CN101809191B - 通过大气压力下的原子层沉积(ald)制造光学膜的方法 - Google Patents
通过大气压力下的原子层沉积(ald)制造光学膜的方法 Download PDFInfo
- Publication number
- CN101809191B CN101809191B CN2008801089693A CN200880108969A CN101809191B CN 101809191 B CN101809191 B CN 101809191B CN 2008801089693 A CN2008801089693 A CN 2008801089693A CN 200880108969 A CN200880108969 A CN 200880108969A CN 101809191 B CN101809191 B CN 101809191B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/861,442 US20090081360A1 (en) | 2007-09-26 | 2007-09-26 | Oled display encapsulation with the optical property |
| US11/861,442 | 2007-09-26 | ||
| PCT/US2008/010943 WO2009042084A1 (en) | 2007-09-26 | 2008-09-18 | Process of making an optical film by atomic layer deposition (ald) at atmospheric pressure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110427409.8A Division CN102433549B (zh) | 2007-09-26 | 2008-09-18 | 通过大气压力下的原子层沉积(ald)制造光学膜的方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101809191A CN101809191A (zh) | 2010-08-18 |
| CN101809191B true CN101809191B (zh) | 2012-10-31 |
Family
ID=40214861
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801089693A Active CN101809191B (zh) | 2007-09-26 | 2008-09-18 | 通过大气压力下的原子层沉积(ald)制造光学膜的方法 |
| CN201110427409.8A Active CN102433549B (zh) | 2007-09-26 | 2008-09-18 | 通过大气压力下的原子层沉积(ald)制造光学膜的方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110427409.8A Active CN102433549B (zh) | 2007-09-26 | 2008-09-18 | 通过大气压力下的原子层沉积(ald)制造光学膜的方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20090081360A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2215283B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2010540774A (cg-RX-API-DMAC7.html) |
| CN (2) | CN101809191B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009042084A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US20090229664A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Method of manufacturing nanocrystalline photovoltaic devices |
| US20090233007A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Chemical vapor deposition reactor and method |
| US20090229663A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Nanocrystalline photovoltaic device |
| US10049859B2 (en) * | 2009-07-08 | 2018-08-14 | Aixtron Se | Plasma generating units for processing a substrate |
| JP2011065738A (ja) * | 2009-08-19 | 2011-03-31 | Panasonic Corp | 光ピックアップ装置 |
| US20110097491A1 (en) * | 2009-10-27 | 2011-04-28 | Levy David H | Conveyance system including opposed fluid distribution manifolds |
| US8765232B2 (en) | 2011-01-10 | 2014-07-01 | Plasmasi, Inc. | Apparatus and method for dielectric deposition |
| US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
| US10526708B2 (en) | 2012-06-19 | 2020-01-07 | Aixtron Se | Methods for forming thin protective and optical layers on substrates |
| US8803187B2 (en) | 2012-10-22 | 2014-08-12 | Empire Technology Development Llc | Protection of light emitting devices |
| WO2014065779A2 (en) * | 2012-10-22 | 2014-05-01 | Empire Technology Development Llc | Protection of light emitting devices |
| US9493874B2 (en) | 2012-11-15 | 2016-11-15 | Cypress Semiconductor Corporation | Distribution of gas over a semiconductor wafer in batch processing |
| US9175389B2 (en) * | 2012-12-21 | 2015-11-03 | Intermolecular, Inc. | ALD process window combinatorial screening tool |
| CN103966572A (zh) * | 2013-02-05 | 2014-08-06 | 王东君 | 卷对卷式原子层沉积设备及其使用方法 |
| WO2014121450A1 (zh) * | 2013-02-05 | 2014-08-14 | Wang Dongjun | 卷对卷式原子层沉积设备及其使用方法 |
| US11267012B2 (en) | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
| US11220737B2 (en) * | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| EP2960059B1 (en) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| CN104733641B (zh) * | 2015-04-03 | 2017-01-18 | 京东方科技集团股份有限公司 | Oled器件的封装方法、封装结构及显示装置 |
| US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
| CN105702881B (zh) * | 2016-01-21 | 2017-11-07 | 京东方科技集团股份有限公司 | 一种基板顶起装置、基板封装设备及方法 |
| LU93390B1 (en) * | 2016-12-21 | 2018-07-24 | Luxembourg Inst Science & Tech List | Method for depositing alumina by atomic layer deposition |
| US10400332B2 (en) * | 2017-03-14 | 2019-09-03 | Eastman Kodak Company | Deposition system with interlocking deposition heads |
| US10435788B2 (en) | 2017-03-14 | 2019-10-08 | Eastman Kodak | Deposition system with repeating motion profile |
| US10422038B2 (en) * | 2017-03-14 | 2019-09-24 | Eastman Kodak Company | Dual gas bearing substrate positioning system |
| US10501848B2 (en) | 2017-03-14 | 2019-12-10 | Eastman Kodak Company | Deposition system with modular deposition heads |
| US10550476B2 (en) | 2017-03-14 | 2020-02-04 | Eastman Kodak Company | Heated gas-bearing backer |
| US11248292B2 (en) | 2017-03-14 | 2022-02-15 | Eastman Kodak Company | Deposition system with moveable-position web guides |
| US10895011B2 (en) | 2017-03-14 | 2021-01-19 | Eastman Kodak Company | Modular thin film deposition system |
| US20180265977A1 (en) | 2017-03-14 | 2018-09-20 | Eastman Kodak Company | Deposition system with vacuum pre-loaded deposition head |
| US10584413B2 (en) | 2017-03-14 | 2020-03-10 | Eastman Kodak Company | Vertical system with vacuum pre-loaded deposition head |
| TWI794240B (zh) * | 2017-06-22 | 2023-03-01 | 美商應用材料股份有限公司 | 用於電漿處理的處理工具及電漿反應器 |
| CN107604309B (zh) * | 2017-11-06 | 2023-09-15 | 京东方科技集团股份有限公司 | 掩膜板贴合装置以及其贴合方法 |
| US10542619B2 (en) | 2017-12-12 | 2020-01-21 | Eastman Kodak Company | Electronic element with embedded information |
| US10606213B2 (en) | 2017-12-12 | 2020-03-31 | Eastman Kodak Company | Embedding an optically-detectable pattern of information in an electrical element |
| US10354963B2 (en) | 2017-12-12 | 2019-07-16 | Eastman Kodak Company | Decoding information embedded in an electronic element |
| WO2019126959A1 (zh) * | 2017-12-25 | 2019-07-04 | 深圳市柔宇科技有限公司 | 薄膜沉积系统及薄膜沉积方法 |
| CN108448006B (zh) * | 2018-03-29 | 2021-01-22 | 京东方科技集团股份有限公司 | 封装结构、电子装置以及封装方法 |
| FI128427B (en) | 2018-04-12 | 2020-05-15 | Beneq Oy | Nozzle head and device |
| US11320568B2 (en) | 2018-05-11 | 2022-05-03 | Corning Incorporated | Curved surface films and methods of manufacturing the same |
| CN111019536B (zh) * | 2019-12-27 | 2022-02-01 | 深圳市华星光电半导体显示技术有限公司 | 光学膜的制备方法、背光模组和显示模组 |
| US20220064792A1 (en) * | 2020-08-25 | 2022-03-03 | Innovalens B.V. | Partial coating of intraocular lenses using spatial atomic layer deposition |
| CN112526663A (zh) * | 2020-11-04 | 2021-03-19 | 浙江大学 | 一种基于原子层沉积的吸收膜及其制作方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794014A (zh) * | 2004-12-21 | 2006-06-28 | 平面系统公司 | 多层材料及其制备方法 |
| CN1937175A (zh) * | 2005-09-20 | 2007-03-28 | 中芯国际集成电路制造(上海)有限公司 | 用于半导体器件的使用大气压的材料原子层沉积的方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI57975C (fi) * | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
| US4476292A (en) * | 1984-01-30 | 1984-10-09 | Ciba-Geigy Corporation | Castable polyurethane systems |
| US4769292A (en) * | 1987-03-02 | 1988-09-06 | Eastman Kodak Company | Electroluminescent device with modified thin film luminescent zone |
| US4877697A (en) * | 1988-05-26 | 1989-10-31 | Hoechst Aktiengesellschaft | Color filter array for liquid crystal display device |
| GB8909011D0 (en) * | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| US5120622A (en) * | 1990-02-05 | 1992-06-09 | Eastman Kodak Company | Lift-off process for patterning dichroic filters |
| DE4407067C2 (de) * | 1994-03-03 | 2003-06-18 | Unaxis Balzers Ag | Dielektrisches Interferenz-Filtersystem, LCD-Anzeige und CCD-Anordnung sowie Verfahren zur Herstellung eines dielektrischen Interferenz-Filtersystems |
| US5981970A (en) * | 1997-03-25 | 1999-11-09 | International Business Machines Corporation | Thin-film field-effect transistor with organic semiconductor requiring low operating voltages |
| US5999321A (en) * | 1998-06-19 | 1999-12-07 | Philips Electronics North America Corporation | Dichroic filters with low nm per degree sensitivity |
| US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
| US6226890B1 (en) * | 2000-04-07 | 2001-05-08 | Eastman Kodak Company | Desiccation of moisture-sensitive electronic devices |
| US20010052752A1 (en) | 2000-04-25 | 2001-12-20 | Ghosh Amalkumar P. | Thin film encapsulation of organic light emitting diode devices |
| US6926572B2 (en) * | 2002-01-25 | 2005-08-09 | Electronics And Telecommunications Research Institute | Flat panel display device and method of forming passivation film in the flat panel display device |
| US20050084610A1 (en) * | 2002-08-13 | 2005-04-21 | Selitser Simon I. | Atmospheric pressure molecular layer CVD |
| US6821563B2 (en) * | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
| US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
| JP2004176081A (ja) * | 2002-11-25 | 2004-06-24 | Matsushita Electric Works Ltd | 原子層堆積法による光学多層膜の製造方法 |
| EP1629543B1 (en) | 2003-05-16 | 2013-08-07 | E.I. Du Pont De Nemours And Company | Barrier films for flexible polymer substrates fabricated by atomic layer deposition |
| KR20060011887A (ko) * | 2003-05-30 | 2006-02-03 | 에비자 테크놀로지, 인크. | 가스 분산 시스템 |
| WO2005034195A2 (en) * | 2003-09-30 | 2005-04-14 | Aviza Technology, Inc. | Growth of high-k dielectrics by atomic layer deposition |
| US6859323B1 (en) * | 2003-12-11 | 2005-02-22 | Optical Coating Laboratory, Inc. | Dichroic neutral density optical filter |
| US20050252449A1 (en) * | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| US20060109397A1 (en) * | 2004-11-24 | 2006-05-25 | Organic Lighting Technologies Llc | Organic light emitting diode backlight inside LCD |
| US20060214154A1 (en) * | 2005-03-24 | 2006-09-28 | Eastman Kodak Company | Polymeric gate dielectrics for organic thin film transistors and methods of making the same |
| US20060246811A1 (en) * | 2005-04-28 | 2006-11-02 | Eastman Kodak Company | Encapsulating emissive portions of an OLED device |
| KR100647711B1 (ko) * | 2005-11-03 | 2006-11-23 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치 및 이의 제조방법 |
| US20070123133A1 (en) * | 2005-11-30 | 2007-05-31 | Eastman Kodak Company | OLED devices with color filter array units |
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| JP5140321B2 (ja) * | 2007-05-31 | 2013-02-06 | 株式会社アルバック | シャワーヘッド |
| US8039052B2 (en) * | 2007-09-06 | 2011-10-18 | Intermolecular, Inc. | Multi-region processing system and heads |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| US8030212B2 (en) * | 2007-09-26 | 2011-10-04 | Eastman Kodak Company | Process for selective area deposition of inorganic materials |
| US7851380B2 (en) * | 2007-09-26 | 2010-12-14 | Eastman Kodak Company | Process for atomic layer deposition |
-
2007
- 2007-09-26 US US11/861,442 patent/US20090081360A1/en not_active Abandoned
-
2008
- 2008-09-18 EP EP08833206.9A patent/EP2215283B1/en active Active
- 2008-09-18 WO PCT/US2008/010943 patent/WO2009042084A1/en not_active Ceased
- 2008-09-18 CN CN2008801089693A patent/CN101809191B/zh active Active
- 2008-09-18 CN CN201110427409.8A patent/CN102433549B/zh active Active
- 2008-09-18 JP JP2010526911A patent/JP2010540774A/ja active Pending
-
2011
- 2011-12-02 US US13/309,621 patent/US8361544B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794014A (zh) * | 2004-12-21 | 2006-06-28 | 平面系统公司 | 多层材料及其制备方法 |
| CN1937175A (zh) * | 2005-09-20 | 2007-03-28 | 中芯国际集成电路制造(上海)有限公司 | 用于半导体器件的使用大气压的材料原子层沉积的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010540774A (ja) | 2010-12-24 |
| EP2215283A1 (en) | 2010-08-11 |
| CN102433549A (zh) | 2012-05-02 |
| EP2215283B1 (en) | 2014-04-30 |
| CN102433549B (zh) | 2014-03-12 |
| CN101809191A (zh) | 2010-08-18 |
| US8361544B2 (en) | 2013-01-29 |
| US20120076929A1 (en) | 2012-03-29 |
| US20090081360A1 (en) | 2009-03-26 |
| WO2009042084A1 (en) | 2009-04-02 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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