CN101828409A - 具有使用接合引线的增强型冲击验证的硅麦克风 - Google Patents
具有使用接合引线的增强型冲击验证的硅麦克风 Download PDFInfo
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- CN101828409A CN101828409A CN200880110129A CN200880110129A CN101828409A CN 101828409 A CN101828409 A CN 101828409A CN 200880110129 A CN200880110129 A CN 200880110129A CN 200880110129 A CN200880110129 A CN 200880110129A CN 101828409 A CN101828409 A CN 101828409A
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/973,075 US8045733B2 (en) | 2007-10-05 | 2007-10-05 | Silicon microphone with enhanced impact proof structure using bonding wires |
US11/973,075 | 2007-10-05 | ||
PCT/SG2008/000369 WO2009045170A1 (en) | 2007-10-05 | 2008-09-29 | Silicon microphone with enhanced impact proof structure using bonding wires |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101828409A true CN101828409A (zh) | 2010-09-08 |
CN101828409B CN101828409B (zh) | 2012-09-05 |
Family
ID=40523266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880110129.0A Active CN101828409B (zh) | 2007-10-05 | 2008-09-29 | 具有使用接合引线的增强型冲击验证的硅麦克风 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8045733B2 (zh) |
CN (1) | CN101828409B (zh) |
TW (1) | TWI386073B (zh) |
WO (1) | WO2009045170A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102457800A (zh) * | 2010-10-21 | 2012-05-16 | 北京卓锐微技术有限公司 | 无背极板的mems电容式麦克风及其制备方法 |
CN102932720A (zh) * | 2012-11-06 | 2013-02-13 | 山东共达电声股份有限公司 | Mems麦克风 |
CN102932721A (zh) * | 2012-11-07 | 2013-02-13 | 山东共达电声股份有限公司 | Mems传声器 |
CN104968599A (zh) * | 2013-02-05 | 2015-10-07 | 罗伯特·博世有限公司 | 具有膜片结构的微机械构件 |
CN106535072A (zh) * | 2016-12-05 | 2017-03-22 | 歌尔股份有限公司 | 一种mems麦克风芯片以及mems麦克风 |
TWI667925B (zh) * | 2018-01-15 | 2019-08-01 | 美律實業股份有限公司 | 壓電傳感器 |
CN110775937A (zh) * | 2019-12-31 | 2020-02-11 | 共达电声股份有限公司 | Mems膜片及mems传感器芯片 |
TWI692255B (zh) * | 2018-10-30 | 2020-04-21 | 美律實業股份有限公司 | 微機電傳感器 |
CN111405441A (zh) * | 2020-04-16 | 2020-07-10 | 瑞声声学科技(深圳)有限公司 | 一种压电式mems麦克风 |
CN112055293A (zh) * | 2019-06-07 | 2020-12-08 | 美商楼氏电子有限公司 | 用于麦克风组件的具有非圆形孔的声换能器 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7346178B2 (en) * | 2004-10-29 | 2008-03-18 | Silicon Matrix Pte. Ltd. | Backplateless silicon microphone |
US8045733B2 (en) | 2007-10-05 | 2011-10-25 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone with enhanced impact proof structure using bonding wires |
US8467559B2 (en) * | 2008-02-20 | 2013-06-18 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone without dedicated backplate |
JP5374077B2 (ja) * | 2008-06-16 | 2013-12-25 | ローム株式会社 | Memsセンサ |
US8134215B2 (en) * | 2008-10-09 | 2012-03-13 | United Microelectronics Corp. | MEMS diaphragm |
CN101415137B (zh) * | 2008-11-14 | 2012-06-06 | 瑞声声学科技(深圳)有限公司 | 电容式麦克风 |
CN102714773A (zh) * | 2009-11-16 | 2012-10-03 | 美国亚德诺半导体公司 | 背板具有特定形状的通孔的传声器 |
JP5083369B2 (ja) * | 2010-04-28 | 2012-11-28 | オムロン株式会社 | 音響センサ及びその製造方法 |
US9380380B2 (en) | 2011-01-07 | 2016-06-28 | Stmicroelectronics S.R.L. | Acoustic transducer and interface circuit |
JP5872163B2 (ja) | 2011-01-07 | 2016-03-01 | オムロン株式会社 | 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US9143870B2 (en) * | 2012-11-09 | 2015-09-22 | Invensense, Inc. | Microphone system with mechanically-coupled diaphragms |
US9624091B2 (en) | 2013-05-31 | 2017-04-18 | Robert Bosch Gmbh | Trapped membrane |
US9344808B2 (en) * | 2014-03-18 | 2016-05-17 | Invensense, Inc. | Differential sensing acoustic sensor |
JP6467837B2 (ja) * | 2014-09-25 | 2019-02-13 | オムロン株式会社 | 音響トランスデューサ及びマイクロフォン |
CN108810773A (zh) * | 2017-04-26 | 2018-11-13 | 中芯国际集成电路制造(上海)有限公司 | 麦克风及其制造方法 |
CN214177565U (zh) * | 2020-11-17 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | Mems麦克风芯片 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4182937A (en) * | 1978-09-21 | 1980-01-08 | International Standard Electric Corp. | Mechanically biased semiconductor strain sensitive microphone |
US5452268A (en) * | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
US6535460B2 (en) * | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
ATE392790T1 (de) * | 2000-08-11 | 2008-05-15 | Knowles Electronics Llc | Erhobene mikrostrukturen |
US6741709B2 (en) * | 2000-12-20 | 2004-05-25 | Shure Incorporated | Condenser microphone assembly |
CN1694575A (zh) * | 2004-05-09 | 2005-11-09 | 美律实业股份有限公司 | 电容式硅基微麦克风及其制法 |
US7346178B2 (en) * | 2004-10-29 | 2008-03-18 | Silicon Matrix Pte. Ltd. | Backplateless silicon microphone |
US7804969B2 (en) * | 2006-08-07 | 2010-09-28 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone with impact proof structure |
US8045733B2 (en) | 2007-10-05 | 2011-10-25 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone with enhanced impact proof structure using bonding wires |
US8467559B2 (en) * | 2008-02-20 | 2013-06-18 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone without dedicated backplate |
US7829366B2 (en) * | 2008-02-29 | 2010-11-09 | Freescale Semiconductor, Inc. | Microelectromechanical systems component and method of making same |
-
2007
- 2007-10-05 US US11/973,075 patent/US8045733B2/en active Active
-
2008
- 2008-09-26 TW TW097137082A patent/TWI386073B/zh active
- 2008-09-29 WO PCT/SG2008/000369 patent/WO2009045170A1/en active Application Filing
- 2008-09-29 CN CN200880110129.0A patent/CN101828409B/zh active Active
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102457800A (zh) * | 2010-10-21 | 2012-05-16 | 北京卓锐微技术有限公司 | 无背极板的mems电容式麦克风及其制备方法 |
CN102932720A (zh) * | 2012-11-06 | 2013-02-13 | 山东共达电声股份有限公司 | Mems麦克风 |
CN102932721A (zh) * | 2012-11-07 | 2013-02-13 | 山东共达电声股份有限公司 | Mems传声器 |
CN102932721B (zh) * | 2012-11-07 | 2015-10-21 | 山东共达电声股份有限公司 | Mems传声器 |
CN104968599A (zh) * | 2013-02-05 | 2015-10-07 | 罗伯特·博世有限公司 | 具有膜片结构的微机械构件 |
CN104968599B (zh) * | 2013-02-05 | 2017-04-26 | 罗伯特·博世有限公司 | 具有膜片结构的微机械构件 |
CN106535072A (zh) * | 2016-12-05 | 2017-03-22 | 歌尔股份有限公司 | 一种mems麦克风芯片以及mems麦克风 |
TWI667925B (zh) * | 2018-01-15 | 2019-08-01 | 美律實業股份有限公司 | 壓電傳感器 |
TWI692255B (zh) * | 2018-10-30 | 2020-04-21 | 美律實業股份有限公司 | 微機電傳感器 |
CN112055293A (zh) * | 2019-06-07 | 2020-12-08 | 美商楼氏电子有限公司 | 用于麦克风组件的具有非圆形孔的声换能器 |
CN112055293B (zh) * | 2019-06-07 | 2022-05-17 | 美商楼氏电子有限公司 | 声换能器和麦克风组件 |
US11483645B2 (en) | 2019-06-07 | 2022-10-25 | Knowles Electronics, Llc | Acoustic transducers for microphone assemblies having non-circular apertures |
CN110775937B (zh) * | 2019-12-31 | 2020-05-08 | 共达电声股份有限公司 | Mems膜片及mems传感器芯片 |
CN110775937A (zh) * | 2019-12-31 | 2020-02-11 | 共达电声股份有限公司 | Mems膜片及mems传感器芯片 |
CN111405441A (zh) * | 2020-04-16 | 2020-07-10 | 瑞声声学科技(深圳)有限公司 | 一种压电式mems麦克风 |
CN111405441B (zh) * | 2020-04-16 | 2021-06-15 | 瑞声声学科技(深圳)有限公司 | 一种压电式mems麦克风 |
Also Published As
Publication number | Publication date |
---|---|
US20090092273A1 (en) | 2009-04-09 |
TW200917878A (en) | 2009-04-16 |
WO2009045170A1 (en) | 2009-04-09 |
US8045733B2 (en) | 2011-10-25 |
TWI386073B (zh) | 2013-02-11 |
CN101828409B (zh) | 2012-09-05 |
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