CN206981997U - A kind of hybrid laser beam machining device of glass micro-channel - Google Patents
A kind of hybrid laser beam machining device of glass micro-channel Download PDFInfo
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- CN206981997U CN206981997U CN201720066814.4U CN201720066814U CN206981997U CN 206981997 U CN206981997 U CN 206981997U CN 201720066814 U CN201720066814 U CN 201720066814U CN 206981997 U CN206981997 U CN 206981997U
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Abstract
The utility model is a kind of hybrid laser beam machining device of glass micro-channel, and processing unit (plant) mainly includes：Cutting head lens group, side axle air inlet, controllable mobile platform, laser cleaning beam shaping system, X/Y scanning galvanometers, focus lamp, the back of the body carve preliminarily forming exemplar, laser cleaning fixture.A whole set of processing unit (plant) is carved by the laser back of the body and two big module composition of laser cleaning, and the back of the body photoetching form of glass micro-channel and the Compound Machining of laser cleaning can be achieved.The micro-channel structure size uniform that the utility model device is processed, surface roughness is good, and runner inner wall without harmful chemicals residue, be easy to integrate, simple to operate, convenient and practical, has higher processing speed and processing cost low by the utility model device.
Description
Technical field
The utility model is used for the technical field for laser machining hard crisp transparent material, and in particular to a kind of glass micro-channel
Hybrid laser beam machining device.
Background technology
Fluid channel is the important component of microreactor and micro-fluidic system, integrated being widely used in of micro sprue system
The fields such as, optics, biologic medical and military affairs.Glass and silicon materials are because of its stable chemical performance, reliability and anti-high pressure height
Wen Hao, the advantages that being driven beneficial to EOF, be the high performance material for preparing fluid channel.But the fragility ambassador of glass material its it is micro- plus
Work is difficult, and with high costs according to special technique preparation microfluidic components, constrain glass makes on a large scale in microfluidic field
With.
In recent years, fluid channel processing technology achieves fast development, and conventional glass micro fabrication includes：Chemistry is carved
Erosion, machining, Ultrasonic machining, glass thermoforming, Laser Processing etc..1) chemical etching fluid channel be at present mainly use plus
Work mode, it need to be passed through again as mask plate by figure needed for the acquisition of the techniques such as surface treatment, resist coating, optical exposure, development
Cross the fluid channel that HF corrosive environments are shaped, the cumbersome cost of technical process is high and not environmentally；2) machined glass fluid channel
Specific knife sharpener is needed to use, adds man-hour requirement to control glass strain, difficulty is larger；3) Ultrasonic machining is in the course of the work
Need to add various sizes of abrasive, when workpiece size is in um ranks, difficulty of processing will sharply increase；4) glass thermoforming
Often it is divided into compressing, blow molding, rolls shaping, is continuous quick increased with temperature reduction using the viscosity of glass
Property, with the change of viscosity, the glass that can be flowed gradually is hardened to solid, and micro-fluidic field needs large area fine
Flow passage structure, according to this method, it will make it that process is more complicated, cost is higher；5) it is to pass through height to laser machine fluid channel
Energy laser beam focus produces high temperature melting for processing district surface to material or gasification process forms processing pattern, the letter of which technique
Single, pattern direct write does not need mask, environment-friendly high-efficiency.Generally believe that laser is one of strong instrument of micro-nano technology at present,
But because glass material permeability is good, common infrared band laser is difficult to focus in glass surface, and uses royal purple wave band or super
Fast Laser Processing micro-structural, processing cost are higher.
Laser etches the substrate for using low energy, short wavelength and laser higher absorption rate mostly backwards, and laser penetration generation adds
Work material incides the substrate at the material back side, and temperature raises fusing or the gasification temperature reached for machining object after substrate absorbs laser
Realize the removal of material.This method can carry out microfabrication to transparent material using the infrared laser of low cost and save equipment investment
Cost, but the problems such as chip removal is difficult and thermal stress is big be present because infrared laser etches fluid channel backwards, easily produced in trench interiors
The slag accumulation and deposition substrate microparticle that raw conventional clean mode is difficult to clean off, in order to overcome above mentioned problem to select suitably
Slag manner of cleaning up inside the substrate and very low power of absorptivity.Laser cleaning technique is a kind of " green " cleaning way, without
Chemical reagent and cleaning solution, the base material range that dirty removal capacities can be applicable by force is extensive, and not damaged cleaning can be achieved.Laser cleaning is set
Standby flexible and adaptability is high, and it is low to be easy to implement automation mechanized operation its operating cost.
Therefore, it is necessary to provide a kind of system that can either be reduced and prepare the glass micro-channel that cost and can ensures crudy
Preparation Method and device.
Utility model content
The purpose of this utility model is to consider above mentioned problem and provides a kind of simple to operate, and convenient and practical, cost is relatively low,
Laser with high-efficiency environment friendly prepares fluid channel method.
The hybrid laser beam machining device of glass micro-channel of the present utility model is carved by the laser back of the body and two big module of laser cleaning
Composition.Wherein laser back of the body die sinking block passes through cutting head lens group, side axle air inlet, controllable mobile platform, graphite substrate and glass
Substrate is formed, and its function is that the glass micro-channel exemplar of standby preliminarily forming is scribed using graphite as the substrate back of the body；Laser cleaning module is led to
Cross laser cleaning beam shaping system, X/Y scanning galvanometers, focus lamp, the back of the body and carve preliminarily forming exemplar, laser cleaning fixture composition,
Its function is that the graphite particle of preliminarily forming glass micro-channel sample surface is deposited using the laser beam after shaping as cleaning means
Thing and slag sputtering thing are cleaned；Light path switching component can switch over to the light path of two big modules, realize that the laser back of the body is carved
With integrating for laser cleaning.
Graphite substrate is positioned on controllable mobile platform and by surface polishing in above-mentioned back of the body die sinking block, is easy to glass
Substrate contact is tightly formed the good back of the body and carves condition；By controlling the movement of cutting head Z axis to make focal point in glass and graphite
Faying face at, cutting head side axle air inlet is constantly blown into compressed air during the back of the body is carved, and reduces the heat history of back of the body quarter process.
Light beam progress spacing shaping is made Energy distribution more uniform by above-mentioned laser cleaning module by optical shaping system,
And export laser by scanning galvanometer and focusing field lens and act on the fluid channel exemplar of back of the body photoetching form, adhere to sample surface
Graphite particle deposit and slag sputtering thing laser ablation impact under be eliminated, laser straight when exemplar is cleaned
Connect and penetrate exemplar cleaning automatic cut-off.
The advantages of the utility model and good effect are：The utility model is carved and laser cleaning phase composite square using the laser back of the body
Formula realizes the laser Compound Machining of fluid channel, and the advantage for taking full advantage of inexpensive infrared band laser realizes the back of the body of fluid channel
Carve preliminarily forming and fluid channel laser cleaning reparation；The hybrid laser beam machining device of glass micro-channel of the present utility model is easy to
It is integrated, it is a kind of ingenious in design, function admirable, convenient and practical processing unit (plant).
Brief description of the drawings
Fig. 1 is the compound processing unit (plant) schematic diagram for preparing fluid channel of laser.
Fig. 2 is the close-up schematic view that the laser back of the body carves fluid channel.
Fig. 3 is the close-up schematic view of dry laser cleaning fluid channel.
Fig. 4 is laser back of the body carved glass fluid channel preliminarily forming schematic diagram.
Fig. 5 is the compound preparation method shaping fluid channel schematic diagram of laser.
In Fig. 1：1. graphite substrate, 2. glass substrates, 3. side axle air inlets, 4. cutting head lens groups, the switching of 5. light paths
Component, 6. laser cleaning beam shaping systems, 7.X/Y scanning galvanometers, 8. focus lamps, 9. back ofs the body carve preliminarily forming exemplar, 10. laser
Cleaning jig, the controllable mobile platform of 11.2 stations.
Embodiment
Embodiment：
Schematic device of the present utility model is as shown in Fig. 1,2,3,4,5, the laser of glass micro-channel of the present utility model
Complex machining device carries on the back die sinking block by laser and laser cleaning module forms.
In the present embodiment, station 1 is that laser carries on the back die sinking block by graphite substrate 1, glass substrate 2, side axle air inlet 3, cutting
Head lens group 4 forms and controllable mobile platform 11 is formed.
In the present embodiment, station 2 be laser cleaning module by light path switching component 5, laser cleaning beam shaping system 6,
X/Y scanning galvanometers 7, focus on galvanometer 8, back of the body quarter preliminarily forming exemplar 9, laser cleaning fixture 10 and the structure of controllable mobile platform 11
Into.
In the present embodiment, air inlet side axle air inlet 3 is constantly passed through 0.1MPa compressed airs, reduces heat caused by back of the body quarter process
Stress.
In the present embodiment, the above-mentioned polished processing surface roughness in the surface of graphite substrate 1 is Ra 0.04~0.1, beneficial to glass
Glass substrate tightly sticks to form the good back of the body with graphite substrate and carves condition.
In the present embodiment, above-mentioned laser beam used is pulsed infrared laser light；Above-mentioned 700~1400nm of laser wavelength range；
Above-mentioned laser pulse width scope is 0~200ns；0~500J/cm of above-mentioned laser energy density scope2；Above-mentioned lasing frequencies range 0
~100KHz；1~2000mm/s of above-mentioned laser galvanometer scanning velocity interval；The back of the body delineation of above-mentioned laser cutting head cut number for 1~
10 times, laser cleaning scanning times 1~20 time.In this example, for carrying on the back the wavelength for the laser for carving laser beam as 1064nm, arteries and veins
A width of 100ns, energy density 198.4J/cm2, frequency 40KHz, cutting-up number 2 times.For laser cleaning repair tentatively into
The pulsewidth of shape fluid channel is 100ns, energy density 88.16J/cm2, sweep speed 1000mm/s, frequency 40KHz, sweep
Face number 3 times.
The processing method of the processing unit (plant) of the utility model laser forming cutting sapphire substrate, comprises the following steps：
1) graphite substrate 1 is fixed in the controllable mobile station 11 of station 1, and glass substrate 2 is close to graphite substrate 1；
2) regulation cutting head makes the laser spot of outgoing focus at the contact surface of graphite substrate 1 and glass substrate 2, simultaneously
Ensure that processing cutting head side axle air inlet 3 is constantly passed through compressed air, air pressure 5Mpa, reducing heat in laser processing procedure should
Power；
3) movement of the controllable platform 11 of station 1 in X/Y planes is controlled, realizes that the fluid channel back of the body carves preliminarily forming；
4) the fluid channel exemplar 9 of preliminarily forming is placed on the laser cleaning fixture 10 of the controllable platform 11 of station 2；
5) it is whole by controlling light path switching component 5 to switch to light path in laser cleaning beam shaping system 6 to carry out light beam
Shape is exported by X/Y scanning galvanometers 7 and focus lamp 8 again；
6) laser spot is focused on into the lower surface of preliminarily forming fluid channel exemplar 9, the motion of control X/Y galvanometers 7 is to preliminary
Molding glass fluid channel carries out laser cleaning until laser passes completely through glass, and laser cleaning is completed；
Finally it should be noted that above content is only illustrating the technical solution of the utility model, rather than to this practicality
The limitation of novel protected scope, simple modification that one of ordinary skill in the art is carried out to the technical solution of the utility model or
Person's equivalent substitution, all without departing from the spirit and scope of technical solutions of the utility model.
Claims (4)
1. a kind of hybrid laser beam machining device of glass micro-channel, it is characterised in that include two stations, station 1 is carried on the back for laser
Die sinking block, for realizing that the laser of fluid channel carries on the back photoetching form, by graphite substrate（1）, glass substrate（2）, survey axle air inlet（3）、
Cutting head lens group（4）And controllable mobile platform（11）Form；Station 2 is laser cleaning module, and station 1 is carried on the back for realizing
The laser cleaning of the fluid channel sample of preliminarily forming is carved, is reached and is removed the graphite particle of residual in runner, slag and repair stream
The purpose of road structure, by light path switching component（5）, laser cleaning beam shaping system（6）, X/Y scanning galvanometers（7）, focus on shake
Mirror（8）, the back of the body carve preliminarily forming exemplar（9）, laser cleaning fixture（10）And controllable mobile platform（11）Form.
2. a kind of hybrid laser beam machining device of glass micro-channel as claimed in claim 1, it is characterised in that made at station 1
Graphite substrate（1）The polished processing in surface, can more preferably and glass substrate（2）Fitting.
3. a kind of hybrid laser beam machining device of glass micro-channel as claimed in claim 1 or 2, it is characterised in that station 1 swashs
Light carries on the back die sinking block and the laser cleaning module of station 2 shares same infrared band pulse laser and passes through light path switching component
（5）Realize that switching of the light beam at station 1 and station 2 uses.
4. a kind of hybrid laser beam machining device of glass micro-channel as claimed in claim 3, it is characterised in that used is infrared
Wave band of laser 700~1400nm of wave-length coverage, laser pulse width scope are 0~200ns, 10~100KHz of lasing frequencies range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720066814.4U CN206981997U (en) | 2017-01-12 | 2017-01-12 | A kind of hybrid laser beam machining device of glass micro-channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720066814.4U CN206981997U (en) | 2017-01-12 | 2017-01-12 | A kind of hybrid laser beam machining device of glass micro-channel |
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| CN206981997U true CN206981997U (en) | 2018-02-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483061A (en) * | 2018-10-09 | 2019-03-19 | 武汉锐科光纤激光技术股份有限公司 | Laser 3D method for making color marker and device |
| CN112317458A (en) * | 2020-09-29 | 2021-02-05 | 深圳信息职业技术学院 | Composite processing equipment and method for laser cleaning and laser shock peening |
| CN114734147A (en) * | 2022-03-09 | 2022-07-12 | 五邑大学 | Laser direct writing analysis method, processing method, equipment and storage medium of micro-channel |
-
2017
- 2017-01-12 CN CN201720066814.4U patent/CN206981997U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483061A (en) * | 2018-10-09 | 2019-03-19 | 武汉锐科光纤激光技术股份有限公司 | Laser 3D method for making color marker and device |
| CN112317458A (en) * | 2020-09-29 | 2021-02-05 | 深圳信息职业技术学院 | Composite processing equipment and method for laser cleaning and laser shock peening |
| CN114734147A (en) * | 2022-03-09 | 2022-07-12 | 五邑大学 | Laser direct writing analysis method, processing method, equipment and storage medium of micro-channel |
| CN114734147B (en) * | 2022-03-09 | 2024-05-07 | 五邑大学 | Laser direct writing analysis method, processing method, equipment and storage medium for micro-channel |
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