CN101755216A - Probe card - Google Patents

Probe card Download PDF

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Publication number
CN101755216A
CN101755216A CN200880025240A CN200880025240A CN101755216A CN 101755216 A CN101755216 A CN 101755216A CN 200880025240 A CN200880025240 A CN 200880025240A CN 200880025240 A CN200880025240 A CN 200880025240A CN 101755216 A CN101755216 A CN 101755216A
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CN
China
Prior art keywords
mentioned
probe
insert
circuit board
space transformer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200880025240A
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Chinese (zh)
Other versions
CN101755216B (en
Inventor
山田佳男
中山浩志
井沼毅
赤尾崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
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NHK Spring Co Ltd
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Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Publication of CN101755216A publication Critical patent/CN101755216A/en
Application granted granted Critical
Publication of CN101755216B publication Critical patent/CN101755216B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probe card having improved accuracy of parallelism and accuracy of planarity of a probe head to a prescribed reference surface. The probe head stores a probe for electrically connecting circuit structures. The probe card is provided with a probe head (15) for holding a plurality of probes; a flat-board-shaped wiring board (11) having a wiring pattern which corresponds to the circuit structure; an interposer (13) laminated on the wiring board (11) and relays the wiring of the wiring board (11); a space transformer (14), which exists between the interposer (13) and the probe head (15), converts an interval between the wirings relayed by the interposer (13), and exposes the converted wiring from a surface facing the probe head (15); and a plurality of post members (18), each of which has substantially a columnar shape with a height more than the sum of the thickness of the wiring board (11) and that of the interposer (13), is embedded to penetrate the wiring board (11) and the interposer (13) in the board thickness direction, and has one bottom surface abut to the space transformer (14).

Description

Probe
Technical field
The present invention relates to a kind of probe, be electrically connected checking as the semiconductor wafer of checking object and generation between the circuit structure with signal.
Background technology
In the semi-conductive inspection step, under the semiconductor wafer state before cutting by making probe (conductive contact) contact can carry out electrical specification inspections such as checking, to detect faulty materials (inspection of wafer level test wafer-level) with electric conductivity.When carrying out this wafer-level inspection,, adopt the probe of accommodating many probes for semiconductor wafer being transmitted the inspection signal.In wafer-level is checked, one side scans the tube core on the semiconductor wafer with probe, one side contacts each probe respectively with tube core, but on semiconductor wafer, form and have hundreds to tens thousand of tube cores, therefore desire checks that a slice semiconductor wafer is very time-consuming, the tube core number can increase, and causes the raising of cost.
In order to solve the problem that above-mentioned wafer-level is checked, a kind of hundreds of methods of checking to the blanket full-wafer grade that is contacted with the tube core of about at least 1/4 to 1/2 on tube cores all on the semiconductor wafer or the semiconductor wafer of tens thousand of probes (for example with reference to patent documentation 1) that make that adopt are arranged recently.Known in the method have a following technology: correctly be contacted with electrode pad on the semiconductor wafer in order to make probe, by keeping the depth of parallelism and the flatness of probe with respect to semiconductor wafer surface with good precision precision, with the technology of the front position degree of accuracy that keeps probe, or the technology (for example with reference to patent documentation 2 or 3) of calibrating semiconductor wafer with pinpoint accuracy.
Figure 11 is that the part that is applicable to the probe of above-mentioned full-wafer grade inspection constitutes sectional view.Probe 9 shown in Figure 11 is to possess: probe 91, in order to accommodate corresponding to set many probes 10 of the configuration pattern of the electrode pad on the semiconductor wafer; Space transformer 92 is in order to the interval of the fine wiring pattern of conversion in probe 91; Insert (interposer) 93 is in order to the wiring w that sent of switching space transformer 92; Circuit board 94, the wiring that insert 93 is transferred is connected to testing fixture; Public connector 95 is located at circuit board 94 and is connected in the female connectors of testing fixture side; And reinforcement 96, in order to strengthen circuit board 94.
Wherein, with regard to known insert 93, have: the base material of the film like that is become by the insulativity material; And be laid in the two-sided of this base material, and be a plurality of splicing ears of the leaf spring type of semi-girder shape with predetermined pattern.At this moment, the set splicing ear in a side of insert 93 surface contacts with the electrode pad of space transformer 92, and the surperficial set splicing ear of the opposing party contacts with the electrode pad of circuit board 94, to seek both electrical connections.
Patent documentation 1: Japanese Unexamined Patent Application Publication 2001-524258 communique
Patent documentation 2: No. 3386077 communique of Jap.P.
Patent documentation 3: TOHKEMY 2005-164600 communique
Yet, in the time will being applicable to that the full-wafer grade is checked as the known probe of probe 9, the diameter of circuit board is greatly about to 8 to 12 inches (about 200 to 300mm), therefore distortion such as warpage or fluctuating take place in circuit board easily, reduce the reason that probe reduces with respect to the degree of accuracy of the flatness of the degree of accuracy of the depth of parallelism of predetermined reference field and probe and become.
Again, known probe, when warpage takes place in the elastic force that is subjected to insert because of space transformer, warpage also can take place along with space transformer in probe, therefore as the circuit board distortion, have and make probe with respect to the degree of accuracy of the depth of parallelism of predetermined reference field and the situation of the degree of accuracy reduction of the flatness of probe
Summary of the invention
The present invention proposes in view of the above problems, its purpose is to provide a kind of probe, be can promote in order to the probe that is housed in the probe of input and output electric signal between different circuit structures with respect to the degree of accuracy of the depth of parallelism of predetermined reference field and the degree of accuracy of flatness.
Reach purpose in order to solve above-mentioned problem, the present invention is a kind of probe, by adopting each to constitute and along its length based on elastic force and many flexible probes by conductive material, establish semiconductor wafer with in order to generate to the person of electrical connection between the circuit structure of the signal of this semiconductor wafer output, this probe is to possess: probe keeps above-mentioned many probes; Circuit board has the wiring pattern that corresponding foregoing circuit is constructed; Flat insert is laminated in above-mentioned circuit board, in order to the wiring of the above-mentioned circuit board of transferring; Flat space transformer is located between above-mentioned insert and the above-mentioned probe, in order to the wiring of the above-mentioned insert of conversion switching at interval, and make wiring after this conversion be exposed to relative with above-mentioned probe to the surface; And a plurality of post members, form thickness of slab and the also big roughly column of the thickness of slab and the above-mentioned insert of the above-mentioned circuit board of aspect ratio, and run through and be embedded in above-mentioned circuit board and the above-mentioned insert to the thickness of slab direction of above-mentioned circuit board and above-mentioned insert, a side's of above-mentioned a plurality of base for post plates bottom surface is connected to above-mentioned space transformer.
Again, probe of the present invention is in foregoing invention, and above-mentioned insert and above-mentioned space transformer are fixed.
Again, probe of the present invention is in foregoing invention, and above-mentioned insert possesses: a plurality of splicing ears are made of conductive material respectively and stretch based on elastic force along its length; And housing member, constitute by the tabular insulating material, and be formed with a plurality of through hole portion of accommodating above-mentioned a plurality of splicing ears respectively, and the both ends of the length direction of each splicing ear are to expose from above-mentioned housing member.
Moreover probe of the present invention is in foregoing invention, also possess be installed on above-mentioned circuit board in order to strengthening the reinforcement of above-mentioned circuit board, and above-mentioned a plurality of post member is fixed in above-mentioned reinforcement.
(effect of invention)
According to probe of the present invention, owing to possess a plurality of post members, therefore can promote in order to be housed in the probe of the probe that carries out electric signal output input between different circuit structures, with respect to the degree of accuracy of the depth of parallelism of being scheduled to reference field and the degree of accuracy of flatness, this post member is thickness of slab and the also big roughly column that formation has the thickness of slab and the insert of its aspect ratio circuit board, and run through and be embedded in circuit board and the insert to the thickness of slab direction of circuit board and insert, a side's of above-mentioned a plurality of post members bottom surface is connected to space transformer.
Description of drawings
Fig. 1 is the exploded perspective view of formation of the probe of embodiment of the present invention 1.
Fig. 2 is the planimetric map of formation of the probe of embodiment of the present invention 1.
Fig. 3 is the sectional view of the A-A line part of Fig. 2.
The synoptic diagram that Fig. 4 is to use the probe of embodiment of the present invention 1 to check.
Fig. 5 is the in-built part sectioned view of the insert that probe possessed of embodiment of the present invention 1.
Fig. 6 is the part sectioned view in the formation of insert periphery of the probe of embodiment of the present invention 1.
Fig. 7 is the part sectioned view of wanting portion to constitute of probe and probe.
Fig. 8 is the part sectioned view of formation of probe of the variation of embodiment of the present invention 1.
Fig. 9 is the part sectioned view of formation of the probe of embodiment of the present invention 2.
Figure 10 is the part sectioned view of formation of the probe of embodiment of the present invention 3.
Figure 11 is the part sectioned view of the formation of known probe.
(explanation of symbol)
1,6,7,8,9 probe
2,10 probes
3 detectors
4 sockets
5 semiconductor wafers
11,61,94 circuit boards
12,62,82,96 reinforcements
13,63,93 inserts
14,92 space transformers
15,91 probes
The 15p probe is accommodated the zone
16 retaining members
17 leaf springs
18,83 post members
18a, 83a large-diameter portion
18b, 83b minor diameter part
71 bonding agents
20,95 public connectors
21,22 plungers
21a, 22a, 134a, 135a leading section
21b, 134c, 135c hub portion
The 21c axial region
22b, 134b, 135b flange part
22c, 134d, 135d base end part
23,136 spring members
23a, 136a dredge coiling portion
The close coiling of 23b, 136b portion
31 probe keep tool
32 pushing anchor clamps
40 female connectors
50 wafer chucks
51,112,141,142 electrode pad
84 bolts
111,131,137,138,151,611,821 through hole portions
121 peripheral parts
122 central parts
123 linking parts
124,624 recesses
132 housing members
132a the 1st member
132b the 2nd member
133 splicing ears
134,135 plungers
137a, 138a, 151a, 821a path hole
137b, 138b, hole, the big footpath of 151b, 821b
171 pallet portions (claw)
The w wiring
Embodiment
Following with reference to description of drawings in order to implement optimal morphology of the present invention (being called " embodiment " later on).In addition, accompanying drawing is schematic person, and must be careful the thickness of each several part has the situation different with actual person with the relation of width, the thickness ratio of various piece etc., and certainly accompanying drawing also has the situation that comprises the different part of size relationship or ratio to each other.
Embodiment 1
Fig. 1 is the exploded perspective view of formation of the probe of embodiment of the present invention 1.Fig. 2 is the planimetric map of the probe of present embodiment 1.Fig. 3 is the sectional view of the A-A line part of Fig. 2.Fig. 4 is for comprising the synoptic diagram of a part of wiring at the B-B of Fig. 2 line section, also the synoptic diagram of checking for the electrical specification of the probe that adopted present embodiment 1.In addition, consistent in order to make in Fig. 4 up and down with actual inspection, make the opposite with Fig. 3 up and down of probe 1.At these Fig. 1 to probe 1 shown in Figure 4, be to as the semiconductor wafer 5 of checking object with possess the device that is electrically connected between the testing fixture of the inspection of generating with the circuit structure of signal.
Probe 1 possesses: circuit board 11, and in the form of annular discs and in order to carry out and being electrically connected of testing fixture; Reinforcement 12 is installed on the one side of circuit board 11, in order to strengthen circuit board 11; Insert 13 is in order to the wiring of switching from circuit board 11; Space transformer 14 is in order to the interval of conversion by the wiring of insert 13 switchings; Probe 15 forms diameter than little discoid of circuit board 11 and be laminated in space transformer 14, and keeps many probes 2 with corresponding the accommodating of wiring pattern of the semiconductor wafer 5 of checking object; Retaining member 16 is fixed in circuit board 11, blanket insert 13 and the space transformer 14 of keeping under stacked state; Leaf spring 17 is fixed in the end that retaining member 16 fixes probe 15; And a plurality of post members 18, run through and be embedded in circuit board 11 and the insert 13 to the thickness of slab direction of circuit board 11 and insert 13.
Circuit board 11 is to be formed by bakelite (Bakelite) or epoxy resin insulativity materials such as (Epoxy Resin), then forms by reach through hole (via-hole) etc. in order to the wiring layer that is electrically connected many probes 2 and testing fixture three-dimensionally.Circuit board 11 has a plurality of through hole portion 111 of running through the thickness of slab direction.Moreover, in Fig. 3, represent, be flat circuit board 11 distortion originally, and the longitudinal profile of this circuit board 11 is contoured state.
As shown in Figure 4, in order to be connected with testing fixture (not icon), an end that is formed at the wiring w of circuit board 11 is connected with a plurality of public connectors 20, and this public connector 20 is provided in the surface of the side that reinforcement 12 is installed of circuit board 11.With respect to this, the other end of wiring w is electrically connected on the probe 2 of probe 15 maintenance of accommodating via space transformer 14.
Each public connector 20 sets radially with respect to the center of circuit board 11, with the female connectors 40 of position relative on the connector holder 4 that is arranged on testing fixture respectively in pairs, establish being electrically connected of probe 2 and testing fixture by contacting with each other of terminal.With regard to the connector 40 that public connector 20 and female connectors 40 constitute, when the plug public connector, almost need not external force, applicable zero insertion force (ZIF, zero-insertion force) the type connector that after connector interosculates, applies crimp force by external force.If be suitable for this ZIF type connector, even then the quantity of probe 2 becomes many, also bear the stress that generates because of connecting hardly, therefore except probe 1 and testing fixture can obtain to be electrically connected reliably, also can improve the permanance of probe 1.
Moreover, lay female connectors at circuit board 11, on the other hand, lay public connector at connector holder 4 and also can.Also can replace connector and make following formation: install pogo pins terminals such as (pogo-pin resilient special probes) at testing fixture, probe 1 is connected testing fixture via this terminal with spring action again.
Reinforcement 12 has as shown in Figure 1: circular peripheral part 121, and this circle has and circuit board 11 roughly the same diameters; Central part 122 has and the identical center of peripheral part 121 formed circles, and forms big slightly discoid in the surface of surface area ratio insert 13; And a plurality of linking parts 123, extend to peripheral part 121 from the peripheral direction of central part 112, and link peripheral part 121 and central part 122.Again, the central part 122 at reinforcement 12 is formed with a plurality of recesses 124, the end of these recess 124 mounting post members 18 (minor diameter part 18b described later).Reinforcement 12 is to be realized by the aluminium, stainless steel, invar, Kovar alloy (Kovar) material (registered trademark), the contour rigid material of duralumin (duralumin) that carried out the aluminium finishing.
Insert 13 is to have positive 8 angled surface and be lamellar.Establish a plurality of through hole portion 131 at insert 13, it runs through to the thickness of slab direction, and the diameter identical with the through hole portion 111 of circuit board 11 arranged.Each through hole portion 131 is under the state that is laminated in circuit board 11, and any one of a plurality of through holes 111 that have with circuit board 11 is connected.
Fig. 5 is the detailed in-built amplification part sectioned view of insert 13.As shown in Figure 5, insert 13 is accommodated at housing member 132 and is maintained a plurality of splicing ears 133 and constitute.Splicing ear 133 possesses: plunger 134 contacts with circuit board 11; Plunger 135 contacts with space transformer 14; And coiled type spring member 136, be located between the plunger 134,135 and plunger 134,135 is linked elastically.Plunger 134,135 and spring member 136 connected to each other are to have same axis.
Plunger 134 possesses: leading section 134a has sharp Sharp end; Flange (frange) 134b of portion has the diameter bigger than the diameter of leading section 134a; Hub (boss) 134c of portion, outstanding via flange part 134b towards the direction opposite with leading section 134a, and it is littler but than big slightly cylindric of the internal diameter of spring member 136 than the diameter of flange part 134b to form diameter, and the end of spring member 23 is pressed into; And base end part 134d, it is littler and than little cylindric of the internal diameter of spring member 136 than the diameter of the 134c of hub portion to form diameter, and extends to opposition side with flange part 134d from the 134c of hub portion.Plunger 134 forms axisymmetric shape with respect to the central shaft of length direction.
Plunger 135 possesses: leading section 135a forms outstanding crown of a plurality of pallets; Flange part 135b, its diameter is bigger than the diameter of leading section 135a; The 135c of hub portion, outstanding via flange part 135b towards the direction opposite with leading section 135a, and it is littler and than big slightly cylindric of the internal diameter of spring member 136 than the diameter of flange part 135b to form diameter, and the end of spring member 136 is pressed into; And base end part 135d, it is littler and than little cylindric of the internal diameter of spring member 136 than the diameter of the 135c of hub portion to form diameter, and extends towards the opposition side with flange part 135b from the 135c of hub portion.Plunger 135 forms axisymmetric shape with respect to the central shaft of length direction.The diameter of flange part 135b is identical with the diameter of flange part 134b, and the diameter of base end part 135d is identical with the diameter of base end part 134d.
Spring member 136, be installed on plunger 134 a side for dredging the 136a of coiling portion, on the other hand, a side that is installed on plunger 135 is the close coiling 136b of portion.The end of dredging the 136a of coiling portion is connected to plunger portion 134b, and the end of the close coiling 136b of portion is connected to flange part 135b.
Housing member 132 overlapping the 1st member 132a of collecting company's connecting terminal 133 and the 2nd member 132b and constitute.Be formed with the through hole portion 137 of accommodating a plurality of splicing ears 133 respectively at the 1st member 132a.Through hole portion 137 has its diameter path hole 137a and diameter than the diameter of the flange part 134b slightly big big footpath hole 137b thereof bigger slightly than the diameter of leading section 134a, and these path holes 137a forms the shoulder hole shape with same axis with big footpath hole 137b.On the other hand, be formed with the through hole portion 138 of accommodating a plurality of splicing ears 133 respectively at the 2nd member 132b.Through hole portion 138 and through hole portion 137 interconnect, and through hole portion 138 has its diameter path hole 138a and diameter than the diameter of the flange part 135b slightly big big footpath hole 138b thereof bigger slightly than the diameter of leading section 135a, and these path holes 138a forms the shoulder hole shape with same axis with big footpath hole 138b.Each of through hole 137,138 forms the part of through hole 131.
Be among Fig. 5 that plunger 134 is connected to the stage part on the border of the big footpath hole 137b of the through hole portion 137 that forms the 1st member 132a and path hole 137a by flange part 134b, and prevents that it from coming off from housing member 132.Similarly, plunger 135 is connected to the path hole 138a of the through hole portion 138 that forms the 2nd member 132b and the stage part on the border of big footpath hole 138b by flange part 135b, and prevents that it from coming off from housing member 132.
Fig. 6 is the pie graph of insert 13 peripheries of probe 1.Insert 13 shown in Figure 6 is located between circuit board 11 and the space transformer 14, the front end of plunger 134 contacts with the electrode pad 112 of circuit board 11, on the other hand, the front end of plunger 135 contacts with the electrode pad 141 of space transformer 14, being electrically connected of transfer by this circuit board 11 and space transformer 14.
In Fig. 6, spring member 136 is crooked and the part of the close coiling 136b of portion is contacted with the base end part 134d of plunger 134.Realize passing through successively the electrically conducting of the shortest path of the close coiling 136b of portion of plunger 134, spring member 136 and plunger 135 by this, and the inductance that can suppress splicing ear 133 increases.
Have the insert 13 that as above constitutes,, therefore can make insert 13 follow the distortion of circuit board 11 or space transformer 14 because of each splicing ear 133 can stretch independently.As a result, broken string can be prevented, and hot exapnsion coefficient poor of the hot exapnsion coefficient of semiconductor wafer 5 and circuit board 11 can be absorbed because of the wiring of the part that distortion caused of circuit board 11 and/or space transformer 14.
Moreover, though though the shape of plunger 134,135 of splicing ear 133 that is applicable to insert 13 for mutually different, also can connect identical shaped each other plunger by spring member 136.Again, plunger 134 also can be laid up and down on the contrary with plunger 136.
Space transformer 14 is to be mother metal with insulativity materials such as potteries, and as circuit board 11, its internal wiring layer is to form by reach through hole etc. three-dimensionally.Space transformer 14 has the surface with roughly the same positive 8 dihedrals of insert 13, and is lamellar.
Fig. 7 is the amplification part sectioned view of the detailed construction of the main cage structure of probe 15 and probe 2.Probe 2 possesses: plunger 21, and it contacts with space transformer 14; Plunger 22, outstanding towards the direction opposite with plunger 21, and contact with the electrode pad 51 of semiconductor wafer 5; And the spring member 23 of coiled type, be installed between the plunger 21,22, link plunger 21,22 elastically.The plunger 21,22 and the spring 23 that interlink are to have same axis.
Plunger 21 has: leading section 21a has sharp Sharp end; The 21b of hub portion, base end side and its diameter of being located at leading section 21a are littler than the diameter of leading section 21a; Axial region 21c, extend on the surface of the opposition side that contacts with leading section 21a in the surface of the 21b of loose boss portion.On the other hand, plunger 22 has: leading section 22a has sharp Sharp end; Flange part 22b, base end side and its diameter of being located at leading section 22a are bigger than the diameter of leading section 22a; The base end part 22c of hub shape, outstanding from the surface of flange part 22b towards the direction opposite with leading section 22a, and have the diameter littler than the diameter of flange part 22b.
Spring member 23, a side that is installed on plunger 21 is for dredging the 23a of coiling portion, and a side that is installed on plunger 22 is the close coiling 23b of portion.The end of dredging the 23a of coiling portion is pressed into the 21b in hub portion, and the end of the close coiling 23b of portion is to be pressed in base end part 22c.
Probe 2 with above formation, under electrode pad 142 state of contact (state shown in Figure 7) that make plunger 21 and space transformer 14, at least a portion of the close coiling 23b of portion contacts with axial region 21c.
Probe 15 is formed by insulating material such as potteries.Accommodate regional 15p at probe shown in Figure 2 and be formed with the through hole portion 151 of accommodating probe 2, its arrangement with the electrode pad 51 of semiconductor wafer 5 is corresponding and be formed on thickness of slab direction (above-below direction of Fig. 7).Through hole portion 151 has: path hole 151a, from the end face of semiconductor wafer 5 sides, spread all at least than the little length of length of the length direction of leading section 22a and form; And big footpath hole 151b, have identical central shaft, and its diameter is bigger than the diameter of path hole 151a with this path hole 151a.The internal diameter of path hole 151a is bigger and slightly littler than the external diameter of flange part 22b slightly than the external diameter of leading section 22a.Therefore through hole 151 prevents coming off of plunger 22.
Moreover also available bolt etc. is fixed in space transformer 14 with probe 15.So can suppress warpage because of the probe that load caused 15 of probe 2.
Retaining member 16 is by constituting with reinforcement 12 identical materials, and has the hollow bulb that insert 13 and space transformer 14 is laminated into retainable positive anistree column.This retaining member 16 pushes insert 13 and 14 pairs of circuit boards of space transformer 11 and is kept, and applies with space transformer 14 via 13 pairs of circuit boards 11 of insert by this and is electrically connected required pressure.
Leaf spring 17 is to be formed by flexible materials of tool such as phosphor bronze, stainless steel (SUS), beryllium coppers, and is the thin wall circular shape.In the interior week of leaf spring 17, be that pallet portion 171 spreads all over similarly to be provided with in full week with the pushing of probe 15 with member in order to keep insert 13, space transformer 14.Pallet portion 171 spreads all over and full week near the direction towards the circuit board 11 acies portion on probe 15 surfaces is pushed equably.Therefore many probes 2 of accommodating at probe 15 can generate roughly initial stage load uniformly, can prevent the warpage of probe 15.
Post member 18 is to be roughly column, and has: large-diameter portion 18a cylindraceous, and the thickness of slab sum of the thickness of slab of its aspect ratio circuit board 11 and insert 13 is bigger; And minor diameter part 18b cylindraceous, its diameter is littler than the diameter of this large-diameter portion 18a, and has the central shaft identical with large-diameter portion 18a.The through hole portion 111 of large-diameter portion 18a feed throughs substrate and the through hole portion 131 of insert 13.Again, the recess 124 of minor diameter part 18b and reinforcement 12 roughly is embedded in recess 124 with the footpath.The bottom surface of the side that the minor diameter part 18b in the bottom surface of large-diameter portion 18a does not give prominence to is connected to the surface of space transformer 14.Though have the post member 18 of above formation is by being realized with reinforcement 12 identical materials, is good in view of the point that needs high manufacturing accuracy and with stainless steel.
Post member 18 is that the center of the polygon-octagonal that forms with respect to the surface of insert 13 disposes (with reference to Fig. 1) symmetrically.Again, post member 18 is configured with a plurality of in the neighboring area at the center of the polygon-octagonal that the surface became that does not comprise insert 13.So by a plurality of post members 18 that will be disposed, run through and be embedded in circuit board and the insert towards the thickness of slab direction of the thickness of slab direction of circuit board 11 and insert 13, can make the height of circuit board 11 and the thickness of slab direction of the laminated portions of insert 13, stipulate by the height of post member 18.Therefore, even circuit board 11 deforms, also can suppress probe 15 with respect to the depth of parallelism of predetermined reference field, and to the influence of the flatness of probe 15.In addition, directly be connected to the surface of space transformer 14 because of the bottom surface of large-diameter portion 18a, therefore, still can guarantee the depth of parallelism of 12 of space transformer 14 and reinforcements even be applied with the elastic force of the probe 2 that the splicing ear 133 that kept from insert 13 and probe 15 kept.
The inspection summary of the semiconductor wafer 5 that uses the probe 1 with above formation then, is described with reference to Fig. 4 and Fig. 7.As shown in Figure 4, probe 1 is to be installed on detector (Prober) 3 when checking, this detector 3 is devices that probe 2 is contacted with semiconductor wafer 5.Detector 3 possesses: probe keeps tool 31, and the bottom surface of loading circuit board 11 is also kept; And pushing anchor clamps 32, be positioned at the top that probe keeps tool 31, and push probe 1 downwards it is fixed.
Probe 2 contacts with semiconductor wafer 5, can make its rising by predetermined drive unit and realizes by the wafer chuck 50 that will load semiconductor wafer 5.At this moment, for the electrode pad 51 that makes semiconductor wafer 5 contacts reliably with the leading section 22a of the plunger 22 of probe 2, must be set as and make the front end height h that makes the probe 2 of probe 2 behind one stroke because of contact than the probe (h＞d) that keeps the thickness d of tool 31 big.Moreover, at Fig. 4 to schematically show front position by the probe 2 of a group probe 2 that the right part was kept (4) when contacting of probe 15 with semiconductor wafer 5.Again, in Fig. 4, will be because of being made as Δ h with the path increment of the probe that contacts 2 of semiconductor wafer 5.
From state shown in Figure 7, when the electrode pad 51 of semiconductor wafer 5 contact with leading section 22a, plunger 22 can rise, and spring member 23 can contraction and then bendings.At this moment, the part of the close coiling 23b of portion keeps the axial region 21c state of contact with plunger 21, therefore realizes in regular turn the electrically conducting via the shortest path of the close coiling 23b of portion of plunger 21, spring member 23 and plunger 22, and suppresses the increase of the inductance of probe 2.
According to the embodiment of the present invention 1 that as above illustrates, owing to possess a plurality of post members, therefore can improve in order to the probe that is housed in the probe of output input electrical signal between different circuit structures with respect to the degree of accuracy of the depth of parallelism of predetermined reference field and the degree of accuracy of flatness, this post member forms the thickness of slab of aspect ratio circuit board and the also big roughly column of thickness of slab sum of insert, run through and be embedded in this circuit board and the insert to the thickness of slab direction of circuit board and insert, a side bottom surface is connected to space transformer.
Again, according to present embodiment 1, because of the end face of post member is connected to the surface of space transformer, so the surface of space transformer becomes parallel with the surface of reinforcement.Thereby easy surperficial parallel with reinforcement in the surface that makes probe, and need be in order to the adjusting mechanism of the complexity of the adjustment depth of parallelism.Therefore the part number needn't be increased, the depth of parallelism and the flatness of probe can be obtained with respect to predetermined reference field.
Fig. 8 is the part sectioned view of formation of probe of a variation of present embodiment 1.Probe 6 shown in Figure 8 possesses: circuit board 61, reinforcement 62, insert 63, space transformer 14, probe 15, retaining member 16, leaf spring 17, and a plurality of post members 18.
The large-diameter portion 18a of post member 18 runs through and is embedded in the through hole portion 611 and 631 that is formed at circuit board 61 and insert 63 respectively.Again, the minor diameter part 18b of post member 18 is loaded into the recess 624 that is located at reinforcement 62.
In this variation, post member 18 also is arranged on the central part of circuit board 61 and insert 63 except the neighboring area that is arranged on circuit board 61 and insert 63.So, in present embodiment 1, the position is set also can be suitably changed of post member 18.
(embodiment 2)
Fig. 9 is the part sectioned view of formation of the probe of embodiment of the present invention 2.In the probe 7 shown in Figure 9, the surface relative to each other in the surface of insert 13 and space transformer 14 is bonding by bonding agent 71 each other.The formation of probe 7 in addition is identical with the formation of the probe 1 of above-mentioned embodiment 1.Therefore, enclose and identical symbols such as Fig. 1 corresponding to the constituent components of the constituent components of probe 1.
With the bonding inserts 13 of bonding agent 71 during, except the part placement of adhesives 71 the butt position of the formation position of the electrode pad 142 on the surface of space transformer 14 and post member with space transformer 14.With regard to the configuration of this bonding agent 71, when bonding agent 71 is liquid, usable brush coating, roll coating, spraying, the coating of carrying out with spinner etc., or undertaken by the impregnating of bonding agent.On the other hand, be half admittedly when shape or solid shape as bonding agent 71, after it being configured as suitable thickness laminar, with after fusion such as solvent or thinning agent or being dispersed into debita spissitudo, again by carrying out above-mentioned coating or flooding with placement of adhesives 71.In addition, replace to use bonding agent 71, also can use, the film like or the laminar thermosetting resin that on the pattern of the butt position of formation position of having removed electrode pad 142 and post member 18, form on the surface of space transformer 14.
Bonding agent 71 can use thermosetting bonding agents such as epoxy resin, phenolics, urea resin, melamine resin, vibrin, silicone resin.Again, bonding agent 71 also can use thermoplasticity bonding agents such as polyvinyl acetate, polyvinyl alcohol (PVA), Polyvinylchloride, nitrocellulose, polyacrylate.Moreover bonding agent 71 also can use pressure-sensitive bonding agent and hot pressing bonding agent.
Moreover bonding agent 71 also can use scolders such as scolding tin.Scolder is when being tool electric conductivity, after its surface forms oxidation overlay film and gives insulativity, just as be bonding agent 71 uses.The melting point of scolder is necessary for 200 ℃ high of maximum temperature when using probe, but the melting point of brazing metal easily deforms when getting back to normal temperature after welding when too high.Considering this problem, be higher than 200 ℃ though be applicable to the melting point of the scolder of bonding agent 71, is good can hang down the person as far as possible still.
During with space transformer 14, can use above-mentioned arbitrary method at bonding insert 13, become semi-harden state in the face that the is fixed placement of adhesives 71 of insert 13 and/or space transformer 14.Then, behind stacked insert 13 and space transformer 14, make adhesive hardens.At this moment, when being the thermosetting bonding agent, be heated to predetermined temperature, or except heating, pressurize again and make it final sclerosis (this sclerosis) as bonding agent 71.Relative therewith, when being the pressure-sensitive bonding agent as bonding agent 71, available predetermined pressure pressurizes and can make it final sclerosis.So, bonding agent 71 is finally hardened, can make insert 13 and space transformer 14 complete bonding being integral.
Bonding by insert 13 and space transformer 14 are given as mentioned above, compare with the situation of stacked two members only, can improve its whole rigidity, and improve the flatness of space transformer 14.As a result, also promote the flatness of the probe 15 be laminated in space transformer 14, and promote the flatness of probe 2 front ends of probe 15 maintenance of accommodating, so probe 2 also can improve with respect to the contact degree of accuracy of semiconductor wafer 5.
According to the embodiment of the present invention 2 that as above illustrates, owing to possess a plurality of post members, therefore can promote in order to the probe that is housed in the probe of output input electrical signal between different circuit structures with respect to the degree of accuracy of the depth of parallelism of predetermined reference field and the degree of accuracy of flatness), wherein this post member has the also big roughly column of thickness of slab sum of the thickness of slab and the insert of aspect ratio circuit board, and run through and be embedded in this circuit board and the insert to the thickness of slab direction of circuit board and insert, a side's of above-mentioned a plurality of post members bottom surface is connected to space transformer.
Again,, insert is fixed in space transformer forms integrated and guarantee suitable intensity, can prevent that load because of the splicing ear laid in the insert from causing the distortion of space transformer according to present embodiment 2.
Moreover, also can make the two-sided glutinous band of film like in the mode of pattern that the electrode pad part of space transformer has been removed in formation, this double sticky tape is attached to the surface of space transformer after, stacked insert and space transformer, with bonding both.
Again, also can use bolt to conclude and fixedly insert and space transformer, use bonding agent to fix insert and space transformer to replace.
Moreover, also can and fix insert and space transformer with bonding agent and bolt.
(embodiment 3)
Figure 10 is the part sectioned view of formation of the probe of embodiment of the present invention 3.The post member that is characterized as of probe 8 shown in Figure 10 is fixed on the reinforcement.The formation of the probe 8 beyond post member and the reinforcement is identical with the formation of the probe 1 of above-mentioned embodiment 1.Therefore the member of formation corresponding with the member of formation of probe 1 enclosed the identical symbol with Fig. 1 etc.
Post member 83 possesses: large-diameter portion 83a, the through hole portion 111 of feed throughs substrate 11 and the through hole 131 of insert 13; And minor diameter part 83b, be fixed in reinforcement 82.Surface at minor diameter part 83b is provided with screw thread, can screw togather with bolt 84.
On reinforcement 82, be provided with in order to fixed leg member 83 through hole portions 821.Through hole portion 821 has: path hole 821a is slotting logical for the minor diameter part 83b of post member 83; And big footpath hole 821b, 821a is coaxial with this path hole, and its diameter is bigger than the diameter of the bolt 84 that is screwed together in minor diameter part 83b.
According to the embodiment of the present invention 3 that as above illustrates, owing to possess a plurality of post members, therefore can promote in order to be housed in output between different circuit structures and go into the probe of probe of electric signal with respect to the degree of accuracy of the depth of parallelism of predetermined reference field and the degree of accuracy of flatness, wherein this post member forms the also big roughly column of thickness of slab sum of the thickness of slab and the insert of its aspect ratio circuit board, imbed in circuit board and the insert and run through and be embedded in to the thickness of slab direction of circuit board and insert, a side's of above-mentioned post member bottom surface is connected to space transformer.
According to present embodiment 3,, can make the formation of probe more firm by the post member is fixed in reinforcement again.
In addition, the post member is installed on the method for reinforcement, also can utilizes the method outside the above explanation to carry out.
With regard in order to implementing with regard to the optimal morphology of the present invention, though embodiment 1 to 3 has been described in detail in detail, the present invention is not limited to above-mentioned embodiment.For example, more than explanation is the probe that is suitable for tip type, but the probe that probe of the present invention was suitable for, and can be any of known various probes.
So, the present invention can comprise not the various embodiments in this record, if do not break away from the application's claim in the scope of specific technological thought, can implement various design alterations etc.
(utilizing on the industry possibility)
As mentioned above, probe card of the present invention is the electrical characteristic inspection that is applicable to semiconductor wafer, especially be applicable to make hundreds of to the blanket full-wafer grade inspection that is contacted with about at least 1/4 to 1/2 chip of semiconductor wafer of tens thousand of probes.

Claims (5)

1. probe, constitute by conductive material respectively and along its length based on elastic force and many flexible probes by adopting, establish semiconductor wafer with in order to generate to being electrically connected between the circuit structure of the signal of this semiconductor wafer output, it is characterized in that possessing:
Probe keeps above-mentioned many probes;
Circuit board has the wiring pattern that corresponding foregoing circuit is constructed;
Flat insert is laminated in above-mentioned circuit board, in order to the wiring of the above-mentioned circuit board of transferring;
Flat space transformer is located between above-mentioned insert and the above-mentioned probe, in order to the interval of the wiring of the above-mentioned insert of conversion switching, and the wiring after this conversion is exposed to and above-mentioned probe facing surfaces; And
A plurality of post members, form the also big roughly column of thickness of slab sum of the thickness of slab and the above-mentioned insert of the above-mentioned circuit board of aspect ratio, run through and be embedded in above-mentioned circuit board and the above-mentioned insert to the thickness of slab direction of above-mentioned circuit board and above-mentioned insert, a side's of above-mentioned a plurality of post members bottom surface is connected to above-mentioned space transformer.
2. probe according to claim 1 is characterized in that,
Above-mentioned insert and above-mentioned space transformer are fixed.
3. probe according to claim 1 and 2 is characterized in that,
Above-mentioned insert possesses:
A plurality of splicing ears are made of conductive material respectively, and stretch based on elastic force along its length; And
Housing member is made of tabular insulativity material, and is formed with each a plurality of through hole portion of accommodating above-mentioned a plurality of splicing ears respectively,
Expose from above-mentioned housing member at the both ends of the length direction of each splicing ear.
4. probe according to claim 1 and 2 is characterized in that,
Also possess be installed on above-mentioned circuit board in order to strengthening the reinforcement of above-mentioned circuit board,
And above-mentioned a plurality of post member is fixed in above-mentioned reinforcement.
5. probe according to claim 4 is characterized in that,
Above-mentioned insert possesses:
A plurality of splicing ears are made of conductive material respectively, and stretch based on elastic force along its length; And
Housing member is made of tabular insulativity material, and is formed with each a plurality of through hole portion of accommodating above-mentioned a plurality of splicing ears respectively, and
Expose from above-mentioned housing member at the both ends of the length direction of each splicing ear.
CN200880025240XA 2007-07-19 2008-07-16 Probe card Expired - Fee Related CN101755216B (en)

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JP2007188546 2007-07-19
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US8149008B2 (en) 2012-04-03
TWI394953B (en) 2013-05-01
TW200912323A (en) 2009-03-16
CN101755216B (en) 2012-10-10
JPWO2009011365A1 (en) 2010-09-24
JP5714817B2 (en) 2015-05-07
US20100219852A1 (en) 2010-09-02

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