CN101888769A - 吸波散热贴片 - Google Patents

吸波散热贴片 Download PDF

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Publication number
CN101888769A
CN101888769A CN2009103023127A CN200910302312A CN101888769A CN 101888769 A CN101888769 A CN 101888769A CN 2009103023127 A CN2009103023127 A CN 2009103023127A CN 200910302312 A CN200910302312 A CN 200910302312A CN 101888769 A CN101888769 A CN 101888769A
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China
Prior art keywords
wave
heat
radiating patch
dissipating layer
absorbing
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Pending
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CN2009103023127A
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English (en)
Inventor
蒋文凯
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2009103023127A priority Critical patent/CN101888769A/zh
Priority to US12/540,348 priority patent/US20100288553A1/en
Publication of CN101888769A publication Critical patent/CN101888769A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Textile Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种吸波散热贴片，包括一第一散热层、一吸波网及一第二散热层，所述第一、第二散热层由矽散热胶制成；所述吸波网设置于所述第一、第二散热层之间，其主要由电磁吸波材料制成，所述吸波散热贴片可以在导热的同时吸收电磁波以减少电磁辐射。

Description

吸波散热贴片
技术领域
本发明涉及一种吸波散热贴片。
背景技术
电子产品内部工作的电子元件是电磁辐射的来源。人们为了解决电磁辐射问题，通常是利用金属罩密闭电子元件阻挡电磁波散射。同时，现今电子产品的工作频率越来越高，其内部高速工作的电子元件会产生大量的热量，如果不及时散去这些热量会使电子元件的使用寿命缩短或导致异常死机。人们为了解决电子产品的散热问题，通常是将热流引导到由铜或者是铝做成的散热器上将热流导出，且散热器和电子元件之间会有间隙，在间隙中一般会填充散热介质来增加热传导率，而如此就不能解决电子元件的电磁辐射问题。
发明内容
鉴于以上内容，有必要提供一种既可以散热又可以吸收电磁波的吸波散热贴片。
一种吸波散热贴片，包括一第一散热层、一吸波网及一第二散热层，所述第一、第二散热层由矽散热胶制成；所述吸波网设置于所述第一、第二散热层之间，其主要由电磁吸波材料制成。
上述吸波散热贴片，通过在第一、第二散热层之间设置由电磁吸波材料制成的所述吸波网，可以在导热的同时吸收电磁波减少电磁辐射。
附图说明
图1本发明吸波散热贴片的较佳实施方式的剖面图。
图2为图1中吸波网的示意图。
具体实施方式
请参阅图1，本发明吸波散热贴片的较佳实施方式包括一第一散热层10、一吸波网20及一第二散热层30。所述吸波网20位于第一、第二散热层10、30之间。所述第一、第二散热层10、30均为由现有的矽散热胶切成0.6毫米厚的散热胶片构成。由于矽散热胶片中的矽元素具有较佳的高压缩性和粘合性，故所述第一散热层10及第二散热层30能够很好的与一散热模组(未示出)及电子元件(未示出)连接。所述吸波网20主要由电磁吸波材料制成，所述电磁吸波材料可以为电损耗性电磁吸波材料或磁损耗性吸波材料，所述吸波网20的厚度为0.05毫米。
请继续参阅图2，所述吸波网20包括若干纬线21及经线22，其中，所述纬线21、经线22均为由现有的纳米技术将电损耗性电磁吸波材料或磁损耗性吸波材料制成的吸波纳米纤维加工成直径为0.05毫米的细线，每相邻的两条纬线21之间的距离为0.1毫米，每相邻的两条经线22之间的距离为0.1毫米。
因为在制作所述吸波散热贴片时，是将所述第一、第二散热层10、30及吸波网20压合在一起，所述第一、第二散热层10、30的矽散热胶透过所述吸波网20上的网孔后粘合。所述电子元件产生的热量通过矽散热胶传递至所述散热模组。所述电子元件产生的电磁波被所述吸波网20的纬线21及经线22吸收。
本实施方式中所述吸波散热贴片的厚度为1.25毫米，在其他的实施方式中所述吸波散热贴片的厚度在1.05～2.08毫米之间，所述第一、第二散热层10、30的厚度可根据需要设置在0.5～1毫米之间，所述吸波网的厚度可根据需要设置在0.05～0.08毫米之间，所述经线21、纬线22的直径可根据需要设置在0.05～0.08毫米之间。所述吸波网20也可为其他网状结构，如蜂巢状。
上述吸波散热贴片，通过在第一、第二散热层10、30之间设置所述吸波网20，可以在导热的同时吸收电磁波以减少电磁辐射。

Claims (5)

1.一种吸波散热贴片，包括一第一散热层、一吸波网及一第二散热层，所述第一、第二散热层由矽散热胶制成；所述吸波网设置于所述第一、第二散热层之间，其主要由电磁吸波材料制成。
2.如权利要求1所述的吸波散热贴片，其特征在于：所述第一及第二散热层的厚度在0.5～1毫米之间，所述吸波网的厚度在0.05～0.08毫米之间，所述吸波散热贴片的厚度在1.05～2.08毫米之间。
3.如权利要求1所述的吸波散热贴片，其特征在于：所述吸波网包括若干经线及纬线，所述经线、纬线均为由纳米技术制成的吸波纳米纤维加工成的细线。
4.如权利要求3所述的吸波散热贴片，其特征在于：所述经线、纬线的直径均在0.05～0.08毫米之间。
5.如权利要求3所述的吸波散热贴片，其特征在于：每两条相邻经线及每两条相邻的纬线之间的距离为0.1毫米。
CN2009103023127A 2009-05-14 2009-05-14 吸波散热贴片 Pending CN101888769A (zh)

Priority Applications (2)

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CN2009103023127A CN101888769A (zh) 2009-05-14 2009-05-14 吸波散热贴片
US12/540,348 US20100288553A1 (en) 2009-05-14 2009-08-12 Cooling pad capable of absorbing electromagnetic interference

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CN2009103023127A CN101888769A (zh) 2009-05-14 2009-05-14 吸波散热贴片

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007704A (zh) * 2014-04-24 2015-10-28 苏州驭奇材料科技有限公司 复合散热吸波膜
CN106633911A (zh) * 2016-12-01 2017-05-10 昆山裕凌电子科技有限公司 一种吸波导热绝缘垫片

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120061135A1 (en) * 2010-09-14 2012-03-15 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies having emi shielding properties

Citations (2)

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Publication number Priority date Publication date Assignee Title
US6542371B1 (en) * 2000-11-02 2003-04-01 Intel Corporation High thermal conductivity heat transfer pad
CN2626193Y (zh) * 2003-04-30 2004-07-14 嘉得隆科技股份有限公司 具有高导热及电磁屏蔽功能的复合材料

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6680849B2 (en) * 2002-03-29 2004-01-20 Nortel Networks Corporation Extruded heatsink and EMC enclosure
US20090067150A1 (en) * 2005-03-22 2009-03-12 Tomoaki Ito Protection Film for Preventing Leakage of Information, Portable Pouch, Card Case, and Information-Leakage Preventing Plate
US20090166065A1 (en) * 2008-01-02 2009-07-02 Clayton James E Thin multi-chip flex module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6542371B1 (en) * 2000-11-02 2003-04-01 Intel Corporation High thermal conductivity heat transfer pad
CN2626193Y (zh) * 2003-04-30 2004-07-14 嘉得隆科技股份有限公司 具有高导热及电磁屏蔽功能的复合材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007704A (zh) * 2014-04-24 2015-10-28 苏州驭奇材料科技有限公司 复合散热吸波膜
CN106633911A (zh) * 2016-12-01 2017-05-10 昆山裕凌电子科技有限公司 一种吸波导热绝缘垫片

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Application publication date: 20101117