CN101866839B - 一种应用掩膜保护进行激光快速加热方法 - Google Patents

一种应用掩膜保护进行激光快速加热方法 Download PDF

Info

Publication number
CN101866839B
CN101866839B CN2010101798947A CN201010179894A CN101866839B CN 101866839 B CN101866839 B CN 101866839B CN 2010101798947 A CN2010101798947 A CN 2010101798947A CN 201010179894 A CN201010179894 A CN 201010179894A CN 101866839 B CN101866839 B CN 101866839B
Authority
CN
China
Prior art keywords
film
amorphous silicon
laser
deposit
silicon nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101798947A
Other languages
English (en)
Other versions
CN101866839A (zh
Inventor
王强
花国然
朱海峰
施敏
张振娟
黄静
宋长青
张华�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Zongyi Novel Materials Co., Ltd.
Original Assignee
Nantong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong University filed Critical Nantong University
Priority to CN2010101798947A priority Critical patent/CN101866839B/zh
Publication of CN101866839A publication Critical patent/CN101866839A/zh
Application granted granted Critical
Publication of CN101866839B publication Critical patent/CN101866839B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

本发明涉及一种应用掩膜保护进行激光快速加热方法。首先将多晶硅衬底的硅片置于PECVD沉积装置完成非晶硅薄膜淀积;然后进行氮化硅薄膜的淀积,形成氮化硅薄膜的掩膜;将含有所述掩膜的非晶硅薄膜置于具有惰性气体的保护性性容器中,用波长为1.00~1.10微米的脉冲激光,通过调整光斑尺寸,使之产生正离焦量方向的一个1×1cm2的光斑,用以对所述薄膜加热进行结晶退火,在保持输出功率不变的情况下,通过调节脉冲频率,达到薄膜外延生长的晶粒尺寸要求,再用氢氟酸水溶液去除氮化硅保护层。本发明使薄膜外延晶粒可控,且通过淀积形成掩膜防薄膜氧化,并通过对激光的增透能力提高激光在衬底中的能量利用率,以降低激光的耗能,提高了薄膜的质量,优化了激光洁净工艺。

Description

一种应用掩膜保护进行激光快速加热方法
技术领域
本发明涉及激光加热非晶硅薄膜材料的方法,尤其涉及应用非晶硅薄膜上掩蔽层,降低激光功率,提高非晶硅薄膜激光结晶质量的一种应用掩膜保护进行激光快速加热方法。
背景技术
激光晶化技术是一种利用激光能量密度高,升温快速的原理进行快速热处理以实现薄膜材料的快速加热和结晶的技术。但是,目前应用脉冲激光对薄膜进行加热时,如果工作频率过高会导致薄膜汽化,薄膜表面龟裂等结晶质量不佳的问题;如果工作频率过低,薄膜又无法有效结晶。这成为了激光快速加热技术的一个瓶颈。因此,寻找一种能保持激光输出功率较高,又能在较低频率下进行薄膜有效结晶的工艺方法显得十分重要。
发明内容
本发明的目的旨在克服现有激光结晶技术在结晶过程中薄膜结晶质量不佳的问题,提出一种保持激光功率不变,降低激光作用频率的工艺方法。符合实验室研究和工业化生产需求,可以提高薄膜结晶质量。上述目的通过以下技术方案得以实施:
所述方法包括如下步骤:
1)将多晶硅衬底的硅片置于PECVD沉积装置中,通入SiH4和H2的混合气体进行非晶硅薄膜淀积,淀积气压为5Pa,衬底淀积温度为250℃,淀积功率为400W,淀积时间为60min,完成非晶硅薄膜淀积;
2)在非晶硅薄膜淀积完成后,通入NH3和SiH4的混合气体进行氮化硅薄膜的淀积,淀积气压为5Pa,衬底淀积温度为250℃,淀积功率为400W,淀积时间为60min,形成氮化硅掩膜层;
3)将含有所述掩膜的非晶硅薄膜置于具有惰性气体的保护性容器中,然后用波长为1.6微米的脉冲激光,通过调整光斑尺寸,使之产生正离焦量方向的一个1×1cm2的光斑,用以对所述薄膜进行结晶退火,保持输出功率和脉宽不变,通过调节脉冲频率,达到所述薄膜外延生长的晶粒尺寸要求。
4)用5%体积比浓度的氢氟酸水溶液,去除所述氮化硅掩膜层。
所述方法的进一步设计在于,输出功率为450W,脉宽为2ms,脉冲频率为4~25Hz,对所述薄膜的加热时间60s。
所述方法的进一步设计在于,惰性气体包括氮气或氩气。
本发明用上述方法来实现对非晶硅薄膜的快速结晶,可以降低结晶所需的激光工作频率,从而减少脉冲激光结晶后薄膜表面龟裂的现象。所形成的氮化硅薄膜具有防止非晶硅薄膜氧化的作用和对激光具有的抗反射的作用,可提高激光在衬底中的能量利用率,从而达到降低激光结晶频率的目的。由于非晶硅表面氮化硅层的存在,非晶硅薄膜的热散失减缓,热脉冲对薄膜结构和表面的破坏作用被抑制,提高了薄膜的质量,优化了激光结晶工艺。本发明不仅可以应用于硅的激光快速退火工艺,也可以应用于ZnO等多种材料的快速结晶生长。应用本技术生长的薄膜材料不仅仅可以应用于太阳能行业,也可以应用于集成电路和电子元器件的制造。
附图说明
图1是经化学气相沉积制得的具有增透非晶硅薄膜置于保护性容器中的示意图。
图2是实施例1所对应的表示在多晶硅衬底上生长的非晶硅薄膜在不同激光脉冲频率下的XRD图。
图3是实施例1所对应的应用了氮化硅保护薄膜的在多晶硅衬底上生长的非晶硅薄膜在不同激光脉冲频率下的XRD图。
具体实施方式
采用PECVD淀积系统进行非晶硅薄膜的淀积。将多晶硅衬底的硅片清洗好,放入上述淀积装置中,通入淀积气体,淀积气体为SiH4和H2的混合气体,淀积气压为5Pa,使衬底淀积温度保持在250℃,淀积功率为400W,淀积时间为60min,完成非晶硅薄膜淀积。
在非晶硅薄膜淀积完成后,通入NH3和SiH4的混合气体进行氮化硅薄膜的淀积。淀积气压为5Pa。使衬底淀积温度保持在250℃,淀积功率为400W,淀积时间为60min,形成氮化硅掩膜层。
将上述含有氮化硅保护层的非晶硅薄膜置于保护性容器1的腔体内,请参见图1。该容器1的腔体内置有垫块12,非晶硅薄膜的硅片4放置在垫块12上。容器1的上方设有一供激光束3射入的窗口11,激光器(未画出)置于该容器1的外侧,其上的的聚焦镜2置于窗口11的上方。由聚焦镜2反射的激光束照射在垫块12上的非晶硅薄膜4上。该容器1下方一侧设有进气口13,惰性气体由进气口进入容器1的腔体内。惰性气体为氮气或氩气,惰性气体可防非晶硅薄膜氧化。然后用长波YAG激样器进行脉冲激光结晶退火,长波的波长为1.06微米。分别应用4Hz、8Hz、10Hz、12Hz、15Hz、20Hz和25Hz的频率对多晶硅衬底上的非晶硅薄膜退火。保持激光器的输出功率450w不变,选择波长为1.06μm,脉宽为2ms的激光脉冲,激光光斑为1×1cm2。各频率所对应的占空比见表1。最后用5%体积比浓度的氢氟酸水溶液,去除氮化硅掩膜层。
表1
将经上述方法进行外延生长的非晶硅薄膜用XRD机(X射线衍射仪)进行薄膜结晶性能测试,其性能见图2。图3为用相同方法制备但未淀积氮化硅掩膜层的非晶硅薄膜样品的XRD图。从图2和图3中可以看出随着激光频率的增加,淀积了氮化硅掩膜层的样品其衍射峰的强度的变化趋势与未淀积的样品是一样的,即先下降后上升,再下降。但是,其衍射峰强最低的频率为8Hz,最大衍射峰频率为15Hz,与未淀积氮化硅掩膜层(图3)相比,出现最小(12Hz)与最大衍射峰(20Hz)的频率都提前。这说明氮化硅掩膜层对于薄膜的结晶可以起到降低激光脉冲频率,减小激光作用能量的作用。

Claims (3)

1.一种应用掩膜保护进行激光快速加热方法,其特征在于包括如下步骤:
1)将多晶硅衬底的硅片置于PECVD沉积系统中,通入SiH4和H2的混合气体进行非晶硅薄膜淀积,淀积气压为5Pa,衬底淀积温度为250℃,淀积功率为400W,淀积时间为60min,完成非晶硅薄膜淀积;
2)在非晶硅薄膜淀积完成后,通入NH3和SiH4的混合气体进行氮化硅薄膜的淀积,淀积气压为5Pa,衬底淀积温度为250℃,淀积功率为400W,淀积时间为60min,形成氮化硅掩膜层;
3)将含有所述掩膜的非晶硅薄膜置于具有惰性气体的保护性容器中,然后用波长为1.6微米的脉冲激光,通过调整光斑尺寸,使之产生正离焦量方向的一个1×1cm2的光斑,用以对含有氮化硅掩膜层的所述非晶硅薄膜进行结晶退火,保持输出功率和脉宽不变,通过调节脉冲频率,达到含有氮化硅掩膜层的所述非晶硅薄膜外延生长的晶粒尺寸要求;
4)用5%体积比浓度的氢氟酸水溶液,去除所述氮化硅掩膜层。
2.根据权利要求1所述的一种应用掩膜保护进行激光快速加热方法,其特征在于所述输出功率为450W,所述脉宽为2ms,所述脉冲频率为4~25Hz,对含有氮化硅掩膜层的所述非晶硅薄膜的加热时间60s。
3.根据权利要求2所述的一种应用掩膜保护进行激光快速加热方法,其特征在于所述惰性气体包括氮气或氩气。
CN2010101798947A 2010-05-24 2010-05-24 一种应用掩膜保护进行激光快速加热方法 Expired - Fee Related CN101866839B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101798947A CN101866839B (zh) 2010-05-24 2010-05-24 一种应用掩膜保护进行激光快速加热方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101798947A CN101866839B (zh) 2010-05-24 2010-05-24 一种应用掩膜保护进行激光快速加热方法

Publications (2)

Publication Number Publication Date
CN101866839A CN101866839A (zh) 2010-10-20
CN101866839B true CN101866839B (zh) 2012-05-16

Family

ID=42958489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101798947A Expired - Fee Related CN101866839B (zh) 2010-05-24 2010-05-24 一种应用掩膜保护进行激光快速加热方法

Country Status (1)

Country Link
CN (1) CN101866839B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102346127A (zh) * 2011-09-08 2012-02-08 浙江向日葵光能科技股份有限公司 用于测量太阳能电池片氮化硅膜致密性的溶液及其使用方法
CN102945798B (zh) * 2012-10-30 2015-07-29 清华大学 超薄氧化层的激光处理生长方法及装置
US11069724B2 (en) 2018-01-12 2021-07-20 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Array substrate, manufacturing method thereof and display device using the same
CN108288619A (zh) * 2018-01-12 2018-07-17 武汉华星光电半导体显示技术有限公司 一种阵列基板及其制作方法、显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1864247A (zh) * 2003-10-03 2006-11-15 应用材料股份有限公司 用于动态表面退火工艺的吸收层
US20080233718A1 (en) * 2007-03-21 2008-09-25 Jia-Xing Lin Method of Semiconductor Thin Film Crystallization and Semiconductor Device Fabrication

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1864247A (zh) * 2003-10-03 2006-11-15 应用材料股份有限公司 用于动态表面退火工艺的吸收层
US20080233718A1 (en) * 2007-03-21 2008-09-25 Jia-Xing Lin Method of Semiconductor Thin Film Crystallization and Semiconductor Device Fabrication

Also Published As

Publication number Publication date
CN101866839A (zh) 2010-10-20

Similar Documents

Publication Publication Date Title
JP6629277B2 (ja) 半導体用途のための結晶化処理
US7923354B2 (en) Methods for depositing a microcrystalline silicon film for a photovoltaic device
KR101040956B1 (ko) 산화아연 나노와이어를 이용한 박막 실리콘 태양전지 및 그의 제조방법
CN101866839B (zh) 一种应用掩膜保护进行激光快速加热方法
CN102534570B (zh) 一种等离子体增强化学气相沉积微晶硅薄膜的方法
CN1312734C (zh) 飞秒脉冲激光制备β-FeSi2半导体薄膜的方法
JP2009105130A (ja) 光起電力素子の製造方法
CN111807405B (zh) 一种高结晶质量纯相氧化亚铜薄膜的制备方法
CN101821854B (zh) 动态控制微晶硅生长期间的温度的方法
CN101928933A (zh) 一种制备碳化硅薄膜的方法
CN101866838B (zh) 一种非晶硅薄膜可控同质外延生长的方法
KR101362890B1 (ko) 마이크로 웨이브를 이용하는 박막태양전지의 제조방법 및이를 위한 박막 증착 장치
CN105002561B (zh) 在(100)GaAs衬底上制备ZnTe外延厚膜的方法
CN103227239A (zh) 干法刻蚀两步法铝诱导非晶硅晶化薄膜的方法
CN117410373A (zh) 一种晶硅底电池及其制备方法和叠层电池
Budini et al. Polycrystalline Silicon for Thin Film Solar Cells
KR101039150B1 (ko) 태양전지 제조방법
Duan et al. Polycrystalline silicon films on sio2 substrate treated by excimer laser annealing
JP2005322842A (ja) 薄膜半導体基板及びその製造方法
Kuo et al. A novel low thermal budget thin-film polysilicon fabrication process for large-area, high-throughput solar cell production
CN102234838A (zh) 动态控制微晶层中形成的膜的微结构的方法
Won et al. Low temperature epitaxial growth of thin film silicon by PECVD for use in solar cell applications

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent for invention or patent application
CB03 Change of inventor or designer information

Inventor after: Wang Qiang

Inventor after: Hua Guoran

Inventor after: Zhu Haifeng

Inventor after: Shi Min

Inventor after: Zhang Zhenjuan

Inventor after: Huang Jing

Inventor after: Song Changqing

Inventor after: Zhang Hua

Inventor before: Hua Guoran

Inventor before: Wang Qiang

Inventor before: Gong Xiaoyan

Inventor before: Shi Min

Inventor before: Zhang Hua

Inventor before: Song Changqing

Inventor before: Zhang Zhenjuan

Inventor before: Cai Xiaopeng

Inventor after: Wang Qiang

Inventor after: Hua Guoran

Inventor after: Zhu Haifeng

Inventor after: Shi Min

Inventor after: Zhang Zhenjuan

Inventor after: Huang Jing

Inventor after: Song Changqing

Inventor after: Zhang Hua

Inventor before: Hua Guoran

Inventor before: Wang Qiang

Inventor before: Gong Xiaoyan

Inventor before: Shi Min

Inventor before: Zhang Hua

Inventor before: Song Changqing

Inventor before: Zhang Zhenjuan

Inventor before: Cai Xiaopeng

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: HUA GUORAN WANG QIANG GONG XIAOYAN SHI MIN ZHANG HUA SONG CHANGQING ZHANG ZHENJUAN CAI XIAOPENG TO: WANG QIANG HUA GUORAN ZHU HAIFENG SHI MIN ZHANG ZHENJUAN HUANG JING SONG CHANGQING ZHANG HUA

C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NANTONG ZHONGYI NEW MATERIAL TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: NANTONG UNIVERSITY

Effective date: 20140327

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 226019 NANTONG, JIANGSU PROVINCE TO: 226300 NANTONG, JIANGSU PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20140327

Address after: 226300 No. 168, Qingdao Road, Tongzhou District Economic Development Zone, Jiangsu, Nantong

Patentee after: Nantong Zongyi Novel Materials Co., Ltd.

Address before: 226019 Jiangsu city of Nantong province sik Road No. 9 School of mechanical engineering Nantong University

Patentee before: Nantong University

Effective date of registration: 20140327

Address after: 226300 No. 168, Qingdao Road, Tongzhou District Economic Development Zone, Jiangsu, Nantong

Patentee after: Nantong Zongyi Novel Materials Co., Ltd.

Address before: 226019 Jiangsu city of Nantong province sik Road No. 9 School of mechanical engineering Nantong University

Patentee before: Nantong University

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120516

Termination date: 20190524

CF01 Termination of patent right due to non-payment of annual fee