CN101958305B - Double-side graph chip forward module package structure and package method thereof - Google Patents

Double-side graph chip forward module package structure and package method thereof Download PDF

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Publication number
CN101958305B
CN101958305B CN2010102730299A CN201010273029A CN101958305B CN 101958305 B CN101958305 B CN 101958305B CN 2010102730299 A CN2010102730299 A CN 2010102730299A CN 201010273029 A CN201010273029 A CN 201010273029A CN 101958305 B CN101958305 B CN 101958305B
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pin
dao
back side
zone
packaging material
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CN101958305A (en
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王新潮
梁志忠
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention relates to a double-side graph chip forward module package structure and a package method thereof. The structure comprises base islands (1), pins (2), unpacked molding compounds (epoxy resins) (3), conductive or non-conductive bonding materials (6), a chip (7), metal wires (8) and packed molding compounds (epoxy resins) (9), wherein the front sides of the pins (2) extend to draw near the base islands (1); and the unpacked molding compounds (3) connect the base islands (1) with the lower periphery of the pins, the lower parts of the pins (2) with the lower parts of the base islands (1), and the lower parts of the pins (2) into a whole and ensure the back size of the base islands and the pins to be less than the front size of the base islands and the pins to form a big end up base island and pin structure. The package structure is characterized in that columns (10) are arranged at the back of the pins (2) and the roots of the columns (10) are embedded in the unpacked molding compounds (3). The package structure can bear superhigh temperature during loading and can not undergo lead frame distorsion due to different physical properties of different substances, can avoid the problem of pin falling and can shorten the length of the metal wires.

Description

Two-sided graphic chips formal dress module package structure and method for packing thereof
(1) technical field
The present invention relates to a kind of two-sided graphic chips formal dress module package structure and method for packing thereof.Belong to the semiconductor packaging field.
(2) background technology
The production method of traditional chip-packaging structure is: after chemical etching and surface electrical coating are carried out in the front of employing metal substrate, promptly accomplish the making (shown in Figure 85) of lead frame.Etching is then carried out at the back side of lead frame again in encapsulation process.Not enough below this method exists:
Because only carried out the work that etches partially before the plastic packaging in the metal substrate front; And plastic packaging material only wraps the height of half pin of pin in the plastic packaging process; So the constraint ability of plastic-sealed body and pin has just diminished; When if the plastic-sealed body paster is not fine to pcb board, does over again again and heavily paste, with regard to the problem (shown in Figure 86) that is easy to generate pin.Especially the kind of plastic packaging material is to adopt when filler is arranged; Because material is at the environment and the follow-up surface-pasted stress changing relation of production process; Can cause metal and plastic packaging material to produce the crack of vertical-type, its characteristic is the high more then crisp more firmly more crack that is easy to generate more of proportion of filler.
In addition, because the distance between chip and the pin is far away, the length of metal wire is longer, shown in Figure 87～88, and metal wire cost higher (the especially metal wire of expensive proof gold matter); Same because the length of metal wire is longer, make that the signal output speed of chip is slow (especially the product of storage class and the calculating that needs mass data are more outstanding); Too because the length of metal wire is longer, so also higher to the interference of signal in existing dead resistance/parasitic capacitance of metal wire and parasitic electric pole; Because the distance between chip and the pin is far away, make that the volume and the area of encapsulation are bigger again, material cost is higher, and discarded object is more.
For this reason, the applicant in first to file name be called the patent of invention of " base island lead frame structure and production method thereof are arranged ", its application number is: 201010165896.0.Its major technique characteristic is: adopt the back side of metal substrate to etch partially earlier; Form the half-etched regions of depression at the back side of metal substrate, form the back side of Ji Dao and pin simultaneously relatively, again in said half-etched regions; Packless soft gap filler in the full-filling; And toast simultaneously, make packless soft underfill cures become packless plastic packaging material (epoxy resin), to wrap the back side of pin.And then etch partially in the front of metal substrate, form the front of Ji Dao and pin simultaneously relatively.Its beneficial effect mainly contains:
1) because the zone between the back side of said metal substrate pin and pin is equipped with packless soft gap filler; This packless soft gap filler has filler plastic packaging material (epoxy resin) to wrap the height of whole pin with the positive routine of the metal substrate in the plastic packaging process; So the constraint ability of plastic-sealed body and pin just becomes big; Do not have the problem that produces pin again, like Figure 89.
2) owing to adopted the positive method of separating the etching operation of lead frame with the back side; So in the etching operation, can form slightly little and the structure that positive pin size is big slightly of the size of back side pin, and slide and fall pin in the tighter more difficult generation of being wrapped up by packless plastic packaging material (epoxy resin) with the size that varies in size up and down of a pin.
3) separate etched technology owing to used the lead frame back side with the front; So can the pin in lead frame front be extended to as much as possible the next door of Ji Dao; Impel chip and pin distance significantly to shorten; Like Figure 89～90, so the employed cost of metal wire also can significantly reduce (the especially metal wire of expensive proof gold matter).
4) also because the shortening of metal wire makes also significantly speedup (the especially product of storage class and the calculating that needs mass data of signal output speed of chip; More outstanding); Because the length of metal wire has shortened, so existing dead resistance/parasitic capacitance of metal wire and parasitic electric pole are to the also significantly reduction of interference of signal.
5) because of having used the elongation technology of pin,, make the volume and the area of encapsulation significantly to dwindle so can be easy to produce the distance between high pin number and the highdensity pin.
6) because volume after being encapsulated is significantly dwindled, more directly embody material cost significantly descend with because the minimizing of material usage also significantly reduces the puzzlement of discarded object environmental protection.
But; Still have following deficiency: owing to the advanced line lead frame back side before the encapsulation does not have the parcel pin operation of filler plastic packaging material; When carrying out positive high temperature load of lead frame and routing operation again, because of the physical property of two kinds of materials of lead frame and no filler plastic packaging material is different, the coefficient of expansion of two kinds of materials is also different; At high temperature receive thermal deformation different, lead frame produces distortion when causing follow-up load.Therefore this kind encapsulating structure can not superhigh temperature resistant (more than 200 ℃) when load.And be through doing the packaging body volume to such an extent that reach resistant to elevated temperatures requirement very greatly, be with regard to not anti-superhigh temperature under the increasing situation but require the more and more littler and power of the volume of packaging body now. in the past
(3) summary of the invention
The objective of the invention is to overcome above-mentioned deficiency; Can bear superhigh temperature when a kind of load is provided and can not produce the lead frame distortion, also not have the problem that produces pin and the two-sided graphic chips formal dress module package structure and the method for packing thereof that can make the contraction in length of metal wire again because of the different physical properties of different material.
The objective of the invention is to realize like this: a kind of two-sided graphic chips formal dress module package structure; Comprise Ji Dao, pin, packless plastic packaging material (epoxy resin), conduction or non-conductive bonding material, chip, metal wire and filler plastic packaging material (epoxy resin) is arranged; Said pin front extends to next door, basic island; Front at said Ji Dao and pin is provided with the first metal layer; Be provided with second metal level at the back side of said Ji Dao and pin; On the first metal layer of front, said basic island, be provided with chip through conduction or non-conductive bonding material; Be connected with metal wire between chip front side and the pin front the first metal layer; Outside the top of said Ji Dao and pin and chip and metal wire, be encapsulated with filler plastic packaging material (epoxy resin), zone and the zone between pin and the pin between peripheral zone, pin and the basic island of said Ji Dao and pin are equipped with packless plastic packaging material (epoxy resin), and said packless plastic packaging material (epoxy resin) links into an integrated entity Ji Dao and periphery, pin bottom, pin bottom and Ji Dao bottom and pin bottom and pin bottom; And make said Ji Dao and pin back side size less than Ji Dao and the positive size of pin; Form up big and down small Ji Dao and pin configuration, it is characterized in that: be provided with pillar at the said pin back side, the pillar root is imbedded in the said packless plastic packaging material (epoxy resin).
The method for packing of the two-sided graphic chips formal dress of the present invention module package structure, said method comprises following processing step:
Step 1, get metal substrate
Get the suitable metal substrate of a slice thickness,
Step 2, metal substrate front and back side lining photoresistance glued membrane
Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging,
The positive photoresistance glued membrane of step 3, metal substrate needs the exposure of plated metal layer region/develop and windows
The metal substrate front that utilizes exposure imaging equipment that step 2 is accomplished photoresistance glued membrane lining operation is carried out exposure imaging and is removed part photoresistance glued membrane, carries out the zone of electroplated metal layer to expose the positive follow-up needs of metal substrate,
The zone of having windowed in step 4, metal substrate front is carried out metal level and is electroplated lining
The first metal layer plating lining is carried out in zone to having windowed in metal substrate front in the step 3, and this first metal layer places the front of said Ji Dao and pin,
Photoresistance glued membrane striping is carried out at step 5, metal substrate front and the back side
The positive remaining photoresistance glued membrane of metal substrate and the photoresistance glued membrane at the metal substrate back side are all removed,
Step 6, metal substrate front and back side lining photoresistance glued membrane
Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up etch process operation,
The photoresistance glued membrane of step 7, metal substrate needs the exposure of two-sided etching area/develop and windows
Exposure imaging removal part photoresistance glued membrane is carried out at the metal substrate front and the back side that utilize exposure imaging equipment that step 6 is accomplished photoresistance glued membrane lining operation, prepares against the two-sided etching operation of metal substrate that follow-up needs carry out to expose the localized metallic substrate,
Step 8, metal substrate carry out two-sided etching operation
After the exposure/development and windowing task of completing steps seven; The etching operation of promptly carrying out each figure at the front and the back side of metal substrate; Etch the front and back of Ji Dao and pin; Simultaneously the pin front is extended to next door, basic island as much as possible, and make the positive size of the back side size of said Ji Dao and pin, form up big and down small Ji Dao and pin configuration less than Ji Dao and pin; And form pillar at the pin back side, and at the company's of leaving muscle between Ji Dao and the pin and between pin and the pin,
Photoresistance glued membrane striping is carried out at step 9, metal substrate front and the back side
The photoresistance glued membrane that the metal substrate front and back is remaining all removes, and processes lead frame,
Step 10, load
On front, the basic island the first metal layer of the lead frame that step 9 is processed, carry out the implantation of chip through conduction or non-conductive bonding material,
Step 11, break metal wire
The semi-finished product of accomplishing chip implantation operation are carried out playing the metal wire operation between chip front side and the pin front the first metal layer,
Step 12, be encapsulated with filler plastic packaging material (epoxy resin)
The semi-finished product front that routing is accomplished is encapsulated with filler plastic packaging material (epoxy resin) 9 operations, and carries out the curing operation after plastic packaging material is sealed, and makes top and the chip of Ji Dao and pin and metal wire all had filler plastic packaging material (epoxy resin) to seal outward,
Step 13, lining photoresistance glued membrane
Utilization by coating equipment will accomplish the half-finished front that is encapsulated with filler plastic packaging material (epoxy resin) operation and the back side be covered respectively the photoresistance glued membrane that can carry out exposure imaging with, protecting follow-up etch process operation,
Step 14, accomplish the exposure that the half-finished back side that is encapsulated with filler plastic packaging material (epoxy resin) operation needs etching area/develop and windowing
Exposure imaging removal part photoresistance glued membrane is carried out at the semi-finished product back side that is encapsulated with the operation of filler plastic packaging material of accomplishing that utilizes exposure imaging equipment that step 13 is accomplished photoresistance glued membrane lining operation; To expose company's muscle that leaves after the two-sided etching operation of step 8 metal substrate and the pillar that forms at the pin back side; Carry out the pillar root and connect muscle etching operation in order to follow-up needs
Step 15, the operation of etching for the second time
After the exposure/development and windowing task of completing steps 14; Promptly carry out the etching operation of each figure at the semi-finished product back side that completion is encapsulated with filler plastic packaging material (epoxy resin) operation; The company's muscle that leaves after the two-sided etching operation of step 8 metal substrate is all etched away; Root at pillar described in this process also can etch away relative thickness simultaneously, makes the pillar root not expose the encapsulating structure back side after sealing
Photoresistance glued membrane striping is carried out at step 10 six, semi-finished product front and the back side
Photoresistance glued membrane that the semi-finished product back side of completing steps 15 etching operations is remaining and the positive photoresistance glued membrane of semi-finished product all remove,
Step 10 seven, seal packless plastic packaging material (epoxy resin)
Packless plastic packaging material (epoxy resin) operation is sealed at the semi-finished product back side of completing steps 16 said striping operations; And carry out the curing operation after plastic packaging material is sealed; Make the peripheral zone of Ji Dao and pin; Packless plastic packaging material (epoxy resin) is all set in zone and the zone between pin and the pin between pin and the basic island; This packless plastic packaging material (epoxy resin) is peripheral with Ji Dao and pin bottom; Pin bottom and Ji Dao bottom and pin bottom and pin bottom link into an integrated entity; And said pillar root is imbedded in this packless plastic packaging material (epoxy resin)
The back side of step 10 eight, Ji Dao and pin is carried out metal level and is electroplated lining
The back side that completing steps 17 is sealed said Ji Dao and the pin of the operation of no filler plastic packaging material is carried out second metal level and is electroplated the lining operation,
Step 10 nine, cutting finished product
The semi-finished product of ten eight the second metal levels of completing steps being electroplated lining carry out cutting operation, make originally more than of chips that connect together with array formula aggregate mode independent, make two-sided graphic chips formal dress module package structure finished product.
The invention has the beneficial effects as follows:
1, lead frame superhigh temperature resistant (more than 200 ℃)
Owing to adopted two-sided figure etched lead frame technology; Once accomplish lead frame just, the back of the body the two-sided etching in two sides; The positive high temperature load routing of advanced line lead frame carries out the pin parcel operation at the lead frame back side again when encapsulating simultaneously; Have only a kind of material of lead frame when making the load routing, in the processing procedure process of using superhigh temperature,, guaranteed superhigh temperature resistant (generally being below the 200 ℃) performance of lead frame because of there not being the different impacts that brought of the multiple material coefficient of expansion.
2, can guarantee lead frame load intensity
Do not seal because do not do in advance earlier, the pressure that bears during the lead frame load is big, can make lead frame produce vibration during routing, and the phenomenon of sinking can appear in lead frame.The present invention is through leaving the design of pillar, the intensity of lead frame during with the increase routing at the lead frame back side.
3, guarantee not have again the problem that produces pin
Owing to adopted two-sided etched technology; So planning and designing easily with produce up big and down small pin configuration; The levels plastic packaging material is wrapped up big and down small pin configuration closely together; So the constraint ability of plastic-sealed body and pin just becomes big, do not have the problem that produces pin again.
4, guarantee the contraction in length of metal wire
1) owing to used the lead frame back side with the positive while and separate etched technology; So can extend to the follow-up next door, zone that needs cartridge chip as much as possible by the pin that lead frame is positive; Impel chip and pin distance significantly to shorten; Like Figure 89～Figure 90, so the length of metal wire has also shortened, and the cost of metal wire also can significantly reduce (the especially metal wire of expensive proof gold matter);
2) also because the contraction in length of metal wire makes also significantly speedup (the especially product of storage class and the calculating that needs mass data of signal output speed of chip; More outstanding); Because the length of metal wire has shortened, so existing dead resistance/parasitic capacitance of metal wire and parasitic electric pole are to the also significantly reduction of interference of signal.
5, the volume of encapsulation and area can significantly be dwindled
Because of having used the elongation technology of pin,, make the volume and the area of encapsulation significantly to dwindle so can be easy to produce the distance between high pin number and highdensity pin and the pin.
6, material cost and material usage reduce
Because volume after being encapsulated is significantly dwindled, more directly embody material cost significantly descend with because the minimizing of material usage also significantly reduces the puzzlement of discarded object environmental protection.
(4) description of drawings
Fig. 1 (A)～Fig. 1 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 1 each operation sketch map.
Fig. 2 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 1 structural representation.
Fig. 3 is the vertical view of Fig. 2.
Fig. 4 (A)～Fig. 4 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 2 each operation sketch map.
Fig. 5 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 2 structural representations.
Fig. 6 is the vertical view of Fig. 5.
Fig. 7 (A)～Fig. 7 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 3 each operation sketch map.
Fig. 8 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 3 structural representations.
Fig. 9 is the vertical view of Fig. 8.
Figure 10 (A)～Figure 10 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 4 each operation sketch map.
Figure 11 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 4 structural representations.
Figure 12 is the vertical view of Figure 11.
Figure 13 (A)～Figure 13 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 5 each operation sketch map.
Figure 14 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 5 structural representations.
Figure 15 is the vertical view of Figure 14.
Figure 16 (A)～Figure 16 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 6 each operation sketch map.
Figure 17 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 6 structural representations.
Figure 18 is the vertical view of Figure 17.
Figure 19 (A)～Figure 19 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 7 each operation sketch map.
Figure 20 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 7 structural representations.
Figure 21 is the vertical view of Figure 20.
Figure 22 (A)～Figure 22 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 8 each operation sketch map.
Figure 23 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 8 structural representations.
Figure 24 is the vertical view of Figure 23.
Figure 25 (A)～Figure 25 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 9 each operation sketch map.
Figure 26 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 9 structural representations.
Figure 27 is the vertical view of Figure 26.
Figure 28 (A)～Figure 28 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 10 each operation sketch map.
Figure 29 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 10 structural representations.
Figure 30 is the vertical view of Figure 29.
Figure 31 (A)～Figure 31 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 11 each operation sketch map.
Figure 32 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 11 structural representations.
Figure 33 is the vertical view of Figure 32.
Figure 34 (A)～Figure 34 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 12 each operation sketch map.
Figure 35 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 12 structural representations.
Figure 36 is the vertical view of Figure 35.
Figure 37 (A)～Figure 37 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 13 each operation sketch map.
Figure 38 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 13 structural representations.
Figure 39 is the vertical view of Figure 38.
Figure 40 (A)～Figure 40 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 14 each operation sketch map.
Figure 41 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 14 structural representations.
Figure 42 is the vertical view of Figure 41.
Figure 43 (A)～Figure 43 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 15 each operation sketch map.
Figure 44 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 15 structural representations.
Figure 45 is the vertical view of Figure 44.
Figure 46 (A)～Figure 46 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 16 each operation sketch map.
Figure 47 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 16 structural representations.
Figure 48 is the vertical view of Figure 47.
Figure 49 (A)～Figure 49 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 17 each operation sketch map.
Figure 50 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 17 structural representations.
Figure 51 is the vertical view of Figure 50.
Figure 52 (A)～Figure 52 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 18 each operation sketch map.
Figure 53 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 18 structural representations.
Figure 54 is the vertical view of Figure 53.
Figure 55 (A)～Figure 55 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 19 each operation sketch map.
Figure 56 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 19 structural representations.
Figure 57 is the vertical view of Figure 56.
Figure 58 (A)～Figure 58 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 20 each operation sketch map.
Figure 59 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 20 structural representations.
Figure 60 is the vertical view of Figure 59.
Figure 61 (A)～Figure 61 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 21 each operation sketch map.
Figure 62 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 21 structural representations.
Figure 63 is the vertical view of Figure 62.
Figure 64 (A)～Figure 64 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 22 each operation sketch map.
Figure 65 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 22 structural representations.
Figure 66 is the vertical view of Figure 65.
Figure 67 (A)～Figure 67 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 23 each operation sketch map.
Figure 68 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 23 structural representations.
Figure 69 is the vertical view of Figure 68.
Figure 70 (A)～Figure 70 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 24 each operation sketch map.
Figure 71 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 24 structural representations.
Figure 72 is the vertical view of Figure 71.
Figure 73 (A)～Figure 73 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 25 each operation sketch map.
Figure 74 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 25 structural representations.
Figure 75 is the vertical view of Figure 74.
Figure 76 (A)～Figure 76 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 26 each operation sketch map.
Figure 77 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 26 structural representations.
Figure 78 is the vertical view of Figure 77.
Figure 79 (A)～Figure 79 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 27 each operation sketch map.
Figure 80 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 27 structural representations.
Figure 81 is the vertical view of Figure 80.
Figure 82 (A)～Figure 82 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 28 each operation sketch map.
Figure 83 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 28 structural representations.
Figure 84 is the vertical view of Figure 83.
Figure 85 was for to adopt the front of metal substrate to carry out chemical etching and surface electrical coating flow diagram in the past.
Figure 86 pin figure for what formed in the past.
Figure 87 is encapsulating structure one sketch map in the past.
Figure 88 is 87 vertical view.
Figure 89 is encapsulating structure two sketch mapes in the past.
Figure 90 is 89 vertical view.
Reference numeral among the figure:
Base island 1, pin 2, packless plastic packaging material (epoxy resin) 3, the first metal layer 4, second metal level 5, conduction or non-conductive bonding material 6, chip 7, metal wire 8, filler plastic packaging material (epoxy resin) 9, pillar 10, metal substrate 11, photoresistance glued membrane 12, photoresistance glued membrane 13, photoresistance glued membrane 14, photoresistance glued membrane 15 are arranged, connect muscle 16, photoresistance glued membrane 17, photoresistance glued membrane 18; The 1.3, the 4th basic island 1.4, the 1.2, the 3rd basic island, the 1.1, the 3rd basic island, the 3rd basic island.
(5) embodiment
The present invention's two-sided graphic chips formal dress module package structure and method for packing thereof are following:
Embodiment 1: single basic island individual pen pin
Referring to Fig. 2 and Fig. 3, Fig. 2 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 1 structural representation.Fig. 3 is the vertical view of Fig. 2.Can find out by Fig. 2 and Fig. 3; The two-sided graphic chips formal dress of the present invention module package structure; Comprise basic island 1, pin 2, packless plastic packaging material (epoxy resin) 3, conduction or non-conductive bonding material 6, chip 7, metal wire 8 and filler plastic packaging material (epoxy resin) 9 is arranged; Said pin 2 fronts extend to 1 next door, basic island; Front at said basic island 1 and pin 2 is provided with the first metal layer 4; The back side at said basic island 1 and pin 2 is provided with second metal level 5; On the 1 front the first metal layer 4 of said basic island, be provided with chip 7 through conduction or non-conductive bonding material 6, chip 7 positive with pin 2 front the first metal layers 4 between be connected with metal wire 8, outside the top of said basic island 1 and pin 2 and chip 7 and metal wire 8, be encapsulated with filler plastic packaging material (epoxy resin) 9; Zone between zone, pin 2 and the basic island 1 of said basic island 1 and pin 2 peripheries and the zone between pin 2 and the pin 2 are equipped with packless plastic packaging material (epoxy resin) 3; Said packless plastic packaging material (epoxy resin) 3 is peripheral with basic island 1 and pin bottom, pin 2 bottoms and 1 bottom, basic island and pin 2 bottoms and pin 2 bottoms link into an integrated entity, and makes said Ji Dao and pin back side size less than Ji Dao and pin front size, forms up big and down small Ji Dao and pin configuration; Be provided with pillar 10 at said pin 2 back sides, pillar 10 roots are imbedded in the said packless plastic packaging material (epoxy resin) 3.
Its method for packing is following:
Step 1, get metal substrate
Referring to Fig. 1 (A), get the suitable metal substrate of a slice thickness 11.The material of metal substrate can be carried out conversion according to the function and the characteristic of chip, for example: copper, aluminium, iron, copper alloy or dilval etc.
Step 2, metal substrate front and back side lining photoresistance glued membrane
Referring to Fig. 1 (B), utilize by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane 12 and 13 of exposure imaging, to protect follow-up electroplated metal layer process operation.And this photoresistance glued membrane can be a dry type photoresistance pellicle also can be wet type photoresistance glued membrane.
The positive photoresistance glued membrane of step 3, metal substrate needs the exposure of plated metal layer region/develop and windows
Referring to Fig. 1 (C), the metal substrate front that utilizes exposure imaging equipment that step 2 is accomplished photoresistance glued membrane lining operation is carried out exposure imaging and is removed part photoresistance glued membrane, carries out the zone of electroplated metal layer to expose the positive follow-up needs of metal substrate.
The zone of having windowed in step 4, metal substrate front is carried out metal level and is electroplated lining
Referring to Fig. 1 (D), the first metal layer 4 plating linings are carried out in the zone of having windowed in metal substrate front in the step 3, this first metal layer 4 places the front of said basic island 1 and pin 2.
Photoresistance glued membrane striping is carried out at step 5, metal substrate front and the back side
Referring to Fig. 1 (E), the positive remaining photoresistance glued membrane of metal substrate and the photoresistance glued membrane at the metal substrate back side are all removed.
Step 6, metal substrate front and back side lining photoresistance glued membrane
Referring to Fig. 1 (F), utilize by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane 14 and 15 of exposure imaging, to protect follow-up etch process operation.And this photoresistance glued membrane can be a dry type photoresistance pellicle also can be wet type photoresistance glued membrane.
The photoresistance glued membrane of step 7, metal substrate needs the exposure of two-sided etching area/develop and windows
Referring to Fig. 1 (G); Exposure imaging removal part photoresistance glued membrane is carried out at the metal substrate front and the back side that utilize exposure imaging equipment that step 6 is accomplished photoresistance glued membrane lining operation, to expose the two-sided etching operation of metal substrate that the localized metallic substrate carries out in order to follow-up needs.
Step 8, metal substrate carry out two-sided etching operation
Referring to Fig. 1 (H); After the exposure/development and windowing task of completing steps seven; The etching operation of promptly carrying out each figure at the front and the back side of metal substrate etches the front and back of basic island 1 and pin 2, simultaneously the pin front is extended to next door, basic island as much as possible; And make the positive size of the back side size of said basic island 1 and pin 2, form up big and down small basic island 1 and pin 2 structures less than basic island 1 and pin 2; And form pillar 10 at pin 2 back sides, and at the company's of leaving muscle 16 between basic island 1 and the pin 2 and between pin 2 and the pin 2.
Photoresistance glued membrane striping is carried out at step 9, metal substrate front and the back side
Referring to Fig. 1 (I), the photoresistance glued membrane that the metal substrate front and back is remaining all removes, and processes lead frame,
Step 10, load
Referring to Fig. 1 (J), on the 1 front the first metal layer 4 of basic island, carry out the implantation of chip 7 through conduction or non-conductive bonding material 6.
Step 11, break metal wire
Referring to Fig. 1 (K), the semi-finished product of accomplishing chip implantation operation are carried out playing metal wire 8 operations between chip front side and the pin front the first metal layer.
Step 12, be encapsulated with filler plastic packaging material (epoxy resin)
Referring to Fig. 1 (L); The semi-finished product front of routing completion is encapsulated with filler plastic packaging material (epoxy resin) 9 operations; And carry out the curing operation after plastic packaging material is sealed, make top and the chip of Ji Dao and pin and metal wire all had filler plastic packaging material (epoxy resin) to seal outward.
Step 13, lining photoresistance glued membrane
Referring to Fig. 1 (M), utilize by coating equipment to be covered respectively and can to carry out the photoresistance glued membrane 17 and 18 of exposure imaging will accomplishing the half-finished front that is encapsulated with filler plastic packaging material (epoxy resin) operation and the back side, to protect follow-up etch process operation.And this photoresistance glued membrane can be a dry type photoresistance pellicle also can be wet type photoresistance glued membrane.
Step 14, accomplish the exposure that the half-finished back side that is encapsulated with filler plastic packaging material (epoxy resin) operation needs etching area/develop and windowing
Referring to Fig. 1 (N); The semi-finished product back side that the completion that utilizes exposure imaging equipment that step 13 is accomplished photoresistance glued membrane lining operation is encapsulated with filler plastic packaging material (epoxy resin) operation is carried out exposure imaging and is removed part photoresistance glued membrane; To expose company's muscle 16 that leaves after the two-sided etching operation of step 8 metal substrate and the pillar 10 that forms at pin 2 back sides, carry out the pillar root and connect muscle etching operation in order to follow-up needs.
Step 15, the operation of etching for the second time
Referring to Fig. 1 (O); After the exposure/development and windowing task of completing steps 14; Promptly carry out the etching operation of each figure, the company's muscle 16 that leaves after the two-sided etching operation of step 8 metal substrate is all etched away, also can etch away relative thickness simultaneously at the root of pillar 10 described in this process at the semi-finished product back side that completion is encapsulated with filler plastic packaging material (epoxy resin) operation; Make the pillar root not expose the encapsulating structure back side after sealing, avoid producing and open circuit.
Photoresistance glued membrane striping is carried out at step 10 six, semi-finished product front and the back side
Referring to Fig. 1 (P), photoresistance glued membrane that the semi-finished product back side of completing steps 15 etching operations is remaining and the positive photoresistance glued membrane of semi-finished product all remove.
Step 10 seven, seal packless plastic packaging material (epoxy resin)
Referring to Fig. 1 (Q); Packless plastic packaging material (epoxy resin) operation is sealed at the semi-finished product back side of completing steps 16 said striping operations; And carry out the curing operation after plastic packaging material is sealed; Make zone and the zone between pin 2 and the pin 2 between basic island 1 and pin 2 peripheral zone, pin 2 and the basic island 1 all set packless plastic packaging material (epoxy resin) 3; This packless plastic packaging material (epoxy resin) 3 is peripheral with basic island 1 and pin bottom, pin 2 bottoms and 1 bottom, basic island and pin 2 bottoms and pin 2 bottoms link into an integrated entity, and said pillar 10 roots are imbedded in this packless plastic packaging material (epoxy resin) 3.
Specify: but also because many said pillars 10 in packaging body, the structure in packaging body is more strong on the contrary (can be compared to mix increased reinforcing bar in the earth intensity but also flexible are arranged not only)
The back side of step 10 eight, Ji Dao and pin is carried out metal level and is electroplated lining
Referring to Fig. 1 (R), the back side that completing steps 17 is sealed said Ji Dao and the pin of the operation of no filler plastic packaging material is carried out second metal level 5 and is electroplated the lining operations, and the material of electroplating can be tin, nickel gold, NiPdAu .... wait metal material.
Step 10 nine, cutting finished product
Referring to Fig. 2 and Fig. 3, the semi-finished product of ten eight the second metal levels of completing steps being electroplated lining carry out cutting operation, make originally more than of chips that connect together with array formula aggregate mode independent, make two-sided graphic chips formal dress module package structure finished product.
Embodiment 2: base island exposed type individual pen pin sinks
Referring to Fig. 4～6, Fig. 4 (A)～Fig. 4 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 2 each operation sketch map.Fig. 5 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 2 structural representations.Fig. 6 is the vertical view of Fig. 5.Can be found out that by Fig. 4, Fig. 5 and Fig. 6 embodiment 2 only is with the difference of embodiment 1: said basic island 1 is sinking type Ji Dao, and promptly basic island 1 front middle section sinks.
Embodiment 3: baried type base island individual pen pin
Referring to Fig. 7～9, Fig. 7 (A)～Fig. 7 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 3 each operation sketch map.Fig. 8 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 3 structural representations.Fig. 9 is the vertical view of Fig. 8.Can be found out that by Fig. 7, Fig. 8 and Fig. 9 embodiment 3 only is with the difference of embodiment 1: said basic island 1 is baried type Ji Dao, and 1 back side, promptly basic island is imbedded in the said packless plastic packaging material (epoxy resin) 3.
Embodiment 4: the base island exposed type individual pen of multi-convex point pin
Referring to Figure 10～12, Figure 10 (A)～Figure 10 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 4 each operation sketch map.Figure 11 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 4 structural representations.Figure 12 is the vertical view of Figure 11.Can be found out that by Figure 10, Figure 11 and Figure 12 embodiment 4 only is with the difference of embodiment 1: said basic island 1 is multi-convex point Ji Dao, and 1 surface, promptly basic island is provided with a plurality of salient points.
Embodiment 5: base island exposed type encloses pin more
Referring to Figure 13～15, Figure 13 (A)～Figure 13 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 5 each operation sketch map.Figure 14 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 5 structural representations.Figure 15 is the vertical view of Figure 14.Can be found out that by Figure 13～15 embodiment 5 is with the difference of embodiment 1: said pin 2 has many circles.
Embodiment 6: the base island exposed type that sinks encloses pin more
Referring to Figure 16～18, Figure 16 (A)～Figure 16 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 6 each operation sketch map.Figure 17 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 6 structural representations.Figure 18 is the vertical view of Figure 17.Can be found out that by Figure 16～18 embodiment 6 is with the difference of embodiment 2: said pin 2 has many circles.
Embodiment 7: baried type Ji Dao encloses pin more
Referring to Figure 19～21, Figure 19 (A)～Figure 19 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 7 each operation sketch map.Figure 20 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 7 structural representations.Figure 21 is the vertical view of Figure 20.Can be found out that by Figure 19～21 embodiment 7 is with the difference of embodiment 3: said pin 2 has many circles.
Embodiment 8: the base island exposed type of multi-convex point encloses pin more
Referring to Figure 22～24, Figure 22 (A)～Figure 22 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 8 each operation sketch map.Figure 23 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 8 structural representations.Figure 24 is the vertical view of Figure 23.Can be found out that by Figure 22～24 embodiment 8 is with the difference of embodiment 4: said pin 2 has many circles.
Embodiment 9: a plurality of base island exposed type individual pen pins
Referring to Figure 25～27, Figure 25 (A)～Figure 25 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 9 each operation sketch map.Figure 26 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 9 structural representations.Figure 27 is the vertical view of Figure 26.Can find out that by Figure 25～27 embodiment 9 is with the difference of embodiment 1: said basic island 1 has a plurality of, and pin 2 has individual pen.
Embodiment 10: the base island exposed type individual pen of a plurality of sinkings pin
Referring to Figure 28～30, Figure 28 (A)～Figure 28 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 10 each operation sketch map.Figure 29 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 10 structural representations.Figure 30 is the vertical view of Figure 29.Can find out that by Figure 28～30 embodiment 10 is with the difference of embodiment 2: said basic island 1 has a plurality of, and pin 2 has individual pen.
Embodiment 11: a plurality of baried type bases island individual pen pin
Referring to Figure 31～33, Figure 31 (A)～Figure 31 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 11 each operation sketch map.Figure 32 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 11 structural representations.Figure 33 is the vertical view of Figure 32.Can find out that by Figure 31～33 embodiment 11 is with the difference of embodiment 3: said basic island 1 has a plurality of, and pin 2 has individual pen.
Embodiment 12: the base island exposed type individual pen of a plurality of multi-convex points pin
Referring to Figure 34～36, Figure 34 (A)～Figure 34 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 12 each operation sketch map.Figure 35 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 12 structural representations.Figure 36 is the vertical view of Figure 35.Can find out that by Figure 34～36 embodiment 12 is with the difference of embodiment 4: said basic island 1 has a plurality of, and pin 2 has individual pen.
Embodiment 13: a plurality of base island exposed types enclose pin more
Referring to Figure 37～39, Figure 37 (A)～Figure 37 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 13 each operation sketch map.Figure 38 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 13 structural representations.Figure 39 is the vertical view of Figure 38.Can be found out that by Figure 37～39 embodiment 13 is with the difference of embodiment 1: said basic island 1 has a plurality of, pin 2 has many circles.
Embodiment 14: the base island exposed type of a plurality of sinkings encloses pin more
Referring to Figure 40～42, Figure 40 (A)～Figure 40 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 14 each operation sketch map.Figure 41 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 14 structural representations.Figure 42 is the vertical view of Figure 41.Can be found out that by Figure 40～42 embodiment 14 is with the difference of embodiment 2: said basic island 1 has a plurality of, pin 2 has many circles.
Embodiment 15: a plurality of baried type Ji Dao enclose pin more
Referring to Figure 43～45, Figure 43 (A)～Figure 43 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 15 each operation sketch map.Figure 44 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 15 structural representations.Figure 45 is the vertical view of Figure 44.Can be found out that by Figure 43～45 embodiment 15 is with the difference of embodiment 3: said basic island 1 has a plurality of, pin 2 has many circles.
Embodiment 16: the base island exposed type of a plurality of multi-convex points encloses pin more
Referring to Figure 46～48, Figure 46 (A)～Figure 46 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 16 each operation sketch map.Figure 47 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 16 structural representations.Figure 48 is the vertical view of Figure 47.Can be found out that by Figure 46～48 embodiment 16 is with the difference of embodiment 4: said basic island 1 has a plurality of, pin 2 has many circles.
Embodiment 17: the base island exposed type and the base island exposed type individual pen pin that sinks
Referring to Figure 49～51, Figure 49 (A)～Figure 49 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 17 each operation sketch map.Figure 50 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 17 structural representations.Figure 51 is the vertical view of Figure 50.Can find out by Figure 49～51; Embodiment 17 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the first basic island 1.1; Another group is the second basic island 1.2; The said second basic island 1.2 front middle sections sink; Front at the said first basic island 1.1 and pin 2 is provided with the first metal layer 4; The back side at said first 1.1, the second basic island 1.2, basic island and pin 2 is provided with second metal level 5; Through conduction or non-conductive bonding material 6 chip 7 is set in the second basic island 1.2 positive central sunken regions and 1.1 fronts, the first basic island, chip 7 positive with pin 2 front the first metal layers 4 between and all be connected between chip 7 and the chip 7 with metal wire 8, no filler plastic packaging material 3 is set in zone between zone, the second basic island 1.2 and pin 2 between zone, the first basic island 1.1 and the second basic island 1.2 between zone, pin 2 and the first basic island 1.1 of said pin 2 peripheries and the zone between pin 2 and the pin 2; Said no filler plastic packaging material 3 links into an integrated entity with pin 2 bottoms and pin 2 periphery, pin bottom, pin 2 and 1.1 bottoms, the first basic island, the first basic island 1.1 and 1.2 bottoms, the second basic island, the second basic island 1.2 with pin 2 bottoms, said pin 2 has individual pen.
Embodiment 18: the base island exposed type and the base island exposed type that sinks enclose pin more
Referring to Figure 52～54, Figure 52 (A)～Figure 52 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 18 each operation sketch map.Figure 53 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 18 structural representations.Figure 54 is the vertical view of Figure 53.Can be found out that by Figure 52～54 embodiment 18 is with the difference of embodiment 17: said pin 2 has many circles.
Embodiment 19: base island exposed type and baried type base island individual pen pin
Referring to Figure 55～57, Figure 55 (A)～Figure 55 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 19 each operation sketch map.Figure 56 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 19 structural representations.Figure 57 is the vertical view of Figure 56.Can find out by Figure 55～57; Embodiment 19 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the first basic island 1.1; Another group is the 3rd basic island 1.3; Front at said first the 3rd basic island 1.3, basic island 1.1 and pin 2 is provided with the first metal layer 4; The back side at the said first basic island 1.1 and pin 2 is provided with second metal level 5; Chip 7 positive with pin 2 front the first metal layers 4 between and all be connected between chip 7 and the chip 7 with metal wire 8; No filler plastic packaging material 3 is set in zone and the zone between pin and the pin between zone, the 3rd basic island 1.3 and pin 2 between zone, 1.3 back sides, the 3rd basic island, the 3rd basic island 1.3 and the first basic island 1.1 between zone, pin 2 and the first basic island 1.1 of said pin 2 peripheries, and said no filler plastic packaging material 3 links into an integrated entity periphery, pin bottom, pin 2 and 1.1 bottoms, the first basic island, 1.3 back sides, the 3rd basic island, the 3rd 1.3 back sides, basic island and 1.1 bottoms, the first basic island, the 3rd 1.3 back sides, basic island and pin 2 bottoms and pin 2 with pin 2 bottoms, and said pin 2 is provided with individual pen.
Embodiment 20: base island exposed type and baried type Ji Dao enclose pin more
Referring to Figure 58～60, Figure 58 (A)～Figure 58 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 20 each operation sketch map.Figure 59 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 20 structural representations.Figure 60 is the vertical view of Figure 59.Can be found out that by Figure 58～60 embodiment 20 is with the difference of embodiment 19: said pin (2) has many circles.
Embodiment 21: the base island exposed type individual pen of base island exposed type and multi-convex point pin
Referring to Figure 61～63, Figure 61 (A)～Figure 61 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 21 each operation sketch map.Figure 62 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 21 structural representations.Figure 63 is the vertical view of Figure 62.Can find out by Figure 61～63; Embodiment 21 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the first basic island 1.1; Another group is the 4th basic island 1.4; Multi-convex point shape structure is arranged in 1.4 fronts, the said the 4th basic island; No filler plastic packaging material 3 is set in zone between zone, the 4th basic island 1.4 and pin 2 between zone, the first basic island 1.1 and the 4th basic island 1.4 between zone, pin 2 and the first basic island 1.1 of said pin 2 peripheries and the zone between pin 2 and the pin 2, and said packless plastic packaging material (epoxy resin) 3 links into an integrated entity with pin 2 bottoms and pin 2 periphery, pin bottom, pin 2 and 1.1 bottoms, the first basic island, the first basic island 1.1 and 1.4 bottoms, the 4th basic island, the 4th basic island 1.4 with pin 2 bottoms, and said pin 2 is provided with individual pen.
Embodiment 22: the base island exposed type of base island exposed type and multi-convex point encloses pin more
Referring to Figure 64～66, Figure 64 (A)～Figure 64 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 22 each operation sketch map.Figure 65 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 22 structural representations.Figure 66 is the vertical view of Figure 65.Can be found out that by Figure 64～66 embodiment 22 is with the difference of embodiment 21: said pin 2 has many circles.
Embodiment 23: the base island exposed type individual pen of base island exposed type and baried type pin sinks
Referring to Figure 67～69, Figure 67 (A)～Figure 67 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 23 each operation sketch map.Figure 68 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 23 structural representations.Figure 69 is the vertical view of Figure 68.Can find out by Figure 67～69; Embodiment 23 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the second basic island 1.2; Another group is the 3rd basic island 1.3; The said second basic island 1.2 front middle sections sink; Through conduction or non-conductive bonding material 6 chip 7 is set in the second basic island 1.2 positive central sunken regions and 1.3 fronts, the 3rd basic island; No filler plastic packaging material 3 is set in zone and the zone between pin and the pin between zone, the 3rd 1.3 back sides, basic island and pin 2 between zone, 1.3 back sides, the 3rd basic island, the second Ji Dao back side 1.2 and the second basic island 1.2 between zone, pin 2 and the second basic island 1.2 of said pin 2 peripheries, and said no filler plastic packaging material 3 links into an integrated entity periphery, pin bottom, pin 2 and 1.2 bottoms, the second basic island, the 3rd the 1.3, the 3rd basic island 1.3, basic island and 1.2 bottoms, the second basic island, the 3rd 1.3 back sides, basic island and pin 2 bottoms and pin 2 with pin 2 bottoms, and said pin 2 is provided with a circle.
Embodiment 24: the base island exposed type of base island exposed type and baried type that sinks encloses pin more
Referring to Figure 70～72, Figure 70 (A)～Figure 70 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 24 each operation sketch map.Figure 71 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 24 structural representations.Figure 72 is the vertical view of Figure 71.Can be found out that by Figure 70～72 embodiment 24 is with the difference of embodiment 23: said pin 2 has many circles.
Embodiment 25: the base island exposed type individual pen of base island exposed type and multi-convex point pin sinks
Referring to Figure 73～75, Figure 73 (A)～Figure 73 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 25 each operation sketch map.Figure 74 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 25 structural representations.Figure 75 is the vertical view of Figure 74.Can find out by Figure 73～75; Embodiment 25 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the second basic island 1.2; Another group is the 4th basic island 1.4; The said second basic island 1.2 front middle sections sink; Multi-convex point shape structure is arranged in 1.4 fronts, the 4th basic island; Front at the said the 4th basic island 1.4 and pin 2 is provided with the first metal layer 4; The back side at said second the 1.2, the 4th basic island 1.4, basic island and pin 2 is provided with second metal level 5, through conduction or non-conductive bonding material 6 chip 7 is set in the said second basic island 1.2 positive central sunken regions and 1.4 fronts, the 4th basic island, and no filler plastic packaging material 3 is set in zone between zone, the 4th basic island 1.4 and pin 2 between zone, the second basic island 1.2 and the 4th basic island 1.4 between zone, pin 2 and the second basic island 1.2 of said pin 2 peripheries and the zone between pin 2 and the pin 2; Said packless plastic packaging material (epoxy resin) 3 links into an integrated entity with pin 2 bottoms and pin 2 periphery, pin bottom, pin 2 and 1.2 bottoms, the second basic island, the second basic island 1.2 and 1.4 bottoms, the 4th basic island, the 4th basic island 1.4 with pin 2 bottoms, said pin 2 is provided with a circle.
Embodiment 26: the base island exposed type of base island exposed type and multi-convex point that sinks encloses pin more
Referring to Figure 76～78, Figure 76 (A)～Figure 76 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 26 each operation sketch map.Figure 77 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 26 structural representations.Figure 78 is the vertical view of Figure 77.Can be found out that by Figure 76～78 embodiment 26 is with the difference of embodiment 25: said pin 2 has many circles.
Embodiment 27: the base island exposed type individual pen of baried type Ji Dao and multi-convex point pin
Referring to Figure 79～81, Figure 79 (A)～Figure 79 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 27 each operation sketch map.Figure 80 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 27 structural representations.Figure 81 is the vertical view of Figure 80.Can find out by Figure 79～81; Embodiment 27 is with the difference of embodiment 1: said basic island 1 has two groups also can be many group Ji Dao; One group is the 3rd basic island 1.3; Another group is the 4th basic island 1.4; Multi-convex point shape structure is arranged in 1.4 fronts, the said the 4th basic island; Front at the said the 3rd the 1.3, the 4th basic island 1.4, basic island and pin 2 is provided with the first metal layer 4; The back side at the said the 4th basic island 1.4 and pin 2 is provided with second metal level 5; No filler plastic packaging material 3 is set in zone and the zone between pin and the pin between zone, the 3rd basic island 1.3 and pin 2 between zone, 1.3 back sides, the 3rd basic island, the second basic island 1.2 and the 4th basic island 1.4 between zone, pin 2 and the 4th basic island 1.4 of said pin 2 peripheries, and said no filler plastic packaging material 3 links into an integrated entity periphery, pin bottom, pin 2 and 1.4 bottoms, the 4th basic island, 1.3 back sides, the 3rd basic island, the 3rd 1.3 back sides, basic island and 1.4 bottoms, the 4th basic island, the 3rd 1.3 back sides, basic island and pin 2 bottoms and pin 2 with pin 2 bottoms, and said pin 2 is provided with a circle.
Embodiment 28: the base island exposed type of baried type Ji Dao and multi-convex point encloses pin more
Referring to Figure 82～84, Figure 82 (A)～Figure 82 (R) is the two-sided graphic chips formal dress of the present invention module method for packing embodiment 28 each operation sketch map.Figure 83 is the two-sided graphic chips formal dress of the present invention module package structure embodiment 28 structural representations.Figure 84 is the vertical view of Figure 83.Can be found out that by Figure 82～84 embodiment 28 is with the difference of embodiment 27: said pin 2 has many circles.

Claims (15)

1. two-sided graphic chips formal dress module package structure; Comprise Ji Dao (1), pin (2), packless plastic packaging material (3), conduction or non-conductive bonding material (6), chip (7), metal wire (8) and filler plastic packaging material (9) is arranged; Said pin (2) front extends to Ji Dao (1) next door; Front at said Ji Dao (1) and pin (2) is provided with the first metal layer (4); The back side at said Ji Dao (1) and pin (2) is provided with second metal level (5); Upward be provided with chip (7) at said Ji Dao (1) front the first metal layer (4) through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between be connected with metal wire (8); Outside the top of said Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9), zone between peripheral zone, pin (2) and the Ji Dao (1) of said Ji Dao (1) and pin (2) and the zone between pin (2) and the pin (2) are equipped with packless plastic packaging material (3), and said packless plastic packaging material (3) links into an integrated entity Ji Dao (1) and periphery, pin bottom, pin (2) bottom and Ji Dao (1) bottom and pin (2) bottom and pin (2) bottom; And make said Ji Dao and pin back side size less than Ji Dao and the positive size of pin; Form up big and down small Ji Dao and pin configuration, it is characterized in that: be provided with pillar (10) at said pin (2) back side, pillar (10) root is imbedded in the said packless plastic packaging material (3).
2. the method for packing of a two-sided according to claim 1 graphic chips formal dress module package structure is characterized in that said method comprises following processing step:
Step 1, get metal substrate
Get the suitable metal substrate of a slice thickness,
Step 2, metal substrate front and back side lining photoresistance glued membrane
Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging,
The positive photoresistance glued membrane of step 3, metal substrate needs the exposure of plated metal layer region/develop and windows
The metal substrate front that utilizes exposure imaging equipment that step 2 is accomplished photoresistance glued membrane lining operation is carried out exposure imaging and is removed part photoresistance glued membrane, carries out the zone of electroplated metal layer to expose the positive follow-up needs of metal substrate,
The zone of having windowed in step 4, metal substrate front is carried out metal level and is electroplated lining
The first metal layer plating lining is carried out in zone to having windowed in metal substrate front in the step 3, and this first metal layer places the front of said Ji Dao and pin,
Photoresistance glued membrane striping is carried out at step 5, metal substrate front and the back side
The positive remaining photoresistance glued membrane of metal substrate and the photoresistance glued membrane at the metal substrate back side are all removed,
Step 6, metal substrate front and back side lining photoresistance glued membrane
Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up etch process operation,
The photoresistance glued membrane of step 7, metal substrate needs the exposure of two-sided etching area/develop and windows
Exposure imaging removal part photoresistance glued membrane is carried out at the metal substrate front and the back side that utilize exposure imaging equipment that step 6 is accomplished photoresistance glued membrane lining operation, prepares against the two-sided etching operation of metal substrate that follow-up needs carry out to expose the localized metallic substrate,
Step 8, metal substrate carry out two-sided etching operation
After the exposure/development and windowing task of completing steps seven; The etching operation of promptly carrying out each figure at the front and the back side of metal substrate; Etch the front and back of Ji Dao and pin; Simultaneously the pin front is extended to next door, basic island as much as possible, and make the positive size of the back side size of said Ji Dao and pin, form up big and down small Ji Dao and pin configuration less than Ji Dao and pin; And form pillar at the pin back side, and at the company's of leaving muscle between Ji Dao and the pin and between pin and the pin,
Photoresistance glued membrane striping is carried out at step 9, metal substrate front and the back side
The photoresistance glued membrane that the metal substrate front and back is remaining all removes, and processes lead frame,
Step 10, load
On front, the basic island the first metal layer of the lead frame that step 9 is processed, carry out the implantation of chip through conduction or non-conductive bonding material,
Step 11, break metal wire
The semi-finished product of accomplishing chip implantation operation are carried out playing the metal wire operation between chip front side and the pin front the first metal layer,
Step 12, be encapsulated with the filler plastic packaging material
The semi-finished product front that routing is accomplished is encapsulated with the operation of filler plastic packaging material, and carries out the curing operation after plastic packaging material is sealed, and makes top and the chip of Ji Dao and pin and metal wire all had the filler plastic packaging material to seal outward,
Step 13, lining photoresistance glued membrane
Utilization by coating equipment will accomplish the half-finished front that is encapsulated with the operation of filler plastic packaging material and the back side be covered respectively the photoresistance glued membrane that can carry out exposure imaging with, protecting follow-up etch process operation,
Step 14, accomplish the exposure that the half-finished back side that is encapsulated with the operation of filler plastic packaging material needs etching area/develop and windowing
Exposure imaging removal part photoresistance glued membrane is carried out at the semi-finished product back side that is encapsulated with the operation of filler plastic packaging material of accomplishing that utilizes exposure imaging equipment that step 13 is accomplished photoresistance glued membrane lining operation; To expose company's muscle that leaves after the two-sided etching operation of step 8 metal substrate and the pillar that forms at the pin back side; Carry out the pillar root and connect muscle etching operation in order to follow-up needs
Step 15, the operation of etching for the second time
After the exposure/development and windowing task of completing steps 14; Promptly carry out the etching operation of each figure at the semi-finished product back side that completion is encapsulated with the operation of filler plastic packaging material; The company's muscle that leaves after the two-sided etching operation of step 8 metal substrate is all etched away; Root at pillar described in this process also can etch away relative thickness simultaneously, makes the pillar root not expose the encapsulating structure back side after sealing
Photoresistance glued membrane striping is carried out at step 10 six, semi-finished product front and the back side
Photoresistance glued membrane that the semi-finished product back side of completing steps 15 etching operations is remaining and the positive photoresistance glued membrane of semi-finished product all remove,
Step 10 seven, seal packless plastic packaging material
Packless plastic packaging material operation is sealed at the semi-finished product back side of completing steps 16 said striping operations; And carry out the curing operation after plastic packaging material is sealed; Make the peripheral zone of Ji Dao and pin; Packless plastic packaging material is all set in zone between pin and the basic island and the zone between pin and the pin; This packless plastic packaging material is peripheral with Ji Dao and pin bottom; Pin bottom and Ji Dao bottom and pin bottom and pin bottom link into an integrated entity; And said pillar root is imbedded in this packless plastic packaging material
The back side of step 10 eight, Ji Dao and pin is carried out metal level and is electroplated lining
The back side that completing steps 17 is sealed said Ji Dao and the pin of the operation of no filler plastic packaging material is carried out second metal level and is electroplated the lining operation,
Step 10 nine, cutting finished product
The semi-finished product of ten eight the second metal levels of completing steps being electroplated lining carry out cutting operation, make originally more than of chips that connect together with array formula aggregate mode independent, make two-sided graphic chips formal dress module package structure finished product.
3. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) back side exposes said packless plastic packaging material (3).
4. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) front middle section sinks.
5. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) back side imbeds in the said packless plastic packaging material (3).
6. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that said Ji Dao (1) front is arranged to multi-convex point shape structure.
7. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is single to it is characterized in that said Ji Dao (1) has, and pin (2) has many circles.
8. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is a plurality of to it is characterized in that said Ji Dao (1) has, and pin (2) has individual pen.
9. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is a plurality of to it is characterized in that said Ji Dao (1) has, and pin (2) has many circles.
10. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is second Ji Dao (1.2); Said second Ji Dao (1.2) front middle section sinks; Front at said first Ji Dao (1.1) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1), second Ji Dao (1.2) and pin (2) is provided with second metal level (5); Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and first Ji Dao (1.1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Nos filler plastic packaging material (3) is set in zone between zone, second Ji Dao (1.2) and pin (2) between zone, first Ji Dao (1.1) and second Ji Dao (1.2) between peripheral zone, pin (2) and first Ji Dao (1.1) of said pin (2) and the zone between pin (2) and the pin (2), and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) and first Ji Dao (1.1) bottom, first Ji Dao (1.1) and second Ji Dao (1.2) bottom, second Ji Dao (1.2) and pin (2) bottom and pin (2) and pin (2) bottom link into an integrated entity, and said pin (2) is provided with individual pen or encloses more.
11. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 3rd Ji Dao (1.3); Front at said first Ji Dao (1.1) the 3rd Ji Dao (1.3) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1) and pin (2) is provided with second metal level (5); Be provided with chip (7) in Ji Dao (1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Outside the top of said Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and first Ji Dao (1.1) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery, and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen or enclose more.
12. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; No filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, first Ji Dao (1.1) and the 4th Ji Dao (1.4) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with first Ji Dao (1.1) bottom, first Ji Dao (1.1), and said pin (2) is provided with individual pen or many circles.
13. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups or organize Ji Dao more; One group is second Ji Dao (1.2); Another group is the 3rd Ji Dao (1.3); Said second Ji Dao (1.2) front middle section sinks; Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and the 3rd Ji Dao (1.3) front through conduction or non-conductive bonding material (6); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) back side and pin (2) between zone, the 3rd Ji Dao (1.3) back side, the second Ji Dao back side (1.2) and second Ji Dao (1.2) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery; Said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2) with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3), the 3rd Ji Dao (1.3), and said pin (2) is provided with individual pen.
14. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is second Ji Dao (1.2); Another group is the 4th Ji Dao (1.4); Said second Ji Dao (1.2) front middle section sinks; The 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said second Ji Dao (1.2), the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5), is provided with chip (7) in positive central sunken regions of said second Ji Dao (1.2) and the 4th Ji Dao (1.4) front through conduction or non-conductive bonding material (6), and no filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with second Ji Dao (1.2) bottom, second Ji Dao (1.2), and said pin (2) is provided with individual pen or many circles.
15. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is the 3rd Ji Dao (1.3); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 3rd Ji Dao (1.3), the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and the 4th Ji Dao (1.4) of said pin (2) periphery; Said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen or many circles.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1635635A (en) * 2004-12-17 2005-07-06 江苏长电科技股份有限公司 Directly connected chip packaging structure
CN201051498Y (en) * 2007-05-30 2008-04-23 宁波康强电子股份有限公司 Integrated circuit out lead framework

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100744138B1 (en) * 2006-06-22 2007-08-01 삼성전자주식회사 Bga semiconductor package and method of fabricating the same
US7989930B2 (en) * 2007-10-25 2011-08-02 Infineon Technologies Ag Semiconductor package
TWI364820B (en) * 2008-03-07 2012-05-21 Chipmos Technoligies Inc Chip structure
CN201936875U (en) * 2010-09-04 2011-08-17 江苏长电科技股份有限公司 Double-sided graphic chip normal-mounting module packaging structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1635635A (en) * 2004-12-17 2005-07-06 江苏长电科技股份有限公司 Directly connected chip packaging structure
CN201051498Y (en) * 2007-05-30 2008-04-23 宁波康强电子股份有限公司 Integrated circuit out lead framework

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