CN101875493B - 还原多晶硅的方法 - Google Patents
还原多晶硅的方法 Download PDFInfo
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- CN101875493B CN101875493B CN2009103104872A CN200910310487A CN101875493B CN 101875493 B CN101875493 B CN 101875493B CN 2009103104872 A CN2009103104872 A CN 2009103104872A CN 200910310487 A CN200910310487 A CN 200910310487A CN 101875493 B CN101875493 B CN 101875493B
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CN2009103104872A CN101875493B (zh) | 2009-11-26 | 2009-11-26 | 还原多晶硅的方法 |
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CN2009103104872A CN101875493B (zh) | 2009-11-26 | 2009-11-26 | 还原多晶硅的方法 |
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CN101875493A CN101875493A (zh) | 2010-11-03 |
CN101875493B true CN101875493B (zh) | 2012-06-27 |
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CN2009103104872A Expired - Fee Related CN101875493B (zh) | 2009-11-26 | 2009-11-26 | 还原多晶硅的方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102849740B (zh) * | 2012-08-23 | 2015-04-29 | 内蒙古盾安光伏科技有限公司 | 一种多晶硅生产工艺 |
CN105574343A (zh) * | 2015-12-22 | 2016-05-11 | 成都蜀菱科技发展有限公司 | 改良西门子法还原炉提高多晶硅一次沉积率的方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1663911A (zh) * | 2003-12-18 | 2005-09-07 | 瓦克化学有限公司 | 无粉尘且无微孔的高纯度粒状多晶硅 |
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- 2009-11-26 CN CN2009103104872A patent/CN101875493B/zh not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
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CN1663911A (zh) * | 2003-12-18 | 2005-09-07 | 瓦克化学有限公司 | 无粉尘且无微孔的高纯度粒状多晶硅 |
Non-Patent Citations (1)
Title |
---|
邓丰等.三氯氢硅氢还原制备高纯硅.《多晶硅生产技术》.化学工业出版社,2009,152-157. * |
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CN101875493A (zh) | 2010-11-03 |
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C14 | Grant of patent or utility model | ||
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ASS | Succession or assignment of patent right |
Owner name: CHINA NATIONAL CHEMICAL ENGINEERING NO.7 CONSTRUCT Effective date: 20130819 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130819 Address after: 614000 No. 6 Lego Road, Leshan hi tech Development Zone, Sichuan Patentee after: Leshan Ledian Tianwei Silicas Co., Ltd. Patentee after: China National Chemical Engineering No.7 Construction Co., Ltd. Address before: 614000 No. 6 Lego Road, Leshan hi tech Development Zone, Sichuan Patentee before: Leshan Ledian Tianwei Silicas Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20161126 |