CN101888746B - 喷流焊锡槽 - Google Patents

喷流焊锡槽 Download PDF

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Publication number
CN101888746B
CN101888746B CN201010174193.4A CN201010174193A CN101888746B CN 101888746 B CN101888746 B CN 101888746B CN 201010174193 A CN201010174193 A CN 201010174193A CN 101888746 B CN101888746 B CN 101888746B
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China
Prior art keywords
mentioned
scolding tin
gas
nitrogen
jet solder
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CN201010174193.4A
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Chinese (zh)
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CN101888746A (zh
Inventor
大清水和宪
高口彰
桥本昇
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CN201010174193.4A 2009-05-14 2010-05-13 喷流焊锡槽 Active CN101888746B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-117666 2009-05-14
JP2009117666A JP5410835B2 (ja) 2009-05-14 2009-05-14 噴流はんだ槽

Publications (2)

Publication Number Publication Date
CN101888746A CN101888746A (zh) 2010-11-17
CN101888746B true CN101888746B (zh) 2014-07-16

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CN201010174193.4A Active CN101888746B (zh) 2009-05-14 2010-05-13 喷流焊锡槽

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JP (1) JP5410835B2 (enrdf_load_stackoverflow)
CN (1) CN101888746B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801809B (zh) * 2014-01-29 2018-09-14 气体产品与化学公司 用于在焊接期间提供惰性气体的设备和方法
CN108817588A (zh) * 2018-05-30 2018-11-16 苏州精美科光电材料有限公司 一种管靶贴合方法
JP7249215B2 (ja) * 2019-06-19 2023-03-30 株式会社デンソーテン はんだ付け装置およびはんだ付け装置の制御方法
CN114850714B (zh) * 2022-04-12 2023-08-08 深圳市林鑫达智能装备有限公司 一种焊接设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3420283B2 (ja) * 1993-06-07 2003-06-23 株式会社タムラ製作所 不活性雰囲気はんだ付け装置における酸素濃度制御方法およびその装置
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
JP2000071066A (ja) * 1998-08-28 2000-03-07 Tokyo Seisan Giken Kk 窒素パッケージ一体型半田槽
JP2001119134A (ja) * 1999-10-22 2001-04-27 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JP2002057449A (ja) * 2000-08-11 2002-02-22 Air Liquide Japan Ltd ガス供給装置およびハンダ付け装置
JP3867511B2 (ja) * 2001-04-05 2007-01-10 スズキ株式会社 部分半田付け装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2000-71066A 2000.03.07
JP特开平6-344176A 1994.12.20
JP特表平9-500238A 1997.01.07

Also Published As

Publication number Publication date
JP5410835B2 (ja) 2014-02-05
JP2010267785A (ja) 2010-11-25
CN101888746A (zh) 2010-11-17

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