CN101911270B - 散热装置及使用楔形锁系统形成散热装置的方法 - Google Patents

散热装置及使用楔形锁系统形成散热装置的方法 Download PDF

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Publication number
CN101911270B
CN101911270B CN2008801240236A CN200880124023A CN101911270B CN 101911270 B CN101911270 B CN 101911270B CN 2008801240236 A CN2008801240236 A CN 2008801240236A CN 200880124023 A CN200880124023 A CN 200880124023A CN 101911270 B CN101911270 B CN 101911270B
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CN
China
Prior art keywords
pyrolytic graphite
tpg
metallic material
graphite element
heat sink
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008801240236A
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English (en)
Chinese (zh)
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CN101911270A (zh
Inventor
D·S·斯拉顿
D·L·麦唐纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intelligent Platforms LLC
Original Assignee
GE Fanuc Automation North America Inc
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Publication of CN101911270A publication Critical patent/CN101911270A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2008801240236A 2007-12-28 2008-11-14 散热装置及使用楔形锁系统形成散热装置的方法 Expired - Fee Related CN101911270B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/966,201 2007-12-28
US11/966,201 US8347502B2 (en) 2007-12-28 2007-12-28 Heat sink and method of forming a heatsink using a wedge-lock system
US11/966201 2007-12-28
PCT/US2008/083645 WO2009085423A2 (en) 2007-12-28 2008-11-14 A heat sink and method of forming a heatsink using a wedge-lock system

Publications (2)

Publication Number Publication Date
CN101911270A CN101911270A (zh) 2010-12-08
CN101911270B true CN101911270B (zh) 2013-03-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801240236A Expired - Fee Related CN101911270B (zh) 2007-12-28 2008-11-14 散热装置及使用楔形锁系统形成散热装置的方法

Country Status (6)

Country Link
US (2) US8347502B2 (https=)
EP (1) EP2227822A2 (https=)
JP (1) JP5384522B2 (https=)
KR (1) KR20100110346A (https=)
CN (1) CN101911270B (https=)
WO (1) WO2009085423A2 (https=)

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US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
FR2967763B1 (fr) * 2010-11-19 2014-07-04 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN102768998A (zh) * 2011-05-05 2012-11-07 优杰精密机械(苏州)有限公司 大功率电子器件模组用基板
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
NL2012119C2 (en) * 2014-01-22 2015-07-23 Dutch Space B V Radiator, as well as space vehicle structure comprising such radiator.
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US9953957B2 (en) * 2015-03-05 2018-04-24 Invensas Corporation Embedded graphite heat spreader for 3DIC
US20190016482A1 (en) * 2015-03-12 2019-01-17 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US10101099B2 (en) 2015-03-12 2018-10-16 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US11141823B2 (en) * 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components

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US5969950A (en) * 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment
CN1666079A (zh) * 2002-06-28 2005-09-07 先进能源科技公司 具有金属基板和石墨散热片的复合散热设备

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US5316080A (en) * 1990-03-30 1994-05-31 The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration Heat transfer device
CN1116400A (zh) * 1994-07-06 1996-02-07 松下电器产业株式会社 部件的冷却结构
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CN1666079A (zh) * 2002-06-28 2005-09-07 先进能源科技公司 具有金属基板和石墨散热片的复合散热设备

Also Published As

Publication number Publication date
WO2009085423A3 (en) 2009-10-08
JP5384522B2 (ja) 2014-01-08
US20090166021A1 (en) 2009-07-02
US20130092363A1 (en) 2013-04-18
JP2011508446A (ja) 2011-03-10
EP2227822A2 (en) 2010-09-15
KR20100110346A (ko) 2010-10-12
US8347502B2 (en) 2013-01-08
WO2009085423A2 (en) 2009-07-09
CN101911270A (zh) 2010-12-08

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