CN101901789A - 内绝缘型塑封半导体器件及其制造方法 - Google Patents
内绝缘型塑封半导体器件及其制造方法 Download PDFInfo
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- CN101901789A CN101901789A CN2010102116659A CN201010211665A CN101901789A CN 101901789 A CN101901789 A CN 101901789A CN 2010102116659 A CN2010102116659 A CN 2010102116659A CN 201010211665 A CN201010211665 A CN 201010211665A CN 101901789 A CN101901789 A CN 101901789A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37147—Copper [Cu] as principal constituent
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102116659A CN101901789B (zh) | 2010-06-28 | 2010-06-28 | 内绝缘型塑封半导体器件及其制造方法 |
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CN2010102116659A CN101901789B (zh) | 2010-06-28 | 2010-06-28 | 内绝缘型塑封半导体器件及其制造方法 |
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CN101901789A true CN101901789A (zh) | 2010-12-01 |
CN101901789B CN101901789B (zh) | 2011-07-20 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102254889A (zh) * | 2011-07-05 | 2011-11-23 | 启东市捷捷微电子有限公司 | 一种大功率半导体器件及其封装方法 |
CN102254879A (zh) * | 2011-07-05 | 2011-11-23 | 启东市捷捷微电子有限公司 | 一种大尺寸硅芯片采用塑料实体封装的可控硅及其封装工艺 |
CN102280427A (zh) * | 2011-07-04 | 2011-12-14 | 启东市捷捷微电子有限公司 | 一种金属与塑料混合封装的可控硅封装结构及其方法 |
CN102751212A (zh) * | 2012-07-06 | 2012-10-24 | 陈长贵 | 一种全塑封半导体器件的封塑体绝缘测试装置 |
CN102751213A (zh) * | 2012-07-06 | 2012-10-24 | 陈长贵 | 一种全塑封半导体器件的封塑体绝缘测试方法 |
CN108198798A (zh) * | 2018-01-12 | 2018-06-22 | 广州新星微电子有限公司 | 一种三极管以及其封装方法 |
CN109449125A (zh) * | 2018-09-12 | 2019-03-08 | 江苏捷捷微电子股份有限公司 | 一种双排结构内绝缘型塑封半导体器件及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706129A (en) * | 1970-07-27 | 1972-12-19 | Gen Electric | Integrated semiconductor rectifiers and processes for their fabrication |
JPS5655069A (en) * | 1979-10-11 | 1981-05-15 | Hitachi Ltd | Semiconductor rectifier |
CN2107053U (zh) * | 1991-12-11 | 1992-06-10 | 黄坡 | 防爆型远动开关 |
-
2010
- 2010-06-28 CN CN2010102116659A patent/CN101901789B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706129A (en) * | 1970-07-27 | 1972-12-19 | Gen Electric | Integrated semiconductor rectifiers and processes for their fabrication |
JPS5655069A (en) * | 1979-10-11 | 1981-05-15 | Hitachi Ltd | Semiconductor rectifier |
CN2107053U (zh) * | 1991-12-11 | 1992-06-10 | 黄坡 | 防爆型远动开关 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102280427A (zh) * | 2011-07-04 | 2011-12-14 | 启东市捷捷微电子有限公司 | 一种金属与塑料混合封装的可控硅封装结构及其方法 |
CN102280427B (zh) * | 2011-07-04 | 2013-01-16 | 江苏捷捷微电子股份有限公司 | 一种金属与塑料混合封装的可控硅封装结构及其封装方法 |
CN102254889A (zh) * | 2011-07-05 | 2011-11-23 | 启东市捷捷微电子有限公司 | 一种大功率半导体器件及其封装方法 |
CN102254879A (zh) * | 2011-07-05 | 2011-11-23 | 启东市捷捷微电子有限公司 | 一种大尺寸硅芯片采用塑料实体封装的可控硅及其封装工艺 |
CN102751212A (zh) * | 2012-07-06 | 2012-10-24 | 陈长贵 | 一种全塑封半导体器件的封塑体绝缘测试装置 |
CN102751213A (zh) * | 2012-07-06 | 2012-10-24 | 陈长贵 | 一种全塑封半导体器件的封塑体绝缘测试方法 |
CN102751213B (zh) * | 2012-07-06 | 2016-09-14 | 泰州海天电子科技股份有限公司 | 一种全塑封半导体器件的封塑体绝缘测试方法 |
CN108198798A (zh) * | 2018-01-12 | 2018-06-22 | 广州新星微电子有限公司 | 一种三极管以及其封装方法 |
CN109449125A (zh) * | 2018-09-12 | 2019-03-08 | 江苏捷捷微电子股份有限公司 | 一种双排结构内绝缘型塑封半导体器件及其制造方法 |
CN109449125B (zh) * | 2018-09-12 | 2023-12-26 | 江苏捷捷微电子股份有限公司 | 一种双排结构内绝缘型塑封半导体器件及其制造方法 |
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CN101901789B (zh) | 2011-07-20 |
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C56 | Change in the name or address of the patentee |
Owner name: JIANGSU JIEJIE MICROELECTRONICS CO., LTD. Free format text: FORMER NAME: QIDONG JIEJIE MICRO-ELECTRONIC CO., LTD. |
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CP03 | Change of name, title or address |
Address after: 226200, No. 8, Xinglong Road, Chengbei Industrial Zone, Qidong Economic Development Zone, Jiangsu, Nantong Patentee after: Jiangsu Jiejie Microelectronics Co., Ltd. Address before: 226200 No. 8, Xinglong Road, Chengbei Industrial Zone, Qidong Economic Development Zone, Jiangsu, China Patentee before: Qidong Jiejie Micro-electronic Co., Ltd. |
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Address after: 226200, 8, Xinglong Road, Qidong science and Technology Pioneer Park, Jiangsu Patentee after: Jiangsu Jiejie Microelectronics Co., Ltd. Address before: 226200, No. 8, Xinglong Road, Chengbei Industrial Zone, Qidong Economic Development Zone, Jiangsu, Nantong Patentee before: Jiangsu Jiejie Microelectronics Co., Ltd. |
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CP02 | Change in the address of a patent holder |
Address after: No.3000 Qiantangjiang Road, Qidong Economic Development Zone, Nantong City, Jiangsu Province Patentee after: JIANGSU JIEJIE MICROELECTRONICS Co.,Ltd. Address before: 226200, 8, Xinglong Road, Qidong science and Technology Pioneer Park, Jiangsu Patentee before: JIANGSU JIEJIE MICROELECTRONICS Co.,Ltd. |