TW201023266A - Apparatus for processing a substrate - Google Patents

Abstract

In an apparatus for processing a substrate, the apparatus includes a coating module transferring the substrate in a horizontal direction and supplying a photoresist composition onto the substrate to form a photoresist layer on the substrate while the substrate is transferred, and a baking module disposed adjacent to the coating module and heating the substrate to harden the photoresist layer while the substrate is transferred in the horizontal direction. A transfer module is disposed between the coating module and the baking module to transfer the substrate in the horizontal direction.

Description

201023266

1 ' TW5784PA VI. Description of the Invention: [Technical Field] The present invention relates to a substrate processing apparatus, and more particularly to a device for forming and hardening a photoresist layer on a substrate when manufacturing a flat display device. [Prior Art] ❹ When manufacturing a flat panel display device such as a liquid crystal display device, a substrate made of Shixia or glass is generally used. The circuit pattern of the other substrate can be used in many processes. For example, a deposition process, a yellow process, an etching process, a cleaning process, a drying process, and the like can be used to form a circuit pattern. The through-light process comprises a coating module for forming a photoresist on a substrate, a soft baking process-hardened photoresist layer, an exposure process for copying a pre-formed pattern onto the photoresist layer, and a developing process for developing the photoresist layer to form a photoresist The pattern, the final hard baked procedure hardens the photoresist pattern.机器 The robot arm can be configured to move the substrate between the process modules to complete each process. However, the robotic arm increases the manufacturing cost of the yellow light process unit. Moreover, if you use these robotic arms to move the substrate, there will be limits to shortening the yellow light process time. SUMMARY OF THE INVENTION The present invention is directed to a substrate processing apparatus capable of forming a photoresist layer on a substrate without requiring a substrate to transfer a robotic arm. According to an aspect of the present invention, a substrate transfer apparatus includes a coating module that can be transported in a horizontal direction, and the coating module is provided when the substrate is transported. 3 201023266

TW5784PA forms a photoresist layer on the substrate; the baking module is disposed in the coating module=baked in the horizontal direction, and the remaining time and the light-reducing photoresist layer are hard. According to an embodiment of the present invention, the module is disposed in the coating module. Between the baking module and the baking module: From: cloth: f transmission.岐 钱 钱 钱 模组 模组 Γ Γ Γ Γ Γ 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施The axis of rotation. Glaze enamel transfer substrate, and further driving portion According to an embodiment of the present invention, it is proposed that the device is further disposed in a vertical direction and can pass between the rotating shafts; the buffer module transmits the substrate in a vertical direction to store the substrate. The moving "group" includes a plurality of support arms that can be passed between the rotating shafts; the support arm supports = a plate and the vertical drive member connects the cutting arms to move the support arms in a vertical direction. According to an embodiment of the invention, the coating module includes The substrate transfer module transports the substrate in a horizontal direction; the nozzle is disposed above the substrate transfer module and extends perpendicular to the horizontal direction (four)-horizontal direction, and the nozzle is provided with a photoresist component on the wire. > According to an embodiment of the present invention, the substrate The transmission module includes a blower to provide a milk body on the bottom surface of the substrate to float the substrate, and the driving component transmits the floating substrate in a horizontal direction. According to an embodiment of the invention, the air blower includes 201023266 including a plurality of holes.

r 1 TW5784PA Porous plate to provide gas. According to an embodiment of the present invention, the air blower comprises a dense hole flat plate made of a dense hole material and the side wall of the dense hole flat plate is disposed. In accordance with an embodiment of the present invention, the drive member includes a plurality of vacuum chucks that hold the edges of the bottom surface of the substrate with vacuum pressure. According to an embodiment of the present invention, a plurality of rollers of the driving member are arranged in parallel in the horizontal direction to support the edge of the bottom surface of the substrate. ❹

According to an embodiment of the invention, the baking module includes a blower to supply gas to the bottom surface of the substrate to float the substrate, and the heater heats the substrate when the substrate is transported through the blower in a horizontal direction. According to an embodiment of the present invention, each of the substrate transfer members includes a rotation axis extending in another horizontal direction perpendicular to the horizontal direction; a plurality of rollers read the substrate on the rotation axis, and the drive member rotates the rotation axis. Porous H This example' blower consists of a gas containing a plurality of holes (4). The embodiment 'heating material is disposed in the blower. The heating base is placed in the horizontal direction and is perpendicular to the horizontal direction:: red: the shaft is matched with a plurality of pulley wires on the rotating substrate, the extension, the complex rotating shaft, and the plurality of heaters are disposed on the rotation c. According to the present invention In an embodiment, a device module is disposed on a coating die and a baking mold: a pain-resistant photoresist layer. Forming from a Dry Substrate According to an embodiment of the invention, the drying module comprises a drying chamber receiving base 5 201023266 '.

In the TW5784PA board, a plurality of rotating shafts are horizontally arranged in the drying chamber and the rotating shafts extend in another horizontal direction perpendicular to the horizontal direction, a plurality of rollers are mounted on the rotating shaft to transmit and support the substrate, and the driving member rotates the rotating shaft. And a vacuum system is connected to the drying chamber to dry the photoresist layer of the substrate on the roller. According to an embodiment of the invention, the drying chamber comprises a lower chamber containing an upper switch portion and a cover system for opening and closing the upper opening portion of the lower chamber, the function of which causes the substrate to be loaded horizontally into the drying chamber and in the horizontal direction It is carried out from the drying chamber. According to the present invention, as described above, a processing substrate device includes a coating mold set, a drying module, a baking module, and the like. The substrate is loaded by the loader in the coating module, the dry mold set and the baking module, and the carrier carries the substrate. In other words, the substrate can be transported in a straight line using a plurality of pulleys without using the substrate to transport the robot. This method can shorten the transfer time of the substrate and reduce the manufacturing cost of the substrate processing apparatus. [Embodiment] Referring to the drawings, embodiments of the invention are more fully disclosed. However, the invention is applicable to a variety of different forms and should not be limited to the disclosed embodiments. The invention may be embodied in many different embodiments and is not limited to the embodiments described below. The embodiments described below are used to fully disclose the present invention so that those skilled in the art can fully understand the present invention. In order to explain the present invention more clearly, the size and related proportions of layers and regions may be clear The exaggeration is exaggerated. 201023266

' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' One component, ten; there is another component or intermediate layer between the two. In contrast, when there is a description of " _ Α 疋 疋 疋 疋 」 」 」 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 , , , , , , , , , , . Similar to - and the parts are marked with similar nicknames. The phrase "and/or" as used herein includes all any combinations. It is clear that although the terms first, second, third, etc. can be used to describe various elements: elements, regions, classes, and parts, these terms should not be limited to this. These techniques # are only used to distinguish one component, eight knives, regions, steps, and parts from another: it, component, region, hierarchy, and part. Therefore, the first element, component, region, layer, and portion after the description may be the first element, the component, the region, the layer, and the portion without infringing the technology of the present invention, the spatial relative term herein, for example The words "lower" or "upper" are used to describe the relationship between a feature and another element or feature. It can be understood that the descriptions of the two spatial relative terms include other orientations, and are not limited by the direction in the schema. For example, when the device in the drawings is turned upside down, the statement "1 is below the other component or feature" becomes "one component is located on the other component or feature". Therefore, the word "below" includes both "upper and lower". The elements can be oriented in other directions (rotating 9 degrees toward the other direction), and the space used here is interpreted relative to the word. The words used herein are merely used to describe the embodiments of the present invention, and are not intended to be limited to 7 201023266

TW5784PA —”, “this” form. The present invention is directed to the steps, operations, steps, operations, and methods herein. The singular forms of "including" and "including" and "comprising", "an" or "an" , components, components or a combination thereof. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning In addition, unless otherwise defined, the terms defined by the ordinary dictionary used herein are consistent with the meaning of the terms used in the related art, and are not intended to be idealized or overly formal.

The embodiments of the present invention are described herein with reference to the accompanying drawings in which FIG. 1 is an illustration of an ideal embodiment (and intermediate structure) of the present invention. Thus, differences from the shapes of the drawings, for example, which are caused by manufacturing techniques and/or errors, are contemplated. The embodiments of the present invention should not be construed as limiting the shape of a particular region, but should include, for example, differences in the shape of the manufacture. The regions depicted in the figures are only schematic representations, the shapes of which are not intended to depict the actual shapes of the regions of the device, and are intended to limit the scope of the invention. Fig. 1 is a schematic view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to Fig. 1, a substrate processing apparatus 10 according to an embodiment of the present invention is used to form a photoresist layer on a substrate 2 composed of chopped or glass when manufacturing a flat display device. / For example, the processing substrate device ίο includes a coating module 10 for forming a photoresist layer on the substrate 2; and a baking module 200 for curing the photoresist layer. The substrate processing apparatus 1 further includes a loader 20 for transporting substrates 2 to 8 201023266

' * TW5784PA coating module 100; the transmission module 300 is disposed between the coating module 100 and the baking module 200 for transporting the substrate 2 between the coating module 1 and the baking mold 00, And the carrier 3 is used to remove the substrate 2 from the baking module. The substrate 2 in the horizontal direction can be transferred from the coating module 1 to the baking module 200. Each of the coating modules and each of the baking modules includes a substrate transfer member for transporting the substrate 2. The substrate 1 is coated in the horizontal direction to transport the substrate 2, and a photoresist component is supplied onto the substrate 2 to form a photoresist layer when the substrate 2 is transferred. Figure 2 is a plan view of the coating module in Figure ith. Figure 3 is a cross-sectional view of the coating module of Figure 1. Referring to Figures 2 and 3, the coating module 1A may include a substrate transfer member 1A2 for transporting the substrate 2 in the horizontal direction, and a nozzle 1?4 for providing a photoresist composition on the substrate 2. The nozzle 1〇4 can be placed above the substrate transporting member 1〇2 and extending in a direction perpendicular to the transport direction. The nozzle may have a slit (not shown in the picture) to provide a photoresist composition on the substrate 2. The slit may extend along the extending direction of the nozzle 104, and the photoresist component is applied to the substrate 2 via the slit when the substrate is transported in the horizontal direction. The substrate transfer member 102 may include a blower 1 to provide gas to the bottom surface of the substrate 2 to float the substrate 2. The driving member 114 moves the floating substrate 2 in the horizontal direction. The blower 106 can include a perforated plate 1 8 having a plurality of holes 108a for providing gas. The perforated plate 1 8 can be disposed below the nozzle 104 and can be connected to the gas supply member 11A. For example, in the third figure, the porous plate 108 can be connected to the gas pipe 112, and the gas pipe U2 is set 9 201023266

TW5784PA buffer space 112a. In other words, the holes 10a8a can be in communication with the buffer space 112a. Gas can be supplied from the buffer space 112a to the bottom surface of the substrate 2 via a plurality of holes 108a. Although not shown in the drawings, the gas supply member 110 may include a gas pump, a gas reservoir, a gas filter, etc., and the gas passage 112 may be connected through the gas line 11a. Still further, the gas supply component 110 can include a gas valve disposed in the gas line 11a to regulate the flow of gas through the porous plate 108. The porous plate 108 may be made of a metal material such as aluminum. These holes 108a have a diameter ranging from about l.lmm to 2.3 mm. The holes 108a are spaced apart by a range of about 10 mm to 150 mm. If the diameter of the hole 108a is larger than 2.3 mm', the temperature of the edge portion of the substrate 2 adjacent to the hole 10a, and the thickness of the photoresist layer 4 formed on the substrate 2 may be uneven. The driving member 114 holds the both edges of the bottom surface of the substrate 2 by the blower 106 so that the substrate 2 can be moved in the horizontal direction. The width of the porous substrate 1〇8 is narrower than the width of the substrate 2. In accordance with an embodiment of the present invention, the drive member 114 can include a plurality of vacuum chucks 116 that hold the bottom edge of the substrate 2 with vacuum pressure. The vacuum chuck 116 is movable in a horizontal direction by a linear motor 118, which is disposed on both sides of the perforated plate. Alternatively, the vacuum chuck 116 can optionally be moved using a power mechanism including a motor, a linear slide, a ball screw, and a spherical block. In Fig. 2, the power component 114 can be mounted to the bracket u〇a. The yoke nozzle 104 is disposed above the blower 106 in the direction in which the vertical substrate 2 is horizontally moved, and is used to support the mouth ι〇4. The φ frame 100b is horizontally movable on the bracket 10a. The arm of the hanger 1〇〇b ίο. . 201023266

The .TW5784PA position extends in the flat direction above the blower 106, and the nozzle 104 can be far away; another water in the horizontal direction of movement, in particular, the nozzle 104 is in the vertical direction: below the hanger arm 100c. 100c. For example, the nozzle 104 can be moved to the hanger arm for movement. The motor and the ball screw are in the vertical direction, although not shown on the picture, clearing the top of the blower 106 to clean the nozzle 1〇4. , early _ no) can be configured in

The hanger 100b can move the nozzle 1 〇4 in the horizontal and vertical directions to clean the nozzle 1〇4. When the substrate transfer member 1() 2 transports the substrate 2 in the horizontal direction, 104 may provide a photoresist component on the substrate 2 to form the photoresist layer 4. Fig. 4 is a cross-sectional view showing another example of the substrate transfer member in Figs. 2 and 3. Referring to Fig. 4, the substrate transfer member 12A may include a blower 122 to float the substrate 2, and the driving member 114 moves the floating substrate 2. The blower 122 may include a dense hole flat plate 124 made of a porous material. The blower 122 may include a side wall 126 disposed on the side of the pinhole plate 124 to prevent gas from leaking out through the side of the pinhole plate 124. The dense hole flat plate 124 may be composed of a ceramic material or a metal material such as stainless steel and may be formed by a sintering method. The aperture plate 124 has a pore size ranging from 1 〇um to 1 〇〇um. The dense hole plate 124 can be connected to the gas supply member 110 via the gas pipe U2. A detailed description of the gas gas pipe 112 and the gas supply member 110 in the driving member 114 will be skipped because it is similar to the description of the second and third circles. Figure 5 is a further example of the substrate transfer member in Figures 2 and 3; 201023266

TW5784PA top view. Figure 6 is a front view of Figure 2 and the second. 3 Further example of the substrate transfer member in the drawing Referring to Figs. 5 and 6, the substrate transfer member 13 is plated with a blower 132 to make the substrate 140. A detailed description of the blower 132 is omitted, and 3 = Figure 2 to Figure 4 have a similar discussion. The mouth horse can include a plurality of rollers 142 in the second driving unit MG, and the material rollers 142 are arranged in parallel to support the partial area of the substrate 2. For example, the roller 142 ❹ can support the edge of the bottom surface of the substrate 2 and can be rotated to transport the substrate 2 in the horizontal direction. The roller 142 is rotatably mounted to the bracket 10a. Drive component 140 can include a motor 144 to rotate the roller. The roller 142 can be coupled to the other roller by a conveyor belt 146. The pulley 148 is smouldably disposed on the side of the roller 142, and a pulley and another pulley are connected using a belt 146 spleen ^ ▼ 46. Idler 149 can be placed between rollers 142 to adjust the tension of the belt. As shown in Fig. 5, although the two rollers can be used to rotate the roller 142, only one motor can be used. In this case, the rotary shaft connecting motor extends through the blower 132, and a pair of rollers can be mounted on the bilateral edges of the rotary shaft. Fig. 7 is a plan view showing another example of the air blower in Figs. 2 and 3. Referring to Fig. 7, the blower 15'' may include a perforated plate 152 having a plurality of holes 152a therein for supplying gas to the bottom surface of the substrate 2. The perforated plate 152 has slits 154 and the idler gears 156 are respectively disposed in the slits 154. The idler 156 can support the substrate 2 to avoid bending. The roller can also be arranged in the slit 154, 12 201023266

• * TW5784PA and use other drive mechanism to rotate the roller to move the substrate 2 in the horizontal direction. As shown in Fig. 4, a dense hole plate composed of a dense hole material can be used as the flat plate 152. In this case, the surface of the slit 154 (four) is added to the outer surface of the dense hole plate to prevent the gas from being replaced by the air blower in the second and third figures. And in the cross-sectional view of the air blower in the third embodiment, referring to Figs. 8 and 9, the air blow hole, the gas: 洞 hole coffee can be connected to the gas supply member 164. For example, the porous plane 162 may be coupled to the gas gas pipe 166, the air-laid defines the buffer space 166a, and the gas gas pipe 166'i〇G may be coupled to the disorder providing member I64 via the gas line 164a. Although not shown in the drawings, the gas supply weir member 164 may include a gas pump, a gas reservoir, a (four) filter, and the like. Still further, the gas providing component 164 can include a gas system disposed in the gas line 164a to regulate the flow of gas through the first aperture 162 & The porous plate 162 may be formed of a metal material such as aluminum. The first hole 162a has a diameter ranging from about 11 mm to 2.3 mm. If the diameter of the first hole 162a is larger than 2.3 mm, the temperature on the substrate 2 adjacent to the first hole 162a may be affected by the gas, and the thickness of the photoresist layer 4 formed on the substrate 2 may be uneven. Further, the porous plate 162 has a plurality of second holes for extracting gas between the substrate 2 and the upper surface of the porous plate 162. Second hole 13 201023266

The TW5784PA 162b moves the substrate 2 smoothly and is connected to the exhaust gas pipe ι68. The suction air pipe 168 is connected to the air suction member 169 via an air suction line 169a. Although not shown in the figure, the gas valve may be disposed in the suction line 169a to adjust the pumping speed. Fig. 10 is a plan view showing still another example of the air blower in Figs. 2 and 3. Fig. 11 is a cross-sectional view showing still another example of the air blower in Figs. 2 and 3. Referring to Figures 10 and 11, the blower 170 may include a dense hole plate 171 composed of a dense hole material. The side wall 172 is disposed on the side of the dense hole flat plate 171 to prevent gas from leaking through the side surface of the dense hole flat plate 171. The dense hole plate 171 may be composed of a ceramic material or a metal material such as stainless steel' and may be formed by a sintering method. The aperture plate 171 has a pore size ranging from 10 um to 100 um. The dense orifice plate 171 can be connected to a gas gas pipe 176 which defines a buffer space 176a. The gas gas pipe 176 is connectable to the gas supply member 174 via the gas line i74a. Further, the 'dense hole plate 171 has a plurality of holes 171a for extracting gas between the substrate 2 and the upper surface of the perforated plate 171. The hole i7ia moves the substrate 2 smoothly and is connected to the suction air tube 178. The suction air tube 178 can be connected to the air suction member 179 via an air suction line 179a. Although not shown in the drawings, the inner wall or the inner tube may be disposed on the inner surface of the hole 171a to prevent gas leakage, and the gas valve may be disposed in the air suction line 179a to adjust the suction air flow. Referring again to Fig. 1, the photoresist layer 4 on the substrate 2 is hardened in the baking process. The transfer mode of the substrate 2 in the baking module 200 is horizontal. The transmission module 300 transmits the substrate 2 having the photoresist layer 4 thereon to enter the baking module 200 〇 , , 201023266

* * TW5784PA Figure 12 is a top view of the baking module in Figure 1; Figure 13 is a cross-sectional view of the baking module in Figure 1. Referring to FIGS. 12 and 13, the baking module 2 can include a blower 202 for supplying gas to the bottom surface of the substrate 2 to float the substrate 2, and the heater 210 heating when the substrate 2 is transported horizontally through the blower 2〇2. Substrate 2. The blower 202 can include a multi-hole plate 204 that includes a plurality of holes 2〇4a to provide a gas. The perforated plate 204 can be coupled to the gas gas pipe 206 and the gas helium gas pipe can be coupled to the gas supply member 208. Gas trachea 206 defines a buffer space 206a. The perforated plate 204 can be made of a metallic material, such as Ming. The hole 2〇4a has a diameter ranging from about 0.1 mm to 2.3 mm. The pitch of the holes 204a is between about 10 mm and 150 mm. The heater 210 can be disposed within the multi-well plate 204. For example, the resistive heating wire shown in Fig. 13 can be embedded in the perforated plate 204. Figure 14 is a schematic view of the gas supply member of Figure 13. Referring to Fig. 14, the temperature of the gas supplied to the bottom surface of the substrate 2 affects the temperature on the substrate 2, and the thickness of the photoresist layer 4 on the substrate 2 may be uneven. Therefore, it is preferable to provide hot air to the bottom surface of the substrate 2. The gas supply component 208 can include a gas pump 212 (or a pneumatic pump) and a gas reservoir 214. Gas reservoir 214 can be coupled to gas manifold 206. The gas supply member 208 can include a filter 216 that filters impurities in the air, a heater 218 that heats the gas, and a gas valve 220 that adjusts the flow of gas heated by the heater 218. The gas gas pipe 206 is connected to the gas storage tanks 214, 15 via a gas line 222.

• I 201023266

The TW5784PA is also provided with a filter 216, a heater 218, and a gas valve 220 disposed in the gas line 222. The gas purified by the filter 216 can be heated to a predetermined temperature via the heater 218, and then the heated gas is sent to the bottom surface of the substrate 2 via the gas pipe 206 and the porous plate 204. Referring to Fig. 12 and Fig. 13, the substrate 2 is passed through the transfer module 300, passes through the porous flat plate 2〇4 in the flat direction, and then the substrate 2 is transferred from the baking module by the loader 3〇. The porous flat plate 2〇4 has a width W2 which is wider than the substrate 2$width W1' and the porous flat plate 204 has a length L2 which is shorter than the length L1 of the substrate 2. In order to make the substrate 2 more stable during the transfer of the baking module 2, the distance D between the transfer module 300 and the carrier 30 is shorter than the length L1 of the substrate 2. Guide article 224 can be disposed over porous plate 2〇4 to guide both edges of substrate 2. For example, the 'guide roller' may be disposed above the perforated plate 204 to guide the substrate 2 to move in the horizontal direction as shown in Fig. 12. Therefore, the substrate 2 is transported through the porous flat plate 204 at a predetermined speed, and the photoresist layer 4 on the substrate 2 can be sufficiently hardened during transport. As shown in Fig. 13, although the hole 204a in the porous plate 204 can be ❹ = the substrate 2 floats, a dense hole plate composed of a dense hole material can also be used, as shown in Fig. 4. Fig. 15 is a plan view showing another example of the baking module in Figs. 12 and 13. 2, referring to Fig. 15, the baking module 200A may include a blower 23 that supplies gas to the bottom surface of the substrate to float the substrate 2; and the heater that heats the substrate 2 when the substrate 2 passes the blower 23G in the horizontal direction (not shown) The substrate transfer members 232 and 234 are respectively disposed on the blower 230 16 201023266

* , The front and back of the TW5784PA are used to transport the substrate 2 in the horizontal direction. For example, the first substrate transfer member 232 can be disposed between the transfer module 3A and the blower 230, and the second transfer member 234 can be disposed between the blower 230 and the loader 30. The distance between the first and second substrate transfer members 232 and 234 is preferably shorter than the length of the substrate 2. Each of the first and second substrate transfer members 232 and 234 may include a rotating shaft 236' rotating shaft 236 extending in another horizontal direction perpendicular to the horizontal direction, and a plurality of rollers 238 mounted on the rotating shaft 236 for transporting the substrate 2, and The moving member 24 is for rotating the rotating shaft 236. A rotary drive mechanism including a motor can be regarded as the drive member 240. As shown in Fig. 15, although the two rollers 24 can be used to rotate the roller 238, a motor can be used. In some cases, the rotating shaft 236 can be coupled to another rotating shaft via a conveyor belt and pulley system. A detailed description of the political fan 230 and the heater is omitted because it is similar to that of Figs. 12 to 14. Fig. 16 is a plan view showing still another example of the baking module in Figs. 12 and 13. Referring to Fig. 16, the baking module 200B may include a plurality of rotating shafts 250 disposed in the horizontal direction and extending in another horizontal direction perpendicular to the horizontal direction. A plurality of rollers 252 are mounted on the rotating shaft to transport the substrate 2, the driving member 254 rotates the rotating shaft 25, and a plurality of heaters 256 are disposed between the rotating shafts 250 to heat the substrate 2. A plurality of pulleys 258 can be mounted to the edges on either side of the rotating shaft 250. The pulley 258 can be coupled to the media member 254 using a conveyor belt 260. The motor can be the drive member 254' and the idler 262 can be further disposed between the pulleys 258.

» I 201023266

TW5784PA to adjust the tension of the conveyor belt 260. At the same time, the infrared heater can be used as the heater 256. The substrate 2 is transported in the horizontal direction via the transport module 3, the roller 252 and the carrier 3, and the photoresist layer 4 on the substrate 2 is hardened when the substrate 2 passes through the heater 256. Referring again to FIG. 1, the transfer module 3 can be disposed between the coating module 1 and the baking module 200. The transmission module 3 can be used to transfer the substrate 2 from the coating module 100 to the baking module 2 (the buffer module 4 (8) can be disposed in the coating module 1 and the baking module 2) For temporary storage of the base A, "17, and 18, the transmission module 300 may include a plurality of 3G2 disposed in the horizontal transmission direction of the substrate 2, and in the direction perpendicular to the water (four) ^ direction - Extending in the horizontal direction, a plurality of rollers 3G4 are mounted on the 旌辕3G2 to transport the substrate 2, and the driving member 3G6 is used to rotate the slave shaft 302. The wheel 3〇8 can be mounted on the edge of the rotating shaft 302. The pulley 308 is connected to the 306 310. The driving member 306 can be used as the driving portion to adjust the reverse t. The outer idler 312 can be further disposed between the pulleys 308 to accurately grasp the tension of the feeding belt 310. Straight direction: i and 4〇0 via the rotating shaft The 302 is movably mounted between the slats: the plate 2 is moved in a straight direction to facilitate the temporary storage of the substrate 2. The traversing turn includes a plurality of branch arms 4〇2, and the support arm 402 is connected to the base plate 2. The vertical drive The component 4〇4 the surface moving component 404 may include a ball screw 18 extending in the vertical direction.

' · TW5784PA H gets the ball screw 连接 $ connects the support arm 402 to the rotary motor 408, and the ball screw 406 404 piece 404 can be included in the vertical shape 410. Further, the vertical drive unit displays). To the linear slide guiding the support arm 402 (the reference device 100 is not again referred to, the additional loader's loader 20 can be disposed adjacent to the coating module 20 and the planter 3 can be configured adjacent to the supply Baking mold, group 200. Each loading is similar to the transfer amount 3GG referred to in Fig. 19. 50 'The photoresist layer is formed on the substrate processing apparatus for manufacturing the flat display. (4) 'In the substrate 2 composed of tantalum or glass 2 The light-based 5-plate device 5A includes a coating module _ used to form a substrate processing device (10) a silk photoresist layer. A coating module _; a two-H Λ human device 2G is used to transport the substrate 2 to and between the drying module 500 Pass 7:= Between the coating module _%, the first transfer module 600B is disposed between the dry mold = and the grilling module 2 〇. For the baking module 2. And the coffee board 2 Further, the substrate processing apparatus 5 can include a first buffer module 7GGA disposed between the coating module and the drying module 500; the second buffer module 7〇〇B g is placed Between the drying module 5〇〇 and the baking module 200. The substrate 2 can be transferred from the coating module 1 through the drying module 5 to the baking in the horizontal direction. Group 200. Each of the coating module 1B, the baking module 2A, and the drying module 500 may include a substrate transfer member for transporting the substrate 2. Regarding the first transfer module 600A, the second transfer module 6〇〇 B, the first buffer module 700A and the second buffer module 7〇 (^ will be skipped because these 201023266 TW5784PA, the components are similar to the transmission module 300 and the buffer module 400, and in the first to the 18th The drawings have been described. In addition, the loader 20, the coating module 100, the baking module 200, and the loader 30 are also omitted, since these components are similarly described in Figures 1 through 18. The drying module 500 is disposed between the first and second transfer modules 6a and 600B and can be used to remove the solvent of the photoresist layer on the substrate 2. For example, the drying module 500 utilizes vacuum pressure to evaporate the photoresist. The solvent on layer 4 is used to dry the photoresist layer. Fig. 20 is a top view of the drying module of Fig. 19, Fig. 21 is a front view of the drying module of Fig. 19, and Fig. 22 is a drying module of Fig. 19. Cross-sectional view. Referring to Figures 20 to 22, the drying module 5A may include a drying chamber 502 for accommodating the substrate 2, at a level To the rotating shaft 5〇8 disposed in the drying chamber and extending in another horizontal direction perpendicular to the horizontal direction; a plurality of rollers 510 are mounted on the rotating shaft 508 to transport and support the substrate 2, and the driving member 512 is used to rotate the rotating shaft 508. And a vacuum system 512 is coupled to the drying chamber 502 to dry the photoresist layer 4 of the substrate 2 on the roller 510. The spring chamber 502 can include a lower chamber 5() 4 having an upper opening portion and a cover The body 506 is used to open and close the upper opening portion of the lower chamber, so that the substrate 2 is loaded into the drying chamber 5〇2 in the horizontal direction and from the drying chamber 502 in the horizontal direction. The cover 506 can be coupled to the vertical drive member 516. The gas red or hydraulic cylinder can be used as the vertical drive member 516. However, the scope of the present invention is not limited to the type of vertical power component 516. The cover 506 can be moved up to the substrate 2 into the drying chamber 5〇2, and can be moved down 20 201023266

p ‘ ivvy/»4PA to dry the photoresist layer 4 on the substrate 2 . The bottom plate of the lower chamber 504 has a plurality of lower vacuum holes 504a connectable to the vacuum system 514 via the lower air tube 518. Although not shown in the drawings, the vacuum system 514 can include a vacuum pump and a gas valve to regulate the pressure of the drying chamber 502 and the like. If the vacuum system 514 is only connected to the bottom of the lower chamber 504, the pressure distribution in the drying chamber 502 may be uneven. In order to solve the above problem, the cover 5 〇 6 e 鲁 may include a plurality of upper vacuum holes 5 〇 6a connected to the vacuum system 514 via the upper air pipe 520. The cover 506 can be hat shaped. For example, the cover 5〇6 may include an upper plate and a side wall. The perforated plate 522 can be disposed in the cover 5 〇 6 in the horizontal direction to make the pressure distribution in the drying chamber 502 more uniform, as shown in Fig. 22. The edge of the rotating shaft 508 can extend to the outside of the side wall of the lower cavity 5〇4. The side of the spin = shaft can be coupled to the drive member 512. A plurality of pulleys 524 can be used to adjust the tension of the belt 526 via a conveyor belt 526 == idler 528. At the same time, the motor door two, piece 53. Can be placed in the lower chamber 5. 4 ==: Shaft 508 leaks. A second sealing member (not shown) can be mounted on the rotating shaft 5〇8 to prevent vacuum from leaking from the rotating shaft/dressing. And the second wall of the lower cavity 504 is shown in Fig. 23 to Fig. 22, referring to Fig. 23, the cross-sectional view of each roller 51. The contact with the substrate 2 is reduced. If the roller and the :=] section are added, the bottom edge of the substrate 2 and the roller will be replaced =:: = 201023266

The TW5784PA is changed and causes the photoresist layer 4 on the substrate 2 to be unevenly dried. Referring again to Fig. 19, the photoresist layer 4 on the substrate 2 may not necessarily be sufficiently dry after passing through the dry mold. However, since the substrate 2 enters the baking module 200 later, it can be shortened between the bait and the dry. When the shirt and the baking module are required to be baked, according to the embodiment of the present invention as described above, the processing substrate device may include a coating module, a dry frequency group, and a material mold. The substrate is transferred from the loader to the carrier, passes through the coating module on the way, and the substrate is linearly transferred to reduce the processing time: the board is used to process the A board without using the substrate transfer robot to transfer the substrate. The manufacturing cost of the substrate processing skirt is reduced. And == = : = does not deviate from the == the scope of the benefit definition = the protection of the standard sentence, the application of the application is attached [simplified description of the drawings] Figure _ shows the substrate processing apparatus according to the present invention - the embodiment Intentional view; Figure 2 is a plan view of the coating module in Fig. 1 , and a cross-sectional view of the coating module in the above (9); cross section @4^ shows the second and third figures Another top view of the substrate transfer member in FIG. 5 shows the substrate transfer member in FIG. 2 and FIG. 3 again.

_ TW5784PA Figure 6 shows a further front view of the substrate transfer member in Figures 2 and 3, and Figure 7 shows another top view of the blower in Figures 2 and 3; Figure 8 FIG. 9 is a further cross-sectional view showing the blower in FIGS. 2 and 3; FIG. 9 is a cross-sectional view showing the blower in FIGS. 2 and 3, and FIG. 10 is a view showing FIG. 2 and FIG. A further top view of the blower in the figure; FIG. 11 is a cross-sectional view of the blower of FIG. 2 and FIG. 3; FIG. 12 is a top view of the baking module of FIG. 13 is a cross-sectional view showing one of the baking modules in FIG. 1; FIG. 14 is a schematic view showing one of the gas supply members in FIG. 13; and FIG. 15 is a view showing the first and the third in FIG. Another top view of the baking module; FIG. 16 shows a further top view of the baking module of FIGS. 12 and 13; and FIG. 17 shows the transmission module and the buffer module of FIG. FIG. 18 is a side view showing a transmission module and a buffer module in FIG. 1; FIG. 19 is a schematic view showing a substrate processing apparatus according to another embodiment of the present invention;23 201023266

TW5784PA and

20th 21st and 22nd, the drying module of FIG. 19 is a diagram showing the dry mold level in FIG. 19, and the drying module of FIG. 19 is shown in FIG. To the top view in Fig. 22; front view; horizontal wear surface; roller-cross-surface substrate photoresist layer substrate processing device loader carrier coating module bracket hanger hanger arm substrate transfer wheel Component nozzle

[Main component symbol description] 2 4 10, 50 20 30 100 100a 100b 100c 102, 120, 130 104 106, 122, 132, 150, 160, blower 170, 202, 230 108, 152, 162, 204, 522 porous plate 108a, 152a, 171a, 204a Holes 110, 164, 174, 208 Gas supply parts 110a, 164a, 174a, 222 Gas lines 112, 166, 176, 206 Gas air pipe 24 201023266

'TW5784PA 112a, 166a, 176a, 206a buffer space 114, 140, 240, 254, 306, drive unit 512 116 vacuum chuck 118 linear motor 124, 171 dense plate 126, 172 side wall 142, 238, 252, 304 510 wheel

144, 240, 408 motor 146, 260, 310, 526, 526 conveyor belt 148, 258, 308, 524 pulley 149, 156, 262, 312, 528, idler 528 154 slit 162a first hole 162b second hole 168, 178 Exhaust air pipe 169, 179 Exhaust parts 169a, 179a Exhaust line 200, 200A, 200B Baking module 210, 218, 256 Heater 212 Gas pump 214 Gas storage tank 216 Filter 220 Air valve 25

201023266 TW5784PA 224 Guide object 232 First substrate transfer component 234 Second substrate transfer component 236, 250, 302, 508 Rotary axis 300 Transmission module 400 Buffer module 402 Support arm 404, 516 Vertical drive component 406 Ball screw 410 Spherical block 500 Drying Module 502 Drying Chamber 504 Lower Cavity 504a Lower Vacuum Hole 506a Upper Vacuum Hole 506 Cover 514 Vacuum System 518 Lower Air Pipe 520 Upper Air Pipe 530 First Sealing Object 600A First Transmission Module 600B Second Transmission Module 700A a buffer module 700B second buffer module

26

Claims (1)

201023266 . * TW5784PA VII. Patent Application Range: i. A substrate processing apparatus includes: a coating module for transmitting the substrate in a horizontal direction and providing a photoresist component on the substrate for transmission to form on the substrate a photoresist layer; and a glow module adjacent to the coating module, the baking module heating the substrate when the substrate is transported in the horizontal direction to harden the photoresist layer. The device of claim 1 further comprising a transmission module 'the transmission module disposed between the coating frequency and the bake group' for the substrate from the coating die The group is transferred to the baking module. Module Lr, the device described in claim 2, wherein the plurality of rotating shafts are disposed in the horizontal direction perpendicular to the horizontal direction in the horizontal direction; the rotating shaft is in the plurality of rollers The skirt is on the rotating shaft to transport the substrate; and a driving component is used to rotate the rotating shafts. 4. The buffer module according to claim 3, wherein the buffer module is movably disposed between the one and the plurality of rotating shafts, and the buffer module traverses the vertical direction=5 Substrate. The module of the fourth aspect of the invention includes: a device, wherein the buffering plurality of movable support arms are disposed between the rotating shafts to support the substrate; And through and through 27 201023266 TW5784PA mobile vertical power material, the material is connected to make the arm vertical module L as described in the "patent specification", wherein the coating: ΐ $: Γ ' at this level Directional transfer of the substrate; and the horizontal direction of the other == transmission wheel member, and extending perpendicular to the first resistance component d, and providing the board according to the sixth paragraph of the transmission patent And a blower, providing a gas on the bottom surface of the substrate to float the substrate; and driving the floating substrate in the horizontal direction by driving the device. The machine comprises a body. The device according to item 7 of the Shenjing patent scope, Wherein the blasting porous plate, the porous plate comprises a plurality of holes to provide gas. The machine comprises a device according to item 7 of the Japanese Patent Application No. 7, wherein a dense-pore plate composed of the blast and the pore material; Multiple side walls, set The apparatus of claim 7, wherein the driving component comprises a plurality of vacuum chucks for holding the bottom edge portion of the substrate by vacuum pressure. The device of claim 7, wherein the driving component comprises a rear plurality of rollers disposed parallel to the horizontal direction to support the bottom edge of the base 28 201023266 1 1 TW5784PA. 12. The device of claim 1, wherein the baking module comprises: a blower that supplies gas to a bottom surface of the substrate to float the substrate; and a heater that heats when the substrate is transported through the blower in the horizontal direction 13. The apparatus of claim 12, wherein the further step comprises a plurality of substrate transfer members disposed at the front end and the rear end of the blower to facilitate transporting the substrate in the horizontal direction. The device of claim 13, wherein each of the substrate transporting members comprises: a rotating shaft perpendicular to the horizontal direction The other horizontal direction extends; a plurality of rollers mounted on the rotating shaft to transmit the substrate; and a driving component for rotating the rotating shaft. 15. The device according to claim 12, wherein The blower includes a multi-well plate having a plurality of holes or a dense-pore plate formed of a dense-pored material to provide a gas. The device of claim 15 wherein the heater is disposed in the blower 17. The device of claim 1, wherein the baking module comprises: a plurality of rotating shafts disposed in the horizontal direction, and the rotating shafts are at another level perpendicular to the horizontal direction Direction extension; 29 201023266 TW5784PA a plurality of rollers mounted on the rotating shafts for transporting the substrate; a driving component for rotating the rotating shafts; and a plurality of heaters disposed between the rotating shafts The substrate is heated. 18. The device of claim 1, further comprising a drying module disposed between the coating module and the baking module to dry the substrate formed on the substrate Photoresist layer. 19. The device of claim 18, wherein the drying module comprises: a drying chamber for accommodating the substrate; a plurality of rotating shafts disposed in the horizontal direction, the rotating axes being perpendicular to The horizontal direction extends in another horizontal direction; a plurality of rollers mounted on the rotating shafts for transmitting and supporting the substrate; a driving component for rotating the rotating shaft; and a vacuum system connected to the drying a chamber to dry the photoresist layer on the substrate on the rollers. 20. The device of claim 19, wherein the drying chamber comprises: a lower chamber having an upper opening portion; and a cover for opening and closing the upper opening portion of the lower chamber, The substrate is introduced into the drying chamber in the horizontal direction, and the substrate is transferred out of the drying chamber in the horizontal direction.