CN101743286A - 用于在不可电镀的基底进行无电金属电镀的底漆层制剂 - Google Patents
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Abstract
说明了一种在无电电镀过程之前用于不可电镀的基底的涂层制剂。所述涂层制剂包括多功能基单体、以及二苯甲烷-4,4-二异氰酸酯(MDI)的混合物,所述多功能基单体含有烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或其组合物,但不包括含有羟基的多功能单体。根据本发明,所述多功能基单体的比例为少于或等于二苯甲烷-4,4-二异氰酸酯(MDI)。所述涂层制剂在用于一不可电镀的基底前在一真空室内混合30分钟。
Description
技术领域
本发明涉及一种将一导电金属以无电金属电镀的方式镀于一非导电及不可电镀材料的表面的方法,特别是,本发明涉及一种在进行无电金属电镀过程之前用于所述不可电镀的基底的涂层制剂、以及一种将所述涂层制剂涂覆于所述不可电镀的基底的方法。
背景技术
无电电镀是一种众所周知的方法,将非导电材料基底镀上金属,供各种应用。它是一种自动催化的方法,其中离子状态的金属无需电力的影响进行化学还原。例如,丙烯腈二乙烯丁二烯(ABS)塑料以金属涂覆,不只是用作装饰用途如汽车配件、家具配件、时装首饰及钮扣,亦是为了功能性的原因,如用于电器外壳可有效阻挡电磁辐射的发射。在基底材料上镀上金属的超卓性质,包括卓越的耐磨、表面修整及均匀涂覆厚度的特征,令无电电镀技术具有广泛的应用空间,如航天、汽车、电子、计算机、机械、油气生产及阀工业。不过,这种技术的缺点,在于其必须依赖于可电镀基底。
过去亦有研究尝试以金属涂覆非导电及不可电镀的基底。以无电电镀将不可电镀的基底镀上金属的主要的问题,在于很多时金属完全不能镀上基底。而在可以电镀的情况下,金属在所述不可电镀的基底上的附着力十分弱。这个问题直接影响电镀基底的耐磨、表面修整以及均匀涂覆厚度特征。此外,即使过往亦有很多的尝试在进行无电电镀过程之前将涂层制剂涂覆于所述基底,以改善电镀基底的耐磨、表面修整以及均匀涂覆厚度特征,但这些问题仍然未能解决。
发明内容
本发明的目的在于提供一种用于不可电镀的基底的涂层制剂,使所述不可电镀的基底可以镀上金属。因此,在进行无电电镀过程之后,镀上金属的基底可以改善其耐磨、表面修整以及均匀涂覆厚度特征。
本发明的另一目的在于提供一种制备所述涂层制剂的方法。
本发明的另一目的在于提供一种在无电电镀过程之前将所述涂层制剂涂覆于一不可电镀的基底的方法。
根据本发明的首个目的,本发明提供一种在无电电镀过程之前用于不可电镀的基底的涂层制剂,其中所述涂层制剂包括含有烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或其组合物的多功能基单体、以及二苯甲烷-4,4-二异氰酸酯(MDI)的混合物,所述多功能基单体不包括含有羟基的多功能单体。优选地,在所述涂层制剂中,所述多功能基单体的比例为少于或等于所述二苯甲烷-4,4-二异氰酸酯(MDI)。
根据本发明的第二个目的,所述涂层制剂包括含有烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或其组合物的多功能基单体、以及二苯甲烷-4,4-二异氰酸酯(MDI)的混合物,所述多功能基单体不包括含有羟基的多功能单体,所述混合物在一真空室混合,并放置30分钟使聚合体在用于所述不可电镀的基底前能充分混合和稳定。
根据本发明的第三个目的,本发明提供一种在进行无电金属电镀过程之前应用根据本发明制备的所述涂层制剂于一不可电镀的基底的方法,所述方法包括以下步骤:
(1)将所述制剂涂覆于所述不可电镀的基底的表面,优选以涂刷或浸渍方式涂覆;
(2)将所述不可电镀的基底在室温养护最少8小时,以容许聚合体混合物充分养护和固化;
(3)烘干所述基底2-3日,优选以烘箱烘干。
为使本发明可被充分理解和加以实施,以下将详细以优选实施例说明。
具体实施方式
根据本发明,本发明提供一种在无电电镀过程之前用于不可电镀的基底的涂层制剂,其中所述涂层制剂包括一多功能基单体,即任何基于烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或所述基的任何可能的组合物的单体、以及二苯甲烷-4,4-二异氰酸酯(MDI)的混合物,所述多功能基单体不包括含有羟基的多功能单体。此外,根据本发明,在所述涂层制剂中,所述多功能基单体的比例为少于或等于所述二苯甲烷-4,4-二异氰酸酯(MDI)。
上述用于不可电镀基底的涂层制剂是一种创新的制剂,其将金属和不可电镀基层表面之间的附着力兼容化。本涂层制剂提供多方面适应性,并可应用于基本上所有种类的材料,不论材料的性质或来源,例以半金属如硅、硅酸盐、玻璃、陶瓷以及非金属如塑料、木材及贝壳。
根据本发明,所述多功能单体包括任何基于烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或所述基的任何可能的组合物的的单体,含有羟基的多功能单体除外。所述多功能单体的一些特别例子,包括三聚氰酸三烯丙酯(基于烯丙基的多功能单体)、三羟甲基丙烷三甲基丙烯酸酯(基于烃基的多功能单体)、聚乙二醇二乙烯基醚或酯(基于乙烯基、醚基或酯基的多功能单体)、二甲基丙烯酸三甘醇酯或二甲基丙烯酸乙二醇酯(基于甲基丙烯酸酯基的多功能单体)、聚丙二醇(6)丙烯酸酯(基于丙烯酸酯基的多功能单体)及酞酸二烯丙酯(DALP)(基于邻苯二酸盐基的多功能单体)。
酞酸二烯丙酯(DALP)的单体及分析级的二苯甲烷-4,4-二异氰酸酯(MDI)用作制备所述聚合体溶剂。单体的混合物DALP∶MDI的比例优选为1∶2。这两种液体的混合过程必须在一真空室中进行,并放置30分钟以容许混合物在使用前充分混合和稳定。聚合物溶剂必须储存于真空瓶内,以防氧化。
虽然在本发明中,所述多功能单体的比例为少于或等于二苯甲烷-4,4-二异氰酸酯(MDI),但在多功能单体为基于乙烯基、醚基或酯基如聚乙二醇二乙烯基醚的情况下,更优选的比例为1∶1。
要为不可电镀的基底如木材进行电镀,首先在所述基底涂覆一薄层的本聚合物溶剂。将基底浸渍于聚合物中、或是以刷将所述聚合物溶剂涂刷于所述基底均可。之后,将所述基底在室温养护最少8小时,然后以烘箱将所述基底烘干数日(2或3日)。之后,所述基底便可用于下一过程,即是一般的无电电镀过程。
一般无电金属电镀过程包括五个主要过程,它们分别是蚀刻、中和、活化、加速及电镀。在镀镍过程中,已涂覆本发明的聚合物制剂的基底在蚀刻溶液(高锰酸钾)中浸5分钟。之后,基底在中和溶液(水合肼、氢氧化钠和酒石酸钠的混合物,其中水合肼可以过氧化氢或蚁醛取代)浸大约45秒。在中和过程之后,基底在活化溶液(氯化亚锡和氯化钯的混合物)中浸5分钟,之后在加速溶液(盐酸)中浸2分钟。最后,基体浸于镀镍槽中。
至于无电镀铜过程,电镀步骤与上述的相同。不过,其使用铬酸作为蚀刻溶液,而电镀槽则为镀铜槽。
一般的电镀过程,即蚀刻、中和、活化、加速及电镀,在其它任何金属的电镀过程中是相同的。
实施例一:于熟石膏上电镀金属
首先,熟石膏以根据本发明的聚合物制剂涂覆,所述聚合物制剂包括比例为1∶2的酞酸二烯丙酯(DALP)及分析级的二苯甲烷-4,4-二异氰酸酯(MDI)。
之后,熟石膏在室温养护8小时,然后在烘箱烘干两天。之后,所述熟石膏进行一般的无电电镀过程,即蚀刻、中和、活化、加速及电镀。
如上所述,不同的多功能单体(任何基于烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或所述基的任何可能的组合物的单体,含有羟基的多功能单体除外)可以用以取代实施例一的酞酸二烯丙酯(DALP),只要所述多功能单体一般少于二苯甲烷-4,4-二异氰酸酯(MDI)。
上述说明为本发明的优选实施例及其优点,但本发明并不为上述说明所限定,本发明只被权利要求的特征和保护范围所限定。
Claims (10)
1.一种在无电电镀过程之前用于不可电镀的基底的涂层制剂,其特征在于:所述涂层制剂包括含有烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或其组合物的多功能基单体、以及二苯甲烷-4,4-二异氰酸酯的混合物,所述多功能基单体不包括含有羟基的多功能单体。
2.根据权利要求1所述的用于不可电镀的基底的涂层制剂,其特征在于:所述多功能基单体的比例为少于或等于所述二苯甲烷-4,4-二异氰酸酯。
3.根据权利要求1或2所述的用于不可电镀的基底的涂层制剂,其特征在于:所述多功能基单体为酞酸二烯丙酯。
4.根据权利要求3所述的用于不可电镀的基底的涂层制剂,其特征在于:所述涂层制剂包括比例为1∶2的酞酸二烯丙酯及二苯甲烷-4,4-二异氰酸酯混合物。
5.根据权利要求1或2所述的用于不可电镀的基底的涂层制剂,其特征在于:所述多功能基单体为聚乙二醇二乙烯基醚。
6.根据权利要求5所述的用于不可电镀的基底的涂层制剂,其特征在于:所述涂层制剂包括比例为1∶1的聚乙二醇二乙烯基醚及二苯甲烷-4,4-二异氰酸酯混合物。
7.根据权利要求1或2所述的用于不可电镀的基底的涂层制剂,其特征在于:所述包括含有烯丙基、烃基、乙烯基、醚基、酯基、甲基丙烯酸酯基、丙烯酸酯基、邻苯二酸盐基或其组合物的多功能基单体、以及二苯甲烷-4,4-二异氰酸酯的混合物的涂层制剂,其中所述多功能基单体不包括含有羟基的多功能单体,所述涂层制剂在一真空室内混合,并放置30分钟使其在用于所述不可电镀的基底前充分混合和稳定。
8.根据权利要求7所述的用于不可电镀的基底的涂层制剂,其特征在于:所述多功能基单体为酞酸二烯丙酯。
9.根据权利要求7所述的用于不可电镀的基底的涂层制剂,其特征在于:所述多功能基单体为聚乙二醇二乙烯基醚。
10.一种将根据权利要求1或2或7或8或9任一权利要求所述的涂层制剂在进行无电金属电镀过程之前用于一不可电镀的基底的方法,所述方法包括以下步骤:
(1)将所述制剂涂覆于所述不可电镀的基底的表面,优选以涂刷或浸渍方式涂覆;
(2)将所述不可电镀的基底在室温养护最少8小时,以容许聚合体混合物充分养护和固化;
(3)烘干所述基底2-3日,优选以烘箱烘干。
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Application Number | Priority Date | Filing Date | Title |
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MYPI20070548 | 2007-04-10 | ||
MYPI20070548 | 2007-04-10 | ||
PCT/MY2008/000029 WO2008123767A2 (en) | 2007-04-10 | 2008-04-08 | An undercoating layer formulation for non-platable grade substrate for electroless metal plating |
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CN101743286A true CN101743286A (zh) | 2010-06-16 |
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CN (1) | CN101743286A (zh) |
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WO2002049982A1 (en) * | 2000-12-18 | 2002-06-27 | Bridgestone Corporation | Film-reinforced glasses |
US6512039B1 (en) * | 2001-11-16 | 2003-01-28 | Lord Corporation | Adhesives for bonding peroxide-cured elastomers |
EP1347003A1 (en) * | 2002-03-18 | 2003-09-24 | Huntsman International Llc | Radiation curable resin composition |
DE10344449A1 (de) * | 2003-09-25 | 2005-04-28 | Henkel Kgaa | Klebstoff-Zusammensetzung mit Barriere-Eigenschaften |
US7368171B2 (en) * | 2004-09-03 | 2008-05-06 | H.B. Fuller Licensing & Financing, Inc. | Laminating adhesive, laminate including the same, and method of making a laminate |
DE102005030500A1 (de) * | 2005-06-28 | 2007-01-04 | Basf Ag | Beschichtungsmassen enthaltend 2,4'-Diisocyanatodiphenylmethan |
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- 2008-04-08 WO PCT/MY2008/000029 patent/WO2008123767A2/en active Application Filing
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WO2008123767A3 (en) | 2008-12-11 |
EP2181164A2 (en) | 2010-05-05 |
WO2008123767A2 (en) | 2008-10-16 |
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