CN101733573B - 电子工业用无铅无卤环保焊膏 - Google Patents
电子工业用无铅无卤环保焊膏 Download PDFInfo
- Publication number
- CN101733573B CN101733573B CN200910212873A CN200910212873A CN101733573B CN 101733573 B CN101733573 B CN 101733573B CN 200910212873 A CN200910212873 A CN 200910212873A CN 200910212873 A CN200910212873 A CN 200910212873A CN 101733573 B CN101733573 B CN 101733573B
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- Prior art keywords
- free
- halogen
- resin
- lead
- soldering paste
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005476 soldering Methods 0.000 title claims abstract description 46
- 230000007613 environmental effect Effects 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 12
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 11
- 239000012190 activator Substances 0.000 claims abstract description 10
- 239000000654 additive Substances 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 8
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 8
- 150000002367 halogens Chemical class 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000003381 stabilizer Substances 0.000 claims abstract description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000007524 organic acids Chemical class 0.000 claims abstract description 4
- 150000003839 salts Chemical class 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 235000006708 antioxidants Nutrition 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- GSLTVFIVJMCNBH-UHFFFAOYSA-N 2-isocyanatopropane Chemical class CC(C)N=C=O GSLTVFIVJMCNBH-UHFFFAOYSA-N 0.000 claims description 2
- HNHVTXYLRVGMHD-UHFFFAOYSA-N n-butyl isocyanate Chemical class CCCCN=C=O HNHVTXYLRVGMHD-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 9
- -1 halogen salt Chemical class 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 6
- 150000001412 amines Chemical class 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract 2
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000000047 product Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- SLLDUURXGMDOCY-UHFFFAOYSA-N 2-butyl-1h-imidazole Chemical compound CCCCC1=NC=CN1 SLLDUURXGMDOCY-UHFFFAOYSA-N 0.000 description 2
- FRENWXHQIOTWRD-UHFFFAOYSA-N 6-phenyl-1h-benzimidazole Chemical compound C=1C=C2NC=NC2=CC=1C1=CC=CC=C1 FRENWXHQIOTWRD-UHFFFAOYSA-N 0.000 description 2
- 206010009866 Cold sweat Diseases 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- HSHXDCVZWHOWCS-UHFFFAOYSA-N N'-hexadecylthiophene-2-carbohydrazide Chemical compound CCCCCCCCCCCCCCCCNNC(=O)c1cccs1 HSHXDCVZWHOWCS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 2
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 2
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CITXLKJETNPCOT-UHFFFAOYSA-N 2-methylideneoctadecanamide Chemical compound CCCCCCCCCCCCCCCCC(=C)C(N)=O CITXLKJETNPCOT-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000012296 anti-solvent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical class CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
测试编号 | 润湿级别 | 焊料球实验 | 坍陷实验 | 铜镜腐蚀实验 |
1 | 1级 | 1级 | 合格 | 不穿透 |
2 | 1级 | 2级 | 合格 | 不穿透 |
3 | 2级 | 1级 | 合格 | 不穿透 |
4 | 1级 | 1级 | 合格 | 不穿透 |
5 | 1级 | 2级 | 合格 | 不穿透 |
6 | 2级 | 1级 | 合格 | 不穿透 |
7 | 1级 | 1级 | 合格 | 不穿透 |
8 | 1级 | 1级 | 合格 | 不穿透 |
9 | 1级 | 1级 | 合格 | 不穿透 |
10 | 2级 | 1级 | 合格 | 不穿透 |
11 | 2级 | 2级 | 合格 | 不穿透 |
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910212873A CN101733573B (zh) | 2009-11-04 | 2009-11-04 | 电子工业用无铅无卤环保焊膏 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910212873A CN101733573B (zh) | 2009-11-04 | 2009-11-04 | 电子工业用无铅无卤环保焊膏 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101733573A CN101733573A (zh) | 2010-06-16 |
CN101733573B true CN101733573B (zh) | 2012-09-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200910212873A Active CN101733573B (zh) | 2009-11-04 | 2009-11-04 | 电子工业用无铅无卤环保焊膏 |
Country Status (1)
Country | Link |
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CN (1) | CN101733573B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102950395A (zh) * | 2012-10-16 | 2013-03-06 | 高新锡业(惠州)有限公司 | 一种环保焊锡膏 |
CN105014253A (zh) * | 2014-04-30 | 2015-11-04 | 江苏博迁新材料有限公司 | 一种无铅焊锡膏及其制备方法 |
CN104785949B (zh) * | 2015-05-12 | 2017-04-26 | 昆山成利焊锡制造有限公司 | 掺杂镀锡合金粉的焊锡粉及包含其的焊膏 |
CN105921905A (zh) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | 一种环保焊锡膏及其制备方法 |
CN107442970A (zh) * | 2017-08-10 | 2017-12-08 | 东北大学 | 低温焊膏用免清洗助焊剂及其制备方法 |
CN107891232B (zh) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | 一种无铅无卤助焊膏及其制备方法 |
CN111360347B (zh) * | 2020-03-06 | 2022-07-05 | 深圳市唯特偶新材料股份有限公司 | 一种改善5g通讯模块焊接性能的方法 |
CN114571126A (zh) * | 2022-03-18 | 2022-06-03 | 厦门市及时雨焊料有限公司 | 一种激光焊锡膏及其制备方法和激光焊接工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1569384A (zh) * | 2004-04-27 | 2005-01-26 | 四川大学 | 电子工业用焊膏 |
CN1709638A (zh) * | 2005-08-12 | 2005-12-21 | 北京工业大学 | 无铅焊膏用松香型无卤素助焊剂 |
CN1876311A (zh) * | 2006-04-30 | 2006-12-13 | 北京市航天焊接材料厂 | 无铅无卤素锡焊膏及其制备方法 |
-
2009
- 2009-11-04 CN CN200910212873A patent/CN101733573B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1569384A (zh) * | 2004-04-27 | 2005-01-26 | 四川大学 | 电子工业用焊膏 |
CN1709638A (zh) * | 2005-08-12 | 2005-12-21 | 北京工业大学 | 无铅焊膏用松香型无卤素助焊剂 |
CN1876311A (zh) * | 2006-04-30 | 2006-12-13 | 北京市航天焊接材料厂 | 无铅无卤素锡焊膏及其制备方法 |
Non-Patent Citations (1)
Title |
---|
JP特开平6-312291A 1994.11.08 |
Also Published As
Publication number | Publication date |
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CN101733573A (zh) | 2010-06-16 |
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Effective date of registration: 20141029 Address after: 516100 Nangang Road, lower South Industrial Zone, Garden Town, Huizhou County, Boluo, Guangdong Patentee after: Gaoxin Tin Industry (Huizhou) Co.,Ltd. Address before: 215331 No. 20-1 Zhu Zhu Road, Lu Jia town, Jiangsu, Kunshan Patentee before: Kunshan Chengli Solder Manufacturing Co.,Ltd. Patentee before: Gaoxin Tin Industry (Huizhou) Co.,Ltd. |
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Effective date of registration: 20220401 Address after: 516000 Yuan Zhou Zhen Tian tou Cun Hong Bian Tian (local name), BOLUO County, Huizhou City, Guangdong Province Patentee after: Huizhou Chengli Industry Co.,Ltd. Address before: 516100 Nangang Road, Xianan Industrial Zone, Yuanzhou Town, BOLUO County, Huizhou City, Guangdong Province Patentee before: Gaoxin Tin Industry (Huizhou) Co.,Ltd. |
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Effective date of registration: 20240116 Address after: 516123 Yuan Zhou Zhen Xia Nan Cun Nan Jiang Lu, Boluo County, Huizhou City, Guangdong Province Patentee after: Guangdong Chengli New Material Technology Co.,Ltd. Address before: 516000 Yuan Zhou Zhen Tian tou Cun Hong Bian Tian (local name), BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou Chengli Industry Co.,Ltd. |
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