CN101861354A - 导热塑性树脂组合物 - Google Patents

导热塑性树脂组合物 Download PDF

Info

Publication number
CN101861354A
CN101861354A CN200880116190A CN200880116190A CN101861354A CN 101861354 A CN101861354 A CN 101861354A CN 200880116190 A CN200880116190 A CN 200880116190A CN 200880116190 A CN200880116190 A CN 200880116190A CN 101861354 A CN101861354 A CN 101861354A
Authority
CN
China
Prior art keywords
composition
volume
polymer
polymkeric substance
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880116190A
Other languages
English (en)
Chinese (zh)
Inventor
Y·萨加
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101861354A publication Critical patent/CN101861354A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/16Halogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/40Glass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31725Of polyamide
    • Y10T428/31765Inorganic-containing or next to inorganic-containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200880116190A 2007-11-16 2008-11-13 导热塑性树脂组合物 Pending CN101861354A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US355607P 2007-11-16 2007-11-16
US61/003556 2007-11-16
PCT/US2008/083389 WO2009064873A1 (en) 2007-11-16 2008-11-13 Thermally conductive plastic resin composition

Publications (1)

Publication Number Publication Date
CN101861354A true CN101861354A (zh) 2010-10-13

Family

ID=40297752

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880116190A Pending CN101861354A (zh) 2007-11-16 2008-11-13 导热塑性树脂组合物

Country Status (6)

Country Link
US (1) US20090130471A1 (https=)
EP (1) EP2209845B1 (https=)
JP (1) JP5264924B2 (https=)
CN (1) CN101861354A (https=)
AT (1) ATE509979T1 (https=)
WO (1) WO2009064873A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103146355A (zh) * 2011-12-07 2013-06-12 北京中石伟业科技股份有限公司 一种吸热材料

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US20090152491A1 (en) * 2007-11-16 2009-06-18 E. I. Du Pont De Nemours And Company Thermally conductive resin compositions
US8293831B2 (en) * 2008-10-30 2012-10-23 E I Du Pont De Nemours And Company Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide
CN102714265A (zh) * 2009-12-30 2012-10-03 默克专利有限公司 作为水分子的扩散屏障的浇铸组合物
WO2012012675A1 (en) * 2010-07-22 2012-01-26 Ferro Corporation Hermetically sealed electronic device using coated glass flakes
US20120080640A1 (en) * 2010-09-30 2012-04-05 E.I. Du Pont De Nemours And Company Thermally conductive resin composition
US20120153217A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Thermally conductive polymeric resin composition
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
EP2596936B1 (en) * 2011-11-24 2015-09-09 ABB Research Ltd. Mold and method for producing shaped articles from a UV-curable composition
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
JP6618144B2 (ja) * 2015-11-17 2019-12-11 デンカ株式会社 球状フッ化カルシウム
DE102016220280A1 (de) 2016-10-17 2018-04-19 Mitsubishi Polyester Film Gmbh Orientierte Polyesterfolien mit erhöhter Wärmeleitfähigkeit
DE102016119751A1 (de) 2016-10-17 2018-04-19 Ensinger Gmbh Polymer-Compounds für die Herstellung von Polyester-Folien mit erhöhter Wärmeleitfähigkeit
CN107603211B (zh) * 2017-09-26 2020-07-14 上海日之升科技有限公司 一种高流动高韧性导热尼龙复合材料及其制备方法
EP3720706A4 (en) * 2017-12-05 2021-09-22 LyondellBasell Advanced Polymers Inc. HIGH PERFORMANCE POLYAMIDE COMPOUNDS AND THEIR USES
JP6755376B2 (ja) * 2019-09-27 2020-09-16 デンカ株式会社 球状フッ化カルシウム
WO2022174348A1 (en) * 2021-02-19 2022-08-25 Eye3Concepts Inc. Electrochemical sensor for phenolic analytes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982136A (ja) * 1995-09-11 1997-03-28 Hitachi Ltd 高熱伝導半導電性プリプレグシート,固定子コイル及びそれを用いた回転電機と回転電機固定子の製造方法
JPH10271730A (ja) * 1997-03-19 1998-10-09 Fujitsu General Ltd 電動機
WO2001096458A1 (de) * 2000-06-16 2001-12-20 Siemens Aktiengesellschaft Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu
JP2002188007A (ja) * 2000-12-21 2002-07-05 Hitachi Metals Ltd 複合材料及び回路基板
JP2003040619A (ja) * 2001-07-27 2003-02-13 Hitachi Metals Ltd CaF2粉末の表面処理方法、樹脂複合材料及びそれを用いた構成部材
US20050176835A1 (en) * 2004-01-12 2005-08-11 Toshikazu Kobayashi Thermally conductive thermoplastic resin compositions
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103146355A (zh) * 2011-12-07 2013-06-12 北京中石伟业科技股份有限公司 一种吸热材料
CN103146355B (zh) * 2011-12-07 2016-02-10 北京中石伟业科技股份有限公司 一种吸热材料

Also Published As

Publication number Publication date
EP2209845B1 (en) 2011-05-18
JP5264924B2 (ja) 2013-08-14
EP2209845A1 (en) 2010-07-28
ATE509979T1 (de) 2011-06-15
WO2009064873A1 (en) 2009-05-22
JP2011503327A (ja) 2011-01-27
US20090130471A1 (en) 2009-05-21

Similar Documents

Publication Publication Date Title
CN101861354A (zh) 导热塑性树脂组合物
JP5547644B2 (ja) 熱伝導性樹脂組成物
JP4764351B2 (ja) 熱伝導性熱可塑性樹脂組成物
CN102482450B (zh) 导热性聚合物组合物和由其制得的制品
CN101679745A (zh) 聚芳硫醚树脂组合物以及由该组合物构成的成形品
CN101845206B (zh) 耐热薄壁阻燃pbt/pet合金材料
CN1798807A (zh) 聚亚芳基硫醚树脂组合物和涂覆成型品
CN103119092A (zh) 导热树脂组合物
JP7122491B2 (ja) ポリアリーレンサルファイド樹脂組成物のバリ抑制方法
CN117715984B (zh) 聚芳硫醚树脂组合物以及嵌入成型品
JP2005306955A (ja) 高熱伝導性樹脂組成物の製造方法
WO2013161844A1 (ja) 高熱伝導性樹脂組成物
JP7309790B2 (ja) ポリアリーレンサルファイド樹脂組成物の製造方法
JP2007106854A (ja) 熱伝導性樹脂組成物
JPH05230367A (ja) 樹脂組成物及びそれからなる電子部品
JP6167011B2 (ja) 電気絶縁性高熱伝導性樹脂組成物
KR20110027904A (ko) 폴리에스테르 수지 조성물
JPH05239344A (ja) 樹脂組成物及びそれからなる電子部品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101013