CN101908514B - 半导体装置 - Google Patents

半导体装置 Download PDF

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CN101908514B
CN101908514B CN2009101580003A CN200910158000A CN101908514B CN 101908514 B CN101908514 B CN 101908514B CN 2009101580003 A CN2009101580003 A CN 2009101580003A CN 200910158000 A CN200910158000 A CN 200910158000A CN 101908514 B CN101908514 B CN 101908514B
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signal
pad
conducting element
semiconductor device
pads
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CN101908514A (zh
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赵建胜
林泽琦
黄英兆
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MediaTek Inc
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Abstract

本发明提供一种半导体装置，包括：至少一芯片，由衬底承载；多个焊盘，设置于该芯片，多个焊盘分别相应于多个信号，多个焊盘包括用以传送/接收第一信号的第一焊盘和用以传送/接收第二信号的第二焊盘；多个导电元件，多个导电元件包括第一导电元件和第二导电元件；以及多个焊线，分别耦接在多个焊盘和多个导电元件之间。本发明提供的半导体装置能增加任意相应于相同多信道立体声信号的左信道信号和右信道信号的两个导电元件或两个焊盘之间的距离，可减少导电元件或焊盘之间的杂散电容，从而降低串音效应。

Description

半导体装置
技术领域
本发明有关于一种半导体装置。
背景技术
对于大规模集成电路而言，例如大规模单芯片系统(system on a chip，SOC)，为了减少外部电路元件的成本，需将外部电路元件集成至该大规模SOC。例如，可将多信道音频编码译码器(audio codec)集成至一个大规模单芯片系统以最小化成本。然而，大规模SOC需要更多数目的信号端口，通常使用薄型方型扁平式封装(Low profile Quad Flat Package，LQFP)、球栅阵列(Ball Grid Array，BGA)封装或其它适用于大规模电路的封装技术对大规模SOC进行封装。图1A为薄型方型扁平式封装的示意图。
为了容纳更多的管脚(pin)或更多的焊珠(solder ball)，需要减少相邻引脚或引线的距离；如图1A所示，两相邻的引脚/引线之间非常接近。图1B为图1A所示的引线、焊线和焊盘(bond pad)的局部放大图。然而，相邻引脚或引线距离的减少导致杂散电容的增加。由于杂散电容的增加，来自一信号线的不需要的电感、电容或电导将干扰相应的相邻信号线，这即所谓的串音效应(crosstalk effect)。特别对于音频处理而言，串音效应是非常重要的问题，因此需要提供一种解决方法。
发明内容
为了容纳更多的管脚或更多的焊珠，需要减少相邻引脚或引线的距离，然而相邻引脚或引线距离的减少导致杂散电容的增加，从而产生串音效应。本发明提供一种半导体装置以解决上述问题。
本发明提供一种半导体装置，包括：至少一芯片，芯片由衬底承载；多个焊盘，多个焊盘设置于芯片，多个焊盘分别相应于多个信号，多个焊盘包括用以传送/接收第一信号的第一焊盘和用以传送/接收第二信号的第二焊盘；多个导电元件，多个导电元件包括第一导电元件和第二导电元件；以及多个焊线，分别耦接在多个焊盘和多个导电元件之间，其中第一导电元件焊接至第一焊盘，第二导电元件焊接至第二焊盘；其中，第一导电元件和第二导电元件由多个导电元件的至少一第三导电元件分隔，且当确定第二信号时，也确定第一信号。
本发明另提供一种半导体装置，包括：至少一芯片，芯片由衬底承载；以及多个焊盘，多个焊盘设置于芯片，多个焊盘分别相应于多个信号，多个焊盘包括用以传送/接收第一信号的第一焊盘和用以传送/接收第二信号的第二焊盘；其中，第一焊盘和第二焊盘由多个焊盘的至少一第三焊盘分隔，且当确定第二信号时，也确定第一信号。
本发明再提供一种半导体装置，包括：至少一芯片，芯片由衬底承载；多个导电元件，用于与该芯片间传送/接收信号，多个导电元件分别相应于多个信号，多个导电元件包括用以传送/接收第一信号的第一导电元件和用以传送/接收第二信号的第二导电元件；其中，第一导电元件和第二导电元件由多个导电元件的至少一第三导电元件分隔，且当确定第二信号时，也确定第一信号。
本发明提供的半导体装置能增加任意相应于相同多信道立体声信号的左信道信号和右信道信号的两个导电元件(或任意两个焊盘)之间的距离，可有效地减少导电元件(或焊盘)之间的杂散电容，从而降低串音效应。
附图说明
图1A为薄型方型扁平式封装的示意图；
图1B为图1A所示的引线、焊线和焊盘的局部放大图；
图2为根据本发明一实施例的集成于半导体装置200的音频处理元件205的示意图；
图3A为图2所示半导体装置200的第一集成电路封装结构的示意图；
图3B为图3A的焊盘和焊线的局部放大示意图；
图4A为图2所示半导体装置200的第二集成电路封装结构的示意图；
图4B为图4A的焊盘和焊线的局部放大示意图；
图5A为图2所示半导体装置200的第三集成电路封装结构的示意图；
图5B为图5A的焊盘和焊线的局部放大示意图；
图6为图2所示半导体装置200的第四集成电路封装结构的示意图；
图7为图2所示半导体装置200的导电元件排列的另一实施例的示意图。
具体实施方式
在说明书及权利要求当中使用了某些词汇来指称特定元件。所属技术领域的技术人员应可理解，制造商可能会用不同名词来称呼同一个元件。本说明书及权利要求并不以名称的差异作为区分元件的方式，而是以元件在功能上的差异作为区分准则。在通篇说明书及权利要求中所提及的“包含”为开放式用语，故应解释成“包含但不限定于”。此外，“耦接”一词在此包含任何直接及间接的电气连接手段。藉由以下的较佳实施例的叙述并配合全文的图至图说明本发明，但以下叙述中的装置、元件与方法、步骤乃用以解释本发明，而不应当用来限制本发明。
图2为根据本发明一实施例的集成于半导体装置200的音频处理元件205的示意图，其中半导体装置200为大规模SOC。在此实施例中，半导体装置200使用LQFP进行封装。音频处理元件205可包括多任务器210、缓冲器215a、缓冲器215b、立体声ADC电路220、音量控制器225、数字滤波器230、信道选择电路235、立体声DAC电路240、多任务器245、多个缓冲器250a～205h和其它音频处理电路(图未示)。如图2所示，音频处理元件205传送/接收四个多信道立体声信号，每个多信道立体声信号具有一个相应的左信道信号和一个相应的右信道信号。例如，一个多信道立体声信号可由一个左信道信号V0L和一个右信道信号V0R组成，换句话说，左信道信号V0L和右信道信号V0R为相应于相同多信道的音频信号，其中，V0L和V0R由音频处理元件205所接收，以此类推V1L和V1R、V2L和V2R以及V3L和V3R。又例如，一个多信道立体声信号可由一个左信道信号V0L’和一个右信道信号V0R’组成，其中，V0L’和V0R’由音频处理元件205所传送/输出，以此类推V1L’和V1R’、V2L’和V2R’以及V3L’和V3R’。也就是说，所述的多信道立体声信号可为输入至音频处理元件205的信号或输出自音频处理元件205的信号。
为了降低串音效应，设计使用至少一个第三管脚以分隔一个管脚和一个相应的管脚，其中，该管脚用以传送/接收一个左信道信号(例如V0L’或V0L)，而该相应的管脚用以传送/接收一个右信道信号(例如V0R’或V0R)。例如，相应于左信道信号V0L和右信道信号V0R的两个管脚由相应于左信道信号V1L的管脚分隔。然而，本发明并不以此为限。在另一实施例中，可设计使用多个管脚分隔相应于一组左信道信号和右信道信号的多个管脚，以降低串音效应。
实施中，为了实现相应于左信道信号和右信道信号的信号端口彼此隔离，例如使用LQFP封装技术，相应于左信道信号和右信道信号的导电元件(例如引脚架或引线)由至少另一个导电元件分隔。图3A为图2所示半导体装置200的第一集成电路封装结构的示意图。如图3A所示，半导体装置200包括至少一个芯片(die)305，该芯片305设置于外露式焊盘(exposed pad，E-pad)310上，并由衬底(substrate)311承载，该芯片305相应于音频处理元件205。此外，半导体装置200进一步包括多个设置于芯片305之上的焊盘，多个排列于衬底311上的导电元件315L、315R、316L、316R、317和318以及多个分别连接于焊盘和导电元件315L、315R、316L、316R、317和318之间的焊线。导电元件315L和316L相应于不同的左信道信号，导电元件315R和316R相应于不同的右信道信号。导电元件315L和315R相应于一个多信道立体声信号，且导电元件316L和316R相应于另一个多信道立体声信号。导电元件317和318其中的一个相应于供应电压电平(例如电源供应电压VDD电平、共模电压Vcm电平或任何大致固定的电压电平)，而导电元件317和318其中的另一个相应于接地电压电平。需注意的是，图3A所示的导电元件的数量仅用以阐释的目的，然本发明并不以此为限。为简洁，忽略图3A未示的其它导电元件。
上述多个焊盘分别相应于多个信号，例如，配置第一焊盘(图3A未示)以传送/接收第一信号，例如相应于第一导电元件(例如导电元件315L)的左信道信号，配置第二焊盘(图3A未示)以传送/接收第二信号，例如相应于第二导电元件(例如导电元件315R)的右信道信号。分别焊接第一导电元件和第二导电元件至第一焊盘和第二焊盘。特别地，所有焊盘和焊线用以将音频处理元件205电性连接至导电元件315L、315R、316L、316R、317和318。因此，在制造之后，已封装的芯片305可通过内置于半导体装置200的导电元件315L、315R、316L、316R、317和318与半导体装置200外部的电路进行通信。
在此实施例中，导电元件315L和315R分别相应于属于同一个多信道立体声信号的左信道信号(例如V0L)和右信道信号(例如V0R)，且导电元件315L和315R由第三导电元件(例如导电元件316L)分隔，其中导电元件316L相应于属于另一个多信道立体声信号的左信道信号V1L。此外，导电元件316L和316R分别相应于属于同一个多信道立体声信号的左信道信号(例如V1L)和右信道信号(例如V1R)，导电元件316L和316R由导电元件315R分隔，其中导电元件315R相应于属于另一个多信道立体声信号的右信道信号V0R。也就是说，相应于一个左/右信道信号的导电元件设置于多个导电元件之间，该多个导电元件相应于属于同一个多信道立体声信号的两个信道信号。因为设置于左信道信号和右信道信号之间的导电元件提供屏蔽功能，所以可显著减少左信道信号和右信道信号(例如V0R和V0L，或V1R和V1L)之间的串音效应。需注意的是，音频处理元件205每次只接收四个多信道立体声信号中的一个。当音频处理元件205处理一个多信道立体声信号时，可将相应于其它多信道立体声信号的信号端口或位于相应于已处理多信道立体声信号的两个信号端口之间的信号端口连接至接地电压电平、供应电压电平(例如电源供应电压VDD电平、共模电压Vcm电平)或任何大致固定的电压电平。也就是说，当确定(assert)属于同一多信道立体声信号的左信道信号和右信道信号的其中一个时，也确定其中的另一个。然而，却不确定属于另一个多信道立体声信号的左/右信道信号。换句话说，左信道信号V0L和右信道信号V0R并不受左信道信号V1L或其它信道信号的影响。
图3B为图3A的焊盘和焊线的局部放大示意图。如图3B所示，芯片305的焊盘(图3A未示)沿着芯片305的边沿排列成一列(tier)。焊线325L和325R由直接耦接导电元件316L的焊线326L分隔，其中焊线325L和325R分别耦接导电元件315L和315R。此外，焊线326L和326R由直接耦接导电元件315R的焊线325R分隔，其中焊线326L和326R分别耦接导电元件316L和316R。也就是说，相应于同一组左信道信号和右信道信号的焊线由相应于另一个左/右信道信号的焊线分隔，相应于同一组左信道信号和右信道信号的导电元件由相应于另一个左/右信道信号的导电元件分隔，且相应于同一组左信道信号和右信道信号的焊盘也由相应于另一个左/右信道信号的焊盘分隔。
在另一实施例中，设置于芯片305上的焊盘也可排列成多行例如两行。请参考图4A和图4B。图4A为图2所示半导体装置200的第二集成电路封装结构的示意图。图4B为图4A的焊盘和焊线的局部放大示意图。相对靠近芯片305中心的焊盘被称作内部焊盘，其它的排列成一列的焊盘被称作外部焊盘。在此实施例中，焊线325L和325R分别耦接导电元件315L和315R，且焊线325L和325R连接排在同一列的焊盘，即内部焊盘。焊线326L和326R分别耦接导电元件316L和316R，且焊线326L和326R连接排在同一列的焊盘，即外部焊盘。也就是说，相应于左信道信号V0L的焊线325L和相应于右信道信号V0R的焊线325R并没有由另外的焊线分隔。然而，由于每个导电元件的长度远大于每个焊盘，因此左信道信号V0L和右信道信号V0R之间的串音效应增加的不大。
在另一实施例中，分别相应于属于相同多信道立体声信号的左信道信号和右信道信号的焊线可由相应于其它信号的一个或多个焊线分隔。请参考图5A和图5B。图5A为图2所示半导体装置200的第三集成电路封装结构的示意图。图5B为图5A的焊盘和焊线的局部放大示意图。类似地，导电元件315L和315R由导电元件316L分隔，其中导电元件315L和315R分别相应于属于相同多信道立体声信号的左信道信号V0L和右信道信号V0R。导电元件316L和316R由导电元件315R分隔，其中导电元件316L和316R分别相应于属于相同多信道立体声信号的左信道信号V1L和右信道信号V1R。因此，显著地减少左信道信号和右信道信号(例如V0R和V0L，或V1R和V1L)之间的串音效应。而与图3A和图4A的差异在于，相应于左信道信号V0L的焊线325L和相应于右信道信号V0R的焊线325R连接至位于不同列的焊盘。更特别地是，焊线325L耦接内部焊盘，而焊线325R耦接外部焊盘。焊线326L耦接内部焊盘，而焊线326R耦接外部焊盘。也就是说，焊线325L和焊线325R并不位于相同的高度，焊线326L和焊线326R也并不位于相同的高度。换句话说，如图5B所示，焊线325L可在焊线325R的上方穿过，且，焊线326L也可在焊线326R的上方穿过。
需注意的是，上述焊线和焊盘的排列并非用来限制本发明的范畴。其它用以减少串音效应的焊线和焊盘配置的改变或均等性的安排均属于本发明所主张的范围。
此外，如图3A-图5A所示的信号线的排列及其改变均可应用于其它类型的集成电路封装，例如BGA封装。请参考图6，图6为图2所示半导体装置200的第四集成电路封装结构的示意图。如图6所示，导电元件(例如引线或所谓的梳形物)615L和615R由相应于另一个或多个多信道立体声信号的至少一个导电元件(例如导电元件616L)分隔，其中导电元件615L和615R分别相应于属于相同多信道立体声信号的左信道信号和右信道信号。所有的导电元件耦接过孔(vias)和焊珠，且焊接至一个芯片。在其它实施例例如覆晶封装(flip chippackage)中，可忽略焊珠，导电元件通过凸块(solder bump)耦接至芯片。因为引线的排列与图3A-图5A的引脚架的排列类似，因此为简洁不再赘述。需注意的是，分别相应于属于相同多信道立体声信号的左信道信号和右信道信号的焊珠可靠近彼此或由相应于另一个信道信号或其它信号的焊珠分隔。换句话说，任何引线排列的改变或焊珠位置的改变均属于本发明所主张的范围。
此外，上述实施例并非仅限于音频处理领域。也就是说，为了减少半导体装置的串音效应，第一导电元件(引脚架、引线或其它电性连接装置)通过至少一个第三导电元件与第二导电元件分隔均属于本发明所主张的范围，其中，当相应于第一导电元件和第二导电元件的第一信号和第二信号已确定时，相应于第三导电元件的第三信号并未确定。当确定第一信号和第二信号时，该第三信号可为大致固定的电压电平(例如供应电压电平、共模电压电平或接地电压电平)以增强屏蔽效果。
再者，在其它实施例中，能调节关于图3A(或图4A和图5A)的LQFP的引脚架排列。请参考图7，图7为图2所示半导体装置200的导电元件排列的另一实施例的示意图。如图7所示，与信道信号无关的导电元件317和318(即引脚架)设置于一组导电元件315L和316L以及一组导电元件315R和316R之间。与图3A-图5A比较，图7所示的导电元件315L和315R(或导电元件316L和316R)由更多的导电元件(例如三个导电元件)分隔，因此，能更进一步地减少属于相同多信道立体声信号的左信道信号和右信道信号之间的串音效应。相似地，也可调整关于图6所示的BGA的引线排列，以获得增强的屏蔽效果。
综上所述，增加任意两个相应于相同多信道立体声信号的左信道信号和右信道信号的导电元件(或焊线)的距离，可有效地减少该等导电元件(或焊线)之间的杂散电容，从而也减少串音效应。此外，当确定左信道信号和右信道信号时，并未确定用以分隔上述两个导电元件的导电元件相应的第三信号。相应于第三信号的管脚/焊珠可耦接大致固定的电压电平(例如供应电压电平、共模电压电平或接地电压电平)以增强屏蔽效果。由于减少了串音效应，可容易地实现左信道信号和右信道信号之间的音频信道隔离，而不需要额外的计算。
上述的实施例仅用来列举本发明的实施方式，以及阐释本发明的技术特征，并非用来限制本发明的范畴。任何所属技术领域的技术人员依据本发明的精神而轻易完成的改变或均等性安排均属于本发明所主张的范围，本发明的权利范围应以权利要求为准。

Claims (14)

1.一种半导体装置，用于音频设备，该半导体装置包括：
至少一芯片，该芯片由衬底承载；
多个焊盘，该多个焊盘设置于该芯片，该多个焊盘分别相应于多个信号，该多个焊盘包括用以传送/接收第一信号的第一焊盘、用以传送/接收第二信号的第二焊盘和用以传送/接收第三信号的第三焊盘；
多个导电元件，该多个导电元件包括第一导电元件、第二导电元件和第三导电元件；以及
多个焊线，分别耦接在该多个焊盘和该多个导电元件之间，其中该第一导电元件通过该焊线焊接至该第一焊盘，该第二导电元件通过该焊线焊接至该第二焊盘，
其中，该第一导电元件和该第二导电元件由该多个导电元件的至少一第三导电元件分隔，该第三导电元件用于传送/接收第三信号，且当确定该第二信号为一个多信道立体声信号的左信道信号时，也确定该第一信号为该多信道立体声信号的右信道信号；或者当确定该第二信号为一个多信道立体声信号的右信道信号时，也确定该第一信号为该多信道立体声信号的左信道信号；并且该第三信号属于不同于上述多信道立体声信号的另一多信道立体声信号或具有固定的电压电平。
2.如权利要求1所述的半导体装置，其特征在于，该多个焊盘进一步包括第三焊盘，该第三焊盘焊接至该第三导电元件，当确定该第一信号和该第二信号时，不确定该第三信号。
3.如权利要求1所述的半导体装置，其特征在于，该固定的电压电平为接地电压电平、共模电压电平或供应电压电平。
4.如权利要求1所述的半导体装置，其特征在于，该第一焊盘为内部焊盘，且该第二焊盘为外部焊盘。
5.如权利要求1所述的半导体装置，其特征在于，该第一焊盘和该第二焊盘由该多个焊盘的至少一第三焊盘分隔，且该第一焊盘、该第二焊盘和该第三焊盘排列在相同列。
6.如权利要求1所述的半导体装置，其特征在于，该多个导电元件为引线或引脚架。
7.如权利要求1所述的半导体装置，其特征在于，该第一信号和该第二信号为相应于相同多信道的音频信号。
8.一种半导体装置，用于音频设备，该半导体装置包括：
至少一芯片，该芯片由衬底承载；以及
多个焊盘，该多个焊盘设置于该芯片，该多个焊盘分别相应于多个信号，该多个焊盘包括用以传送/接收第一信号的第一焊盘、用以传送/接收第二信号的第二焊盘和用以传送/接收第三信号的第三焊盘；
其中，该第一焊盘和该第二焊盘由该多个焊盘的至少一第三焊盘分隔，且当确定该第二信号为一个多信道立体声信号的左信道信号时，也确定该第一信号为该多信道立体声信号的右信道信号；或者当确定该第二信号为一个多信道立体声信号的右信道信号时，也确定该第一信号为该多信道立体声信号的左信道信号；并且该第三信号属于不同于上述多信道立体声信号的另一多信道立体声信号或具有固定的电压电平。
9.如权利要求8所述的半导体装置，其特征在于，当确定该第一信号和该第二信号时，不确定该第三信号。
10.如权利要求8所述的半导体装置，其特征在于，该第一信号和该第二信号为相应于相同多信道的音频信号。
11.一种半导体装置，用于音频设备，该半导体装置包括：
至少一芯片，该芯片由衬底承载；
多个导电元件，用于与该芯片间传送/接收信号，该多个导电元件分别相应于多个信号，该多个导电元件包括用以传送/接收第一信号的第一导电元件、用以传送/接收第二信号的第二导电元件和用以传送/接收第三信号的第三导电元件；
其中，该第一导电元件和该第二导电元件由该多个导电元件的至少一第三导电元件分隔，且当确定该第二信号为一个多信道立体声信号的左信道信号时，也确定该第一信号为该多信道立体声信号的右信道信号；或者当确定该第二信号为一个多信道立体声信号的右信道信号时，也确定该第一信号为该多信道立体声信号的左信道信号；并且该第三信号属于不同于上述多信道立体声信号的另一多信道立体声信号或具有固定的电压电平。
12.如权利要求11所述的半导体装置，其特征在于，当确定该第一信号和该第二信号时，不确定该第三信号。
13.如权利要求11所述的半导体装置，其特征在于，该多个导电元件为引线或引脚架。
14.如权利要求11所述的半导体装置，其特征在于，该第一信号和该第二信号为相应于相同多信道的音频信号。
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