CN101971351B - 连接薄金属层的装置和方法 - Google Patents

连接薄金属层的装置和方法 Download PDF

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Publication number
CN101971351B
CN101971351B CN200880115931.9A CN200880115931A CN101971351B CN 101971351 B CN101971351 B CN 101971351B CN 200880115931 A CN200880115931 A CN 200880115931A CN 101971351 B CN101971351 B CN 101971351B
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China
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laser
contact layer
solar cell
layer
back contact
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Expired - Fee Related
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CN200880115931.9A
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English (en)
Chinese (zh)
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CN101971351A (zh
Inventor
克劳兹·齐默
亚历山大·布劳恩
卡斯滕·奥蒂
罗萨·格拉齐
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Agence Spatiale Europeenne
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Agence Spatiale Europeenne
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/93Interconnections
    • H10F77/933Interconnections for devices having potential barriers
    • H10F77/935Interconnections for devices having potential barriers for photovoltaic devices or modules
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Photovoltaic Devices (AREA)
CN200880115931.9A 2007-11-07 2008-11-05 连接薄金属层的装置和方法 Expired - Fee Related CN101971351B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007052972.6 2007-11-07
DE1020070529726 2007-11-07
DE102007052972A DE102007052972A1 (de) 2007-11-07 2007-11-07 Verfahren und Mittel zum Verbinden dünner Metallschichten
PCT/EP2008/009316 WO2009059752A2 (de) 2007-11-07 2008-11-05 Verfahren und mittel zum verbinden dünner metallschichten

Publications (2)

Publication Number Publication Date
CN101971351A CN101971351A (zh) 2011-02-09
CN101971351B true CN101971351B (zh) 2013-10-16

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CN200880115931.9A Expired - Fee Related CN101971351B (zh) 2007-11-07 2008-11-05 连接薄金属层的装置和方法

Country Status (6)

Country Link
US (1) US20100294347A1 (https=)
EP (1) EP2218104A2 (https=)
JP (1) JP5414125B2 (https=)
CN (1) CN101971351B (https=)
DE (1) DE102007052972A1 (https=)
WO (1) WO2009059752A2 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2113945A1 (de) * 2008-04-30 2009-11-04 3S Swiss Solar Systems AG Verfahren zur Herstellung einer Kontaktierung von Solarzellen
DE102011104159A1 (de) * 2011-06-14 2012-12-20 Institut Für Solarenergieforschung Gmbh Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul
US8399281B1 (en) * 2011-08-31 2013-03-19 Alta Devices, Inc. Two beam backside laser dicing of semiconductor films
US8361828B1 (en) * 2011-08-31 2013-01-29 Alta Devices, Inc. Aligned frontside backside laser dicing of semiconductor films
DE102011117757A1 (de) * 2011-11-05 2013-05-08 Robert Bosch Gmbh Lötverfahren zum Herstellen einer elektrisch leitfähigen Verbindung
DE102012218369B4 (de) 2012-10-09 2023-08-03 Robert Bosch Gmbh Verfahren zum Verbinden von schichtartigen Metallstrukturen auf einem Polymer und Schichtaufbau aus einem Polymer und schichtartigen Metallstrukturen mit integriertem Thermoelement
DE102013005139A1 (de) * 2013-03-26 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Abtragen von sprödhartem Material mittels Laserstrahlung
DE102013217356B4 (de) * 2013-08-30 2024-02-01 Meyer Burger (Germany) Gmbh Verfahren zum Herstellen eines Solarzellensegments und Verfahren zum Herstellen einer Solarzelle
US20150072515A1 (en) * 2013-09-09 2015-03-12 Rajendra C. Dias Laser ablation method and recipe for sacrificial material patterning and removal
US9818903B2 (en) 2014-04-30 2017-11-14 Sunpower Corporation Bonds for solar cell metallization
DE102016203363A1 (de) 2016-03-02 2017-09-07 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum stoffschlüssigen Verbinden eines Aluminiumgussbauteils mit einem Fügepartner und Bauteil
CN108247205B (zh) * 2016-12-28 2020-02-07 富泰华工业(深圳)有限公司 激光铆接方法
CN109877454B (zh) * 2019-04-11 2021-02-09 武汉华工激光工程有限责任公司 薄膜太阳能电池电极的激光焊接方法
DE102019122213A1 (de) 2019-08-19 2021-02-25 Heliatek Gmbh Verfahren zur elektrisch leitenden Kontaktierung eines mindestens eine Schutzschicht aufweisenden optoelektronischen Bauelements und optoelektronisches Bauelement mit einer solchen Kontaktierung
DE102019215000A1 (de) * 2019-09-30 2021-04-01 Robert Bosch Gmbh Mikroschweißverfahren flexibler und dünner Folien, bspw. für den Einsatz in elektrischen und elektronischen Vorrichtungen
DE102020131743A1 (de) 2020-11-30 2022-06-02 Heliatek Gmbh Photovoltaisches Element mit mindestens einer photovoltaischen Zelle und mit einer Rückseitenbarriere
CN114334482B (zh) * 2021-06-15 2023-08-25 清华大学 器件制造方法、储能器件和能源供应装置
DE102022206270A1 (de) 2022-06-22 2023-12-28 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungsverfahren zum Verbinden zweier metallischer Schichten

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343014A (en) * 1990-07-12 1994-08-30 Nippondenso Co., Ltd. Method of welding metals of different kind by laser
DE19814780A1 (de) * 1998-04-02 1999-07-22 Ver Glaswerke Gmbh Fotovoltaisches Bauelement
EP1061589A2 (en) * 1999-06-14 2000-12-20 Kaneka Corporation Method of fabricating thin-film photovoltaic module
US6388187B1 (en) * 1997-12-26 2002-05-14 Canon Kabushiki Kaisha Photovoltaic element module and its production method, and non-contact treatment method
CN1486289A (zh) * 2001-05-29 2004-03-31 皇家菲利浦电子有限公司 金属-陶瓷的结合

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2139850A1 (de) * 1971-08-09 1973-02-15 Licentia Gmbh Verfahren und einrichtung zur verbindung von kontakten an solargeneratoren
JPS6250125A (ja) * 1985-08-29 1987-03-04 Toyota Motor Corp 合成樹脂材料と異種材料の接合方法
DE3619342A1 (de) * 1986-06-09 1987-12-10 Klaus Dr Rohr Innenbeschichten, innenlegieren, innenfuellen von durchgangsloechern mit hilfe des lasers
US4817020A (en) * 1987-06-22 1989-03-28 General Electric Company Cooling rate determination apparatus for laser material processing
US4965655A (en) * 1987-12-10 1990-10-23 Minnesota Mining And Manufacturing Company Interconnected semiconductor devices
JP3323573B2 (ja) * 1992-03-31 2002-09-09 キヤノン株式会社 太陽電池モジュール及びその製造方法
US5391235A (en) * 1992-03-31 1995-02-21 Canon Kabushiki Kaisha Solar cell module and method of manufacturing the same
US5877472A (en) * 1996-02-22 1999-03-02 Pacesetter, Inc. System for laser-welding components of an implantable device
JPH1177348A (ja) 1997-08-29 1999-03-23 Canon Inc 溶接方法及び光起電力素子
DE19913436C1 (de) * 1999-03-25 2000-12-14 Erbsloeh Ag Schweißverbindung von Bauteilen aus unterschiedlichen Werkstoffen
JP3477119B2 (ja) * 1999-09-17 2003-12-10 日東電工株式会社 フレキシブル配線板の導体層間の接続方法、およびフレキシブル配線板
US6768754B1 (en) * 2000-09-13 2004-07-27 National Research Council Of Canada Quantum dot tunable external cavity lasers (QD-TEC lasers)
US20030044539A1 (en) * 2001-02-06 2003-03-06 Oswald Robert S. Process for producing photovoltaic devices
US20050011551A1 (en) 2003-07-14 2005-01-20 Simburger Edward J. Thin film solar cell electrical contacts
US7122398B1 (en) * 2004-03-25 2006-10-17 Nanosolar, Inc. Manufacturing of optoelectronic devices
JP4077456B2 (ja) 2005-01-14 2008-04-16 株式会社カネカ 集積化薄膜太陽電池
JP2006320954A (ja) * 2005-05-20 2006-11-30 Nichirin Co Ltd 鉄系合金部材とアルミニウム系合金部材との異種金属溶接接合体
JP2006332453A (ja) 2005-05-27 2006-12-07 Sharp Corp 薄膜太陽電池の製造方法および薄膜太陽電池

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343014A (en) * 1990-07-12 1994-08-30 Nippondenso Co., Ltd. Method of welding metals of different kind by laser
US6388187B1 (en) * 1997-12-26 2002-05-14 Canon Kabushiki Kaisha Photovoltaic element module and its production method, and non-contact treatment method
DE19814780A1 (de) * 1998-04-02 1999-07-22 Ver Glaswerke Gmbh Fotovoltaisches Bauelement
EP1061589A2 (en) * 1999-06-14 2000-12-20 Kaneka Corporation Method of fabricating thin-film photovoltaic module
CN1486289A (zh) * 2001-05-29 2004-03-31 皇家菲利浦电子有限公司 金属-陶瓷的结合

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-320954A 2006.11.30

Also Published As

Publication number Publication date
DE102007052972A1 (de) 2009-05-14
WO2009059752A2 (de) 2009-05-14
US20100294347A1 (en) 2010-11-25
CN101971351A (zh) 2011-02-09
EP2218104A2 (de) 2010-08-18
WO2009059752A3 (de) 2009-12-03
JP5414125B2 (ja) 2014-02-12
JP2011503855A (ja) 2011-01-27

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