CN101905381A - Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring - Google Patents
Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring Download PDFInfo
- Publication number
- CN101905381A CN101905381A CN 201010216374 CN201010216374A CN101905381A CN 101905381 A CN101905381 A CN 101905381A CN 201010216374 CN201010216374 CN 201010216374 CN 201010216374 A CN201010216374 A CN 201010216374A CN 101905381 A CN101905381 A CN 101905381A
- Authority
- CN
- China
- Prior art keywords
- processing
- lens
- ceramic material
- diaphragm
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910010293 ceramic material Inorganic materials 0.000 title claims abstract description 27
- 238000007789 sealing Methods 0.000 title claims abstract description 12
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 244000309464 bull Species 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000002516 radical scavenger Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 15
- 238000005516 engineering process Methods 0.000 abstract description 14
- 230000003287 optical effect Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000006061 abrasive grain Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the technical field of ultrafine processing of hard and brittle ceramic materials, in particular to special microstructure-type excimer laser delaminated processing method and device of a ceramic material sealing ring. The method is characterized by comprising the following steps of: delaminating the special microstructure-type three-dimensional profile of a processed ceramic material; converting into NC (Numerical Control) codes and realizing the computer control of the position of a lens, the size and the shape of an aperture, the replacement of a round lens and a cylindrical lens, the aperture size and the shape of a light chopper and the movement of a worktable in an optical system by combining the generated NC codes so as to realize the automation and the flexibility of a processing process. The invention has the advantages that the ultrafine processing problem of the special microstructure-type hard and brittle ceramic material sealing ring is solved by applying an excimer delaminated processing technology. A non-contact, clean and high-efficiency processing mode is provided to effectively solve the problems of attached contact stress, embedded abrasive grains and low processing efficiency in a traditional processing method, and the processing flexibility is realized.
Description
Technical field
The invention belongs to hard brittle material micro-configuration Ultraprecision Machining field, relate to Al
2O
3, hard brittle ceramic materials micro-configuration ultraprecise processing method such as SiC and device.
Background technology
It is strong that ceramic material has non-oxidizability, and anti-wear performance is good, the hardness height, and Heat stability is good, elevated temperature strength is big, and thermal coefficient of expansion is little, the big and good characteristics such as anti-thermal shock and resistance to chemical attack of thermal conductivity.Ceramic material is mainly used in the cutting edge of cutter in the high-accuracy process equipment of preparation at present, seal member in high temperature, high pressure and the severe corrosive environment etc., ceramic material is being brought into play more and more important effect because of its good physical and chemical performance in oil, chemical industry, machinery, space flight, nuclear energy field.Constantly perfect along with ceramic material technology, the quality of ceramic material has obtained great raising, lays a good foundation for using in high-precision pointed collar territories such as space flight, nuclear energy.Wherein the SiC ceramic material can be by HCl, HNO
3, H
2SO
4With alkaline solution corrosion such as acid solution such as HF and NaOH, pure SiC heat easy oxidation in air, but the SiO of top layer formation during oxidation
2Can suppress the diffusion of further oxidation, so oxidation rate is not high, aspect electrical property, SiC has semiconductive, and the introducing of small amount of impurities can show good electrical conductivity, therefore is considered to replace crystal Si and becomes the chip material of a new generation.Sintering or hot-forming technology are generally adopted in the preparation of ceramic material, its surface roughness is generally at several microns to tens microns, therefore must adopt precision machining method that surface roughness is reduced to nanometer scale, and reach certain surface precision, just can come into operation, especially at high-technology field, had higher requirement in roughness, surface precision and the surface of material and the integrality on inferior surface.Present processing to the ceramic material plane, superfine grinding technology can meet the demands, but aspect the processing of sealing ring micro-configuration, especially the hysteresis of the harmless Processing Technology Development of large scale spatial complex micro-configuration sealing ring ultraprecise has become the bottleneck of restriction ceramic-seal ring in the high-technology field extensive use.
Because hard crisp characteristic of ceramic material and high chemical inertness make existing process technology be difficult to realize the processing of large scale spatial complex micro-configuration sealing ring ultraprecise not damaged.Realize the processing of sealing ring micro-configuration by making the profiling cam in the United States Patent (USP), but equipment complexity, cost height need prepare corresponding profiling cam for difformity, is difficult to realize Flexible Production; Because ceramic material is non-conductive, has limited the electro-spark polishing The Application of Technology; Though traditional mechanical polishing technology can be realized nanoscale processing, and crudy meets instructions for use, but only limit to processing to planar end surface, and working (machining) efficiency also has much room for improvement, simultaneously owing to adopt mechanical contact processing, be easy to stay defectives such as cut, insert at surface to be machined.PRK has the instantaneous power height, the single photon energy is big, the processing heat affected area is minimum, advantages such as the hard fragility of machined parameters and material is irrelevant, therefore as a kind of ultraprecise cold processing technique of contactless, molecular layer stripping type, be the optimal processing method that realizes the micro-configuration sealing ring not damaged processing of large scale space at present.Though it is at present a lot of at the report of PRK processing ceramic aspect, but often be confined to qualitative research, only relate to laser parameter processing influenced aspects such as rule, laser boring, and great majority just at the research of organic compound, do not relate to the research work of the little removal of large-size ceramic material seal ring micro-configuration aspect.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of processing method and device at the little removal ultra-precise low-damage of large-size ceramic sealing ring micro-configuration layering.
The technical scheme that processing method of the present invention adopted is:
Process acts on the shape and the power density of ceramic surface laser beam by change, and skin-material is realized little removal.The surface topography of processed ceramic material is converted into corresponding numerical control program code by computer software, and by importing digital control system after the path optimization; Be equipped with the numerical control diaphragm in the light path system, in conjunction with the numerical control program of surface to be machined, adjust the diaphragm shape and size automatically, the hot spot that acquisition and Working position and pattern adapt; Laser focuses on and adopts bull's-eye and cylindrical mirror, cooperates diaphragm to obtain the focal beam spot of processing diverse location, shape and thickness, realizes the control of machining shape, size and removal amount; By the photochopper of control laser focusing lens below, the territory, thermogravimetric melting zone of at utmost eliminating machined material shape edges place; By the unique cleaning action of PRK, machined surface is cleaned in the process; The final layering processing that realizes ceramic-seal ring micro-configuration PRK by utilization to above-mentioned process; Processed ceramic material is in and is full of airtight the closing in the container of protection, adds the flying chip that produce man-hour by built-in gas-circulating system cleaning.
The device of described processing method comprises speculum; Three-shaft linkage workbench, photochopper, condenser lens, diaphragm, monitor, convex lens, concavees lens, inner scavenger system, exhaust outlet, window lens, protective cover and air inlet; It is characterized in that light beam, converges through convex lens behind the beam divergence after project concavees lens behind speculum and the speculum from laser instrument input again, makes the light beam parallel transmission; Light beam is behind speculum, along vertical machined material surface direction transmission; Diaphragm is set behind speculum adjusts beam shape; Final light beam is vertically projected to the machined material surface behind lens focusing and photochopper.
Apparatus of the present invention comprise parts compositions such as light beam guiding control appliance, diaphragm and control appliance, light beam convergence device, beam quality improved equipment, photochopper.By light path with laser aiming to processing platform, realize workpiece processing: change the laser propagation direction by speculum in the light path system, control laser travel track; On the light path propagation path diaphragm is set, light path is carried out shape control, circular adjustable diaphragm and rectangle adjustable diaphragm are set, position by changing transmitted beam and shape are to adapt to the processing to different boundary shape curved surface; A pair of concavees lens and convex lens are set on propagation path,, improve the collimation of light beam, change the beam cross section size simultaneously by process to beam divergence-convergence, and then the depth of field and focus place optical quality after the focusing of control light beam; Adopt bull's-eye and cylindrical mirror that light beam is focused in the light path system, the use round lens is realized the corner and is needed the processing of the small position of processing dimension, but the cylindrical mirror light beam is converted into a branch of line spot, makes processing dimension carry out the transition to line by point, improves working (machining) efficiency; Behind the light path condenser lens, photochopper is set, projects material surface beam edge density smaller part and be filtered, improve the crudy of light beam in focus place hot spot edge by covering of convergent beam marginal position place made.The position of the replacing of stop position and size, lens position, circle and cylindrical lens, photochopper and size etc. all are embedded in computer in to the materials processing route optimization in the light path system, realize the process automation.
Effect of the present invention and benefit are: solve the processing problems of hard brittle ceramic materials sealing ring micro-configuration by the application of quasi-molecule layering process technology, improved working (machining) efficiency simultaneously greatly.This The Application of Technology has solved a difficult problem of in traditional processing complicated micro-configuration being processed, and makes processing realize automation, and this technology also can be applied to plane processing simultaneously, and the processing flexibility and processing degree is further improved; PRK processing is a kind of contactless, cleaning, processing mode efficiently, after reaching certain threshold value, power density can realize the cold working that layers of material is peeled off, the influence of avoided traditional mechanical lapping, polishing the contact stress of being introduced, thermal stress influence when cold working mode has also been eliminated Long Pulse LASER processing ceramic material simultaneously, the influence of having stopped processing rear surface residual stress; Because PRK is the conversion of a kind of electric energy to luminous energy, it is a kind of green processing mode that cleans, compare more and to support modern processing theory with adding chemical substances such as grinding agent, polishing agent in the processing modes such as tradition grinding, polishing, particle studded situation of going into surface to be machined in grinding agent of also having avoided tradition to add on the other hand very easily forming man-hour or the polishing agent; The PRK pulsewidth is in nanosecond order, so process is very fast, by increasing spot size or carrying out laser beam splitter processing and all can easily improve working (machining) efficiency.
Description of drawings
Fig. 1 is a laser optical path schematic diagram of the present invention.
Fig. 2 is protection and a scavenger system schematic diagram in the process of the present invention.
Among the figure: 1 excimer laser; 2 first speculums 1; 3 three-shaft linkage workbench; 4 photochoppers; 5 condenser lenses; 6 diaphragms; 7 second speculums 2; 8 monitors; 9 convex lens; 10 concavees lens; 11 the 3rd speculums 3; 12 inner scavenger systems; 13 exhaust outlets; 14 potteries; 15 window lens; 16 protective covers; 17 air inlets.
The specific embodiment
Describe the specific embodiment of the invention in detail below in conjunction with technical scheme and accompanying drawing.
As shown in Figure 1, PRK system of processing of the present invention comprises the compositions such as light beam regulation device that three speculums, workbench 3, photochopper 4, condenser lens 5, diaphragm 6, watch-dog 8 and convex lens 9 and concavees lens 10 are formed.Wherein first speculum 2 and 11 combinations of the 3rd speculum are used for changing the light beam locus, for enough spaces are expanded in the installation of other parts of system; Concavees lens 10 are used for beam divergence, and the light beam that has certain angle of divergence in the light beam is propagated with the bigger angle of divergence, reach and reject the purpose that excessive angle of divergence light beam disturbs; The light beam that convex lens 9 will be dispersed collimates again, simultaneously can be by controlling the spot size that the lens position acquisition needs; 50 times of watch-dog 8 amplification coefficients are used for focusing, locating and monitor the process of material; Second speculum 7 changes direction of beam propagation, makes the light beam vertical irradiation in processed ceramic material surfaces; Diaphragm 6 is used for obtaining the hot spot of a series of required forms such as circle, rectangle, ellipse; Condenser lens 5 has bull's-eye and cylindrical mirror, in order to obtain focus point hot spot and linear light spot; Photochopper 4 is in order to reduce hot spot boundary melt region in the process; The processed ceramic material of workbench 3 carryings, and control material movement track.
As shown in Figure 2, protective cover device of the present invention is made up of inside air blowing equipment 12, three-shaft linkage workbench 3, steam vent 13, window lens 15, protective cover 16, air admission hole 17.Inner air blowing equipment 12 provides the air-flow of certain pressure intensity, removes the flying chip that produces in the process; Steam vent 13, change protection gas in processing initial period, the process and machine after be used for discharging the passage of gas in the protective cover; Laser beam 15 sees through window, adopts the ultraviolet fused silica material preparation of the PRK wavelength not being had absorption; Protective cover 16 is used for completely cutting off the influence of outside atmosphere; Air admission hole 17 is used for injecting the passage of protective gas and process make-up gas.
As shown in Figure 2, the processing initial period at first carries out the gas exchange, charges into protection gas by air admission hole 17, and steam vent 18 is discharged air in the cover, closes steam vent after being full of protection gas in the cover, regulates air admission hole pressure, opens inner air blowing equipment; Shown in the accompanying drawing 1, three speculums and concavees lens are 10 to be fixed on the equipment on the optical table, need not to adjust, by computer software the analysis of processed ceramic surface is generated corresponding numerical control program, and in conjunction with the final numerical control code of machine data bank generation, that realizes the aperture size of replacing, photochopper 4 of size and dimension, condenser lens 5 and cylindrical mirror of position, diaphragm 6 of convex lens 9 in the light path system and shape and workbench moves through the computer numerical control programming Control, makes processing realize flexibility, automation.
Claims (2)
1. a ceramic material sealing ring micro-configuration PRK divides layer processing method, it is characterized in that: in conjunction with the three-dimensional surface shape layering with processed ceramic material of the factor of PRK density and shape, and be converted into the NC code; Be equipped with the numerical control diaphragm in the light path system,, adjust diaphragm shape, size automatically in conjunction with the NC code of surface to be machined; Laser focuses on and adopts bull's-eye and cylindrical mirror, cooperates the control of numerical control diaphragm machining shape, size and removal amount; At the variation of diaphragm and focal length, regulate laser focusing lens back photochopper, weaken the reflow zone of ceramic material laser facula edge; In the light path system aperture size of the replacing of the size and dimension of the position of convex lens, diaphragm, bull's-eye and cylindrical mirror, photochopper and shape and workbench move through computer control, make processing realize flexibility, automation.
2. be used for the device of the described processing method of claim 1, comprise speculum; Three-shaft linkage workbench (3), photochopper (4), condenser lens (5), diaphragm (6), monitor (8), convex lens (9), concavees lens (10), inner scavenger system (12), exhaust outlet (13), window lens (15), protective cover (16) and air inlet (17); It is characterized in that light beam, converges through convex lens (9) behind the beam divergence after project concavees lens (10) behind speculum (2) and the speculum (11) from laser instrument input again, makes the light beam parallel transmission; Light beam is behind speculum (7), along vertical machined material surface direction transmission; Diaphragm (6) is set behind speculum (7) adjusts beam shape; Final light beam is vertically projected to the machined material surface behind lens (5) focusing and photochopper (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010216374 CN101905381A (en) | 2010-07-05 | 2010-07-05 | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010216374 CN101905381A (en) | 2010-07-05 | 2010-07-05 | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101905381A true CN101905381A (en) | 2010-12-08 |
Family
ID=43261046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010216374 Pending CN101905381A (en) | 2010-07-05 | 2010-07-05 | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101905381A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990230A (en) * | 2012-12-12 | 2013-03-27 | 京东方科技集团股份有限公司 | Laser cutting machine |
| CN104625416A (en) * | 2014-12-29 | 2015-05-20 | 北京理工大学 | Method for electronic dynamic control of crystal silicon surface periodic micro-nano structures based on square hole assistance |
| CN107498176A (en) * | 2017-08-02 | 2017-12-22 | 中国科学院光电研究院 | A kind of PRK polishing of porous ceramics and detection method |
| CN107685197A (en) * | 2017-09-22 | 2018-02-13 | 南京理工大学 | The processing unit (plant) and method of cutting are carried out to casting sand type using Linear Laser source |
| CN109095587A (en) * | 2018-08-28 | 2018-12-28 | 江苏大学 | A kind of Optical devices based on cavitation technology waste water |
| CN111451629A (en) * | 2020-04-20 | 2020-07-28 | 中国科学院合肥物质科学研究院 | Excimer laser rear-end optical path system |
| CN112171053A (en) * | 2020-08-26 | 2021-01-05 | 中国科学院西安光学精密机械研究所 | Method and system for machining threads on surface of hard and brittle material |
| CN112846530A (en) * | 2020-12-29 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Curved thick glass cutting and splitting method and system |
| CN113500298A (en) * | 2021-07-21 | 2021-10-15 | 哈尔滨工业大学 | Laser ablation processing device and method for micro-texture on surface of curved surface workpiece |
| CN114147373A (en) * | 2021-12-29 | 2022-03-08 | 广东中科微精光子制造科技有限公司 | Ceramic wafer laser cutting equipment |
| CN118081087A (en) * | 2024-04-22 | 2024-05-28 | 山东奈鑫激光智能装备有限责任公司 | Double-beam laser welding jacket equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1947917A (en) * | 2006-10-30 | 2007-04-18 | 西安交通大学 | Femto-second laser ture three-D micro-nano-processing center |
| CN101125393A (en) * | 2007-09-18 | 2008-02-20 | 南京航空航天大学 | Gas protecting device used for laser material processing |
| CN101391345A (en) * | 2007-10-31 | 2009-03-25 | 松下电器产业株式会社 | Mask for laser processing and laser processing method |
| CN201257573Y (en) * | 2008-05-30 | 2009-06-17 | 北京有色金属研究总院 | Inert atmosphere protecting housing for laser producing, processing and molding metallic material |
| CN101480757A (en) * | 2009-01-16 | 2009-07-15 | 陕西午禾科技有限责任公司 | Micro-fine processing system of femtosecond laser for material surface modification |
| CN101610870A (en) * | 2007-10-16 | 2009-12-23 | 三星钻石工业股份有限公司 | The U-lag processing method of brittle substrate and the removal processing method, perforation processing method and the chamfering method that use this method |
| CN201371316Y (en) * | 2009-03-27 | 2009-12-30 | 华中科技大学 | Multi-functional laser machining system |
-
2010
- 2010-07-05 CN CN 201010216374 patent/CN101905381A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1947917A (en) * | 2006-10-30 | 2007-04-18 | 西安交通大学 | Femto-second laser ture three-D micro-nano-processing center |
| CN101125393A (en) * | 2007-09-18 | 2008-02-20 | 南京航空航天大学 | Gas protecting device used for laser material processing |
| CN101610870A (en) * | 2007-10-16 | 2009-12-23 | 三星钻石工业股份有限公司 | The U-lag processing method of brittle substrate and the removal processing method, perforation processing method and the chamfering method that use this method |
| CN101391345A (en) * | 2007-10-31 | 2009-03-25 | 松下电器产业株式会社 | Mask for laser processing and laser processing method |
| CN201257573Y (en) * | 2008-05-30 | 2009-06-17 | 北京有色金属研究总院 | Inert atmosphere protecting housing for laser producing, processing and molding metallic material |
| CN101480757A (en) * | 2009-01-16 | 2009-07-15 | 陕西午禾科技有限责任公司 | Micro-fine processing system of femtosecond laser for material surface modification |
| CN201371316Y (en) * | 2009-03-27 | 2009-12-30 | 华中科技大学 | Multi-functional laser machining system |
Non-Patent Citations (1)
| Title |
|---|
| 《激光技术》 20070228 王成等 Al2O3陶瓷的激光三维雕刻实验研究 第1-3部分及图1，5 1-2 第31卷, 第1期 * |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990230B (en) * | 2012-12-12 | 2015-08-12 | 京东方科技集团股份有限公司 | A kind of laser cutting machine |
| CN102990230A (en) * | 2012-12-12 | 2013-03-27 | 京东方科技集团股份有限公司 | Laser cutting machine |
| CN104625416A (en) * | 2014-12-29 | 2015-05-20 | 北京理工大学 | Method for electronic dynamic control of crystal silicon surface periodic micro-nano structures based on square hole assistance |
| CN104625416B (en) * | 2014-12-29 | 2016-06-22 | 北京理工大学 | Based on square hole auxiliary electron dynamic regulation crystal silicon surface periodic micro-nano structure method |
| CN107498176B (en) * | 2017-08-02 | 2019-05-14 | 中国科学院光电研究院 | A kind of the excimer laser polishing and detection method of porous ceramics |
| CN107498176A (en) * | 2017-08-02 | 2017-12-22 | 中国科学院光电研究院 | A kind of PRK polishing of porous ceramics and detection method |
| CN107685197A (en) * | 2017-09-22 | 2018-02-13 | 南京理工大学 | The processing unit (plant) and method of cutting are carried out to casting sand type using Linear Laser source |
| CN109095587B (en) * | 2018-08-28 | 2021-08-03 | 江苏大学 | Optical device based on cavitation degradation waste water |
| CN109095587A (en) * | 2018-08-28 | 2018-12-28 | 江苏大学 | A kind of Optical devices based on cavitation technology waste water |
| CN111451629A (en) * | 2020-04-20 | 2020-07-28 | 中国科学院合肥物质科学研究院 | Excimer laser rear-end optical path system |
| CN112171053A (en) * | 2020-08-26 | 2021-01-05 | 中国科学院西安光学精密机械研究所 | Method and system for machining threads on surface of hard and brittle material |
| CN112171053B (en) * | 2020-08-26 | 2021-06-22 | 中国科学院西安光学精密机械研究所 | Method and system for machining threads on surface of hard and brittle material |
| CN112846530A (en) * | 2020-12-29 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Curved thick glass cutting and splitting method and system |
| CN113500298A (en) * | 2021-07-21 | 2021-10-15 | 哈尔滨工业大学 | Laser ablation processing device and method for micro-texture on surface of curved surface workpiece |
| CN113500298B (en) * | 2021-07-21 | 2023-03-24 | 哈尔滨工业大学 | Laser ablation processing device and method for micro-texture on surface of curved surface workpiece |
| CN114147373A (en) * | 2021-12-29 | 2022-03-08 | 广东中科微精光子制造科技有限公司 | Ceramic wafer laser cutting equipment |
| CN114147373B (en) * | 2021-12-29 | 2024-04-26 | 广东中科微精光子制造科技有限公司 | Ceramic wafer laser cutting equipment |
| CN118081087A (en) * | 2024-04-22 | 2024-05-28 | 山东奈鑫激光智能装备有限责任公司 | Double-beam laser welding jacket equipment |
| CN118081087B (en) * | 2024-04-22 | 2024-07-19 | 山东奈鑫激光智能装备有限责任公司 | Double-beam laser welding jacket equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101905381A (en) | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring | |
| CN111822887B (en) | Processing system and method for laser drilling thick glass | |
| CN206732372U (en) | A kind of ultrafast picosecond laser Precision Machining equipment of the more laser heads of large format | |
| CN100462199C (en) | Method of polishing normal pressure plasma | |
| CN103802039B (en) | A kind of concave curved surface super-abrasive grinding wheel laser finishing device and method | |
| CN104385065B (en) | Based on the quartz glass ductile regime grinding method that laser crackle is repaired in advance | |
| CN104384727B (en) | The devices and methods therefor of optical-fiber laser processed alumina pottery | |
| CN106238918A (en) | The ceramic etching system of a kind of ultrasonic wave added laser and method | |
| CN106271493A (en) | A kind of prefabricated micro-texture assisting ultrasonic milling process method of laser and system of processing | |
| CN102528280A (en) | Laser-water jet composite micromachining process and device | |
| CN105904151B (en) | Thin-wall part combined-repair method based on pulse welding and laser gain material reparation | |
| CN103030266A (en) | Laser cutting method and device | |
| CN113414889B (en) | Method and device for compounding laser-assisted diamond cutting and laser polishing in situ | |
| CN213194882U (en) | Laser cleaning equipment integrating laser cleaning, texturing and stripping | |
| CN103521767A (en) | Method and device for precisely machining complex part at high speed | |
| CN112824004B (en) | Composite water-assisted laser processing system and processing method thereof | |
| CN104625432B (en) | The laser cutting method of a kind of wolfram steel thin slice and system | |
| CN107824958A (en) | A kind of 355nm Ultra-Violet Lasers diamond cut equipment | |
| CN101804519A (en) | Laser processing head | |
| CN103802024B (en) | A kind of Apparatus and method for using dual-beam to repair ultra-thin extra hard material grinding wheel | |
| CN206981997U (en) | A kind of hybrid laser beam machining device of glass micro-channel | |
| CN205324994U (en) | Equipment of complicated shape part is made in sheet metal stack | |
| CN103273196B (en) | Irradiation scanning machining method of micro-lens array in CO2 laser selective region of organic glass | |
| WO2024032054A1 (en) | Multi-axis linkage laser superfinishing method and device | |
| CN117250907A (en) | Device and method for adjusting important parameters in synchronous laser auxiliary processing in real time |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101208 |