CN101789481A - Light-emitting component is with encapsulating and luminaire - Google Patents
Light-emitting component is with encapsulating and luminaire Download PDFInfo
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- CN101789481A CN101789481A CN201010108591A CN201010108591A CN101789481A CN 101789481 A CN101789481 A CN 101789481A CN 201010108591 A CN201010108591 A CN 201010108591A CN 201010108591 A CN201010108591 A CN 201010108591A CN 101789481 A CN101789481 A CN 101789481A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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Abstract
Light-emitting component of the present invention has the matrix of ceramic with encapsulation and is located at the upper surface of this matrix, is formed with the framework of the ceramic of the cavity that is used to accommodate light-emitting component in the inboard, on described matrix, light reflecting board is embedded in the lower position of described cavity with the posture of its light reflection surface towards the top, between the upper surface of the light reflection surface of described light reflecting board and described matrix, be provided with the part of the pottery that forms this matrix, and this part has light transmission at least.Luminaire of the present invention has above-mentioned light-emitting component with encapsulating, be housed in this light-emitting component interior light-emitting component of cavity of encapsulation.The framework of the upper surface that is configured in described matrix that another luminaire of the present invention has the matrix that is made of ceramic material, be made of ceramic material equally, be configured in the light-emitting component in the cavity that the upper surface by the inner peripheral surface of framework and matrix constitutes, be embedded with first reflector of the light that the described light-emitting component of the reflection that is made of metal material sends in the inside of described framework.
Description
Present patent application is quoted at this but is not limited to Japanese patent application 2009-011581 number and Japanese patent application 2009-085761 number priority.
Technical field
The present invention relates to a kind of light-emitting component that is used for element mounted with encapsulation and have the luminaire of this light-emitting component with encapsulation.
Background technology
In the past, be used for the light-emitting component of element mounted 101 in the luminaire as shown in figure 17 with encapsulating 102.Light-emitting component engages integrated with encapsulation 102 matrixes 103 with ceramic with framework 104 and constitutes, and is formed with the cavity 104a that is used to accommodate light-emitting component 101 in the inboard of framework 104.In addition, in the upper surface of matrix 103, the zone that constitutes the bottom surface of cavity 104a is formed with the metal level 105 that is waited formation by silver (Ag) or aluminium (Al).And light-emitting component 101 is arranged on the metal level 105 in cavity 104a.
In the above-mentioned luminaire, to comprehensive ejaculation light, the light former state ground that penetrates towards the top moves ahead upward from light-emitting component 101, and the light that penetrates towards the below is changed whereabouts by the surface reflection of metal level 105, moves ahead upward.
But, in luminaire shown in Figure 17 because metal level 105 exposes at the upper surface of matrix 103, so the surface of metal level 105 because of the oxidation deterioration, the light reflectivity of metal level 105 can reduce.In addition, in the resin 106 that will contain fluorophor shown in Figure 180 for the luminous intensity that improves luminaire is filled in luminaire among the cavity 104a, owing to the chemical reaction of metal level 105 with resin 106, make the surface deterioration of metal level 105, the light reflectivity of metal level 105 can reduce.Therefore, in luminaire in the past, existence can not obtain the problem of fully high luminous intensity.
In addition, the light-emitting component that is used for element mounted 1122 in the luminaire shown in Figure 19 in the past is with encapsulation 1100.Light-emitting component engages integrated with framework 1120 ceramic matrix 1100 with encapsulation 1100 and constitutes, and is formed with the cavity 1130 that is used to accommodate light-emitting component 1122 in the inboard of framework 1120.In addition, in the zone of the inner side surface that constitutes cavity 1130, be formed with the metal level 1140 that constitutes by silver (Ag) or aluminium (Al) etc.And light-emitting component 1122 is arranged on the upper surface of ceramic matrix 1100.In addition, in cavity 1130, be filled with the resin 1150 that contains fluorophor.
In above-mentioned luminaire, to comprehensive ejaculation light, the light former state ground that penetrates towards the top moves ahead upward from light-emitting component 1122, and the light that penetrates towards the side is by the surface reflection of metal level 1140, and the change whereabouts moves ahead upward.
But, in luminaire shown in Figure 19, metal level 1140 exposes on the surface of framework 1120, so by metal level 1140 and the reaction that contains the resin 1150 of fluorophor, the surface of metal level 1140 is because of the oxidation deterioration, and the light reflectivity of metal level 1140 reduces.
In addition, even the resin 1150 contain fluorophor is filled on the surface of metal level 1140 in cavity 1130, also can by through the time change or the Hot of luminaire, the surface that makes metal level 1140 is because of deteriorations such as oxidations, the light reflectivity of metal level 1140 reduces.Therefore, in luminaire in the past, can not obtain fully high luminous intensity, and then have the problem that to keep.
Summary of the invention
Therefore the object of the present invention is to provide a kind of light-emitting component encapsulation and the luminaire that can keep luminous intensity with abundant high state.
First light-emitting component involved in the present invention has the matrix of ceramic with encapsulation and is located at the upper surface of this matrix, is formed with the framework of the ceramic of the cavity that is used to accommodate light-emitting component in the inboard, on described matrix, light reflecting board is embedded in the lower position of described cavity with the posture of its light reflection surface towards the top, between the upper surface of the light reflection surface of described light reflecting board and described matrix, be provided with the part of the pottery that forms this matrix, and this part has light transmission at least.
Above-mentioned light-emitting component with encapsulation in, the light reflection surface of light reflecting board is because by the part covering of the pottery that forms matrix, so be difficult to take place the deterioration that oxidation or chemical reaction cause on the light reflection surface of light reflecting board.
In addition, above-mentioned light-emitting component is with in the encapsulation, between the upper surface of the light reflection surface of light reflecting board and matrix, be provided with pottery with light transmission, so in cavity, accommodate under the situation of light-emitting component, the light transmission pottery that penetrates towards the below from this light-emitting component and by the light reflection surface reflection of light reflecting board, advance upward, its result, the light-emitting component that contains light-emitting component in cavity can obtain sufficient luminous intensity with encapsulation.
Second light-emitting component involved in the present invention is used at above-mentioned first light-emitting component on the basis of encapsulation with encapsulation, and described light reflecting board is formed by metal, and described matrix is by forming with the low temperature while Low fire ceramic that the metal that forms described light reflecting board burns till simultaneously.
With encapsulation,,, can reach the light reflection surface of light reflecting board towards the light of below ejaculation from this light-emitting component according to above-mentioned second light-emitting component so in cavity, accommodate under the situation of light-emitting component because low temperature while Low fire ceramic has light transmission.Therefore, described light is reflected by light reflection surface, advances upward.
The 3rd light-emitting component involved in the present invention is with encapsulating, on the basis of above-mentioned first or second light-emitting component with encapsulation, described matrix and light reflecting board are made by the duplexer that has burnt till a plurality of ceramic sheet materials stacked and be provided with the metal level that constitutes light reflecting board between adjacent a pair of ceramic sheet material.
The 4th light-emitting component involved in the present invention is with encapsulating, on any the basis of the above-mentioned first and even the 3rd light-emitting component, in the upper surface of described matrix, constitute second light reflection surface that face constitutes that exposes that is formed with at least a portion zone in zone of bottom surface of described cavity by the pottery that forms this matrix with encapsulation.
, accommodate in cavity under the situation of light-emitting component with encapsulation according to above-mentioned the 4th light-emitting component, from the light that this light-emitting component penetrates towards the below, its part reflect by second light reflection surface, and the light by second light reflection surface is reflected by the light reflection surface of light reflecting board.Therefore, the light that penetrates towards the below from light-emitting component is guided efficiently upward, its result, and the light-emitting component of accommodating light-emitting component in cavity is with obtaining higher luminous intensity in the encapsulation.
First luminaire involved in the present invention, have the above-mentioned first and even the 4th light-emitting component with any light-emitting component of encapsulation with encapsulation with carry at this light-emitting component with the light-emitting component in the encapsulation, this light-emitting component is housed in and is formed in the cavity of described light-emitting component with the inboard of the framework of encapsulation.
The framework of the upper surface that is arranged on described matrix that second luminaire involved in the present invention has the matrix that is made of ceramic material, be made of ceramic material equally, be configured in the light-emitting component in the cavity that the upper surface by the inner peripheral surface of described framework and described matrix constitutes, be embedded with first reflector of the light that the described light-emitting component of the reflection that is made of metal material sends in the inside of described framework.
The 3rd luminaire involved in the present invention, on the basis of above-mentioned second luminaire, described first reflector has the upper surface approximate vertical with described matrix, and the light that described light-emitting component is sent is towards first reflecting surface of described cavity internal reflection.
The 4th luminaire involved in the present invention, on the basis of above-mentioned the 3rd luminaire, described first reflecting surface has a plurality of first partially reflecting surfaces that the described cavity of interrupted encirclement ground is arranged.
The 5th luminaire involved in the present invention, on the basis of above-mentioned the 4th luminaire, described first reflecting surface has on the position in the outside of described first partially reflecting surface and intermittently to surround described cavity and side by side a plurality of second partially reflecting surfaces, described first partially reflecting surface and the mutual disjunction position of the second partially reflecting surface polishing and surround described cavity.
The involved in the present invention the 6th luminaire on the basis of any of the luminaire the above-mentioned second and even the 5th, is embedded with second reflector that is constituted and reflected the light that described light-emitting component sends by metal material in the inside of described matrix.
The involved in the present invention the 7th luminaire, on the basis of the luminaire the above-mentioned the 6th, described second reflector has the upper surface almost parallel with described matrix, and the light that described light-emitting component is sent is towards second reflecting surface of described cavity internal reflection.
The involved in the present invention the 8th luminaire, on the basis of the luminaire the above-mentioned the 6th or the 7th, described first reflector extends to the inside of described matrix, is connected with described second reflector.
Description of drawings
Fig. 1 is the cutaway view of ceramic body that expression is used for the manufacturing of the related luminaire of first execution mode of the present invention.
Fig. 2 be expression burn till this ceramic body and the light-emitting component made with the cutaway view of encapsulation.
Fig. 3 is illustrated in this light-emitting component is provided with the state of light-emitting component with encapsulation cutaway view.
Fig. 4 is the cutaway view of the luminaire of expression made.
Fig. 5 is the vertical view that the luminaire element of the related luminaire of expression second execution mode of the present invention is seen from upper surface with encapsulation.
Fig. 6 is the stacked operation of the luminaire element of the related luminaire of expression second execution mode of the present invention with encapsulation, the figure that dissects along A-A ' line of Fig. 5.
Fig. 7 be the related luminaire of second execution mode of the present invention the luminaire element with the encapsulation burn till after cutaway view.
Fig. 8 is a process chart from package arrangements luminaire element to the luminaire element of the related luminaire of second execution mode of the present invention that use.
Fig. 9 is to the luminaire element of the related luminaire of second execution mode of the present invention cutaway view with the process chart of encapsulation potting resin and the luminaire finished.
Figure 10 is the cutaway view of other embodiment of the related luminaire of second execution mode of the present invention.
Figure 11 is the cutaway view of other embodiment of the related luminaire of second execution mode of the present invention.
Figure 12 is the cutaway view of other embodiment of the related luminaire of second execution mode of the present invention.
Figure 13 is the vertical view that the related luminaire of the 3rd execution mode of the present invention is seen from upper surface.
Figure 14 is that the related luminaire of the 3rd execution mode of the present invention is by B-B ' line side cross sectional view.
Figure 15 is the cutaway view of the related luminaire of the 3rd execution mode of the present invention.
Figure 16 is the cutaway view of the related luminaire of the 4th execution mode of the present invention.
Figure 17 is a cutaway view of representing an example of luminaire in the past.
Figure 18 is another routine cutaway view of representing luminaire in the past.
Figure 19 is other the cutaway view of embodiment of representing luminaire in the past.
Embodiment
Below, about embodiments of the present invention, specify with reference to the accompanying drawings.
(first execution mode)
Fig. 1～Fig. 4 is about the related luminaire of one embodiment of the present invention, represents the cutaway view of its manufacture method according to process sequence.
At first, in ceramic body forms operation, by will be stacked as shown in Figure 1, thereby form the duplexer 711 of ceramic sheet material 21 by a plurality of ceramic sheet materials 21 of ceramic making.At this moment, between adjacent a pair of ceramic sheet material 21,21, be provided with metal level 41.Thus, metal level 41 is along expanding with the stacked direction plane orthogonal of ceramic sheet material 21.
And, be the stacked one or more ceramic sheet materials 21 of mode of the size of regulation with distance from the upper surface of duplexer 711 to the upper surface of metal level 41 on the upper strata of metal level 41.At this, the size of regulation be the upper surface (the upper surface 2a of matrix 2 shown in Figure 2) of the duplexer 711 after burning till and burn till after the distance of upper surface (light reflection surface 42 of light reflecting board 4 shown in Figure 2) of metal level 41 be the size of 0.1mm～0.4mm degree.
After forming duplexer 711, at the stacked shaped as frame adult 30 of the upper surface of duplexer 711 by ceramic making.At this moment, be positioned at the mode configuration block organizator 30 of the top of metal level 41 with the space 30a of the inboard that is formed on shaped as frame adult 30.Thus, form the ceramic body 71 that constitutes by duplexer 711 and shaped as frame adult 31.
In addition, the pottery that forms shaped as frame adult 30 uses the low temperature that can burn till simultaneously with metal level 41 Low fire ceramic (LTCC) simultaneously.The pottery that forms shaped as frame adult 30 also can use and form the ceramic phase pottery together of ceramic sheet material 21, also can use the pottery different with it.
Then, in firing process, burn till by ceramic body and form the ceramic body 71 that operation forms, thereby, light-emitting component shown in Figure 2 made with encapsulating 72.By burning till of ceramic body 71, as shown in Figure 2, duplexer 711 and shaped as frame adult 30 be sintering and form matrix 2 and framework 3 respectively, and matrix 2 is engaged integrated with framework 3.
And by the sintering of shaped as frame adult 30, the space 30a that forms in the inboard of shaped as frame adult 30 is configured for accommodating the cavity 3a of light-emitting component 1.
In addition, by burning till of ceramic body 71, make metal level 41 sintering, the lower position that is formed in cavity 3a is embedded in the light reflecting board 4 in the matrix 2.In addition, as mentioned above, metal level 41 along with stacked direction plane orthogonal expansion, so the light reflecting board 4 about being obtained by the sintering of metal level 41 can make its upper surface play effect as light reflection surface 42.Thus, light reflecting board 4 has and makes the posture of its light reflection surface 42 towards the top.
In the present embodiment, use low temperature Low fire ceramic (LTCC) simultaneously as the pottery that forms ceramic body 71, so can make this ceramic post sintering with 800 ℃～950 ℃ temperature.Therefore, can suppress the abnormal contraction of metal level 41 employed metals etc., and make metal level 41 sintering.In addition, low temperature Low fire ceramic simultaneously passes through sintering and crystallization, becomes to have light transmission.
In ceramic body 71, upper strata at metal level 41, be laminated with one or more ceramic sheet materials 21, so the light-emitting component of being made by burning till of ceramic body 71 with in the encapsulation 72, is provided with the part of the pottery that forms matrix 2 between the upper surface 2a of the light reflection surface 42 of light reflecting board 4 and matrix 2.
Therefore, light-emitting component with encapsulation 72 in, the light reflection surface 42 of light reflecting board 4 is by the covering of the part of the pottery that forms matrix 2, is difficult to produce the deterioration that oxidation or chemical reaction cause at the light reflection surface 42 of light reflecting board 4.
In addition, form the pottery use low temperature while Low fire ceramic of light-emitting component with the matrix 2 of encapsulation 72, the low temperature of crystallization while Low fire ceramic (LTCC) has light transmission as mentioned above, so from the light of cavity 3a towards below incident, can arrive light reflection surface 42, advance upward by light reflection surface 42 reflections to light reflecting board 4.
Then, be provided with in the operation, as shown in Figure 3, with encapsulating on 72 light-emitting component 1 be set at the light-emitting component of making by firing process at light-emitting component.Particularly, in cavity 3a, light-emitting component 1 is arranged on the upper surface 2a of matrix 2 in the top position of light reflecting board 4 via bonding die liner (die attach pad) 10.
And, in the resin filling work procedure, fill the resin 6 that contains fluorophor in the inside of cavity 3a shown in Figure 4, make this resin 6 sclerosis.Thus, make the related luminaire of one embodiment of the present invention.
In above-mentioned luminaire, the light that penetrates towards the below from light-emitting component 1 reflects by being embedded in the light reflection surface 42 of light-emitting component with the light reflecting board 4 the encapsulation 71, advances upward, and its result obtains sufficient luminous intensity in luminaire.
Therefore, the luminous intensity of luminaire is maintained at fully high state.
In addition, above-mentioned light-emitting component with encapsulation 72 in, the distance from the upper surface 2a of matrix 2 to the light reflection surface 42 of light reflecting board 4 is preferably 0.1mm～0.4mm as mentioned above.Its reason is, described distance is easy to generate migration than under the little situation of 0.1mm in light reflecting board 4, and described distance is than under the big situation of 0.4mm, and the absorbing amount of pottery increases, the reflection of light rate reduction of penetrating downwards from light-emitting component 1.
Wherein, use the metal that is difficult to move as the metal that forms light reflecting board 4, thereby can make from the upper surface 2a of matrix 2 littler than 0.1mm to the distance of the light reflection surface 42 of light reflecting board 4.
Perhaps, adopt the pottery that can suppress the migration that produces in the light reflecting board 4 as the pottery between the upper surface 2a of the light reflection surface 42 of light reflecting board 4 and matrix 2, thereby can make from the upper surface 2a of matrix 2 littler than 0.1mm to the distance of the light reflection surface 42 of light reflecting board 4.
As shown in Figure 2, use in the encapsulation 72 at above-mentioned light-emitting component, among the upper surface 2a of matrix 2, a part that forms the pottery of this matrix 2 is exposed in cavity 3a, so can make the face 22a that exposes of this pottery play effect as second light reflection surface different with the light reflection surface 42 of light reflecting board 4.For example form and use fully little ceramic sheet material 21 of surface roughness in the operation, thereby the above-mentioned surface roughness of exposing face 22a is little, therefore expose face 22a and play effect as second light reflection surface at ceramic body.
The above-mentioned face 22a that exposes is played under the situation as the effect of second light reflection surface, the light that penetrates towards the below from the light-emitting component 1 that is housed in the cavity 3a, its part is reflected by second light reflection surface, by light reflection surface 42 reflections of the light behind second light reflection surface by light reflecting board.Therefore, the light that penetrates towards the below from light-emitting component 1 is guided efficiently upward, and the luminous intensity of luminaire is maintained at higher state.
In addition, each several part formation of the present invention is not limited to above-mentioned first execution mode, can carry out various distortion in the technical scope that claims are put down in writing.For example, the metal that forms light reflecting board 4 is not limited to silver (Ag) or aluminium (Al), can use to have the various metals of high light reflectivity.
(second execution mode)
Fig. 5～Fig. 9 is about the related light-emitting component equipment of second execution mode of the present invention, represents the cutaway view of its manufacture method according to process sequence.Fig. 5 is the figure that the light-emitting component of second execution mode is seen from upper surface with encapsulation.The later diagram of Fig. 6 is the A-A ' side cross sectional view along Fig. 5.
At first form in the operation, as shown in Figure 6,, form duplexer 111 by stacked matrix 11 (ceramic sheet material) and the framework 12 that constitutes by ceramic material at ceramic body.Be embedded with in the inside of matrix 11 and framework 12 with first reflector 31 of the light of the upper surface approximate vertical of matrix 11 and reflection light-emitting component 22 and with second reflector 32 of the light of the upper surface almost parallel of matrix 11 and reflection light-emitting component 22.At this, first reflector 31 forms first reflecting surface, 36, the second reflectors 32 and forms second reflecting surface 37.In addition, reflector is made of silver of light reflectivity good metal material etc.
In the formation of first reflector 31, on matrix 11 and framework 12, form through hole (PVC ア) as filler opening, fill silver paste etc.(at this, through hole also can only be formed on the framework 12) passes through coating silver paste such as scraping blade method on the surface of matrix 11 under the situation that is second reflector 32.
In addition, as shown in Figure 5, the interrupted cavity 13 that surrounds of the layer of first reflector 31 has disjunction position 33a, but also disjunction position 33a can be set.At this, in order to reflect the light of light-emitting component 22, do not have disjunction position 33a for well, but if there is not disjunction position 33a, then framework 12 and matrix 11 are divided into two by first reflector 31, are difficult to handle.
In addition, the pottery that forms matrix 11 and framework 12 uses the low temperature that can burn till simultaneously with silver paste Low fire ceramic (LTCC) simultaneously.But, also can select refractory metal, use high temperature to burn till the ceramic material of usefulness.
Then in firing process, burn till at ceramic body and form the duplexer 111 that forms in the operation, thereby make light-emitting component shown in Figure 7 with encapsulating 14.As shown in Figure 7, matrix 11 and framework 12 are engaged integrated.
At this moment, form first reflecting surface 36 respectively (at this on first reflector 31 of in the filler opening of matrix 11 and framework 12, filling and second reflector 32 that is coated on the matrix 11, also constitute a plurality of first partially reflecting surface 36a that arrange in the mode of surrounding cavity 13) and second reflecting surface 37, and interconnect and engage.Thus, eliminate the gap between first reflector 31 and second reflector 32, the light of light-emitting component 22 is not reflected on light leak ground.
In addition, by the sintering of matrix 11 and framework 12, the space that is made of the inner peripheral surface of the upper surface of matrix 11 and framework 12 becomes cavity 13.
In the present embodiment, use low temperature Low fire ceramic (LTCC) simultaneously as pottery, thus can make this ceramic post sintering with 800 ℃～1000 ℃ temperature, abnormal contraction that can inhibitory reflex device 31,32 employed metals etc., and make its sintering.
Then being provided with in the operation of light-emitting component 22, as shown in Figure 8, the light-emitting component of making in firing process is provided with light-emitting component 22 with encapsulating on 14.Particularly,, in cavity 13, liner etc. is set, light-emitting component 22 is set thereon, implement to carry out the wiring etc. of the supply of power supply etc. in the surface area of matrix 112 for light-emitting component 22.At this, the setting of light-emitting component 22 is connected up in LTCC with method same, so its diagram is omitted.For example realize as shown in figure 19.
Then, in the resin filling work procedure, fill the resin 113 that contains fluorophor, make this resin 113 sclerosis in the inside of cavity shown in Figure 9 13.Thus, make the related luminaire 15 of second execution mode of the present invention.In addition, also can not fill the resin 113 that contains fluorophor in the inside of cavity 13.
Shown in Figure 19 as example in the past is exposed in the luminaire of inner peripheral surface of cavity 1130 at reflector 1140, because reflector 1140 directly contacts with the resin 1130 that contains fluorophor, thus silver-colored oxidation and corroding, so the reflectivity reduction.
Catoptrical first reflector 31 and second reflector 32 made in second execution mode are buried the inside that is formed on matrix 11 and framework 12 underground, so directly do not contact with the resin 113 that contains fluorophor, therefore can not cause the corrosion of silver, can keep reflectivity yet.And then, also be difficult to cause through the time change the deterioration that causes, reliability improves.Its result can access and keep the more luminaire 15 of high luminous intensity under high luminous intensity.
And then as shown in figure 10, the inner peripheral surface of cavity 13 is faces vertical with the upper surface of matrix 2, also can access same effect.
And then as shown in figure 11, first reflector 31 forms and step-likely also can access same effect.
And then as shown in figure 12, first reflector 31 only is formed on the framework 12 and also can accesses same effect.
(the 3rd execution mode)
About the 3rd execution mode, describe by Figure 13～Figure 15.At this,, connect up in LTCC with method same, so its diagram is omitted to the wiring of light-emitting component 22 supply powers etc. etc.
Figure 13 is the diagram from top observation luminaire 16.At central portion light-emitting component 22 is set in this case.Figure 14, Figure 15 are the B-B ' line side cross sectional view of Figure 13.
At first in stacked operation, as shown in figure 14, at a plurality of first reflectors 31 of the internal configurations of matrix 11 and framework 12a.Figure 15 is a cutaway view of finishing product.
At this moment, as Figure 13, Figure 14 and shown in Figure 15, first reflector 31 has a plurality of reflection aspect 36a of first that arrange in the mode of interrupted encirclement cavity 13 and is positioned at the second partially reflecting surface 36b in the outside of the first partially reflecting surface 36a.
And then, the reflection aspect 36a of first and the second partially reflecting surface 36b polishing disjunction position 33a and surround cavity 13.Its result, the leakage of light that can polishing light-emitting component 22.
Thereafter, similarly burn till with second execution mode, configuration light-emitting component 22 is filled the resin 113 that contains fluorophor, makes luminaire.
By above-mentioned formation, the light that leaks from the disjunction position 33a of first reflector 31 is arranged in second execution mode, in the 3rd execution mode, the light that leaks at the first partially reflecting surface 36a can be replenished by second partially reflecting surface 36b reflection, so further improve luminous intensity.
(the 4th execution mode)
About the 4th execution mode, describe by Figure 16.Figure 16 is second reflector, 32 interrupted second reflectors 35 that form as the luminaire 16 that makes the 3rd execution mode, further increases the diagram of one deck.Structure is in addition similarly made with the 3rd execution mode.
By on second reflector 35, forming the disjunction position, thereby can relax the thermal expansion of the matrix 11 and second reflector 35, can reduce the warpage after burning till,, more can eliminate warpage than second execution mode and the 3rd execution mode.
In addition, each formation of the present invention is not limited to the above-mentioned second and even the 4th execution mode, can carry out various distortion in the technical scope of claims record.
Claims (12)
1. a light-emitting component is with encapsulating, wherein, have the matrix of ceramic and be located at the upper surface of this matrix, be formed with the framework of the ceramic of the cavity that is used to accommodate light-emitting component in the inboard, on described matrix, light reflecting board is embedded in the lower position of described cavity with the posture of its light reflection surface towards the top, between the upper surface of the light reflection surface of described light reflecting board and described matrix, be provided with the part of the pottery that forms this matrix, and this part has light transmission at least.
2. light-emitting component as claimed in claim 1 is with encapsulating, and wherein, described light reflecting board is formed by metal, and described matrix is by forming with the low temperature while Low fire ceramic that the metal that forms described light reflecting board burns till simultaneously.
3. light-emitting component as claimed in claim 1 is with encapsulation, and wherein, described matrix and light reflecting board are made by burning till duplexer, stacked a plurality of ceramic sheet materials of this duplexer and be provided with the metal level that constitutes light reflecting board between adjacent a pair of ceramic sheet material.
4. light-emitting component as claimed in claim 1 is with encapsulation, wherein, and in the upper surface of described matrix, constitute second light reflection surface that face constitutes that exposes that is formed with at least a portion zone in zone of bottom surface of described cavity by the pottery that forms this matrix.
5. luminaire wherein, has the described light-emitting component of claim 1 with encapsulation be equipped on this light-emitting component with the light-emitting component in the encapsulation, and this light-emitting component is contained in and is formed in the cavity of described light-emitting component with the inboard of the framework of encapsulation.
6. luminaire, it has: the matrix that constitutes by ceramic material, equally by ceramic material constitute and be arranged on the upper surface of described matrix framework, be configured in the light-emitting component in the cavity that the upper surface by the inner peripheral surface of described framework and described matrix constitutes, be embedded with first reflector that constitutes and reflect the light that described light-emitting component sends by metal material in the inside of described framework.
7. luminaire as claimed in claim 6, wherein, described first reflector has the upper surface approximate vertical with described matrix, and the light that described light-emitting component is sent is towards first reflecting surface of described cavity internal reflection.
8. luminaire as claimed in claim 7, wherein, described first reflecting surface has a plurality of first partially reflecting surfaces of arranging in the mode of the described cavity of interrupted encirclement.
9. luminaire as claimed in claim 8, wherein, described first reflecting surface has a plurality of second partially reflecting surfaces of arranging with in the interrupted mode of surrounding described cavity in the position in the outside of described first partially reflecting surface, described first partially reflecting surface and the second partially reflecting surface polishing each other the disjunction position and surround described cavity.
10. luminaire as claimed in claim 6 wherein, is embedded with second reflector that is constituted and reflected the light that described light-emitting component sends by metal material in the inside of described matrix.
11. luminaire as claimed in claim 10, wherein, described second reflector has the upper surface almost parallel with described matrix, and the light that described light-emitting component is sent is towards second reflecting surface of described cavity internal reflection.
12. luminaire as claimed in claim 10, wherein, described first reflector extends to the inside of described matrix, is connected with described second reflector.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009011581A JP2010171158A (en) | 2009-01-22 | 2009-01-22 | Package for light emitting element and light emitting device |
| JP2009-011581 | 2009-01-22 | ||
| JP2009-085760 | 2009-03-31 | ||
| JP2009085760A JP2010238941A (en) | 2009-03-31 | 2009-03-31 | Light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101789481A true CN101789481A (en) | 2010-07-28 |
Family
ID=42532616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010108591A Pending CN101789481A (en) | 2009-01-22 | 2010-01-22 | Light-emitting component is with encapsulating and luminaire |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20100086443A (en) |
| CN (1) | CN101789481A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160112116A (en) * | 2015-03-18 | 2016-09-28 | 엘지이노텍 주식회사 | Light Emitting Device Array and Lighting System with the Light Emitting Device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235204A (en) * | 2003-01-28 | 2004-08-19 | Kyocera Corp | Package for storing light emitting element and light emitting device |
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
-
2010
- 2010-01-22 KR KR1020100006059A patent/KR20100086443A/en not_active Application Discontinuation
- 2010-01-22 CN CN201010108591A patent/CN101789481A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235204A (en) * | 2003-01-28 | 2004-08-19 | Kyocera Corp | Package for storing light emitting element and light emitting device |
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100086443A (en) | 2010-07-30 |
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Application publication date: 20100728 |