CN101762985B - Apparatus for processing a substrate - Google Patents
Apparatus for processing a substrate Download PDFInfo
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- CN101762985B CN101762985B CN2009102117358A CN200910211735A CN101762985B CN 101762985 B CN101762985 B CN 101762985B CN 2009102117358 A CN2009102117358 A CN 2009102117358A CN 200910211735 A CN200910211735 A CN 200910211735A CN 101762985 B CN101762985 B CN 101762985B
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- substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides an apparatus for processing a substrate. The device comprises a coating unit which delivers the substrate along the horizontal direction, and provides the resist composition onto the substrate to form the resist layer on the substrate while delivering the substrate; a baking unit disposed close to the coating unit, which heats the substrate and hardens the resist layer when the substrate is delivered along the horizontal direction. A delivery unit is provided between the coating unit and the baking unit in order to deliver the substrate along the horizontal direction.
Description
Technical field
Usually, embodiments of the invention relate to the device for the treatment of substrate.Embodiments of the invention relate in particular to the device that forms photoresist layer and this photoresist layer that hardens in the manufacture process of flat panel display equipment at substrate.
Background technology
In the process of the flat panel display equipment of making liquid crystal display and so on, the plate substrate that normal operation is made by silicon or glass, and carry out multiple processing to form circuitous pattern at substrate.For example, can carry out deposition process, photoetching treatment, etch processes, cleaning, dry processing etc., to form circuitous pattern.
Photoetching treatment is included on the substrate that the coating that forms photoresist layer is processed, the soft baking of sclerosis photoresist layer is processed, will required graph transfer printing exposure-processed, development photoresist layer to the photoresist layer with the development treatment that forms the photoresistance figure and the hard baking processing of sclerosis photoresistance figure.
Can be provided with automechanism between the processing unit to transmit substrate.Yet automechanism can increase the manufacturing cost of photoetching treatment device.In addition, in the situation that transmit substrate by automechanism, the minimizing of photoetching treatment required time is restricted.
Summary of the invention
Embodiments of the invention provide a kind of device for the treatment of substrate, and it can form photoresist layer in the situation that do not need substrate to transmit automechanism.
According to an aspect of the present invention, a kind of device for the treatment of substrate comprises coater unit, its along continuous straight runs transmits described substrate, and when transmitting described substrate, the photoresistance composition is provided on the described substrate to form the photoresist layer on the described substrate; And near described coater unit setting cure the unit, when described substrate transmitted along described horizontal direction, the described unit that cures was to the described substrate described photoresist layer that heats to harden.
According to some embodiments of the present invention, described device also comprises and is arranged on described coater unit and the described delivery unit that cures between the unit, so that described substrate is sent to the described unit that cures from described coater unit.
According to some embodiments of the present invention, described delivery unit comprises a plurality of turning axles that arrange along described horizontal direction, and described turning axle extends along another horizontal direction perpendicular to described horizontal direction; A plurality of being installed on the described turning axle to transmit the roller of described substrate; And so that the drive division of described turning axle rotation.
According to some embodiments of the present invention, described device also comprises the buffer cell that vertically is located at movably between the described turning axle, and described buffer cell moves described substrate along described vertical direction, thereby deposits described substrate.
According to some embodiments of the present invention, described buffer cell comprises a plurality of sway braces, and it is located between the described turning axle movably along described vertical direction, and described sway brace supports described substrate; And vertical drive section, it is connected with described sway brace with along described vertical direction movable support arm.
According to some embodiments of the present invention, described coater unit comprises the substrate transport unit that transmits described substrate along described horizontal direction; And being located at the nozzle of described substrate transport unit top, described nozzle extends along another horizontal direction perpendicular to described horizontal direction, and when described substrate transmits described photoresistance composition is provided on the described substrate.
According to some embodiments of the present invention, described substrate transport unit comprises pressure fan, and its lower surface that air is provided to described substrate is to float described substrate; And drive division, it transmits the described substrate that floats along described horizontal direction.
According to some embodiments of the present invention, described pressure fan comprises having a plurality of holes so that the perforated plate of described air to be provided.
According to some embodiments of the present invention, pressure fan comprises the porous plate that is formed by porosint; And be located at sidewall on the side surface of described porous plate.
According to some embodiments of the present invention, described drive division comprises a plurality of vacuum cups, and described vacuum cup it use vacuum pressure to keep the edge part of the lower surface of described substrate.
According to some embodiments of the present invention, a plurality of rollers of described drive division, described roller support the edge part of the lower surface of described substrate along the direction setting that is parallel to described horizontal direction.
According to some embodiments of the present invention, the described unit that cures comprises pressure fan, and its lower surface that air is provided to described substrate is to float described substrate; And well heater, it heats described substrate when transmitting described substrate along described horizontal direction above described pressure fan.
According to some embodiments of the present invention, also comprise the front side that is located at respectively described pressure fan and the substrate transport unit of rear side, to transmit described substrate along described horizontal direction.
According to some embodiments of the present invention, each described substrate transport unit comprises the turning axle that extends along perpendicular to another horizontal direction of described horizontal direction; A plurality of being installed on the described turning axle to transmit the roller of described substrate; And so that the drive division of described turning axle rotation.
According to some embodiments of the present invention, described pressure fan comprises the perforated plate with a plurality of holes or the porous plate that is formed by porosint, so that described air to be provided.
According to some embodiments of the present invention, described well heater is arranged among the described pressure fan.
According to some embodiments of the present invention, the described unit that cures comprises a plurality of turning axles that arrange along described horizontal direction, and described turning axle extends along another horizontal direction perpendicular to described horizontal direction; A plurality of being installed on the described turning axle to transmit the roller of described substrate; So that the drive division of described turning axle rotation; And a plurality of being located between the described turning axle to heat the well heater of described substrate.
According to some embodiments of the present invention, also comprise being located at described coater unit and the described drying unit that cures between the unit, with the described photoresist layer that is formed on the substrate of drying.
According to some embodiments of the present invention, described drying unit comprises the hothouse that holds described substrate; A plurality ofly be located at turning axle in the described hothouse along described horizontal direction, described turning axle extends along another horizontal direction perpendicular to described horizontal direction; A plurality of being installed on the described turning axle to transmit and to support the roller of described substrate; So that the drive division of described turning axle rotation; And the vacuum system that is connected with described hothouse, described by the described photoresist layer on the substrate of roll support with drying.
According to some embodiments of the present invention, described hothouse comprises the bottom compartment with open top; And lid, its described top that opens and closes described bottom compartment with along described horizontal direction with pack into described hothouse and described substrate is taken out from described hothouse along described horizontal direction of described substrate.
According to embodiments of the invention, comprise coater unit, drying unit and cure unit etc. for the treatment of the device of substrate.Via described coater unit, drying unit and cure the unit, along continuous straight runs transmits from loader substrate towards unloader.That is, use a plurality of rollers and pressure fan and need not substrate and transmit automechanism, with the mode treatment substrate of being aligned.Thereby the required time for the treatment of substrate is reduced, and the manufacturing cost of described substrate board treatment is minimized.
Description of drawings
By reference to the accompanying drawings, can more know embodiments of the invention with reference to detailed description hereinafter, wherein:
Fig. 1 is the schematic diagram that illustrates according to the substrate board treatment of the embodiment of the invention;
Fig. 2 is the schematic plan view that coater unit shown in Figure 1 is shown;
Fig. 3 is the schematic sectional view that coater unit shown in Figure 1 is shown;
Fig. 4 is the schematic sectional view that another embodiment of the substrate transport unit shown in Fig. 2 and 3 is shown;
Fig. 5 is the again schematic plan view of an embodiment that the substrate transport unit shown in Fig. 2 and 3 is shown;
Fig. 6 is the again schematic front view of an embodiment that the substrate transport unit shown in Fig. 2 and 3 is shown;
Fig. 7 is the schematic plan view that another embodiment of pressure fan shown in Fig. 2 and 3 is shown;
Fig. 8 is the again schematic plan view of an embodiment that the pressure fan shown in Fig. 2 and 3 is shown;
Fig. 9 is the again schematic sectional view of an embodiment that the pressure fan shown in Fig. 2 and 3 is shown;
Figure 10 is the schematic plan view that another embodiment of the pressure fan shown in Fig. 2 and 3 is shown;
Figure 11 is the schematic sectional view that another embodiment of the pressure fan shown in Fig. 2 and 3 is shown;
Figure 12 illustrates the schematic plan view that cures the unit shown in Figure 1;
Figure 13 illustrates the schematic sectional view that cures the unit shown in Figure 1;
Figure 14 is the schematic diagram of air supply section shown in Figure 13;
Figure 15 be illustrate cure shown in Figure 12 and 13 unit the schematic plan view of another embodiment;
Figure 16 illustrates the again schematic plan view that cures the unit shown in Figure 12 and 13;
Figure 17 illustrates delivery unit shown in Figure 1 and the schematic plan view of buffer cell;
Figure 18 is the diagrammatic side view that delivery unit and buffer cell shown in Figure 1 are shown;
Figure 19 illustrates the according to another embodiment of the present invention schematic diagram of substrate board treatment;
Figure 20 is the schematic plan view that drying unit shown in Figure 19 is shown;
Figure 21 is the schematic front view that drying unit shown in Figure 19 is shown;
Figure 22 is the schematic sectional view that drying unit shown in Figure 19 is shown; And
Figure 23 is the schematic sectional view that the roller shown in Figure 20～22 is shown.
Embodiment
Referring to the accompanying drawing that the embodiment of the invention is shown, hereinafter the present invention will be described in more detail.Yet the present invention can be with many multi-form realizations, and should not be construed as the restriction of the embodiment that is subjected in this proposition.On the contrary, it is abundant and complete open in order to reach proposing these embodiment, and makes those skilled in the art understand scope of the present invention fully.In these accompanying drawings, for clarity sake, may amplify size and the relative size in layer and zone.
Should be understood that when element or layer are called another element or layer " on " or " being connected to " another element or layer in, it can be directly on another element or layer or is connected directly to other element or layer, perhaps has the element or the layer that occupy therebetween.In contrast, when element being called in " directly on another element or layer " or " being connected directly to " or another element or the layer, there are not the element or the layer that occupy therebetween.Same numeral refers to identical element in the whole part of instructions.As used herein, term " and/or " comprise any or all combination of the Listed Items that one or more is relevant.
Although should be understood that herein and describe a plurality of elements, assembly, zone, layer and/or part with first, second, third, etc., these elements, assembly, zone, layer and/or part are not subjected to the restriction of these terms.These terms only are used for making an element, assembly, zone, layer or part and another zone, layer or part difference to come.Thus, hereinafter be referred to as the first element, assembly, zone, layer or part and also can be described as the second element, assembly, zone, layer or part, and do not break away from instruction of the present invention.
With the statement of space correlation, such as " lower (lower) ", " upper (upper) " etc., using in this article is for easily statement element as shown in the figure or the relation of parts and another element or parts.Should be understood that the statement of these and space correlation except orientation shown in the figure, also be intended to contain this equipment use or work in different azimuth.For example, if the upset of this equipment among the figure, be described as other element or parts " below " or " under " equipment then can be defined as other element or parts " on ".Thus, this exemplary statement " ... the below " can contain simultaneously " ... the top " with " ... the below " both.This equipment can be other towards (90-degree rotation or other towards), and corresponding explanation is also done in the statement of these and space correlation used herein.
Statement used herein only is used for describing specific embodiment, and and is not intended to limit the present invention.As described herein, the article of singulative is intended to comprise plural form, unless its context is expressed.Will also be understood that, in this instructions, use in the statement " comprising ", offered some clarification on and had described parts, integral body, step, operation, element and/or assembly, do not existed or be attached with one or more other parts, integral body, step, operation, element, assembly and/or their combination but do not get rid of.
Unless describe in detail separately, the meaning of employed all terms of this paper (comprising scientific and technical terminology) is consistent with those skilled in the art institute common understanding.Should also be understood that such as defined term in the general dictionary should be interpreted as with correlative technology field in aggregatio mentium, and should not be construed as Utopian or excessive mechanical implication, unless clearly definition is arranged in the text in addition.
For embodiments of the invention, be to describe with reference to the schematic sectional view of idealized embodiment of the present invention (and intermediate structure) herein.Like this, expection for example can produce because of manufacturing process and/or tolerance and cause in shape variation.Thus, embodiments of the invention should not be construed as it is constrained to specific region shown in this article shape, also for example should comprise the form variations that causes because of manufacturing.The essence in the zone shown in the figure is schematically, and its shape and be not intended to illustrate the accurate shape of component area, also is not intended to limit scope of the present invention.
Fig. 1 is the schematic diagram that illustrates according to the substrate board treatment of the embodiment of the invention.
With reference to figure 1, in the process of making flat panel display equipment, can use the device 10 that is used for processing substrate according to the embodiment of the invention to form photoresist layer at the substrate 2 of being made by silicon or glass.
What for example, substrate board treatment 10 was included on the substrate 2 coater unit 100 that forms photoresist layer and this photoresist layer that hardens cures unit 200.Substrate board treatment 10 also comprise with substrate 2 be sent to coater unit 100 loader 20, be located at coater unit 100 and cure between the unit 200 with at coater unit 100 and cure the delivery unit 300 that transmits substrate 2 between the unit 200 and the unloader 30 that takes out substrates 2 from curing unit 200.
Along continuous straight runs transmits from coater unit 100 substrate 2 towards curing unit 200, and coater unit 100 and cure unit 200 and comprise that respectively the substrate transport unit is to transmit substrate 2.
Fig. 2 is the schematic plan view that coater unit shown in Figure 1 is shown, and Fig. 3 is the schematic sectional view that coater unit shown in Figure 1 is shown.
With reference to figure 2 and 3, coater unit 100 comprises for the substrate transport unit 102 that transmits in the horizontal direction substrate 2, and is used for the photoresistance composition is provided to nozzle 104 on the substrate 2.Nozzle 104 is located at the top of substrate transport unit 102, and extends along another horizontal direction perpendicular to this horizontal transmission direction.In addition, nozzle 104 has the slit (not shown) so that the photoresistance composition is provided on the substrate 2.This slit can extend along the bearing of trend of nozzle 104, and the photoresistance composition can be provided on the substrate 2 via this slit when substrate 2 transmits with this horizontal transmission direction.
Perforated plate 108 can be formed by the metal material of aluminium and so on, and the scope of the diameter in a plurality of hole 108 is the about 2.3mm of 0.1mm～approximately.In addition, the scope at the interval between the 108a of hole is about 10mm～150mm.Simultaneously, in the situation of diameter greater than 2.3mm in hole 108, the temperature of the part in the close hole 108 of substrate 2 can change because of air, and the thickness of the photoresist layer 4 that forms on the substrate 2 becomes inhomogeneous thus.
According to embodiments of the invention, drive division 114 can comprise a plurality of vacuum cups 116, keeps the edge part of the lower surface of substrate 2 to utilize vacuum pressure.In addition, vacuum cup 116 moves with the horizontal transmission direction by the linear electric motors 118 that are located at perforated plate 108 both sides.Perhaps, can come Mobile vacuum sucker 116 by the driving mechanism that comprises motor, lm guides, ball-screw, ball base etc.Simultaneously, drive division 114 can be mounted to framework 110a, as shown in Figure 2.
Move perpendicular to another horizontal direction of the horizontal transmission direction of substrate 2 on nozzle 104 edges, and supported by the carriage 100b that is located at pressure fan 160 tops.Particularly, carriage 100b is mobile at framework 100a along this horizontal direction.The arm 100c of carriage 100b extends along another horizontal direction perpendicular to the horizontal transmission direction above pressure fan 106, and nozzle 104 is connected with the bottom of bracket arm 100c.Particularly, nozzle 104 vertically is mounted to bracket arm 100c movably.For example, can be by motor and ball-screw moving nozzle 104 in vertical direction.
In addition, although not shown in the figures, can be provided with the cleaning unit (not shown) on the pressure fan 106 with cleaning nozzle.But carriage 100b along continuous straight runs and vertical direction moving nozzle 104 are with cleaning nozzle 104.
When substrate transport unit 102 transmitted substrate 2 with the horizontal transmission direction, nozzle 104 was provided on the substrate 2 the photoresistance composition to form photoresist layer 4.
Fig. 4 is the schematic sectional view that another embodiment of the substrate transport unit shown in Fig. 2 and 3 is shown.
With reference to figure 4, substrate transport unit 120 comprises the pressure fan 122 that substrate 2 is floated, and the mobile drive division 114 that floats substrate 2.
Porous plate is connected with air supply section 110 by air manifold 112.Owing to having described drive division 114, air manifold 112 and air supply section 110 with reference to figure 2 and 3, therefore having saved their detailed description.
Fig. 5 is the again schematic plan view of an embodiment that the substrate transport unit shown in Fig. 2 and 3 is shown, and Fig. 6 is the again schematic front view of an embodiment that the substrate transport unit shown in Fig. 2 and 3 is shown.
With reference to figure 5 and 6, substrate transport unit 130 comprises the pressure fan 132 that substrate 2 is floated, and the mobile drive division 140 that floats substrate 2.Because pressure fan 132 is similar with the pressure fan of describing referring to figs. 2 to Fig. 4, therefore omit its detailed description.
As shown in Figure 5, although can rotate roller 142 with two motors 144, also can use a motor.In this case, the turning axle that is connected with motor is extensible by pressure fan 132, and a pair of roller can be installed on two edge parts of this turning axle.
Fig. 7 is the again schematic plan view of an embodiment that pressure fan shown in Fig. 2 and 3 is shown.
With reference to figure 7, pressure fan 150 comprises that the perforated plate 152 with a plurality of hole 152a is to be provided to air on the lower surface of substrate 2.In addition, perforated plate 152 has slit 154, and driven roller 156 is located at respectively in the slit 154.But driven roller 156 supporting substrates 2 sink to prevent substrate 2.Perhaps, roller can be located in the slit 154 and by another driving mechanism rotation, with along described horizontal transmission direction moving substrate 2.
In addition, as shown in Figure 4 the porous plate that is formed by porosint can be used to replace perforated plate 152.Like this, in order to prevent air leakage, can madial wall be set at the inside surface of slit 154, and at the outside surface of porous plate lateral wall be set.
Fig. 8 is the again schematic plan view of an embodiment that the pressure fan shown in Fig. 2 and 3 is shown, and Fig. 9 is the again schematic sectional view of an embodiment that the pressure fan shown in Fig. 2 and 3 is shown.
With reference to figure 8 and 9, pressure fan 160 comprises that the perforated plate 162 with a plurality of first hole 162a is to be provided to air on the lower surface of substrate 2.The first hole 462a of perforated plate 162 is connected with air supply section 164.For example, perforated plate 162 is connected with the air manifold 166 that defines cushion space 166a, and air manifold 166 is connected with air supply section 164 by air hose 164a.Although not shown in the figures, air supply section 164 can comprise air pump, gas-holder, air strainer etc.In addition, air supply section 164 can comprise the flow velocity of the air that the valve that is located among the air hose 164a provides with the first hole 162a that regulates via perforated plate 162.
Perforated plate 162 can be formed by the metal material of aluminium and so on, and the scope of the diameter of the first hole 162a is the about 2.3mm of 0.1mm～approximately.Simultaneously, in the situation of diameter greater than 2.3mm of hole 162a, the temperature of the part of the close first hole 162a of substrate 2 can change because of air, and the thickness of the photoresist layer 4 that forms on the substrate 2 becomes inhomogeneous thus.
In addition, perforated plate 162 has a plurality of the second hole 162b and is supplied to air between the upper surface of substrate 2 and perforated plate 162 with discharge.The second hole 162b is set with moving substrate 2 stably, and the second hole 162b is connected with discharge manifold 168.Discharge manifold 168 is connected with discharge portion 169 by delivery pipe 169a.Although not shown in the figures, valve can be set to regulate the flow velocity of discharged air among the delivery pipe 169a.
Figure 10 is the schematic plan view that another embodiment of the pressure fan shown in Fig. 2 and 3 is shown, and Figure 11 is the again schematic sectional view of an embodiment that the pressure fan shown in Fig. 2 and 3 is shown.
With reference to Figure 10 and 11, pressure fan 170 comprises the porous plate 171 that is formed by porosint, and the sidewall 172 on the side surface of porous plate 171 is set, and leaks via the side surface of porous plate 171 to prevent air.
In addition, porous plate 171 has a plurality of hole 171a and is supplied to air between the upper surface of substrate 2 and porous plate 171 with discharge.Hole 171a is set with moving substrate 2 stably, and hole 171a is connected with discharge manifold 178.Discharge manifold 178 is connected with discharge portion 179 by delivery pipe 179a.Although not shown in the figures, but madial wall or inner tube are set preventing air leakage at the inside surface of hole 171a, and valve can be set to regulate the flow velocity of discharged air among the delivery pipe 179a.
Again with reference to figure 1, can process sclerosis and be formed on photoresist layer 4 on the substrate 2 by curing.Can transmit substrate 2 by curing unit 200 along described horizontal transmission direction.Herein, delivery unit 300 transmits the substrate 2 that is formed with photoresist layer 4 on it towards curing unit 200.
Figure 12 illustrates the schematic plan view that cures the unit shown in Figure 1, and Figure 13 illustrates the schematic sectional view that cures the unit shown in Figure 1.
With reference to Figure 12 and 13, cure unit 200 and comprise pressure fan 202 so that air is provided on the lower surface of substrate 2, thereby so that substrate 2 floats, cure unit 200 and also comprise well heater 210, when above pressure fan 202, transmitting substrate 2 along described horizontal transmission direction, heated substrates 2.
Perforated plate 204 can be formed by the metal material of aluminium and so on, and the scope of the diameter in hole 204 is the about 2.3mm of 0.1mm～approximately.In addition, the scope at the interval between the 204a of hole is about 10mm～150mm.
Well heater 210 is located among the perforated plate 204.For example, can be in perforated plate 204 the embedded resistor heater strip, as shown in figure 13.
Figure 14 is the schematic diagram of air supply section shown in Figure 13.
With reference to Figure 14, the temperature that the temperature of substrate 2 can be provided to because having perforated plate 204 air on the lower surface of substrate 2 changes, and the thickness of the photoresist layer on the substrate 24 becomes inhomogeneous thus.Thus, it is desirable having hot-air to be provided on the lower surface of substrate 2.
With reference to Figure 12 and 13, above perforated plate 204, transmit substrate 2 along described horizontal transmission direction by delivery unit 300 again, then from cure unit 200, take out substrate 2 by unloader 30.Herein, the width W 2 of perforated plate 204 is greater than the width W 1 of substrate 2, and the length L 2 of perforated plate 204 is less than the length L 1 of substrate 2.Particularly, the distance D between delivery unit 300 and the unloader 30 is desirable less than the length L 1 of substrate 2.Thus, can cure unit 200 above stably transmit substrate 2.
In addition, guide 224 can be set above perforated plate 204 leads with two edge parts to substrate 2.For example, guide roller can be set with the substrate 2 that leads along described horizontal transmission direction, as shown in figure 12 above perforated plate 204.
Thereby, can above perforated plate 204, transmit at a predetermined velocity substrate 2, and can be when transmitting substrate 2 photoresist layer 4 on the abundant curing substrates 2.
As shown in figure 13, although float substrate 2 with the perforated plate 204 with hole 204a, also can use the porous plate that is formed by porosint as shown in Figure 4.
Figure 15 illustrates shown in Figure 12 and 13 another to cure the schematic plan view of unit.
With reference to Figure 15, cure unit 200A comprise on the lower surface that air is provided to substrate 2 with the pressure fan 230 that floats substrate 2, be used for above pressure fan 230 along both sides, front and back that described horizontal transmission direction transmits the well heater (not shown) of heated substrates 2 in the substrate 2 and pressure fan 230 is set respectively to transmit the substrate transport unit 232 and 234 of substrate 2 along described horizontal transmission direction.
For example, first substrate transport unit 232 is located between delivery unit 300 and the pressure fan 230, and second substrate transport unit 234 is located between pressure fan 230 and the unloader 30.Herein, the distance between first, second substrate transport unit 232 and 234 is desirable less than the length of substrate 2.
First, second substrate transport unit 232 and 234 comprises respectively along the turning axle 236 that extends perpendicular to another horizontal direction of described horizontal transmission direction, a plurality of being installed on the turning axle 236 with the roller 238 that transmits substrate 2 and the drive division 240 that makes turning axle 236 rotations.The rotary drive mechanism that comprises motor can be used as drive division 240.
As shown in figure 15, although can rotate roller 238 with two motors 240, also can use a motor.In this case, turning axle 236 can be connected to each other by driving-belt and pulley system.
Owing to already having described similar section with reference to Figure 12～14, therefore having omitted the detailed description of pressure fan 230 and well heater.
Figure 16 illustrates the again schematic plan view that cures the unit shown in Figure 12 and 13.
With reference to Figure 16, cure unit 200B and comprise a plurality of turning axles 250, a plurality ofly be installed on the turning axle 250 with the roller 252 that transmits substrate 2, be used for making drive division 254 and a plurality of being located between the turning axle 250 with the well heater 256 of heated substrates 2 of turning axle 250 rotations, described turning axle 250 along continuous straight runs settings and extend along another horizontal direction perpendicular to this horizontal direction.
A plurality of pulleys 258 can be installed on the edge part of turning axle 250.Pulley 258 is connected with drive division 254 by driving-belt 260.Motor can be used as drive division 254, and also can be provided with idle pulley 262 between the pulley 258 to regulate the tension force of driving-belt 260.
Simultaneously, infrared heater can be used as well heater 256.
Can pass through delivery unit 300, roller 252 and unloader 30 and transmit substrate 2 along described horizontal transmission direction, and above well heater 256, transmit the photoresist layer 4. on the curing substrates 2 in the substrate 2
With reference to figure 1, delivery unit 300 can be located at coater unit 100 and cure between the unit 200 again.Delivery unit 300 can be used for substrate 2 is sent to from coater unit 100 and cures unit 200.In addition, coater unit 100 and cure between the unit 200 and can be provided with buffer cell 400 is with interim storing substrate 2.
Figure 17 illustrates delivery unit shown in Figure 1 and the schematic plan view of buffer cell, and Figure 18 is the diagrammatic side view that delivery unit and buffer cell shown in Figure 1 are shown.
With reference to Figure 17 and 18, delivery unit 300 comprises a plurality of turning axles 302, a plurality of being installed on the turning axle 302 with the roller 304 that transmits substrate 2 and the drive division 306 that is used for making turning axle 302 rotations, and described turning axle 302 arranges and extends along another horizontal direction perpendicular to this horizontal transmission direction along the described horizontal transmission direction of substrate 2.
A plurality of pulleys 308 can be installed on the edge part of turning axle 302.Pulley 308 is connected with drive division 306 by driving-belt 310.Motor can be used as drive division 306, and also can be provided with idle pulley 312 between the pulley 308 to regulate the tension force of driving-belt 310.
Particularly, buffer cell 400 comprises a plurality of sway braces 402 that vertically are located at movably between the turning axle 302 with supporting substrate 2, and the vertical drive section 404 that is connected to move in the vertical direction sway brace 402 with sway brace 402.
With reference to figure 1, loader 20 can arrange near coater unit 100 again, and unloader 30 can arrange near curing unit 200.Particularly, the structure of the structure of loader 20 and unloader 30 and delivery unit 300 is similar.
Figure 19 illustrates the according to another embodiment of the present invention schematic diagram of substrate board treatment.
With reference to Figure 19, in the manufacture process of flat panel display equipment, can using according to another embodiment of the present invention, substrate board treatment 50 forms photoresist layer at the substrate 2 that is formed by silicon or glass.
For example, substrate board treatment 50 be included on the substrate 2 coater unit 100 that forms photoresist layer, dry this be formed on the drying unit 500 of the photoresist layer on the substrate 2 and this photoresist layer that hardens cure unit 200.In addition, substrate board treatment 50 also comprises substrate 2 is sent to the loader 20 of coater unit 100, the unloader 30 that is located at the first delivery unit 600A between coater unit 100 and the drying unit 500, is located at drying unit 500 and cures the second delivery unit 600B between the unit 200 and take out substrates 2 from curing unit 200.In addition, substrate board treatment 50 comprises the first buffer cell 700A of being located between coater unit 100 and the drying unit 500, is located at drying unit 500 and cures the second buffer cell 700B between the unit 200.
Along continuous straight runs transmits substrates 2 from coater unit 100 towards curing unit 200 via drying unit, and coater unit 100, drying unit 500 and cure unit 200 and comprise that separately the substrate transport unit is to transmit substrate 2.
Owing to already having described similar element delivery unit 300 and buffer cell 400 with reference to figure 1～18, therefore having omitted the detailed description of the first delivery unit 600A, the second delivery unit 600B, the first buffer cell 700A and the second buffer cell 700B.In addition, owing to already having described like with reference to figure 1～18, the detailed description of therefore omitting loader 20, coater unit 100, curing unit 200 and unloader 30.
Drying unit 500 is located between the first and second delivery unit 600A and the 600B, and is used for removing solvent from the photoresist layer 4 that is formed on the substrate 2.For example, drying unit 500 utilizes vacuum pressure so that solvent volatilizees from photoresist layer 4, thus so that photoresist layer 4 dryings.
Figure 20 is the schematic plan view that drying unit shown in Figure 19 is shown, and Figure 21 is the schematic front view that drying unit shown in Figure 19 is shown, and Figure 22 is the schematic sectional view that drying unit shown in Figure 19 is shown.
With reference to Figure 20～22, drying unit 500 comprises the hothouse 502 that holds substrate 2, a plurality of turning axle 508, a plurality ofly is installed on the turning axle 508 to transmit and the roller 510 of supporting substrate 2, makes the drive division 512 of turning axle 508 rotations and is connected with hothouse 502 so that the vacuum system 514 of photoresist layer 4 dryings on the substrate 2 that is supported by roller 510, and described turning axle 508 is arranged in the described hothouse and along another horizontal direction extension perpendicular to described horizontal direction along described horizontal direction.
Can move up lid 506 with hothouse 502 that substrate 2 is packed into, then move down lid 506 so that the photoresist layer 4 on the substrate 2 is carried out drying.
The lower panel of bottom compartment 504 has a plurality of lower vacuum hole 504a that are connected with vacuum system 514 via lower manifold 518.Although not shown in the figures, vacuum system 514 comprises vacuum pump, is used for the valve of adjusting hothouse 502 pressure etc.
Simultaneously, vacuum system 514 only with situation that the lower panel of bottom compartment 504 is connected under, the pressure distribution in the hothouse 502 becomes inhomogeneous.In order to solve aforesaid problem, lid 506 has a plurality of upper vacuum hole 506a that are connected with vacuum system 514 via upper manifold 520.
The shape of lid 506 is similar to cap.For example, lid 506 can comprise top panel and sidewall.In the lid 506, along continuous straight runs can be provided with perforated plate 522, so that the pressure distribution in the hothouse 502 becomes more even, as shown in figure 22.
The sidewall that the edge part of turning axle 508 passes bottom compartment 504 stretches out.An edge part of turning axle 508 is connected with drive division 512.Be equipped with a plurality of by driving-belt 526 interconnected pulleys 524 on the edge part of turning axle 508.Be provided with idle pulley 528 between the pulley 524 to regulate the tension force of driving-belt 526.Simultaneously, motor can be used for drive division 512.
Can be provided with the first seal 530 between bottom compartment 504 and the lid 506, with the vacuum leak between preventing, and the second seal (not shown) can be installed on the turning axle 508, to prevent the vacuum leak between turning axle 508 and the bottom compartment 504.
Figure 23 is the schematic sectional view that the roller shown in Figure 20～22 is shown.
With reference to Figure 23, the edge part of each roller 510 has leg-of-mutton cross section, with the contact area of minimizing with substrate 2.In the situation that the contact area between the lower surface of roller 510 and substrate 2 increases, can change with the temperature with roller 510 forms the part that contacts of substrate 2 lower surfaces, and the photoresist layer on the substrate 24 thus may be dry unevenly.
With reference to Figure 19, possibly can't carry out abundant drying by the photoresist layer 4 on 500 pairs of substrates 2 of drying unit again.Yet, because being sent to, substrate 2 cures unit 200 after drying unit 500 is dry, therefore curing the required time of processing in curing unit 200 is reduced.
According to the abovementioned embodiments of the present invention, the device for the treatment of substrate comprises coater unit, drying unit and cures unit etc.Via described coater unit, drying unit and cure the unit, along continuous straight runs transmits from loader substrate towards unloader.That is, with the mode treatment substrate of being aligned, and the required time for the treatment of substrate reduced.
In addition, transmit substrate owing to need not to transmit automechanism with substrate, can reduce the manufacturing cost of substrate board treatment.
Although already described embodiments of the invention, the present invention should be understood and these embodiment should be restricted to, make within the spirit and scope of the invention that those skilled in the art can define such as appended claims and change and revise.
Claims (17)
1. the device of a treatment substrate comprises
Coater unit, its along continuous straight runs transmits described substrate, and when transmitting described substrate, the photoresistance composition is provided on the described substrate to form the photoresist layer on the described substrate;
Near described coater unit setting cure the unit, when described substrate transmitted along described horizontal direction, the described unit that cures was to the described substrate described photoresist layer that heats to harden; And
Be arranged on described coater unit and the described delivery unit that cures between the unit, so that described substrate is sent to the described unit that cures from described coater unit, described delivery unit comprises:
A plurality of turning axles that arrange along described horizontal direction, described turning axle extends along another horizontal direction perpendicular to described horizontal direction;
A plurality of being installed on the described turning axle to transmit the roller of described substrate; And
So that the drive division of described turning axle rotation,
Wherein said device also comprises the buffer cell that vertically is located at movably between the described turning axle, and described buffer cell moves described substrate along described vertical direction, thereby deposits described substrate.
2. device as claimed in claim 1, wherein said buffer cell comprises:
A plurality of sway braces, it is located between the described turning axle movably along described vertical direction, and described sway brace supports described substrate; And
Vertical drive section, it is connected with described sway brace with along described vertical direction movable support arm.
3. device as claimed in claim 1, wherein said coater unit comprises:
Transmit the substrate transport unit of described substrate along described horizontal direction; And
Be located at the nozzle of described substrate transport unit top, described nozzle extends along another horizontal direction perpendicular to described horizontal direction, and when described substrate transmits described photoresistance composition is provided on the described substrate.
4. device as claimed in claim 3, wherein said substrate transport unit comprises:
Pressure fan, it is provided to air on the lower surface of described substrate to float described substrate; And
Drive division, it transmits the substrate that floats along described horizontal direction.
5. device as claimed in claim 4, wherein said pressure fan comprises having a plurality of holes so that the perforated plate of described air to be provided.
6. device as claimed in claim 4, wherein pressure fan comprises:
The porous plate that is formed by porosint; And
Be located at the sidewall on the side surface of described porous plate.
7. device as claimed in claim 4, wherein said drive division comprises a plurality of vacuum cups, described vacuum cup uses vacuum pressure to keep the edge part of the lower surface of described substrate.
8. device as claimed in claim 4, wherein said drive division comprises a plurality of rollers, described roller supports the edge part of the lower surface of described substrate along the direction setting that is parallel to described horizontal direction.
9. device as claimed in claim 1, the wherein said unit that cures comprises:
Pressure fan, it is provided to air on the lower surface of described substrate to float described substrate; And
Well heater, it heats described substrate when transmitting described substrate along described horizontal direction above described pressure fan.
10. device as claimed in claim 9 also comprises the front side that is located at respectively described pressure fan and the substrate transport unit of rear side, to transmit described substrate along described horizontal direction.
11. device as claimed in claim 10, wherein each described substrate transport unit comprises:
Along the turning axle that extends perpendicular to another horizontal direction of described horizontal direction;
A plurality of being installed on the described turning axle to transmit the roller of described substrate; And
So that the drive division of described turning axle rotation.
12. device as claimed in claim 9, wherein said pressure fan comprise the perforated plate with a plurality of holes or the porous plate that is formed by porosint, so that described air to be provided.
13. device as claimed in claim 12, wherein said well heater is arranged among the described pressure fan.
14. device as claimed in claim 1, the wherein said unit that cures comprises:
A plurality of turning axles that arrange along described horizontal direction, described turning axle extends along another horizontal direction perpendicular to described horizontal direction;
A plurality of being installed on the described turning axle to transmit the roller of described substrate;
So that the drive division of described turning axle rotation; And
A plurality of being located between the described turning axle to heat the well heater of described substrate.
15. device as claimed in claim 1 also comprises being located at described coater unit and the described drying unit that cures between the unit, is formed on described photoresist layer on the substrate with drying.
16. device as claimed in claim 15, wherein said drying unit comprises:
The hothouse that holds described substrate;
A plurality ofly be located at turning axle in the described hothouse along described horizontal direction, described turning axle extends along another horizontal direction perpendicular to described horizontal direction;
A plurality of being installed on the described turning axle to transmit and to support the roller of described substrate;
So that the drive division of described turning axle rotation; And
The vacuum system that is connected with described hothouse, with drying by the described photoresist layer on the substrate of roll support.
17. device as claimed in claim 16, wherein said hothouse comprises:
Bottom compartment with open top; And
Lid, its described top that opens and closes described bottom compartment with along described horizontal direction with pack into described hothouse and described substrate is taken out from described hothouse along described horizontal direction of described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0109353 | 2008-11-05 | ||
| KR1020080109353A KR100985135B1 (en) | 2008-11-05 | 2008-11-05 | Apparatus for processing a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101762985A CN101762985A (en) | 2010-06-30 |
| CN101762985B true CN101762985B (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009102117358A Active CN101762985B (en) | 2008-11-05 | 2009-11-05 | Apparatus for processing a substrate |
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| Country | Link |
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| JP (1) | JP5122546B2 (en) |
| KR (1) | KR100985135B1 (en) |
| CN (1) | CN101762985B (en) |
| TW (1) | TWI501318B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101099555B1 (en) * | 2010-01-12 | 2011-12-28 | 세메스 주식회사 | Apparatus for processing a substrate |
| CN102074490B (en) * | 2010-09-30 | 2013-04-10 | 东莞宏威数码机械有限公司 | Intermittent transmission and heating mechanism |
| JP5798505B2 (en) | 2011-04-27 | 2015-10-21 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| KR101223037B1 (en) * | 2011-07-29 | 2013-01-17 | 세메스 주식회사 | Apparatus and method for treating substrate |
| KR101418301B1 (en) * | 2012-10-05 | 2014-07-10 | 위아코퍼레이션 주식회사 | Porous ceramic table |
| JP6226419B2 (en) * | 2013-08-22 | 2017-11-08 | オイレス工業株式会社 | Levitation transfer device |
| CN104859291B (en) | 2015-04-13 | 2017-12-29 | 京东方科技集团股份有限公司 | A kind of drying device and its drying means |
| CN105500883B (en) * | 2015-12-15 | 2017-11-17 | 郑州佰沃生物质材料有限公司 | Hot press enters discharging machine automatically |
| CN107413603B (en) * | 2017-07-20 | 2021-01-29 | 武汉华星光电技术有限公司 | Vacuum decompression drying equipment |
| JP7096746B2 (en) * | 2018-09-21 | 2022-07-06 | 株式会社荏原製作所 | A board processing device including a board transfer device and a board transfer device. |
| CN109188739A (en) * | 2018-09-29 | 2019-01-11 | 深圳市纳瑞科技有限公司 | A kind of liquid crystal module panel intelligence production line |
| CN112114500A (en) * | 2020-10-23 | 2020-12-22 | 江苏迪盛智能科技有限公司 | Exposure machine |
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| CN1702561A (en) * | 2000-12-26 | 2005-11-30 | 株式会社东芝 | Apparatus for processing substrate and method of processing the same |
| CN1406675A (en) * | 2001-08-15 | 2003-04-02 | 富士胶片株式会社 | Coated baker |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010114448A (en) | 2010-05-20 |
| JP5122546B2 (en) | 2013-01-16 |
| KR20100050187A (en) | 2010-05-13 |
| TW201023266A (en) | 2010-06-16 |
| KR100985135B1 (en) | 2010-10-05 |
| CN101762985A (en) | 2010-06-30 |
| TWI501318B (en) | 2015-09-21 |
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