of circuit board 52 is clamping place of the track clamping circuit board 52 of conveying device 60, and final circuit board 52 finished products can cut this cutting edge 523; In step 102, circuit board 52 after detecting through paste solder printing and paste solder printing can move toward assembly placement machine 54 these stations, as shown in Figure 5 control unit 64 can control conveying devices 60 at this first direction (directions X) drive circuit board 52 to this anchor point (meaning is backstay 66 whereabouts); In step 104, because first width W 1 of backstay 66 before folding not is greater than the width W 3 of groove 524, circuit board 52 stops and can't pass through groove 524 so can be subjected to backstay 66 at this anchor point, detecting unit 62 is understood testing circuit plates 52 at this moment, use and judge whether to correct circuit board 52 and whether decision circuitry plate 52 exists and correct location whether, and the detection of detecting unit 62 action can be selectivity action, and meaning can be omitted this and detect the inspection action; In step 106, detecting unit 62 detects circuit board 52 and correctly locatees and export corresponding detection signal to control unit 64, when control unit 64 decision circuitry plates 52 behind the errorless and correct location, as shown in Figure 6, control unit 64 can control conveying device 60 be different from this second direction of this first direction (+Y direction) drive circuit board 52 to this assembling position (meaning is the piece position of assembly placement machine 54), and wherein this first direction can be in fact perpendicular to this second direction; Then as shown in Figure 7, in step 108, when 52 of circuit boards during at this assembling position, at least one optical alignment point 525 on the assembly placement machine 54 meeting sensing circuit plates 52, use and locate the piece position more accurately, control unit 64 control assembly placement machine 54 are assembled to first block 521 of circuit board 52 with first group of assembly 56 afterwards, and finish the piece program of 52 phase I of circuit board.
Simultaneously in step 110, backstay 66 can be by original first width W, 1 folding to second width W 2 less than first width W 1, wherein second width W 2 is less than the width W 3 of groove 524, and the mode of folding can be as shown in Figure 4, backstay 66 can comprise two rod members 661 that articulate mutually, be used for respect to a rotating shaft 662 rotations, as rotating with respect to rotating shaft 662 toward this first direction, so that backstay 66 can original relatively anchor point behind folding toward this first direction a little distance of shrinking back, the interference effect that is produced when causing circuit board 52 correctly to be positioned to this anchor point because of the assembling tolerance to avoid.For instance, the width W 3 of groove 524 can be designed to 8mm, and the original size of backstay 66 can be width 12mm (first width W 1), thickness 2mm, 3 of the width W of first width W 1 and groove 524 have been reserved the error design of 4mm, width is 4mm (second width W 2) behind half folding and backstay 66 is through cuing open, this moment, the width W 3 of groove 524 designed with error that 2 of second width W have also been reserved 4mm, according to present high-precision track dimensional tolerance, can guarantee sane production, in addition backstay 66 can original relatively anchor point behind folding toward this first direction 2mm that shrinks back, use and guarantee that circuit board 52 is sent back to and can not touch backstay 66 behind this anchor point and cause damage.And backstay 66 is adjusted to the mode that can be not limited to folding less than the mechanism design mode of second width W 2 of first width W 1 by original first width W 1; for example can be by mode such as flexible, so long as can adjust the category that the mechanism design of backstay 66 width all belongs to the present invention and protected.
Then as shown in Figure 8, in step 112, when assembly placement machine 54 is finished first group of assembly 56 of assembling to first block 521 of circuit board 52, control unit 64 can control conveying device 60 got back to this anchor point in contrast to this second direction (Y direction) drive circuit board 52 once more, at this moment the groove 524 on the backstay 66 alignment circuit plates 52 behind the folding; Next as shown in Figure 9, in step 114, control unit 64 can be controlled conveying device 60 at this first direction (+directions X) drive circuit board 52, this moment is owing to the width W 3 of second width W 2 behind backstay 66 foldings less than groove 524, so backstay 66 can't stop circuit board 52, therefore circuit board 52 is sustainable mobile toward this first direction (+directions X), in groove 524, relatively move to the bottom of groove 524 up to backstay 66, this moment, backstay 66 only was butted on groove 524 bottoms of circuit board 52, whether whether exist as aforementioned detecting unit 62 meeting testing circuit plates and correctly locate this moment, and the detection of detecting unit 62 action can be selectivity action, and meaning can be omitted this and detect the inspection action.
Be same as aforementioned start principle, in step 118, detecting unit 62 detects circuit board 52 and correctly locatees and export corresponding detection signal to control unit 64, behind control unit 64 decision circuitry plates 52 correct location, as shown in figure 10, backstay 66 can be packed up earlier, afterwards control unit 64 can control conveying devices 60 at this second direction (+Y direction) drive circuit board 52 to this assembling position (meaning is the piece position of assembly placement machine 54), the mode of wherein packing up backstay 66 can be for by removing backstay 66 in the groove 524 to other places, or but Design Orientation bar 66 is a retractility mechanism, this moment is retraction backstay 66 just, and the present invention also can design circuit board 52 is removed to the position that can not produce interference with backstay 66, and replace the mechanism pack up backstay 66, use successfully drive circuit board 52 to this assembling position; Then as shown in figure 11, in step 120, when circuit board 52 is positioned at this assembling position, the optical alignment point 525 of assembly placement machine 54 on also can sensing circuit plate 52, use and locate the piece position more accurately, control unit 64 control assembly placement machine 54 are assembled to second block 522 of circuit board 52 with second group of assembly 58 afterwards, and finish the piece program of circuit board 52 second stage; Then as shown in figure 12, in step 122, when assembly placement machine 54 is finished second group of assembly 58 of assembling to second block 522 of circuit board 52, control unit 64 can control conveying devices 60 be being got back to this anchor point and drive circuit board 52 moves toward next work stations once more in contrast to this second direction (Y direction) drive circuit board 52, and finishes the piece program of circuit board 52.And next piece circuit board also can continue the flow process of repeated execution of steps 100 to step 122, and reaches the effect of large scale circuit plate automation execution list SMT processing procedure.
In sum, the present invention only uses an assembly placement machine to carry out two stage pieces, just can break through the use size restrictions of present board thus, in that do not purchase under the production equipment situation can ordinary production elongated circuit board, but so just the lifting means utilance, reduce the equipment purchase cost, and promote production efficiency; Solve in addition to produce and go up size restrictions, just need not to be subject to restriction of production during research and development end designing new product, make the design end can obtain maximum performance, for example can produce and plate (being that identical product is incorporated in a board production), and the production of plate can the speed production time-histories.In addition, the present invention also can design the application of multistage piece, and meaning promptly is provided with multi-level groove on circuit board, and carries out multistage piece action on same circuit board, and its action principle is identical with previous embodiment, just no longer describes in detail at this.
Compared to prior art, circuit board group packing technique of the present invention can be broken through the use size restrictions of present board, in that do not purchase under the production equipment situation can ordinary production elongated circuit board, but so just the lifting means utilance, reduce the equipment purchase cost, and promote production efficiency.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claims of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (20)
1. the method for assembled components to a circuit board comprises:
On described circuit board, form a groove;
Drive described circuit board at a first direction;
When described circuit board when an anchor point is stopped by a positioning rod, drive described circuit board to an assembling position in a second direction that is different from described first direction, one first width of wherein said backstay before not adjusting width can't not pass through described groove greater than a width of described groove so that adjust the described backstay of width;
When described circuit board is positioned at described assembling position, one first group of component groups is filled to one first block of described circuit board;
Adjust described backstay to one second width less than described first width, wherein said second width is less than the described width of described groove;
Finish the described first group of assembly of assembling to described circuit board, drive described circuit board and get back to described anchor point;
Drive described circuit board at described first direction, in described groove, relatively move to the bottom of described groove up to described backstay;
When described backstay relatively moves to the bottom of described groove in described groove, drive described circuit board to described assembling position in described second direction; And
When described circuit board is positioned at described assembling position, one second group of component groups is filled to one second block of described circuit board.
2. the method for claim 1 wherein is included on the side of a cutting edge of described circuit board at the described groove of formation on the described circuit board and forms described groove.
3. the method for claim 1, wherein said first direction is in fact perpendicular to described second direction.
4. the method for claim 1, described first block that wherein described first group of component groups is filled to described circuit board comprise utilizes surface mounting technology with described first block of described first group of assembly piece to described circuit board.
5. the method for claim 1, described first block that wherein described first group of component groups is filled to described circuit board comprise utilizes an assembly placement machine with described first block of described first group of assembly piece to described circuit board.
6. the method for claim 1, wherein adjust described backstay to described second width and comprise that two of described backstay articulates rod member and rotates with respect to a rotating shaft, use the described backstay of folding to described second width less than described first width less than described first width.
7. method as claimed in claim 6, two of wherein said backstay articulate rod member and comprise that with respect to described rotating shaft rotation two of described backstay articulates rod member and rotates with respect to described rotating shaft toward described first direction.
8. the method for claim 1 also is included in described backstay relatively moves to the bottom of described groove in described groove after, packs up described backstay.
9. the method for claim 1, described second block that wherein described second group of component groups is filled to described circuit board comprise utilizes surface mounting technology with described second block of described second group of assembly piece to described circuit board.
10. the method for claim 1, described second block that wherein described second group of component groups is filled to described circuit board comprise utilizes an assembly placement machine with described second block of described second group of assembly piece to described circuit board.
11. whether correctly the method for claim 1 also comprises and detects described circuit board location.
12. a circuit board group assembling system comprises:
One circuit board, described circuit board is provided with a groove, and described circuit board comprises one first block and one second block;
One assembly placement machine, described assembly placement machine are used for assembled components to described circuit board;
A positioning rod, described backstay is arranged at an anchor point in the mode that can adjust width, and one first width of wherein said backstay before not adjusting width can't not pass through described groove greater than a width of described groove so that adjust the described backstay of width;
One conveying device, described conveying device are used for driving described circuit board at a first direction and drive described circuit board to an assembling position to described anchor point and in a second direction that is different from described first direction; And
One control unit, described control unit is used at described circuit board when described anchor point is stopped by described backstay, control described conveying device and drive described circuit board to described assembling position and control described first block that described assembly placement machine is filled to one first group of component groups described circuit board in described second direction, simultaneously and control described backstay by described first width adjustment to one second width less than the described width of described groove, and finish the described first group of assembly of assembling to described circuit board, controlling described conveying device drives described circuit board and gets back to described anchor point and drive described circuit board at described first direction, up to described backstay relatively moves to the bottom of described groove in described groove after, control described conveying device and drive described circuit board to described assembling position and control described second block that described assembly placement machine is filled to one second group of component groups described circuit board in described second direction.
13. circuit board group assembling system as claimed in claim 12 also is provided with a cutting edge on the wherein said circuit board, described cutting edge is formed at a side of described groove.
14. circuit board group assembling system as claimed in claim 12, wherein said first direction are in fact perpendicular to described second direction.
15. circuit board group assembling system as claimed in claim 12, wherein said assembly placement machine utilize surface mounting technology respectively with described first group of assembly and described second group of assembly piece described first block and described second block to described circuit board.
16. circuit board group assembling system as claimed in claim 12, wherein said assembly placement machine are a high-speed assembly placement machine or a general purpose module placement machine.
17. circuit board group assembling system as claimed in claim 12, wherein said backstay comprise that two articulate rod members, described two articulate rod members is used for respect to rotating shaft rotation so that described backstay by the described first width folding to described second width.
18. circuit board group assembling system as claimed in claim 17, described two of wherein said backstay articulates rod members and is used for rotate with respect to described rotating shaft toward described first direction, so that described backstay is by the described first width folding described second width extremely.
19. circuit board group assembling system as claimed in claim 12, wherein said control device are used for described backstay relatively moves to the bottom of described groove in described groove after, described backstay is packed up in control.
20. whether correctly circuit board group assembling system as claimed in claim 12 also comprises a detecting unit, be used for detecting described circuit board location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101624270A CN101990364B (en) | 2009-08-04 | 2009-08-04 | Method for assembling assemblies to circuit board and relevant circuit board assembling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101624270A CN101990364B (en) | 2009-08-04 | 2009-08-04 | Method for assembling assemblies to circuit board and relevant circuit board assembling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101990364A true CN101990364A (en) | 2011-03-23 |
| CN101990364B CN101990364B (en) | 2012-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101624270A Expired - Fee Related CN101990364B (en) | 2009-08-04 | 2009-08-04 | Method for assembling assemblies to circuit board and relevant circuit board assembling system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547075A (en) * | 2013-10-12 | 2014-01-29 | 中国科学院深圳先进技术研究院 | Automatic PCB (printed circuit board) detecting and assembling production equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446960A (en) * | 1994-02-15 | 1995-09-05 | International Business Machines Corporation | Alignment apparatus and method for placing modules on a circuit board |
| KR100311747B1 (en) * | 1999-08-20 | 2001-10-18 | 정문술 | PCB Transfering System of Surface Mounting Device |
| US20050247761A1 (en) * | 2004-05-04 | 2005-11-10 | Albanese Patricia M | Surface mount attachment of components |
| CN2699626Y (en) * | 2004-04-16 | 2005-05-11 | 昶驎科技股份有限公司 | Multi-board type printed circuit board positioning equipment |
-
2009
- 2009-08-04 CN CN2009101624270A patent/CN101990364B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547075A (en) * | 2013-10-12 | 2014-01-29 | 中国科学院深圳先进技术研究院 | Automatic PCB (printed circuit board) detecting and assembling production equipment |
| CN103547075B (en) * | 2013-10-12 | 2016-08-31 | 中国科学院深圳先进技术研究院 | Pcb board automatically detects and assembles production equipment |
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| Publication number | Publication date |
|---|---|
| CN101990364B (en) | 2012-05-09 |
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