CN101735744A - 一种太阳能电池用eva热溶胶片 - Google Patents
一种太阳能电池用eva热溶胶片 Download PDFInfo
- Publication number
- CN101735744A CN101735744A CN 200810231006 CN200810231006A CN101735744A CN 101735744 A CN101735744 A CN 101735744A CN 200810231006 CN200810231006 CN 200810231006 CN 200810231006 A CN200810231006 A CN 200810231006A CN 101735744 A CN101735744 A CN 101735744A
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- Prior art keywords
- hot melt
- melt adhesive
- adhesive sheet
- solar battery
- eva hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 19
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 45
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 42
- 238000004090 dissolution Methods 0.000 claims description 13
- -1 silane compound Chemical class 0.000 claims description 10
- 230000003712 anti-aging effect Effects 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229930195725 Mannitol Natural products 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- XTNRHLDLGNQMCW-UHFFFAOYSA-N acetic acid;1,1'-biphenyl Chemical compound CC(O)=O.C1=CC=CC=C1C1=CC=CC=C1 XTNRHLDLGNQMCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 229940087101 dibenzylidene sorbitol Drugs 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 239000000594 mannitol Substances 0.000 claims description 2
- 235000010355 mannitol Nutrition 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 229960004249 sodium acetate Drugs 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 2
- NESLWCLHZZISNB-UHFFFAOYSA-M sodium phenolate Chemical compound [Na+].[O-]C1=CC=CC=C1 NESLWCLHZZISNB-UHFFFAOYSA-M 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 4
- 238000010248 power generation Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 239000004417 polycarbonate Substances 0.000 abstract description 2
- 229920000515 polycarbonate Polymers 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 239000002667 nucleating agent Substances 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000005340 laminated glass Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- NOSXUFXBUISMPR-UHFFFAOYSA-N 1-tert-butylperoxyhexane Chemical class CCCCCCOOC(C)(C)C NOSXUFXBUISMPR-UHFFFAOYSA-N 0.000 description 2
- GLISOBUNKGBQCL-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(C)CCCN GLISOBUNKGBQCL-UHFFFAOYSA-N 0.000 description 2
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- PYOLJOJPIPCRDP-UHFFFAOYSA-N 1,1,3-trimethylcyclohexane Chemical class CC1CCCC(C)(C)C1 PYOLJOJPIPCRDP-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- SYJCOHSRXJVNRT-UHFFFAOYSA-N ethoxy-dimethyl-propoxysilane Chemical compound CCCO[Si](C)(C)OCC SYJCOHSRXJVNRT-UHFFFAOYSA-N 0.000 description 1
- GKQONXBVXBMBRB-UHFFFAOYSA-N ethoxy-methyl-propoxysilane Chemical compound C[SiH](OCCC)OCC GKQONXBVXBMBRB-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (9)
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CN 200810231006 CN101735744B (zh) | 2008-11-24 | 2008-11-24 | 一种太阳能电池用eva热溶胶片 |
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CN 200810231006 CN101735744B (zh) | 2008-11-24 | 2008-11-24 | 一种太阳能电池用eva热溶胶片 |
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CN101735744A true CN101735744A (zh) | 2010-06-16 |
CN101735744B CN101735744B (zh) | 2012-06-06 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101942170A (zh) * | 2010-09-25 | 2011-01-12 | 杭州福斯特光伏材料股份有限公司 | 一种聚合物封装材料及其应用 |
CN102408841A (zh) * | 2011-09-19 | 2012-04-11 | 陈光伟 | 高透光率太阳能电池封装用eva胶膜及其制备方法 |
CN102569467A (zh) * | 2012-03-13 | 2012-07-11 | 北京东方雨虹防水技术股份有限公司 | 一种自粘型模块化的晶体硅太阳能电池组件 |
CN102775944A (zh) * | 2011-01-30 | 2012-11-14 | 苏州尚善新材料科技有限公司 | 一种密封胶条及其使用方法 |
CN103468167A (zh) * | 2013-08-13 | 2013-12-25 | 安徽东方金河精密机械制造有限公司 | 一种抗紫外线eva热熔胶 |
CN103820052A (zh) * | 2014-03-06 | 2014-05-28 | 张家港市互惠光电有限公司 | 一种bivp组件上可熔化的胶带 |
CN105027303A (zh) * | 2013-03-08 | 2015-11-04 | 希爱化成株式会社 | 太阳能电池用密封件和太阳能电池模块 |
CN108018002A (zh) * | 2017-12-18 | 2018-05-11 | 常州市好利莱光电科技有限公司 | 一种抗老化粘结型太阳能电池封装胶膜的制备方法 |
CN108219690A (zh) * | 2016-12-22 | 2018-06-29 | 上海海优威新材料股份有限公司 | 用于封装的高折射率的乙烯醋酸乙烯酯胶膜及其相应的封装方法 |
CN109486426A (zh) * | 2018-11-13 | 2019-03-19 | 广州市隆创新材料有限公司 | 一种防白雾、防蓝光的热熔光学胶及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG42380A1 (en) * | 1995-06-08 | 1997-08-15 | Sekisui Chemical Co Ltd | An interlayer film and laminated glass using the same |
-
2008
- 2008-11-24 CN CN 200810231006 patent/CN101735744B/zh not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101942170B (zh) * | 2010-09-25 | 2012-07-25 | 杭州福斯特光伏材料股份有限公司 | 一种聚合物封装材料及其应用 |
CN101942170A (zh) * | 2010-09-25 | 2011-01-12 | 杭州福斯特光伏材料股份有限公司 | 一种聚合物封装材料及其应用 |
CN102775944A (zh) * | 2011-01-30 | 2012-11-14 | 苏州尚善新材料科技有限公司 | 一种密封胶条及其使用方法 |
CN102408841A (zh) * | 2011-09-19 | 2012-04-11 | 陈光伟 | 高透光率太阳能电池封装用eva胶膜及其制备方法 |
CN102569467B (zh) * | 2012-03-13 | 2015-08-12 | 北京东方雨虹防水技术股份有限公司 | 一种自粘型模块化的晶体硅太阳能电池组件 |
CN102569467A (zh) * | 2012-03-13 | 2012-07-11 | 北京东方雨虹防水技术股份有限公司 | 一种自粘型模块化的晶体硅太阳能电池组件 |
CN105027303A (zh) * | 2013-03-08 | 2015-11-04 | 希爱化成株式会社 | 太阳能电池用密封件和太阳能电池模块 |
CN103468167B (zh) * | 2013-08-13 | 2016-02-10 | 安徽东方金河精密机械制造有限公司 | 一种抗紫外线eva热熔胶 |
CN103468167A (zh) * | 2013-08-13 | 2013-12-25 | 安徽东方金河精密机械制造有限公司 | 一种抗紫外线eva热熔胶 |
CN103820052A (zh) * | 2014-03-06 | 2014-05-28 | 张家港市互惠光电有限公司 | 一种bivp组件上可熔化的胶带 |
CN103820052B (zh) * | 2014-03-06 | 2017-02-01 | 张家港市互惠光电有限公司 | 一种bivp组件上可熔化的胶带 |
CN108219690A (zh) * | 2016-12-22 | 2018-06-29 | 上海海优威新材料股份有限公司 | 用于封装的高折射率的乙烯醋酸乙烯酯胶膜及其相应的封装方法 |
CN108018002A (zh) * | 2017-12-18 | 2018-05-11 | 常州市好利莱光电科技有限公司 | 一种抗老化粘结型太阳能电池封装胶膜的制备方法 |
CN109486426A (zh) * | 2018-11-13 | 2019-03-19 | 广州市隆创新材料有限公司 | 一种防白雾、防蓝光的热熔光学胶及其制备方法 |
CN109486426B (zh) * | 2018-11-13 | 2021-05-18 | 广州市隆创新材料有限公司 | 一种防白雾、防蓝光的热熔光学胶及其制备方法 |
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