CN112462108A - Novel probe card device - Google Patents

Novel probe card device Download PDF

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Publication number
CN112462108A
CN112462108A CN202011272645.2A CN202011272645A CN112462108A CN 112462108 A CN112462108 A CN 112462108A CN 202011272645 A CN202011272645 A CN 202011272645A CN 112462108 A CN112462108 A CN 112462108A
Authority
CN
China
Prior art keywords
probe
fixed
lifting device
probe card
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011272645.2A
Other languages
Chinese (zh)
Inventor
顾良波
王�华
季海英
凌俭波
周建青
吴勇佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sino IC Technology Co Ltd
Original Assignee
Sino IC Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sino IC Technology Co Ltd filed Critical Sino IC Technology Co Ltd
Priority to CN202011272645.2A priority Critical patent/CN112462108A/en
Publication of CN112462108A publication Critical patent/CN112462108A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07392Multiple probes manipulating each probe element or tip individually
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07385Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a novel probe card device, wherein each probe is provided with a receiving device, the probe is fixed on a lifting device, and the probe is fixed through a bracket. Different probes can be lifted according to the debugging requirement, one or more probes can be conveniently positioned to the pin feet with influence, the design and analysis reasons are convenient, and the direct other influences on the test of a certain module can be eliminated.

Description

Novel probe card device
Technical Field
The invention relates to the technical field of wafer testing, in particular to a novel probe card device.
Background
In wafer testing, conversion devices are typically used to connect the wafer to the tester resources, and in these conversion devices, the probe card is first brought into contact with the wafer. Generally, how many pins are needed, how many needles are made, and there is no way to add needles or reduce needles in the testing process. However, in the actual testing process, some test items may be interfered by some irrelevant pins, which affects the accuracy of the test value of the test item. Usually, the circuit is cut off by a relay inside or a peripheral relay of the testing machine, which can solve some problems, but the probe is stuck on the pad, and the probe does not pass through current and voltage, but is stuck on the pad like an antenna, which also affects the accuracy of the test value of the test item. In this time, if the test is accurate, the needle reduction needs to be carried out again, the needle reduction is single, the period is long, and the cost is high. And because the pins are multiplexed, the pins irrelevant to the test item A are related to the pins relevant to the test item B.
Disclosure of Invention
The invention provides a novel probe card device for solving the technical problems, which is the same as the traditional probe card, wherein needles are pricked on a wafer, but needle tails are not fixed and can be extended and retracted, and each needle tail can independently control the extension and retraction, and the specific technical scheme is as follows:
each probe is provided with a receiving device, the probes are fixed on the lifting device, and the probes are fixed through the support.
The novel probe card device is characterized in that: the wafer test is defaulted to be high level, the starting signal is low level, and the probe after receiving the starting signal is fixed by the lifting device; after the probe is fixed, a signal is sent to the lifting device, and after the lifting device receives the signal, the whole fixed probe is lifted upwards to be not in contact with the pad, and then debugging is carried out; after commissioning, the raised needle is restored if necessary.
Compared with the prior art, the invention has the following beneficial effects: different probes can be lifted according to the debugging requirement, one or more probes can be conveniently positioned to the pin feet with influence, the design and analysis reasons are convenient, and the direct other influences on the test of a certain module can be eliminated.
Drawings
Fig. 1 is a schematic structural diagram of a novel probe card device.
In the figure:
1 lifting device 2 support 3 receiving device 4 probe
Detailed Description
The invention is further described below with reference to the figures and examples.
pin: a pin;
arm: a transfer arm;
pad: and (4) nodes.
Each probe 4 is provided with a receiving device 3, the default is high level, the starting signal is low level, and the probe receiving the starting signal is fixed by the lifting device 1. After the fixing, a signal is sent to the lifting device 1, and after the lifting device 1 receives the signal, the whole fixed probe 4 is lifted upwards to be not in contact with the pad, and then debugging is carried out. After the debugging, the raised probe 4 is restored if necessary. In this way, different probes 4, one or more, can be raised according to the needs of the commissioning. The pin foot that can be convenient fix a position the influence, the design analysis reason of being convenient for also can get rid of direct other influences to certain module test.

Claims (2)

1. The utility model provides a novel probe card device which characterized in that: each probe is provided with a receiving device, the probes are fixed on the lifting device, and the probes are fixed through the support.
2. The novel probe card apparatus of claim 1, wherein: the wafer test is defaulted to be high level, the starting signal is low level, and the probe after receiving the starting signal is fixed by the lifting device; after the probe is fixed, a signal is sent to the lifting device, and after the lifting device receives the signal, the whole fixed probe is lifted upwards to be not in contact with the pad, and then debugging is carried out; after commissioning, the raised needle is restored if necessary.
CN202011272645.2A 2020-11-13 2020-11-13 Novel probe card device Pending CN112462108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011272645.2A CN112462108A (en) 2020-11-13 2020-11-13 Novel probe card device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011272645.2A CN112462108A (en) 2020-11-13 2020-11-13 Novel probe card device

Publications (1)

Publication Number Publication Date
CN112462108A true CN112462108A (en) 2021-03-09

Family

ID=74836146

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011272645.2A Pending CN112462108A (en) 2020-11-13 2020-11-13 Novel probe card device

Country Status (1)

Country Link
CN (1) CN112462108A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101755216A (en) * 2007-07-19 2010-06-23 日本发条株式会社 Probe card
JP2010151559A (en) * 2008-12-25 2010-07-08 Japan Electronic Materials Corp Probe card
CN102435798A (en) * 2011-10-14 2012-05-02 日月光半导体制造股份有限公司 Probe card and test method
TW201316006A (en) * 2011-10-04 2013-04-16 Advanced Semiconductor Eng Probe card and testing method
CN208672753U (en) * 2018-08-07 2019-03-29 德淮半导体有限公司 Probe adjusts device, wafer reliability test equipment and probe card configuration
CN209979706U (en) * 2019-03-29 2020-01-21 德淮半导体有限公司 Probe card and wafer test equipment
CN211148737U (en) * 2019-05-15 2020-07-31 苏州安靠电源有限公司 Probe assembly for battery charging and discharging test

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101755216A (en) * 2007-07-19 2010-06-23 日本发条株式会社 Probe card
JP2010151559A (en) * 2008-12-25 2010-07-08 Japan Electronic Materials Corp Probe card
TW201316006A (en) * 2011-10-04 2013-04-16 Advanced Semiconductor Eng Probe card and testing method
CN102435798A (en) * 2011-10-14 2012-05-02 日月光半导体制造股份有限公司 Probe card and test method
CN208672753U (en) * 2018-08-07 2019-03-29 德淮半导体有限公司 Probe adjusts device, wafer reliability test equipment and probe card configuration
CN209979706U (en) * 2019-03-29 2020-01-21 德淮半导体有限公司 Probe card and wafer test equipment
CN211148737U (en) * 2019-05-15 2020-07-31 苏州安靠电源有限公司 Probe assembly for battery charging and discharging test

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