CN101719475A - Ball mounting method - Google Patents
Ball mounting method Download PDFInfo
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- CN101719475A CN101719475A CN200810170216A CN200810170216A CN101719475A CN 101719475 A CN101719475 A CN 101719475A CN 200810170216 A CN200810170216 A CN 200810170216A CN 200810170216 A CN200810170216 A CN 200810170216A CN 101719475 A CN101719475 A CN 101719475A
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- Prior art keywords
- ball
- substrate
- tool
- utensil
- weld
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Abstract
The invention relates to a ball method which comprises the following steps of: setting a substrate, wherein the substrate is provided with a plurality of weld pads arranged on the surface of the substrate in a pattered mode; utilizing a transfer tool to transfer a soldering flux to the weld pads, wherein the transfer tool is provided with a plurality of fully provided pins, and a part of the soldering flux is arranged on the surface of the substrate; setting a plurality of weld balls on a ball placing tool, wherein the ball placing tool is provided with a plurality of fully provided ball placing holes for placing the weld balls with full version; utilizing a ball adsorption tool to adsorb parts of the weld balls, wherein the ball adsorption tool is provided with a plurality of ball adsorption holes on positions corresponding to the weld pads; and setting the weld balls adsorbed on the ball adsorption tool on the soldering flux on the weld pads. The method for utilizing a shared ball tool saves the cost of new tools and the preposing time of the new tools.
Description
Technical field
The present invention relates to a kind of ball-establishing method, particularly a kind of ball grid array (Ball Grid Array, BGA) ball-establishing method of encapsulating products.
Prior art
Semiconductor science and technology promotes rapidly along with the function of products such as computer and network communication, the demand that must possess diversification, portable and frivolous microminiaturization, make the Chip Packaging industry must towards high efficiency, high density, light, approach and high precision technological development such as microminiaturization.
In addition, be the exquisite day by day demand of the function that adapts to sci-tech product and the increasing trend of pin count of IC encapsulation, the IC size is dwindled also just more urgent, utilizes the IC encapsulation of conventional surface gluing technique can't adapt to these requirements gradually.Therefore, market mainstream technology begins to be turned to by wire-frame type encapsulation and plants the encapsulation of ball formula.
Usually, generally the technology that needs to put the tin ball as the encapsulating products of ball grid array after finishing encapsulation promptly, is utilized ball-establishing method and inhales ball device the tin ball is arranged on the substrate.Yet existing ball-establishing method and device all can only be applicable to the application of single kind of encapsulating products, when different encapsulating structures need be planted ball technology, need design new ball-planting device to meet new substrate wiring.
Summary of the invention
For addressing the above problem, one of order of the present invention utilizes the sharable ball utensil of planting to save the manufacturing cost of utensil and the time that utensil is made for a kind of ball-establishing method is provided.
In order to achieve the above object, the ball-establishing method of the embodiment of the invention comprises the following steps: to be provided with substrate, and wherein substrate is arranged on a plurality of weld pads on the substrate surface with having patterning; Utilize the transfer utensil that scaling powder is transferred on the weld pad, wherein translator has the pins that a plurality of full versions are provided with, and the part scaling powder is arranged on the substrate surface; A plurality of soldered balls are set on the Place utensil, and wherein the Place utensil has a plurality of full version settings to place the Place hole of soldered ball; Utilize Device for absorbing ball tool absorbed portion soldered ball, wherein the Device for absorbing ball tool has a plurality of suction balls hole in the position corresponding with weld pad; And will be adsorbed on soldered ball on the Device for absorbing ball tool and be arranged on the scaling powder on the weld pad.
Below be described with reference to the accompanying drawings the effect that can be easier to understand purpose of the present invention, technology contents, characteristics and be reached by specific embodiment.
Description of drawings
Figure 1A to Fig. 1 G is the end view of structure of the ball-establishing method of the embodiment of the invention.
Each utensil of Fig. 2 A to Fig. 2 D embodiment of the invention or the part of structure are overlooked or upward view.
The primary clustering symbol description
| ??100 | Substrate |
| ??102 | Weld pad |
| ??104 | Base board unit |
| ??200 | Shift utensil |
| ??202 | Pin |
| ??300 | Scaling powder |
| ??400 | Soldered ball |
| ??500 | The Place utensil |
| ??502 | The Place hole |
| ??600 | The Device for absorbing ball tool |
| ??602 | Inhale the ball hole |
| ??604 | Air flue |
Embodiment
It is described in detail as follows, and described preferred embodiment only is used as explanation rather than is used for limiting the present invention.
Referring to figs. 1A to Fig. 1 G, Figure 1A to Fig. 1 G is the end view of structure of the ball-establishing method of the embodiment of the invention.The ball-establishing method of the embodiment of the invention comprises the following steps: at first, as Figure 1A, substrate 100 is set, and wherein substrate 100 is arranged on substrate 100 lip-deep a plurality of weld pads 102 with having patterning.Then,, utilize transfer utensil 200 that scaling powder 300 is transferred on the weld pad 102, wherein shift utensil 200 and have a plurality of pins 202 that full version is provided with reference to Figure 1B.In addition, the transfer utensil 200 that sticks scaling powder 300 is moved to substrate 100 tops, as Fig. 1 C.Scaling powder 300 is arranged on the weld pad 102 of substrate 100, shown in Fig. 1 D.In addition, with reference to figure 1E, a plurality of soldered balls 400 are arranged on the Place utensil 500, wherein Place utensil 500 has a plurality of Places hole 502 of full version setting to place soldered ball 400.With reference to figure 1F, utilize Device for absorbing ball tool 600 absorbed portion soldered balls 400, wherein Device for absorbing ball tool 600 has the suction ball hole 602 that a plurality of corresponding bond pad locations are provided with.At last, shown in Fig. 1 G, the soldered ball 400 that is adsorbed on the Device for absorbing ball tool 600 is arranged on the scaling powder 300 of weld pad 102.
From the above, in an embodiment, because of the pin 202 that shifts on the utensil 200 is provided with for full version, so partly scaling powder 300 can be set on the surface of substrate 100 in the process that shifts.In another embodiment, each on the Device for absorbing ball tool 600 is inhaled all corresponding air flue 604 in ball hole 602, and utilizes the method that vacuumizes that soldered ball 400 is adsorbed onto on the ball hole 602.Method of the present invention, no matter how weld pad 102 positions on the substrate 100 are provided with, only need change suction ball hole 602 Position Design of Device for absorbing ball tool 600, the pin 202 on the transfer utensil 200 and the stencil design in the Place hole 502 on the Place utensil 500 can be reused, this practice not only can shorten the lead time (lead time) of planting ball technology, also can reduce the cost of planting the ball utensil.
Below, with reference to figure 2A to Fig. 2 D, its part for each utensil of the embodiment of the invention or structure is overlooked or upward view.Shown in Fig. 2 A, this is the partial top view of substrate 100, and substrate 100 is a substrate strip, and substrate strip has the base board unit 104 that a plurality of arrays are provided with, and weld pad 102 patternings be arranged in each base board unit 104.Then, with reference to figure 2B and Fig. 2 C, it is respectively the part of shifting utensil 200 and Place utensil 500 and looks up or vertical view, as shown in the figure, to shift utensil 200 reusable with Place utensil 500 for convenient, and the pin 202 of sticking scaling powder all be a full version setting with 400 the Place hole 502 that soldered ball is set.In an embodiment, the size of soldered ball 400 is between between the 0.25mm to 0.45mm, and the spacing (pitch) that soldered ball 400 is provided with is about 0.55mm to 0.75mm.Last with reference to figure 2D, Fig. 2 D is the partial bottom view of Device for absorbing ball tool 600, among the figure configuration in suction ball hole 602 identical with weld pad 102 on the substrate 100, plant ball technology with what adapt to different package size structures.Be understandable that the weld pad design of Fig. 2 A and Fig. 2 D only is embodiment, does not limit the present invention.
According to above-mentioned, one of feature of the present invention utilizes the sharable spirit of part utensil structure to shorten the lead time of planting ball technology for a kind of ball-establishing method is provided, and also can reduce the cost of planting the ball utensil.In addition, in size of substrate, the soldered ball size of certain limit, plant under sphere gap or the package dimension, shifting utensil and Place utensil and all can share, is very flexible on the technology.
Comprehensively above-mentioned, the invention provides a kind of ball-establishing method, utilize sharable planting the time that the ball utensil is made with the manufacturing cost and the utensil of saving utensil.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who is familiar with this technology can understand content of the present invention and is implementing according to this, can not limit claim of the present invention with it, be that every equivalence of doing according to spirit disclosed in this invention changes or modification, must be encompassed in the claim of the present invention.
Claims (5)
1. ball-establishing method comprises the following step:
One substrate is set, and wherein said substrate has a plurality of patternings and is arranged on weld pad on this substrate surface;
Utilize a transfer utensil that scaling powder is transferred on described these weld pads, wherein said translator has a plurality of pins that full version is provided with, and described these scaling powders of part are arranged on the described substrate surface;
A plurality of soldered balls are set on the Place utensil, and wherein said Place utensil has a plurality of full versions and is provided with to place the Place hole of described these soldered balls;
Utilize described these soldered balls of a Device for absorbing ball tool absorbed portion, wherein said Device for absorbing ball tool has the suction ball hole that described these bond pad locations of a plurality of correspondences are provided with; And
Described these soldered balls that are adsorbed on the described Device for absorbing ball tool are arranged on described these scaling powders of described these weld pads.
2. ball-establishing method as claimed in claim 1, the size that it is characterized in that described these soldered balls is between between the 0.25mm to 0.45mm.
3. ball-establishing method as claimed in claim 1 is characterized in that the spacing of described these soldered ball settings is about 0.55mm to 0.75mm.
4. ball-establishing method as claimed in claim 1 is characterized in that the method that described these Device for absorbing ball tool utilizations vacuumize is adsorbed onto described these soldered balls on described these suction ball holes.
5. ball-establishing method as claimed in claim 1 is characterized in that described substrate is a substrate strip, and described substrate strip has the base board unit that a plurality of arrays are provided with, and described these weld pad patternings be arranged in each described these base board unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170216A CN101719475A (en) | 2008-10-09 | 2008-10-09 | Ball mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170216A CN101719475A (en) | 2008-10-09 | 2008-10-09 | Ball mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101719475A true CN101719475A (en) | 2010-06-02 |
Family
ID=42434028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810170216A Pending CN101719475A (en) | 2008-10-09 | 2008-10-09 | Ball mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101719475A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112045329A (en) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
-
2008
- 2008-10-09 CN CN200810170216A patent/CN101719475A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112045329A (en) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
| CN112045329B (en) * | 2020-09-07 | 2022-03-11 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100602 |