CN101981753A - 用于制造循环器和隔离器用复合组件的磁性和介电材料的共烧制 - Google Patents
用于制造循环器和隔离器用复合组件的磁性和介电材料的共烧制 Download PDFInfo
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Abstract
一种用于制造复合的磁性-介电圆盘组件的方法，包括形成介电陶瓷圆柱体，形成磁性陶瓷杆，将该磁性陶瓷杆同轴地组装到该介电陶瓷圆柱体内部以形成杆-圆柱体组件，烘烤(烧制)该杆-圆柱体组件，将该杆-圆柱体组件切片成若干复合磁性-介电圆盘形组件。该磁性-介电圆盘组件可用于制造例如循环器、隔离器或类似电子元件。相应地，该用于制造圆盘组件的方法可作为制造这种电子元件的方法的一部分。
Description
背景技术
循环器(circulator)和隔离器(isolator)是无源电子器件，其用在高频(例如微波)射频系统中，允许信号在一个方向通过，同时在相反的方向提供高阻隔至反射能量。循环器和隔离器通常包括同心地布置在环形介电元件内的包括圆盘形铁氧体或其它铁磁陶瓷元件的圆盘形组件。由于钇铁石榴石(YIG)具有低损耗微波特性，所以它是最常用的一种铁氧体材料。该环形介电元件也相似地通常由陶瓷材料制得。
用于制造上面述及的复合圆盘组件的传统工艺由图1的流程图示出。在步骤12中，由介电陶瓷材料形成圆柱体。然后在步骤14中，在烘干炉中烧制该(未烧制的或“未加工的”)圆柱体(通常简单称作“烧制”)。然后在步骤16中，机械加工圆柱体的外表面，以保证其外径(OD)是所选尺寸。由于所述尺寸影响微波波导特性，因此在组合元件中达到精确的尺寸是很重要的。在步骤18中，类似地机械加工圆柱体的内表面以保证其内径(ID)是所选的尺寸。另外在步骤20中，由磁性陶瓷材料形成杆。然后在步骤22中烧制该杆，并且在步骤24中，机械加工其表面以达到所选的OD。使该杆的OD略小于该圆柱体ID，以使该杆能够完全装配于圆柱体内部，如下所述。实现提高杆-圆柱体之间粘合性的紧密配合源于机械加工的杆的外表面和圆柱体的内表面两者达到精确的公差。
在步骤26中，将环氧粘合剂涂覆至杆-圆柱体之一或两者上。在步骤28中，将杆插入到圆柱体内部，以形成杆-圆柱体组件，并使环氧固化(硬化)，如步骤30所示。在步骤32中，再次机械加工杆-圆柱体组件的外表面至精确的OD。最后在步骤34中，将该杆-圆柱体组件切片成若干圆盘组件。因此，每个圆盘组件包括同心设置在介电陶瓷环内部的磁性陶瓷圆盘。典型地，每个圆盘组件具有几毫米的厚度。
在以上所述的方法中，涉及机械加工圆柱体内表面以提高粘合力、对多个部分涂覆环氧、小心地处理和组装涂有环氧的部件、以及固化环氧树脂的时间都是低效率的。希望能够提供一种更有效的用于制造复合磁性-介电圆盘组件的方法。
发明内容
根据本发明的示例性实施方案，提供了一种用于制造复合磁性-介电圆盘组件的方法，其包括形成介电陶瓷圆柱体，形成磁性陶瓷杆，将该磁性陶瓷杆同轴地组装到该介电陶瓷圆柱体的内部以形成杆-圆柱体组件，烧制该杆-圆柱体组件，将该杆-圆柱体组件切片形成多个复合磁性-介电圆盘形组件。该磁性-介电圆盘组件可以用于制造例如循环器、隔离器或类似的电子元件。因此，该制造圆盘组件的方法可以作为制造这种电子元件的方法的一部分。
通过下面的附图和详细的描述，对所属领域技术人员来说，本发明的其它系统、方法、特点和优点将显而易见。希望所有这些其它的系统、方法、特点和优点都包含在说明书中，包含在本发明的保护范围内，并且由随附的权利要求保护。
附图说明
参照下面的附图将可以更好地理解本发明。附图中的元件不必是按比例的，而是在于强调能够清晰地说明本发明的原理。此外，在这些附图中，相同的附图标记在不同的视图中始终指定相应的部分。
图1是根据现有技术的制造复合磁性-介电圆盘组件的方法流程图。
图2是根据本发明的示例性实施方案的制造复合磁性-介电圆盘组件的方法流程图。
图3所示为根据示例性实施方案的介电陶瓷圆柱体的透视图。
图4所示为根据示例性实施方案的磁性陶瓷杆的透视图。
图5所示为举例说明图4的杆插入到图3的圆柱体中的杆-圆柱体组件的顶部俯视图。
图6所示为类似于图5的烧制后的杆-圆柱体组件的顶部俯视图。
图7所示为由图6的杆-圆柱体组件切片而成的多个复合磁性-介电圆盘组件的透视图。
具体实施方式
根据本发明的示例性实施方案，用于制造复合磁性-介电圆盘组件的工艺过程由图2的流程图示出。简要参照附图3-7，该工艺包括介电陶瓷圆柱体36和磁性陶瓷杆38。
反观图2，在步骤40中，通过现有技术中任意适合的、用于制造这种例如高频电子元件中的介电陶瓷元件的元件的传统工艺，由介电陶瓷材料形成圆柱体36(附图3)。类似地，在步骤42中，采用任意适合的传统工艺，由磁性陶瓷材料形成杆38(图4)。在步骤44中，通过在烘干炉(未示出)中烧制杆38而使其烧结。在下面的工艺流程的说明中阐明材料和烧制温度的一些实例。但是，熟知本发明涉及的现有技术的所属领域技术人员能够理解，用于制造这种类型的磁性陶瓷和介电陶瓷元件的材料和工艺在现有技术中是众所周知的。因此，合适的材料和温度并未进行穷举。所有这些用于制造这种杆、圆柱体和该类型的类似元件的合适的材料和工艺都包括在本发明的保护范围内。
在步骤46中，机械加工杆38的外表面，以保证其外径(OD)小于圆柱体36的内径(ID)。在步骤48中，在(未烧制的或“未加工的”)圆柱体36中纳入(现在为预烧制的)杆38，以形成如图5中示出的杆-圆柱体组件。尽管图5并非按比例的，但可以注意到杆38的OD略小于圆柱体36的ID，以使得杆38可以容纳于圆柱体36中。
在步骤50中，对圆柱体36和杆38进行共烧制。也就是，烧制该杆-圆柱体组件(图5)。该共烧制的温度优选低于杆38在步骤44中的烧制温度，以保证杆38的物理性能和电性能保持不变。该共烧制的温度可以在所述圆柱体进行传统烧制的公知范围内。重要的是，共烧制引起圆柱体36绕杆38收缩，由此将它们固定在一起，如图6所示。然后在步骤52中，可以机械加工杆-圆柱体组件的外表面，以保证其达到指定的或其它预定的OD。
最后，在步骤54中，将该杆-圆柱体组件切片成复合磁性-介电圆盘组件56，如图7所示。复合磁性-介电圆盘组件56可以与传统生产的该类型组件相同的方式用于制造高频电子元件。但是，本发明的方法比传统方法更经济，如本发明不涉及使用粘合剂。
实施例1
杆38由钇铁石榴石在等于或高于约1400℃下烧制而制得。该类型的适合的材料可通过多种商业渠道获得，包括从Adamstown Maryland的Trans-Tech公司(Skyworks solutions公司的子公司)得到。圆柱体36由组成为MgO-CaO-ZnO-Al2O3-TiO2的陶瓷材料制得，其与杆38在约1310℃下进行共烧制。
实施例2
杆38由掺杂钙和钒的钇铁石榴石在等于或高于1350℃下烧制而制得。该类型的适合的材料可通过多种商业渠道获得，包括从Adamstown Maryland的Trans-Tech公司(Skyworks solutions公司的子公司)得到。圆柱体36由具有组分MgO-CaO-ZnO-Al2O3-TiO2的陶瓷材料制得，其与杆38在约1310℃下进行共烧制。
已经描述了本发明的各种实施方案，对于所属领域的技术人员来说，更多的可能的其它实施方案和执行例在本发明的范围内是显而易见的。因此，本发明并不限于以上所述，除以下权利要求中的之外。
Claims (7)
1.一种用于制造复合磁性-介电圆盘组件的方法，其包括：
形成介电陶瓷圆柱体；
形成磁性陶瓷杆；
将该磁性陶瓷杆同轴地组装到该介电陶瓷圆柱体的内部，以形成杆-圆柱体组件；
烧制该杆-圆柱体组件；以及
将该杆-圆柱体组件切片成至少一个复合磁性-介电圆盘组件。
2.如权利要求1的方法，其中该介电陶瓷圆柱体在组装和烧制步骤之前未被烧制，并且该磁性陶瓷杆在组装和烧制步骤之前进行预烧制。
3.如权利要求2方法，其中烧制步骤在低于磁性陶瓷杆的预烧制温度的温度下进行。
4.如权利要求1的方法，其还包括在烧制步骤之后，机械加工该杆-圆柱体组件的外表面。
5.如权利要求2的方法，其还包括在组装步骤之前，机械加工预烧制的磁性陶瓷杆的外表面。
6.一种用于制造复合磁性-介电圆盘组件的方法，其包括：
形成介电陶瓷圆柱体：
形成磁性陶瓷杆；
将该磁性陶瓷杆同轴地组装到该介电陶瓷圆柱体的内部，以形成杆-圆柱体组件；
使该杆-圆柱体组件的介电陶瓷圆柱体围绕该杆-圆柱体组件的磁性陶瓷杆收缩；以及
将该杆-圆柱体组件切片成至少一个复合磁性-介电圆盘组件。
7.一种在用于制造循环器或隔离器的方法中制造复合磁性-介电圆盘组件的方法，其包括：
形成介电陶瓷圆柱体；
形成磁性陶瓷杆；
将该磁性陶瓷杆同轴地组装到该介电陶瓷圆柱体的内部，以形成杆-圆柱体组件；
烧制该杆-圆柱体组件；以及
将该杆-圆柱体组件切片成至少一个复合磁性-介电圆盘组件。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/055,416 US7687014B2 (en) | 2008-03-26 | 2008-03-26 | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| US12/055,416 | 2008-03-26 | ||
| PCT/US2009/038049 WO2009120667A2 (en) | 2008-03-26 | 2009-03-24 | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
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| CN101981753A true CN101981753A (zh) | 2011-02-23 |
| CN101981753B CN101981753B (zh) | 2014-04-09 |
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| US (1) | US7687014B2 (zh) |
| EP (1) | EP2255404B1 (zh) |
| JP (1) | JP2011515998A (zh) |
| KR (1) | KR101235964B1 (zh) |
| CN (1) | CN101981753B (zh) |
| HK (1) | HK1154701A1 (zh) |
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| CN104380526A (zh) * | 2012-05-18 | 2015-02-25 | 天工方案公司 | 与具有改进的插入损耗性能的结铁氧体装置相关的设备和方法 |
| CN109467427A (zh) * | 2017-09-08 | 2019-03-15 | 天工方案公司 | 低温可共烧的介电材料 |
| US11387532B2 (en) | 2016-11-14 | 2022-07-12 | Skyworks Solutions, Inc. | Methods for integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| US11565976B2 (en) | 2018-06-18 | 2023-01-31 | Skyworks Solutions, Inc. | Modified scheelite material for co-firing |
| US11603333B2 (en) | 2018-04-23 | 2023-03-14 | Skyworks Solutions, Inc. | Modified barium tungstate for co-firing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4590597B2 (ja) * | 2008-03-12 | 2010-12-01 | 国立大学法人東北大学 | シャワープレートの製造方法 |
| US9214712B2 (en) | 2011-05-06 | 2015-12-15 | Skyworks Solutions, Inc. | Apparatus and methods related to ferrite based circulators |
| US9640849B2 (en) | 2014-07-23 | 2017-05-02 | Skyworks Solutions, Inc. | Impedance matching in very high dielectric constant isolator/circulator junctions |
| WO2019246364A1 (en) * | 2018-06-21 | 2019-12-26 | Skyworks Solutions, Inc. | Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators |
| US11891340B2 (en) | 2018-07-23 | 2024-02-06 | Skyworks Solutions, Inc. | Spinel-based oxides containing magnesium, aluminum and titanium and methods of forming articles having same |
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| US6844789B2 (en) | 2001-11-13 | 2005-01-18 | Raytheon Company | Low temperature co-fired ceramic (LTCC) circulator |
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- 2009-03-24 WO PCT/US2009/038049 patent/WO2009120667A2/en active Application Filing
- 2009-03-24 JP JP2011501969A patent/JP2011515998A/ja active Pending
- 2009-03-24 EP EP09726061.6A patent/EP2255404B1/en active Active
- 2009-03-24 KR KR1020107022806A patent/KR101235964B1/ko active IP Right Grant
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| JPH0878284A (ja) * | 1994-08-31 | 1996-03-22 | Murata Mfg Co Ltd | 複合電子部品とその製造方法 |
| JP2000201007A (ja) * | 1999-01-08 | 2000-07-18 | Nec Corp | 複合基板型の非可逆回路素子及びその製造方法 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104380526A (zh) * | 2012-05-18 | 2015-02-25 | 天工方案公司 | 与具有改进的插入损耗性能的结铁氧体装置相关的设备和方法 |
| US11387532B2 (en) | 2016-11-14 | 2022-07-12 | Skyworks Solutions, Inc. | Methods for integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| US11804642B2 (en) | 2016-11-14 | 2023-10-31 | Skyworks Solutions, Inc. | Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| CN109467427A (zh) * | 2017-09-08 | 2019-03-15 | 天工方案公司 | 低温可共烧的介电材料 |
| TWI791605B (zh) * | 2017-09-08 | 2023-02-11 | 美商天工方案公司 | 低溫可共燒介電材料 |
| US11715869B2 (en) | 2017-09-08 | 2023-08-01 | Skyworks Solutions, Inc. | Low temperature co-fireable dielectric materials |
| US11603333B2 (en) | 2018-04-23 | 2023-03-14 | Skyworks Solutions, Inc. | Modified barium tungstate for co-firing |
| US11958778B2 (en) | 2018-04-23 | 2024-04-16 | Allumax Tti, Llc | Modified barium tungstate for co-firing |
| US11565976B2 (en) | 2018-06-18 | 2023-01-31 | Skyworks Solutions, Inc. | Modified scheelite material for co-firing |
Also Published As
| Publication number | Publication date |
|---|---|
| US7687014B2 (en) | 2010-03-30 |
| CN101981753B (zh) | 2014-04-09 |
| WO2009120667A2 (en) | 2009-10-01 |
| KR20100123764A (ko) | 2010-11-24 |
| EP2255404A2 (en) | 2010-12-01 |
| EP2255404B1 (en) | 2013-10-02 |
| HK1154701A1 (zh) | 2012-04-27 |
| EP2255404A4 (en) | 2011-10-12 |
| KR101235964B1 (ko) | 2013-02-21 |
| WO2009120667A3 (en) | 2009-12-17 |
| JP2011515998A (ja) | 2011-05-19 |
| US20090243163A1 (en) | 2009-10-01 |
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