CN101719492B - Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof - Google Patents
Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof Download PDFInfo
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- CN101719492B CN101719492B CN2009101103288A CN200910110328A CN101719492B CN 101719492 B CN101719492 B CN 101719492B CN 2009101103288 A CN2009101103288 A CN 2009101103288A CN 200910110328 A CN200910110328 A CN 200910110328A CN 101719492 B CN101719492 B CN 101719492B
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- crystal particle
- transparent frame
- led crystal
- light
- fluorescent powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The invention relates to an encapsulating structure of a light-emitting diode (LED), comprising an LED bracket and an LED crystal grain fixed on the bottom plane of the LED bracket. The encapsulating structure of the LED also comprises a transparent frame and an encapsulating adhesive containing fluorescent powder, wherein the transparent frame is fixedly arranged on the LED bracket and circles the LED crystal grain so that the LED crystal grain is positioned in the center of the transparent frame; the encapsulating adhesive containing the fluorescent powder is filled in a space between the LED crystal grain and the transparent frame; and the upper surface of the encapsulating adhesive containing the fluorescent powder is a thin layer which has uniform thickness and slightly dents downwards. The invention also discloses an encapsulating method. The invention can well utilize rays on all lighting surfaces of the LED crystal grain to further uniformly excite the fluorescent powder, has the advantages of high light source utilization rate, LED superheat degree retardancy, energy saving, brightness enhancement, and the like.
Description
Technical field
The present invention relates to a kind of encapsulating structure of light-emitting diode, especially relate to a kind of encapsulating structure and method for packing thereof of light-emitting diode.
Background technology
Light-emitting diode abbreviates LED as.Diode by the compound of gallium (Ga) and arsenic (AS), phosphorus (P) is made can give off visible light when electronics and hole-recombination, thereby can be used for making light-emitting diode, as indicator light, perhaps forms literal or numeral demonstration in circuit and instrument.The gallium arsenide phosphide diode glows, gallium phosphide diode green light, silicon carbide diode jaundice light.
Light-emitting diode is a kind of of semiconductor diode, can change into luminous energy to electric energy; Often be abbreviated as LED.Light-emitting diode is the same with general-purpose diode to be made up of a PN junction, also has unilateral conduction.After adding forward voltage to light-emitting diode, be injected into the hole in N district from the P district and be injected into the electronics in P district by the N district, near PN junction in several microns respectively with the electronics in N district and the hole-recombination in P district, produce the fluorescence of spontaneous radiation.Electronics is different with the residing energy state in hole in the different semi-conducting materials.What are different for the energy that discharges during with hole-recombination when electronics, and the energy that discharges is many more, and the light wavelength of then sending is short more.Commonly used is glows, the diode of green glow or gold-tinted.
Compare with light sources such as small filament lamp bubble and neon lamps, the characteristics of light-emitting diode have operating voltage very low (more several volts that have); Operating current very little (the only zero point that has several milliamperes can be luminous); Shock resistance and anti-seismic performance are good, the reliability height, and the life-span is long; The electric current power of passing through by modulation is the power of modulated luminescence easily.Because these characteristics are arranged, light-emitting diode is used as light source in some photoelectric control equipments, be used as Signal Monitor in many electronic equipments.
Simultaneously, by the effort of this area person skilled, light-emitting diode is the light source such as replace incandescent gradually in some fields, becomes the leading role in the lighting technology.Simultaneously, be structurally or on the manufacture method all to improve to some extent to light-emitting diode.
As shown in Figure 1, be traditional positive surface-emitting type White-light LED package structure schematic diagram, among the figure, traditional positive surface-emitting type White-light LED package structure comprise a package support 5 ', and be installed in the LED crystal grain 1 of described package support 5 ' inside ', described LED crystal grain 1 ' by lead 2 ' electrically connect with the internal electrode 6 that is installed in described package support 5 ' interior ' formation, and be connected to the outer electrode 9 that is in described package support 5 ' outside ', described LED crystal grain 1 ' by be filled in described package support 5 ' inside and upper surface contain fluorescent powder 11 ' packing colloid 4 ' form secondary encapsulation.
As the patent No. is 02140284.1, the encapsulating structure of master and slave type light-emitting diode by name and the Chinese invention patent of method are improved to the light-emitting diode of above-mentioned prior art: this invention " encapsulating structure of master and slave type light-emitting diode and method ", it is the LED encapsulation daughter element that LED crystal grain is packaged into surface mounted (SMD) earlier, enclose in package casing parent of another big tool groove with single or a plural number SMDLED again, form the encapsulating structure of master and slave type, its advantage is to make white light LEDs etc. when using the light-emitting diode of phosphor powder, the yield and the light uniformity that are packaged into the SMD type earlier are all very high, and can be according to brightness, the Vf of LED or photochromic x, the demand of y value is picked out suitable SMD LED earlier and is enclosed in the same structure, also structure fabrication goes out by many SMD type LED set to form single bigger high-power LED thus, has advantage on many processing procedures so be packaged into the structure of SMD the mode in the big tool groove package casing of enclosing again earlier.
By as can be seen above, the relevant timely personnel in prior art and follow-up this area, have certain progressive, but with regard to present technology, still have the deficiency of the following aspects for the luminous lighting field the improvement of light-emitting diode:
1, the light-emitting diode secondary encapsulating structure that prior art provided, because what it adopted is simple at LED crystal particle surface-coated fluorescent material, and then be fixed into spherical by transparent resin, the fluorescent material that such structure can cause being coated in the diode crystal particle surface is thicker and peripheral thinner at the thickness of middle position, cause light that its LED crystal particle sends stimulation effect difference to the middle position fluorescent material different with peripheral thickness, peripheral thickness is thinner, be easy to fully excite, and middle position is thicker, the fluorescent material of outer surface owing to internal layer fluorescent material to the absorption of light with stop the underexcitation state that is in, as the luminous intensity that improves crystal grain fully excites the fluorescent material of middle position extexine, then the fluorescent material of Zhou Bian thinner thickness will be in excessively and excite, make exciting of fluorescent material inhomogeneous, illumination effect is not good, luminous efficiency reduces, and light repeatedly reflects in the thicker phosphor powder layer of middle position and sends out and do not go out, not only cause the utilization ratio of light source low, and can cause light-emitting diode overheated, caused the waste of the energy.
2, simultaneously, because LED crystal particle is not that table is luminous, but it is stereo luminous, the light-emitting diode secondary encapsulating structure of prior art, when coating fluorescent powder, except that covering the crystal grain upper surface, also can around crystal grain, form very thick phosphor powder layer, and the light that the LED crystal particle side surface is sent is very poor to the stimulation effect of very thick like this phosphor powder layer, can not make full use of the light that the light-emitting diode side surface sends, the luminous efficiency of light-emitting diode is reduced.
3 and, because the coating of fluorescent material is inhomogeneous, the consumption that fluorescence is divided increases, and causes the raising greatly of cost, and the serious waste of resource.
Summary of the invention
In view of the above-mentioned problems in the prior art, the purpose of this invention is to provide and a kind ofly have the fluorescent material solid and evenly excite, the utilization ratio height of light source, and can slow down the light-emitting diode degree of superheat, energy savings, the encapsulating structure of the light-emitting diode of increase brightness.
For realizing above-mentioned purpose of the present invention, the object of the present invention is to provide a kind of encapsulating structure of light-emitting diode, comprising: a LED support; LED crystal particle, described LED crystal particle are fixed on the base plane of described LED support; Wherein, the encapsulating structure of described light-emitting diode also comprises a Transparent frame, described Transparent frame is fixedly set on the described LED support, and described Transparent frame circle residence is stated and is fixed in the LED crystal particle on the described LED support and makes described LED crystal particle be in the central authorities of described Transparent frame; The packing colloid that contains fluorescent powder, the described packing colloid that contains fluorescent powder are filled in the space between described LED crystal particle and the described Transparent frame; And the packing colloid that contains fluorescent powder that is in upper surface in the described packing colloid that contains fluorescent powder be thickness evenly and the slight thin layer of recess downwards.
After installing according to above-mentioned design, reach of the present invention its and had the utilization ratio height of light source, and can slow down the light-emitting diode degree of superheat, energy savings, while are more effectively utilized LED crystal particle side light, increase the purpose of brightness.Owing to can more effectively utilize the light that is in led sides, its brightness improves 30% at least.
According to above-mentioned design of the present invention, the height of described Transparent frame is greater than the height of described LED crystal particle; The thickness of the frame wall of described Transparent frame is between the 0.1-1.0mm; The described gap of thickness between described LED crystal particle sidewall and described Transparent frame inwall that contains the packing colloid of fluorescent powder is between the 0.1-1.0mm.Such design both can guarantee that the light source of light-emitting diode can effectively evenly excite, again can economical with materials.
According to above-mentioned design of the present invention, partly thickness equates between the minimum point of the thickness of the described packing colloid that contains fluorescent powder part between described LED crystal particle sidewall and described Transparent frame inwall and described LED crystal particle upper surface and the described packing colloid recess that contains fluorescent powder.Guaranteed that the packaging plastic physical efficiency that contains fluorescent powder roughly evenly excites, and effectively improves brightness.
According to above-mentioned design of the present invention, described Transparent frame is the Transparent frame that glass material Transparent frame or the mold pressing of transparent colloid material form, and the light transmittance of described Transparent frame is more than 1.4.Wherein, this transparent colloid material can be that silica gel or resin material form through mold pressing, and guarantees that its light transmittance is more than 1.4.
According to above-mentioned design of the present invention, described LED crystal particle is one; Or described LED crystal particle is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, and described LED crystal particle is regularly arranged on X-axis and Y-axis.
According to above-mentioned design of the present invention, described LED crystal particle is one; Or described LED crystal particle is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, the adjacent two LED crystal particle arrangement that misplaces on X-axis and Y-axis arbitrarily.
The invention also discloses a kind of light emitter diode seal method, wherein, described light emitter diode seal method comprises the steps:
Step 1, fixing LED crystal particle are fixedly connected on LED crystal particle on the base plane of described LED support;
Step 2, preparation Transparent frame;
Step 4, fill the packing colloid contain fluorescent powder, the packing colloid that will contain fluorescent powder is filled in the described Transparent frame and covers described LED crystal particle;
According to above-mentioned design of the present invention, described preparation Transparent frame comprises that single Transparent frame independently prepares or prepare the Transparent frame tube of certain-length then by physics cutting or laser cutting; And the frame wall light transmittance of described Transparent frame reached more than 1.4.Like this, in the preparation Transparent frame, just can be batch making, save cost to a certain extent.This transparent colloid material can be that silica gel or resin material form through mold pressing, and guarantees that its light transmittance is more than 1.4.
According to above-mentioned design of the present invention, described LED crystal particle is one; Or described LED crystal particle is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, and the regularly arranged or dislocation on X-axis and Y-axis of described LED crystal particle is arranged.
According to above-mentioned design of the present invention, the thickness of thickness between described LED crystal particle and described Transparent frame inwall that contains the packing colloid of fluorescent powder in the described step 5 is between the 0.1-1.0mm.Partly thickness equates between the minimum point of the thickness of the described packing colloid that contains fluorescent powder part between described LED crystal particle two side and described Transparent frame inwall and described LED crystal particle upper surface and described recess.
Advantage of the present invention and beneficial effect are, having remedied existing in prior technology fluorescent material excites inhomogeneous and marginal ray to utilize insufficient and makes the utilization ratio of light source low, brightness is low, causes light-emitting diode secondary encapsulating structure overheated easily, causes the waste of the energy.Have fluorescent material and excite evenly, the utilization ratio height of light source, brightness height and can slow down light-emitting diode secondary encapsulating structure degree of superheat, advantages such as energy savings.
Description of drawings
Fig. 1 is traditional positive surface-emitting type White-light LED package structure schematic diagram;
Fig. 2 is the sectional view of preferred embodiment of the encapsulating structure of light-emitting diode of the present invention;
Fig. 3 is the vertical view of preferred embodiment of the encapsulating structure of light-emitting diode of the present invention;
Fig. 4 is the flow chart of light emitter diode seal method of the present invention.
Embodiment
In order to further specify principle of the present invention and structure, existing in conjunction with the accompanying drawings to a preferred embodiment of the present invention will be described in detail, however the described embodiment usefulness for furnishing an explanation and explaining only can not be used for limiting scope of patent protection of the present invention.
The encapsulating structure of a kind of light-emitting diode as shown in Figures 2 and 3 comprises: a LED support 1; LED crystal particle 2, described LED crystal particle 2 is fixed on the base plane of described LED support 1; Wherein, the encapsulating structure of described light-emitting diode also comprises a Transparent frame 3, described Transparent frame 3 is fixedly set on the described LED support 1, and described Transparent frame 3 circle residences are stated and are fixed in the LED crystal particle 2 on the described LED support 1 and make described LED crystal particle 2 be in the central authorities of described Transparent frame 3; The packing colloid 4 that contains fluorescent powder, the described packing colloid 4 that contains fluorescent powder are filled in the space between described LED crystal particle 2 and the described Transparent frame 3; And the packing colloid that contains fluorescent powder that is in the surface in the described packing colloid 4 that contains fluorescent powder is thickness evenly and slight recess downwards.
After installing, reached of the present invention its and had fluorescent material and excite evenly, the utilization ratio height of light source, and can slow down the light-emitting diode degree of superheat, energy savings, the purpose of brightness of increasing according to above-mentioned design.Owing to can utilize the light source that is in led sides, its brightness improves 30% at least.
As shown in Figure 2, according to above-mentioned design of the present invention, the height of described Transparent frame 3 is greater than the height of described LED crystal particle 2; The thickness of the frame wall of described Transparent frame 3 is between the 0.1-1.0mm; The described thickness of thickness between described LED crystal particle 2 and described Transparent frame 3 inwalls that contains the packing colloid 4 of fluorescent powder is between the 0.1-1.0mm.
According to above-mentioned design of the present invention, partly thickness equates between the minimum point of the thickness of the described packing colloid 4 that contains fluorescent powder part between described LED crystal particle 2 two sides and described Transparent frame 3 inwalls and described LED crystal particle 2 upper surfaces and described packing colloid 4 recess that contain fluorescent powder.
According to above-mentioned design of the present invention, described Transparent frame 3 is the Transparent frame that glass material Transparent frame or the mold pressing of transparent colloid material form, and the light transmittance of described Transparent frame 3 is more than 1.4.
According to above-mentioned design of the present invention, described LED crystal particle 2 is one; Or described LED crystal particle 2 is a plurality of, and described a plurality of LED crystal particle 2 is coordinate with the base plane center of described LED support 1, and described LED crystal particle 2 is regularly arranged on X-axis and Y-axis.
According to above-mentioned design of the present invention, described LED crystal particle 2 is one; Or described LED crystal particle 2 is a plurality of, and described a plurality of LED crystal particle 2 is coordinate with the base plane center of described LED support 1, adjacent two LED crystal particle 2 arrangement that misplaces on X-axis and Y-axis arbitrarily.
As shown in Figure 4, the invention also discloses a kind of light emitter diode seal method, wherein, described light emitter diode seal method comprises the steps:
Step 1 S1, fixing LED crystal particle are fixedly connected on LED crystal particle on the base plane of described LED support;
Step 2 S2, preparation Transparent frame;
Step 4 S4, fill the packing colloid contain fluorescent powder, the packing colloid that will contain fluorescent powder is filled in the described Transparent frame and covers described LED crystal particle;
According to above-mentioned design of the present invention, described step 2 S2 prepares Transparent frame and comprises that single Transparent frame independently prepares or prepare the Transparent frame tube of certain-length then by physics cutting or laser cutting; And the frame wall light transmittance of described Transparent frame reached more than 1.4.Like this, in the preparation Transparent frame, just can be batch making, save cost to a certain extent.
According to above-mentioned design of the present invention, the described LED crystal particle 2 of described step 1 S1 is one or more, and described a plurality of LED crystal particle 2 is a coordinate with the base plane center of described LED support 1, adjacent two LED crystal particle 2 regularly arranged or dislocation arrangement on X-axis and Y-axis arbitrarily.
According to above-mentioned design of the present invention, the thickness of thickness between described LED crystal particle and described Transparent frame inwall that contains the packing colloid of fluorescent powder among the described step 5 S5 is between the 0.1-1.0mm.Partly thickness equates between the minimum point of the thickness of the described packing colloid that contains fluorescent powder part between described LED crystal particle two side and described Transparent frame inwall and described LED crystal particle upper surface and described recess.
Advantage of the present invention and beneficial effect are, having remedied existing in prior technology fluorescent material excites inhomogeneous, the LED crystal particle marginal ray utilizes insufficient, the utilization ratio of light source is low, brightness is low, cause light-emitting diode secondary encapsulating structure overheated easily, cause the deficiency of the aspects such as waste of the energy.Have fluorescent material and excite evenly, the utilization of LED crystal particle marginal ray is abundant, the utilization ratio height of light source, and the brightness height, and can slow down light-emitting diode secondary encapsulating structure degree of superheat, advantages such as energy savings.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, under the prerequisite that does not break away from this practicality invention, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. the encapsulating structure of a light-emitting diode comprises:
One LED support;
LED crystal particle, described LED crystal particle are fixed on the base plane of described LED support;
It is characterized in that:
The encapsulating structure of described light-emitting diode also comprises a Transparent frame, described Transparent frame is fixedly set on the described LED support, and described Transparent frame circle residence is stated and is fixed in the LED crystal particle on the described LED support and makes described LED crystal particle be in the central authorities of described Transparent frame;
The packing colloid that contains fluorescent powder, the described packing colloid that contains fluorescent powder are filled in the space between described LED crystal particle and the described Transparent frame; And
The packing colloid that contains fluorescent powder that is in upper surface in the described packing colloid that contains fluorescent powder is thickness evenly and slightly to lower recess.
2. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that:
The height of described Transparent frame is greater than the height of described LED crystal particle;
The thickness of the frame wall of described Transparent frame is between the 0.1-1.0mm;
The described thickness of thickness between described LED crystal particle sidewall and described Transparent frame inwall that contains the packing colloid of fluorescent powder is between the 0.1-1.0mm.
3. the encapsulating structure of light-emitting diode as claimed in claim 1 or 2 is characterized in that:
Described Transparent frame is the Transparent frame that glass material Transparent frame or the mold pressing of transparent colloid material form, and the light transmittance of described Transparent frame is more than 1.4.
4. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that:
Described LED crystal particle is one; Or
Described LED crystal particle is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, and described LED crystal particle is regularly arranged on X-axis and Y-axis.
5. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that:
Described LED crystal particle is one; Or
Described LED crystal particle is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, the adjacent two LED crystal particle arrangement that misplaces on X-axis and Y-axis arbitrarily.
6. light emitter diode seal method is characterized in that:
Described light emitter diode seal method comprises the steps:
Step 1, fixing LED crystal particle are fixedly connected on LED crystal particle on the base plane of described LED support;
Step 2, preparation Transparent frame, the height of described Transparent frame is greater than the height of described LED crystal particle;
Step 3, fixed installation Transparent frame are about to the described Transparent frame for preparing and are fixedly installed on the described LED support;
Step 4, fill the packing colloid contain fluorescent powder, the packing colloid that will contain fluorescent powder is filled in the described Transparent frame and covers described LED crystal particle;
Step 5, heating, drying, and make the described upper surface that contains the packing colloid of fluorescent powder be thickness evenly and slightly to lower recess.
7. light emitter diode seal method according to claim 6 is characterized in that:
Described preparation Transparent frame comprises that single Transparent frame independently prepares or prepare the Transparent frame tube of certain-length then by physics cutting or laser cutting; And the frame wall light transmittance of described Transparent frame reached more than 1.4.
8. light emitter diode seal method according to claim 6 is characterized in that:
The described LED crystal particle of described step 1 is a plurality of, and described a plurality of LED crystal particle is coordinate with the base plane center of described LED support, and the regularly arranged or dislocation on X-axis and Y-axis of adjacent two LED crystal particle is arranged arbitrarily.
9. light emitter diode seal method according to claim 6 is characterized in that:
The thickness of thickness between described LED crystal particle and described Transparent frame inwall that contains the packing colloid of fluorescent powder in the described step 5 is between the 0.1-1.0mm.
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| CN2009101103288A CN101719492B (en) | 2009-10-27 | 2009-10-27 | Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof |
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| CN102456819A (en) * | 2010-10-27 | 2012-05-16 | 英特明光能股份有限公司 | LED (Light-Emitting Diode) package structure |
| CN102299234A (en) * | 2011-06-13 | 2011-12-28 | 协鑫光电科技（张家港）有限公司 | Light emitting diode (LED) and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1220281C (en) * | 2002-07-03 | 2005-09-21 | 诠兴开发科技股份有限公司 | Package structure for composite LED and method thereof |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220281C (en) * | 2002-07-03 | 2005-09-21 | 诠兴开发科技股份有限公司 | Package structure for composite LED and method thereof |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
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