CN101922042A - 一种外延片托盘及与其配合的支撑和旋转联接装置 - Google Patents

一种外延片托盘及与其配合的支撑和旋转联接装置 Download PDF

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CN101922042A
CN101922042A CN201010263418.3A CN201010263418A CN101922042A CN 101922042 A CN101922042 A CN 101922042A CN 201010263418 A CN201010263418 A CN 201010263418A CN 101922042 A CN101922042 A CN 101922042A
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pallet
drive shaft
tray
counterbore
rotating shaft
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CN101922042B (zh
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金小亮
陈爱华
孙仁君
张伟
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Jiangsu Zhongcheng Semi-Conductor Equipment Co Ltd
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Huacheng Photoelectric Equipment (hong Kong) Co Ltd
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Abstract

用于MOCVD反应腔的外延片托盘及与其配合的支撑和旋转联接装置,在机械装卸托盘时,通过托盘底部中心向外凸出的转轴,插入与其垂直的驱动轴顶部的沉孔中,利用分别设置的平行于托盘表面的接触面或对应侧面上的接触面支撑托盘,利用该接触面间的摩擦传动当驱动轴旋转时,带动托盘旋转。通过设置轴向定位槽和定位键,从摩擦传动转变为接触传动,保证托盘转动与驱动轴转动一致,提高托盘在中高速下长期转动的可靠性。凸出的托盘转轴易于对摩擦接触的表面进行加工处理,在保证托盘上对应部位的机械强度的条件下,不增加托盘的整体厚度,减少了托盘的热容量,从而减少了托盘加热与冷却需要的时间,提高了生产效率并有利于外延反应需要的快速温度调节控制。

Description

一种外延片托盘及与其配合的支撑和旋转联接装置
技术领域
本发明涉及一种用于生产化合物半导体光电器件的MOCVD(金属有机化学气相沉淀)系统中通过机械手取放的外延片托盘以及与其配合从中心处支撑并且带动托盘旋转的联接装置。
背景技术
金属有机化学气相沉淀系统(以下简称MOCVD系统)是一种用于外延生长半导体薄膜,以形成如LED(发光二极管)等半导体器件的设备。
在大规模生产时,通常使用批处理方式来提高系统产量,即将一批多片外延片40(或称外延芯片、衬底芯片等)一起放入MOCVD系统的反应腔中,完成外延生长后,再更换新的一批外延片40,开始下一轮的反应处理。若干外延片40被放置在同一个衬底托盘10上(图1),自动化生产需要在反应腔中以机械手装卸该托盘10,来实现上述一批外延片40同时外延生长、同时取放的批处理过程。
在外延片托盘下方一般设置有加热器,通过其中围绕托盘圆心排列的加热元件,对托盘进行加热。由于设计上的限制和制造上的差异,加热器上各点的温度不可能完全一样,因此在加热过程中通过旋转托盘可以使托盘径向上的温度趋于均匀一致。此外,托盘的旋转还是多个外延片的表面取得均匀的气体浓度和均匀的气体速度等边界条件的一个关键控制手段,因此其转速需要在一个很大范围内可以调节,并使托盘在需要的转速范围内可以平稳运行。
目前有两种典型的支撑托盘并且带动托盘旋转的方式。如图2所示,是一种从边缘支撑并带动托盘旋转的MOCVD系统。该MOCVD系统的反应腔中,设置有支撑筒51,从下方与放置若干外延片40的托盘10的边缘位置接触,来支撑该托盘10,保证托盘10的中心落在支撑面内,因此托盘10在静态时很稳定。所述加热器30的加热元件在托盘下方,特别是在其中心位置可以连续设置,保证托盘10中心的温度环境与其他位置一致。
然而,该种托盘10的旋转,是由支撑筒51的底盘511下方、中间位置的驱动轴20带动,传递转动使用的部件多,调节托盘10水平度和动平衡都很困难,而且部件多转动惯量大,该种从边缘支撑并带动托盘10旋转的装置一般适用于低速转动的情况。
如图3或图4所示,是从中心支撑并且带动托盘10旋转的MOCVD系统。其中,托盘10底部中间位置设置有凹入的沉孔101,其底面与托盘10的上表面平行。与该圆柱形(图3)或圆锥形(图4)等形状的沉孔101相匹配,对应将驱动轴20顶端圆柱形或圆锥形的部分201,垂直插入该托盘10的沉孔101中。通过驱动轴20的表面与托盘10沉孔101的表面接触,成为托盘10的支撑面,并在摩擦力作用下,由驱动轴20带动托盘10一起旋转。
由于结构简单、部件少,该种MOCVD系统的动平衡易于调节,由机械手对托盘10进行取出和放入的操作也很容易。而且由于使用的部件少,转动惯量也相对小,适合在中高速转动的情况下使用;并且通过摩擦力即可驱动托盘10的转速跟随驱动轴20的转速,方便了速度的控制。
当采用石墨作为托盘10材料时,为了增强接触面上的摩擦力和抗摩擦强度,需要有特殊的表面加工处理,由于该接触面落在沉孔101里,增加了表面加工处理的难度。
在托盘10上加工沉孔101会使得托盘10相应部位的厚度减薄,机械强度降低,为保证沉孔101部位的机械强度,往往要使托盘10的整体厚度增加,因而造成托盘10的重量增加,导致热容量增加,延长了加热或冷却需要的时间。
发明内容
本发明的目的是提供一种外延片托盘及与其配合的支撑和旋转联接装置,通过机械手在反应腔里取放、更换托盘,使托盘能与底部中心位置的驱动轴耦合,由驱动轴带动在各种需要的转速下平稳转动,对放在托盘上的若干外延片或衬底基片进行处理。
为了达到上述目的,本发明的技术方案是提供一种外延片托盘及与其配合的支撑和旋转联接装置,包含放置在MOCVD系统的反应腔中可机械装卸的托盘,以及从下方与所述托盘的底面中心外凸转轴耦合连接的垂直驱动轴;所述反应腔中引入有若干反应气体,对所述托盘上放置的若干外延片进行外延反应或薄膜沉积。
所述若干外延片对应放置在托盘上表面开设的若干浅凹盘内。
所述托盘的底部中间设置有向下凸出的托盘转轴,其对应插入所述驱动轴顶部开设的沉孔中,通过托盘转轴与沉孔上对应设置的接触面的摩擦传动或轴向接触传动,使所述驱动轴旋转时,支撑并带动与其耦合连接的所述托盘旋转。
所述用于MOCVD系统的外延片托盘及其旋转装置,还包含与所述驱动轴连接的旋转密封装置、旋转驱动装置,以及设置在所述托盘下方的加热器;
所述驱动轴向下穿过所述加热器,并通过所述旋转密封装置从反应腔的底部引出,与旋转驱动装置连接;
由所述旋转驱动装置带动所述驱动轴旋转,并使所述托盘与驱动轴一起旋转,使加热器能对所述托盘均匀加热,并在外延片上获得均匀反应气体。
在一种实施例中,所述托盘转轴是向下凸出的阶梯形,包含一设置在托盘底部的第一凸台,以及设置在第一凸台下、直径较小的第二凸台;
所述第一凸台底端的环形端面与所述托盘的上表面、底面均平行;
所述沉孔的环形顶面与所述驱动轴的轴心垂直;
所述托盘转轴的第二凸台对应插入所述沉孔时,使所述第一凸台底端的环形端面与所述沉孔的环形顶面相接触,支撑托盘,并通过摩擦传动,使所述驱动轴带动托盘一起旋转。
所述第二凸台的高度a1小于所述沉孔的深度b1,使第二凸台完全插入所述沉孔时,并在所述第二凸台的底面与沉孔的底面之间留有空隙,使所述第一凸台的环形端面与所述沉孔的环形顶面能可靠接触。
所述第一凸台是圆柱形;所述第二凸台是直径小于第一凸台的圆柱形或圆锥形。
在另一种实施例中,所述向下凸出的托盘转轴,对应插入所述沉孔时,使所述托盘转轴底端的台阶端面与所述沉孔的底面相接触,支撑托盘,并通过摩擦传动,使所述驱动轴带动托盘一起旋转;
所述台阶端面与所述托盘的上表面、底面均平行。
所述沉孔的底面与所述驱动轴的轴心垂直;
所述托盘转轴的高度a2大于所述沉孔的深度b2,使托盘转轴的一部分插入该沉孔中,并在所述驱动轴的顶面与托盘的底面之间留有空隙,使所述台阶端面与沉孔的底面能可靠接触。
所述托盘转轴是圆柱形或圆锥形。
还有一种实施例中,所述向下凸出的托盘转轴对应插入与其形状相匹配的沉孔中,通过托盘转轴的台阶侧面与驱动轴沉孔的侧面相接触,作为托盘转轴与驱动轴之间摩擦传动的接触面,使驱动轴能带动托盘一起旋转。
所述托盘转轴是圆柱形或圆锥形,所述驱动轴是圆柱形或圆锥形。
在另一种实施例中,在所述托盘转轴上和对应的沉孔上分别设置若干轴向定位装置,通过该定位装置在旋转方向上的至少一对接触面耦合,当驱动轴旋转时带动托盘旋转。
所述轴向定位装置分别是设置在托盘转轴侧面的若干定位键,以及在驱动轴沉孔的侧面,对应开设的若干定位槽;
所述托盘转轴插入沉孔时,所述定位键与定位槽的位置,由设置在所述旋转驱动装置上的转角位置传感器对准,转动时至少一个定位键的侧端面与定位槽的侧端面相接触,使托盘与驱动轴同步旋转。
与现有技术相比,本发明的优点在于,提出了一种可机械装卸的外延片托盘,通过在其底部中心设置向下凸出的托盘转轴,对应插入驱动轴顶部的沉孔中耦合联接。通过托盘转轴和驱动轴沉孔上,分别设置的一对平行于托盘表面的接触端面进行摩擦传动,或是通过托盘转轴和驱动轴沉孔上对应侧面的接触进行摩擦传动,使托盘在驱动轴的带动下,能在各种需要的转速下平稳转动,并使托盘上的若干外延片通过托盘底部的加热器均匀加热,并在外延片上获得均匀的气体浓度、均匀的气体速度的边界层,对外延片进行外延反应或薄膜沉积处理。
而且,本发明还在托盘转轴和驱动轴沉孔的侧面对应设置若干定位槽和定位键,通过其在旋转方向的接触面传动,使托盘与驱动轴的转速同步。避免了由于摩擦传动而引起的部件磨损,提高了在中高速旋转条件下长期使用的可靠性,减少了托盘的更换,从而减少了外延片的生产成本。
由于托盘转轴具有向下凸出的结构,使其与驱动轴摩擦传动的接触面在托盘底部的外面,容易进行表面加工处理。
凸出的托盘转轴,不需要额外增加托盘的整体厚度,即能保证该处的机械强度,因此,使制造托盘的材料消耗减少,更减轻了托盘的重量,减少了其热容量,从而减少了托盘加热与冷却的时间,提高了生产效率,亦提高了外延反应温度调节控制的能力。
附图说明
图1是MOCVD系统中若干外延片排列放置在托盘上的示意图;
图2是现有一种从边缘支撑并带动托盘旋转的MOCVD系统的结构示意图;
图3是现有一种从中心支撑并且带动托盘旋转的MOCVD系统的结构示意图;
图4是现有另一种从中心支撑并且带动托盘旋转的MOCVD系统的结构示意图;
图5是本发明可机械装卸的外延片托盘及其旋转装置与MOCVD系统的连接关系示意图;
图6是本发明用于MOCVD系统的外延片托盘及其旋转装置在实施例1中通过平行端面接触摩擦传动的结构示意图;
图7是本发明用于MOCVD系统的外延片托盘及其旋转装置在实施例2中通过平行端面接触摩擦传动的结构示意图;
图8是本发明用于MOCVD系统的外延片托盘及其旋转装置在实施例3中通过侧面接触摩擦传动的结构示意图;
图9是本发明用于MOCVD系统的外延片托盘及其旋转装置在实施例4中通过固定接触传动的结构示意图;
图10是本发明在实施例4中用于固定接触传动的托盘转轴端面的一种结构仰视图;
图11是本发明在实施例4中用于固定接触传动的驱动轴端面的一种结构俯视图。
具体实施方式
以下结合附图说明本发明的多个具体实施方式。
如图5所示,本发明所述可机械装卸的圆形托盘10,放置在MOCVD系统的反应腔50中;该托盘10的上表面11与底面12平行,在上表面11上围绕中心开设有若干浅凹盘,用于排列放置多个外延片40(图1)。所述旋转装置是垂直设置的驱动轴20,通过机械手取放托盘10,使托盘10底部中间、向下凸出的托盘转轴100,对应插入驱动轴20顶部开设的沉孔200中,将驱动轴20与托盘10耦合连接。该驱动轴20向下穿过所述托盘10下方的加热器30,并通过一个旋转密封装置21从反应腔50的底部引出,与旋转驱动装置22连接。
若干反应气体从反应腔50顶部进入,在托盘10的外延片40上进行外延反应或薄膜沉积后,从反应腔50下部排出。在对外延片40处理的过程中,由所述旋转驱动装置22的马达带动驱动轴20旋转,并通过相互的耦合使托盘10与驱动轴20能同步旋转,使加热器30能对托盘10均匀加热,并在外延片40上获得均匀的反应气体。
由于托盘转轴100具有向下凸出的结构,不需要增加托盘10的整体厚度,即能保证机械强度,因此,使制造托盘10的材料消耗减少,更减轻了托盘10的重量,从而减少了其热容量。
由于托盘转轴100具有向外凸出的结构,转轴上与驱动轴的接触面凸出在托盘底部的外面,该表面的加工处理容易实施。
本发明所述可机械装卸的托盘10,与底部中心的驱动轴20耦合,可通过以下多种结构使下凸的托盘转轴100与驱动轴20沉孔200的接触,通过摩擦传动或者接触传动实现由驱动轴20带动的托盘10的旋转。
实施例1
如图5或图6所示,在本实施例中,所述托盘10底部中心位置的托盘转轴100,是向下凸出的阶梯形,包含一设置在托盘10底部的圆柱形的第一凸台110,以及设置在第一凸台110下、直径较小的圆柱形(图5)或圆锥形(图6)的第二凸台120。所述第一凸台110的环形端面111与托盘10的上表面11、底面12均平行。
所述驱动轴20的顶端开设有一沉孔200,该沉孔200的环形顶面211与驱动轴20的轴心垂直。在托盘10放入反应腔50时,将上述托盘转轴100的第二凸台120完全插入该沉孔200中,由第二凸台120的侧面112作为托盘10垂直方向的导向和平面上定位,使直径较大的第一凸台110的环形端面111放在驱动轴20的环形顶面211上,在垂直方向上定位托盘10在反应腔50里的位置,并由驱动轴20支撑托盘10。所述驱动轴20的环形顶面211作为托盘10支撑的有效面积,由该驱动轴20的沉孔200的内外直径决定。
所述第二凸台120的高度a1必须小于沉孔200的深度b1,使第二凸台120插入沉孔200时,第二凸台120的底面113与沉孔200的底面212之间留有空隙,保证第一凸台110的环形端面111与环形顶面211的可靠接触。在外延反应时,所述第一凸台110的环形端面111和驱动轴20的环形顶面211,作为托盘转轴100与驱动轴20相互摩擦传动的接触面,驱动所述托盘10与驱动轴20一起旋转。
实施例2
如图7所示,在本实施例中,所述托盘10底部中心位置的托盘转轴100,是向下凸出的一个圆柱形或圆锥形的台阶(图中未示出),该台阶端面121与托盘10的上表面11、底面12均平行。
托盘转轴100经由其台阶侧面122进行平面的定位,使其插入驱动轴20顶端开设的沉孔200时,台阶端面121落在沉孔200底面222上,在垂直方向上定位了托盘10在反应腔50里的位置,并且由驱动轴20支撑托盘10。所述驱动轴20的沉孔200的底面222支撑托盘10的有效面积,由托盘转轴100的直径决定。
托盘转轴100插入沉孔200时,所述台阶端面121与沉孔200底面222相匹配且相接触,作为托盘转轴100与驱动轴20相互摩擦传动的接触面,驱动所述托盘10与驱动轴20一起旋转。托盘转轴100的高度a2必须大于沉孔200的深度b2,使托盘转轴100的一部分插入沉孔200中,驱动轴20的顶面221与托盘10的底面12之间留有空隙,保证台阶端面121与沉孔200的底面222的可靠接触。
实施例3
与上述实施例1、2中主要通过托盘转轴100与驱动轴20上,平行于托盘10上表面11、底面12的一对接触面的配合,带动托盘10与驱动轴20一起旋转的结构不同。
如图8所示,本实施例中,托盘转轴100向下设置有凸出托盘10底面12的台阶,可以是圆柱形或圆锥形,相对应地将驱动轴20顶端的沉孔200也设置为圆柱形或圆锥形或其他与托盘转轴100相匹配的形状,使托盘转轴100插入沉孔200后,通过托盘转轴100的台阶侧面131与驱动轴20沉孔200的侧面231相接触,支撑托盘10,并且作为托盘转轴100与驱动轴20相互摩擦传动的接触面,使托盘10跟随驱动轴20一起旋转。
实施例4
如图9至图11所示,在一些优选的实施方式中,在凸出的托盘转轴100和驱动轴20的沉孔200上分别设置轴向的定位装置,通过定位装置的耦合,对应增加了旋转方向上的若干对接触面,保证托盘10转速与驱动轴20转速的一致。
具体地,可在托盘转轴100的侧面设置若干向外凸出的定位键140,在驱动轴20沉孔200的侧面对应位置,开设若干形状匹配的定位槽240。在托盘10放入反应腔50时,通过设置在旋转驱动装置22上的转角位置传感器,对准该定位键140和定位槽240的位置,将托盘转轴100插入沉孔200,使定位键140的侧端面141与定位槽240的侧端面241相接触,通过轴向的接触传动使托盘10与驱动轴20一起旋转,且两者转速能保持一致。
如图10所示,是托盘转轴100上设置一对定位键140的一种可选的结构示意。图11所示,是驱动轴20的沉孔200中设置十字形定位槽240的一种结构示意,此时,托盘转轴100上的定位键140亦可对应设置成十字形,来增加旋转方向的接触面。或是可将图10所示的定位键140插入图11所示的十字形定位槽240,定位槽240中的任意一对都可与定位键140匹配,方便托盘10与驱动轴20的定位对准。
由于在旋转方向上增加了定位槽240与定位键140的若干对接触面,尤其在中高速旋转的条件下,使驱动轴20带动托盘10同步旋转时不再依靠摩擦传动,长期使用可靠性高,减少了托盘10因为磨损而造成的更换,从而减少了外延片40的生产成本。
综上所述,本发明提出了一种放置若干外延片40的托盘10,通过在底部中心设置向下凸出的托盘转轴100,对应插入驱动轴20顶部的沉孔200中耦合联接,方便由机械手在反应腔50里进行取放和更换。
本发明通过托盘转轴100和驱动轴20沉孔200上,分别设置的一对平行于托盘10表面的接触端面进行摩擦传动,或是通过托盘转轴100和驱动轴20沉孔200上对应侧面的接触进行摩擦传动,使托盘10在驱动轴20的带动下,能在各种需要的转速下平稳转动,并使托盘10上的若干外延片40通过托盘10下方的加热器30均匀加热,并在外延片40上获得均匀的气体浓度、均匀的气体速度的边界层,对外延片40进行外延反应或薄膜沉积处理。
而且,本发明还在托盘转轴100和驱动轴20沉孔200的侧面对应设置若干对应的定位槽240和定位键140,通过其在旋转方向的若干对接触面的贴合,使托盘10与驱动轴20的转速同步。因而使驱动轴20带动托盘10旋转时不再依靠摩擦传动,尤其在中高速旋转的条件下,长期使用的可靠性提高,减少了托盘10因为磨损而造成的更换,从而减少了外延片40的生产成本。
另外,由于托盘转轴100具有向下凸出的结构,使其与驱动轴20摩擦的接触面暴露在托盘10底部的外面,容易进行该表面加工处理。
并且,凸出的托盘转轴100,不需要额外增加托盘10的整体厚度,即能保证该处的机械强度,因此,使制造托盘10的材料消耗减少,更减轻了托盘10的重量,减少了其热容量,从而减少了托盘10加热与冷却的时间,提高了生产效率,亦提高了外延反应温度调节控制的能力。
尽管本发明的内容已经通过上述优选实施例作了详细介绍,但应当认识到上述的描述不应被认为是对本发明的限制。在本领域技术人员阅读了上述内容后,对于本发明的多种修改和替代都将是显而易见的。因此,本发明的保护范围应由所附的权利要求来限定。

Claims (9)

1.一种外延片托盘及与其配合的支撑和旋转联接装置,包含放置在MOCVD反应腔(50)中可机械装卸的托盘(10),以及从下方与所述托盘(10)的底面(12)中心联接的垂直驱动轴(20);所述反应腔(50)中引入有若干反应气体,对所述托盘(10)上放置的若干外延片(40)进行外延反应或薄膜沉积,其特征在于,
所述托盘(10)的上表面设有若干浅凹盘,对应放置若干外延片;
所述托盘(10)的底部中间设置有向外凸出的托盘转轴(100);
所述驱动轴(20)的顶部开设有沉孔(200);
在当所述托盘(10)由机械放入反应腔(50)中时,至少所述托盘转轴(100)的一部份插入所述驱动轴(20)顶部对应的沉孔(200)中,通过托盘转轴(100)与沉孔(200)上对应设置的接触面的耦合联接定位并支撑所述托盘(10)在反应腔(50)中的位置,并且使所述驱动轴(20)旋转时带动所述托盘(10)旋转。
2.如权利要求1所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,还包含与所述驱动轴(20)连接的旋转密封装置(21)、旋转驱动装置(22),以及设置在所述托盘(10)下方的加热器(30);
所述驱动轴(20)向下穿过所述加热器(30),并通过所述旋转密封装置(21)从反应腔(50)的底部引出,与旋转驱动装置(22)连接;
由所述旋转驱动装置(22)带动所述驱动轴(20)旋转,并使所述托盘(10)与驱动轴(20)一起旋转。
3.如权利要求1所述外延片托盘及与其配合的支撑和旋转联接装置,其特征x在于,所述托盘转轴(100)是向下凸出的阶梯形,包含一设置在托盘(10)底部的第一凸台(110),以及设置在第一凸台(110)下的第二凸台(120);所述第一凸台(110)底端的环形端面(111)与所述托盘(10)的上表面(11)和底面(12)均平行;
所述沉孔(200)的环形顶面(211)与所述驱动轴(20)的轴心垂直;
所述第二凸台(120)的高度a1小于所述沉孔(200)的深度b1;
所述托盘转轴(100)的第二凸台(120)对应插入所述沉孔(200)时,使所述环形端面(111)与沉孔(200)的环形顶面(211)相接触,支撑托盘(10),并通过摩擦传动,当所述驱动轴(20)旋转时,带动托盘(10)旋转。
4.如权利要求3所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述第一凸台(110)是圆柱形;所述第二凸台(120)是直径小于第一凸台(110)的圆柱形或圆锥形。
5.如权利要求1所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述向下凸出的托盘转轴(100),对应插入所述沉孔(200)时,使所述托盘转轴(100)底端的台阶端面(121)与所述沉孔(200)的底面(222)相接触,支撑托盘(10),并通过摩擦传动,当所述驱动轴(20)旋转时,带动托盘(10)旋转;
所述台阶端面(121)与所述托盘(10)的上表面(11)和底面(12)均平行;
所述沉孔(200)的底面(222)与所述驱动轴(20)的轴心垂直;
所述托盘转轴(100)的高度a2大于所述沉孔(200)的深度b2。
6.如权利要求5所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述托盘转轴(100)是圆柱形或圆锥形。
7.如权利要求1所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述向下凸出的托盘转轴(100)对应插入与其形状相匹配的沉孔(200)中,通过托盘转轴(100)的台阶侧面(131)与驱动轴(20)沉孔(200)的侧面(231)相接触,支撑托盘(10),并作为所述托盘转轴(100)与所述驱动轴(20)相互摩擦传动的接触面,使所述驱动轴(20)能带动所述托盘(10)旋转。
8.如权利要求2所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述托盘转轴(100)与所述驱动轴(20)的沉孔(200)上分别设置若干轴向的定位装置,通过定位装置在旋转方向上的至少一对接触面的耦合,使所述驱动轴(20)能带动所述托盘(10)旋转。
9.如权利要求8所述外延片托盘及与其配合的支撑和旋转联接装置,其特征在于,所述轴向定位装置分别是设置在托盘转轴(100)侧面的若干定位键(140),以及在驱动轴(20)沉孔(200)的侧面,对应开设的若干定位槽(240);
所述托盘转轴(100)插入沉孔(200)时,所述定位键(140)与定位槽(240)的位置,由设置在所述旋转驱动装置(22)上的转角位置传感器对准,使定位键(140)与定位槽(240)准确耦合。
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