CN101737723B - LED light conversion plate and manufacturing method thereof - Google Patents
LED light conversion plate and manufacturing method thereof Download PDFInfo
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- CN101737723B CN101737723B CN200910264566A CN200910264566A CN101737723B CN 101737723 B CN101737723 B CN 101737723B CN 200910264566 A CN200910264566 A CN 200910264566A CN 200910264566 A CN200910264566 A CN 200910264566A CN 101737723 B CN101737723 B CN 101737723B
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- Prior art keywords
- fluorescent material
- high molecular
- light converting
- led light
- converting plate
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Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 238000006243 chemical reaction Methods 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 239000002994 raw material Substances 0.000 claims abstract description 21
- 238000005303 weighing Methods 0.000 claims abstract description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- 229920001225 polyester resin Polymers 0.000 claims abstract description 6
- 239000004645 polyester resin Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000004743 Polypropylene Substances 0.000 claims abstract description 3
- -1 polypropylene Polymers 0.000 claims abstract description 3
- 229920001155 polypropylene Polymers 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 50
- 239000002245 particle Substances 0.000 claims description 24
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 102100032047 Alsin Human genes 0.000 claims description 3
- 101710187109 Alsin Proteins 0.000 claims description 3
- 229910052693 Europium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 229910017639 MgSi Inorganic materials 0.000 claims description 2
- 239000011236 particulate material Substances 0.000 claims description 2
- 230000004313 glare Effects 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- 229920000515 polycarbonate Polymers 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 abstract 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 11
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 8
- 238000013459 approach Methods 0.000 description 6
- 238000004781 supercooling Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention provides an LED light conversion plate and a manufacturing method thereof. An LED light conversion plate comprises fluorescent powder and a high molecular polymer, wherein the high molecular polymer is polycarbonate, acrylic, polypropylene or polyester resin. Weighing a certain amount of fluorescent powder and polymer raw materials in proportion, uniformly mixing the fluorescent powder and the polymer raw materials, and then manufacturing the mixture into a plate with a certain shape by using methods such as mould pressing, cooling roller or injection molding and the like. The LED lamp manufactured by the light conversion plate can obviously prolong the service life and solve the problem of glare of the existing LED light source.
Description
Technical field
The present invention relates to a kind of LED light converting plate and manufacturing approach thereof, belong to field of semiconductor illumination.
Background technology
LED (light emitting diode) is as a kind of novel solid light source, and development in recent years has been widely used in fields such as large screen display, traffic lights, Landscape Lighting, street lighting very rapidly now.Compare with electricity-saving lamp with incandescent lamp, its major advantage has: volume is little, reaction speed is fast, and shock resistance is good, the life-span is long, especially energy-conserving and environment-protective, be described as the 4th generation lighting source.
Because technical reason, the LED manufacturing approach of main flow is blue chip+yellow fluorescent powder at present, and packaging technology is also all similar: after fluorescent material and silica gel or epoxy resin are mixed, be coated in above the chip, curing gets final product.The LED that adopts this technology to make, its light decay wear out in other words and come from two aspects: the one, and long long-time the wearing out of back self of using of chip, this is the problem that any electronic devices and components all exist, along with the growth of service time, efficient is also more and more lower; The 2nd, fluorescent material since the quantum efficiency that influenced by chip cooling to cause decay; Since existing LED packaging technology all be directly with the mixing object point glue of fluorescent material and silica gel to chip; And chip can give out a large amount of heat when work, and chip temperature is on every side raise rapidly; The luminous efficiency of fluorescent material constantly descends owing to be heated as a result, finally directly has influence on the life-span of LED.Therefore in order to reduce the light decay of LED, must set about from above-mentioned two root problems.Adopt present main flow packaging technology also to have some other problem in addition, for example: during batch process, some glue amount is difficult to reach the uniformity of height, after the encapsulation, also need sort according to parameter; Phosphor gel layer thickness above single chips differs, and thick middle is thin all around.These problems also all are to solve.
In addition; Except above aging and consistency problem; Present LED light fixture ubiquity glare problem, during to night the vision of human eye has been caused to have a strong impact on, and this is that the led light source that uses owing to making light fixture is the reason of spot light; Therefore desire to address this problem, must make the spot light of light fixture change area source into.
Summary of the invention
The objective of the invention is to be to provide a kind of LED light converting plate, adopt this light converting plate after, fluorescent material and chip no longer are in contact with one another; The 2nd, keep certain distance, fluorescent material can not receive the influence of chip heating again, and quantum efficiency can remain on higher level in the long time; While need not put operations such as glue yet, only need encapsulate chip to get final product, and can significantly enhance productivity; The LED light fixture that adopts the present invention to make in addition will be an area source, can not have glare problem again.Another object of the present invention has provided the manufacturing approach of above-mentioned LED light converting plate.
Technical scheme of the present invention is: a kind of LED light converting plate, it is characterized in that raw material consists of fluorescent material and high molecular polymer, and wherein the mass ratio of fluorescent material and high molecular polymer is 1: (5-20); The thickness of light converting plate is 0.5-5mm.
Wherein said fluorescent material is: YAG:Ce
3+And/or YAG:Tb
3+, or YAG:Ce
3+And/or YAG:Tb
3+Be at least Ba
3MgSi
2O
8: Eu, Mn, Ca (Mo, W) O
4: Eu, Sm, (Sr, Ca) S:Eu, Sr
2Si
5N
8: Eu, (Ca, Sr) AlSiN
3: Eu, (Na, Li) Eu (W, Mo)
2O
8In a kind of mixture; YAG:Ce in the mixture wherein
3+And/or YAG:Tb
3+Quality account for the 20%-100% of mixture gross mass.
Preferred above-mentioned high molecular polymer is Merlon, acrylic, polypropylene or polyester resin, more preferably Merlon or acrylic.
The present invention also provides the manufacturing approach of above-mentioned LED light converting plate, and concrete steps are:
(1) the respectively fluorescent material and the high molecular polymerization raw material of weighing certain mass in proportion;
(2) fluorescent material and high molecular polymerization raw material are mixed after, add in the extruder;
(3) configure the temperature of extruder, the mixture of fluorescent material and high molecular polymerization raw material is evenly extruded;
(4) mixture of fluorescent material of extruding and high molecular polymer is processed light converting plate through forming processes.
In the method for above-described manufacturing LED light converting plate: the particle size range of preferred above-mentioned fluorescent material is 1-100 μ m; The high molecular polymerization raw material is a particulate material, and the scope of particle diameter is 1-5000 μ m.The temperature of described extruder is 100-300 ℃.The method of described making sheet is that mold pressing, injection moulding or cooling are rolled.Be shaped as plane, sphere or other Design of Luminaires of the described light converting plate of processing need curved slab.
Beneficial effect:
At first produce the LED light converting plate, adopt this LED light converting plate of the present invention to make the LED light fixture then, compared with prior art, advantage is:
(1) this light converting plate manufacturing approach is simple, and technical threshold is low, can make on a large scale;
(2) adopt this LED light converting plate to make the whole lamp of LED; Fluorescent material and chip be not in contact with one another; But keep certain distance; The influence of fluorescent material with regard to not receiving chip cooling more like this, quantum efficiency can remain on the higher level in a long time, has directly prolonged the service life of light fixture.
(3) because this light converting plate is easily manufactured, and uniformity is high, after being used for whole lamp and making, can make between the light fixture of different batches all to keep uniformity highly.Save the operation that single LEDs light source is sorted simultaneously, improved production efficiency greatly.
(4) adopting the LED light fixture of this light converting plate manufacturing is area source, efficiently solves glare problem.
The specific embodiment
Embodiment 1: take by weighing 1kg YAG:Ce respectively
3+Fluorescent material (particle diameter is 1-30 μ m) and 5kg Merlon raw material (particle diameter is 1-200 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 180 ℃; Fluorescent material and Merlon raw mix are evenly extruded, then the mixture of extruding is rolled processing through supercooling, promptly can be made into the plane light converting plate.
Embodiment 2: take by weighing 1kg YAG:Ce respectively
3+Fluorescent material (particle diameter is 50-100 μ m) and 10kg Merlon raw material (particle diameter is 300-1500 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 150 ℃; Fluorescent material and Merlon raw mix are evenly extruded, then the mixture of extruding is handled through injection moulding, promptly can be made into the spherical light converting plate.
Embodiment 3: take by weighing 1kg YAG:Ce respectively
3+Fluorescent material (particle diameter is 80-100 μ m) and 20kg Merlon raw material (particle diameter is 2000-5000 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 170 ℃; Fluorescent material and Merlon raw mix are evenly extruded, then the mixture of extruding is handled through mold pressing, promptly can be made into the spherical light converting plate.
Embodiment 4: take by weighing 1kg YAG:Ce respectively
3+Fluorescent material (particle diameter is 20-50 μ m) and 5kg acrylic raw material (particle diameter is 100-1000 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 180 ℃; Fluorescent material and acrylic raw mix are evenly extruded, then the mixture of extruding is rolled processing through supercooling, promptly can be made into the plane light converting plate.
Embodiment 5: take by weighing 1kg YAG:Ce respectively
3+Fluorescent material (particle diameter is 1-20 μ m) and 10kg pp material (particle diameter is 20-100 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 180 ℃; Fluorescent material and pp material mixture are evenly extruded, then the mixture of extruding is rolled processing through supercooling, promptly can be made into the plane light converting plate.
Embodiment 6: take by weighing 1kg YAG:Ce respectively
3+, 0.5kg YAG:Tb
3+Fluorescent material (particle diameter is 5-80 μ m) and 10kg acrylic raw material (particle diameter is 50-300 μ m); Fluorescent material and acrylic raw material are mixed in the back adding extruder; Setting extruder temperature is 200 ℃; Fluorescent material and acrylic raw mix are evenly extruded, then the mixture of extruding is handled through injection moulding, promptly can be made into the spherical light converting plate.
Embodiment 7: take by weighing 0.5kg YAG:Ce respectively
3+, 0.5kg YAG:Tb
3+, 0.1Sr
2Si
5N
8: Eu fluorescent material (particle diameter is 70-100 μ m) and 20kg Merlon raw material (particle diameter is 300-2000 μ m); Fluorescent material and Merlon are mixed in the back adding extruder; Setting extruder temperature is 250 ℃; Fluorescent material and Merlon raw mix are evenly extruded, then the mixture of extruding is handled through mold pressing, promptly can be made into the spherical light converting plate.
Embodiment 8: take by weighing 1kg YAG:Tb respectively
3+, 0.05Sr
2Si
5N
8: Eu, 0.03Ca (Mo, W) O
4: Eu; Sm fluorescent material (particle diameter is 60-80 μ m) and 15kg acrylic raw material (particle diameter is 1000-4000 μ m); Fluorescent material and acrylic are mixed in the back adding extruder, and setting extruder temperature is 180 ℃, and fluorescent material and acrylic raw mix are evenly extruded; Then the mixture of extruding is handled through injection moulding, promptly can be made into the spherical light converting plate.
Embodiment 9: take by weighing 0.1kg YAG:Ce respectively
3+, 1kg YAG:Tb
3+, 0.03Ca (Mo, W) O
4: Eu, Sm, 0.05Sr
2Si
5N
8: Eu, 0.01 (Ca, Sr) AlSiN
3: Eu fluorescent material (particle diameter is 90-100 μ m) and 20kg polyester resin raw material (particle diameter is 4000-5000 μ m); Fluorescent material and polyester resin are mixed in the back adding extruder; Setting extruder temperature is 300 ℃; Fluorescent material and polyester resin raw mix are evenly extruded, then the mixture of extruding is rolled processing through supercooling, promptly can be made into the plane light converting plate.
Embodiment 10: take by weighing 1kg YAG:Tb respectively
3+, fluorescent material (particle diameter is 10-20 μ m) and 10kg pp material (particle diameter is 100-500 μ m); The two is mixed the back adds in the extruder; Setting extruder temperature is 200 ℃; Fluorescent material and pp material mixture are evenly extruded, then the mixture of extruding is handled through mold pressing, promptly can be made into the spherical light converting plate.
Claims (4)
1. a LED light converting plate is characterized in that raw material consists of fluorescent material and high molecular polymer, and wherein the mass ratio of fluorescent material and high molecular polymer is 1: 5-20; The thickness of light converting plate is 0.5-5mm; Wherein said fluorescent material is YAG:Tb
3+, or YAG:Tb
3+Be at least Ba
3MgSi
2O
8: Eu, Mn, Ca (Mo, W) O
4: Eu, Sm, (Sr, Ca) S:Eu, Sr
2Si
5N
8: Eu, (Ca, Sr) AlSiN
3: Eu, (Na, Li) Eu (W, Mo)
2O
8In any one mixture; YAG:Tb in the mixture wherein
3+Quality account for the 20%-100% of mixture gross mass; The particle size range of fluorescent material is 1-100 μ m; The high molecular polymerization raw material is a particulate material, and the scope of particle diameter is 1-5000 μ m; Made by following method, concrete steps are:
(1) the respectively fluorescent material and the high molecular polymerization raw material of weighing certain mass in proportion;
(2) fluorescent material and high molecular polymerization raw material are mixed after, add in the extruder;
(3) configure the temperature of extruder, the mixture of fluorescent material and high molecular polymerization raw material is evenly extruded;
(4) mixture of fluorescent material of extruding and high molecular polymer is processed light converting plate through forming processes; The light converting plate of processing be shaped as plane, sphere or curved slab.
2. LED light converting plate according to claim 1 is characterized in that described high molecular polymer is Merlon, acrylic, polypropylene or polyester resin.
3. LED light converting plate according to claim 1, the temperature that it is characterized in that extruder is 100-300 ℃.
4. LED light converting plate according to claim 1, the method that it is characterized in that forming processes are that mold pressing, injection moulding or cooling are rolled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910264566A CN101737723B (en) | 2009-12-28 | 2009-12-28 | LED light conversion plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910264566A CN101737723B (en) | 2009-12-28 | 2009-12-28 | LED light conversion plate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101737723A CN101737723A (en) | 2010-06-16 |
| CN101737723B true CN101737723B (en) | 2012-09-19 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910264566A Expired - Fee Related CN101737723B (en) | 2009-12-28 | 2009-12-28 | LED light conversion plate and manufacturing method thereof |
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| Country | Link |
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Families Citing this family (10)
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| CN102468373A (en) * | 2010-11-10 | 2012-05-23 | 詹国光 | Manufacturing method for cover plate, and method for manufacturing packaged light-emitting diode by using cover plate |
| JP2013546184A (en) * | 2010-11-10 | 2013-12-26 | ▲セン▼國光 | Cover fabrication method and packaged light emitting diode fabrication method |
| CN102337017B (en) * | 2011-08-17 | 2012-10-31 | 金发科技股份有限公司 | Polycarbonate composition with LED (Light-emitting Diode) photoconversion function and application thereof |
| CN102344660A (en) * | 2011-09-30 | 2012-02-08 | 常熟市亚太荧光材料有限公司 | LED (Light-Emitting Diode) fluorescent sheet material and preparation method thereof |
| CN103378225A (en) * | 2012-04-25 | 2013-10-30 | 比亚迪股份有限公司 | Manufacturing method of LED assembly and LED assembly |
| CN102721003A (en) * | 2012-05-21 | 2012-10-10 | 苏州晶品光电科技有限公司 | LED fluorescent lampshade and manufacturing method thereof |
| CN102820413B (en) * | 2012-08-17 | 2015-08-12 | 江苏脉锐光电科技有限公司 | A kind of fluorescent resin component and manufacture method |
| CN107841797A (en) * | 2017-11-10 | 2018-03-27 | 江阴金盟纺织有限公司 | A kind of Novel luminous long filament and preparation method thereof |
| CN107840660B (en) * | 2017-12-02 | 2020-03-31 | 重庆文理学院 | Preparation method of semitransparent curved surface YAG fluorescent thin ceramic |
| CN112321155B (en) * | 2020-11-06 | 2022-11-25 | 焦作市吉成磁电有限公司 | Laser lighting assembly and method of manufacturing the same |
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2009
- 2009-12-28 CN CN200910264566A patent/CN101737723B/en not_active Expired - Fee Related
Patent Citations (6)
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| CN1264228C (en) * | 1996-06-26 | 2006-07-12 | 奥斯兰姆奥普托半导体股份有限两合公司 | Light-emitting semi-conductor component with luminescence conversion element |
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Assignee: LIGHT INDUSTRY DEPARTMENT THE Research Institute OF NANJING ELECTRIC LIGHT SOURCE MATERIALS Assignor: Nanjing Tech University Contract record no.: 2010320000901 Denomination of invention: LED light converting plate and manufacturing method thereof License type: Exclusive License Open date: 20100616 Record date: 20100712 |
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Application publication date: 20100616 Assignee: JIANGSU YITA NEW MATERIAL TECHNOLOGY Co.,Ltd. Assignor: Nanjing Tech University Contract record no.: 2016320000030 Denomination of invention: LED light converting plate and manufacturing method thereof Granted publication date: 20120919 License type: Common License Record date: 20160226 |
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