CN103489793B - The method forming soldered ball on the pad of substrate - Google Patents
The method forming soldered ball on the pad of substrate Download PDFInfo
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- CN103489793B CN103489793B CN201310370783.8A CN201310370783A CN103489793B CN 103489793 B CN103489793 B CN 103489793B CN 201310370783 A CN201310370783 A CN 201310370783A CN 103489793 B CN103489793 B CN 103489793B
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- pad
- solder
- substrate
- hollow
- soldered ball
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Providing a kind of method forming soldered ball on the pad of substrate, the method comprises the steps: to provide the substrate with pad；Placing hollow solder on the pad of substrate, hollow solder includes entity portion and the hollow bulb at least partly surrounded by entity portion；And centering missing solder material refluxes, to form soldered ball, wherein, the volume sum of the volume of the soldered ball volume less than entity portion and hollow bulb.
Description
Technical field
The present invention relates to the field of Electronic Packaging, more particularly, relate to a kind of method forming soldered ball on the pad of substrate.
Background technology
Fig. 1 is the schematic cross sectional views illustrating a kind of traditional package on package 10.With reference to Fig. 1, package on package 10 includes the upper packaging part 12 of stacking and lower packaging part 11.Upper packaging part 12 and lower packaging part 11 are traditional BGA (BGA) semiconductor package parts, and it has substrate, is provided with the wire of a plurality of patterning in substrate.Having multiple connection pad on the top of substrate, semiconductor chip wire bonding is to connecting pad.It addition, some region at substrate top is encapsulated by epoxy molding plastic and is formed encapsulating component so that semiconductor chip and lead-in wire are enclosed.Being stained with multiple soldered ball on the pad of base plate bottom, these soldered balls can be connected with layout wire in a substrate.Multiple soldered balls 13 of upper packaging part 12 are electrically connected to the pad being exposed to outside its encapsulating component and being located thereon on surface of lower packaging part 11, thus forming package on package 10.
Along with the development of Electronic Encapsulating Technology, soldered ball or the soldered ball of Ultra fine pitch that size is extra small just become to be becoming increasingly popular.Such as, it is even less that the spacing between soldered ball 13 in the package on package 10 shown in Fig. 1 has reached 0.35mm, and now the size (such as, diameter) of soldered ball 13 can be that 0.2mm is even less.More little or soldered ball the spacing of soldered ball is more little, it is meant that the number of the soldered ball can arranged in certain area is more many；And after backflow, the height of soldered ball is more little, contributes to realizing the encapsulation of high density, little thickness.
But, along with the reduction of size of solder ball, the layout of soldered ball becomes more and more difficult.It is difficulty with spacing by traditional soldered ball method for arranging to arrange at the soldered ball of below 0.3mm.Less welded ball array can be realized by Printing Paste, but the soldered ball formed by the method has uneven defect.Accordingly, it is difficult to be formed uniformly undersized soldered ball, especially when the size of soldered ball is when below 0.2mm.
Summary of the invention
It is an object of the present invention to provide a kind of method forming soldered ball on the pad of substrate of soldered ball that can form super-small or Ultra fine pitch.
Another object of the present invention is to provide a kind of method forming soldered ball on the pad of substrate that can be formed uniformly soldered ball.
A further object of the present invention is in that to provide a kind of method forming soldered ball on the pad of substrate being easy to realize by existing soldered ball attachment means.
The method forming soldered ball on the pad of substrate according to the present invention comprises the steps: to provide the substrate with pad；Placing hollow solder on the pad of substrate, hollow solder includes entity portion and the hollow bulb at least partly surrounded by entity portion；And centering missing solder material refluxes, to form soldered ball, wherein, the volume sum of the volume of the soldered ball volume less than entity portion and hollow bulb.
According to an aspect of the present invention, substrate is printed circuit board (PCB).
According to an aspect of the present invention, substrate also has the semiconductor chip molded being arranged on the surface contrary with the surface residing for pad.
According to an aspect of the present invention, the entity portion of hollow solder includes at least one in Sn-Ag-Cu, SnBi solder and SnCu solder.
According to an aspect of the present invention, the shape of hollow solder is tubular, spherical, hemispherical, segment-shaped, elliposoidal, semielliptical shape, polyhedron shape or irregular shape.
According to an aspect of the present invention, the step that centering missing solder material carries out refluxing includes the material of centering missing solder under vacuum conditions and refluxes.
According to an aspect of the present invention, the volume of soldered ball equals to or less than the 90% of the volume in entity portion and the volume sum of hollow bulb.
According to an aspect of the present invention, the diameter of soldered ball equals to or less than 0.2mm.
According to an aspect of the present invention, it is provided that the step with the substrate of pad includes providing the substrate with multiple pad；Placing the step of hollow solder on the pad of substrate and include with placement hollow solder on the identical technique each pad in the plurality of pad, the hollow solder being placed on multiple pad has homogeneous size, material and character；The step that centering missing solder material carries out refluxing includes by identical technique, the hollow solder being placed on multiple pad being refluxed, and is separately positioned on size on multiple pad and the homogeneous multiple soldered balls of character to be formed.
According to an aspect of the present invention, the diameter of each soldered ball being separately positioned in the multiple soldered balls on multiple pad equals to or less than 0.2mm, is separately positioned on the spacing between soldered ball adjacent in the multiple soldered balls on multiple pad equal to or less than 0.35mm.
Accompanying drawing explanation
By below in conjunction with the accompanying drawing description to embodiment, above and/or other aspect of the present invention and advantage will be clear from and be easier to understand, in the accompanying drawings:
Fig. 1 is the schematic cross sectional views illustrating a kind of traditional package on package；
Fig. 2 to Fig. 4 is the flow chart illustrating the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate；And
Fig. 5 illustrates the perspective view with reference to the hollow solder used in Fig. 2 to Fig. 4 method forming soldered ball on the pad of substrate described.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings to be more fully described the present invention, embodiments of the invention shown in the drawings.The present invention can implement in a number of different ways, and should not be understood as being limited to embodiments set forth here.In the accompanying drawings, for clarity, the size in layer and region can be exaggerated.
Fig. 2 to Fig. 4 is the flow chart illustrating the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate.Fig. 5 illustrates the perspective view with reference to the hollow solder used in Fig. 2 to Fig. 4 method forming soldered ball on the pad of substrate described.The method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate is described below with reference to Fig. 2 to Fig. 5.
With reference to Fig. 2, it is provided that have the substrate 100 of pad 110.Substrate 100 can be printed circuit board (PCB) (PCB), and can have the multiple pads 110 being disposed thereon on surface 120.Additionally, substrate 100 also can have the inner lead (not shown) of at least one the pad (not shown) arranged on the lower surface thereof and the pad being disposed therein to be connected on lower surface by pad 110.Additionally, the semiconductor chip molded can be provided with on the lower surface of substrate 110.Although Fig. 2 having illustrated two pads 110, but the quantity of pad 110 being unrestricted.
As shown in Figure 5, tubular hollow solder 200 include columnar entity portion 210 and by entity portion 210 partially around hollow bulb 220.The example of tubular hollow solder 200 includes all solders being suitable for carrying out refluxing, for instance SAC(Sn-Ag-Cu) solder, SnBi solder, at least one in SnCu solder.
With reference to Fig. 3 A, the pad 110 of substrate 100 is flatly placed tubular hollow solder 200.In this case, the longitudinal axis of tubular hollow solder 200 is arranged essentially parallel to pad 110 so that tubular hollow solder 200 is disposed horizontally on the pad 110 of substrate 100.
With reference to Fig. 3 B, optionally, the pad 110 of substrate 100 is placed vertically tubular hollow solder 200.In this case, the longitudinal axis of tubular hollow solder 200 is substantially perpendicular to pad 110 so that tubular hollow solder 200 is placed vertically on the pad 110 of substrate 100.
With reference to Fig. 4, tubular hollow solder 200 is refluxed, to form soldered ball 300.In the exemplary embodiment, it is possible under vacuum conditions tubular hollow solder 200 is refluxed, to form soldered ball 300.In the process that tubular hollow solder 200 is refluxed, the hollow bulb 220 of hollow solder 200 reduces or is eliminated.Therefore, the volume sum of the volume of the soldered ball 300 the formed volume less than the entity portion 210 of tubular hollow solder 200 and hollow bulb 220.In the exemplary embodiment, the volume of soldered ball 300 is the volume and less than the 90% of volume sum of hollow bulb 220, less than 80%, less than 70%, less than 60%, less than 50% or less than 40% in the entity portion 210 of tubular hollow solder 200.
Because the volume sum of the volume in the entity portion 210 of tubular hollow solder 200 and hollow bulb 220 is more than the volume of the soldered ball 300 of desired formation, so taking notice of that figure forms desired small size (such as, below diameter 0.2mm) soldered ball 300 time, it is possible on pad 110, place the size hollow solder 200 bigger than desired small size.In this case, because the size of hollow solder 200 is relatively large, it is possible to easily pass through existing soldered ball attachment means (such as, precoating tin cream and attachment) and place hollow solder 200.
Additionally, multiple tubular hollow solders 200 can be manufactured with homogeneous size, material and character.Therefore, there is the multiple tubular hollow solder 200 of homogeneous size, material and character by placing by identical technique and reflux, it is possible to obtain size and the homogeneous multiple soldered balls 300 of character.
Therefore, the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate can be formed uniformly the soldered ball of super-small or Ultra fine pitch.
Although in the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate described with reference to Fig. 2 to Fig. 5, the tubular hollow solder 200 of use has the cross section of closed annular, but the invention is not restricted to this.The shape of the cross section of tubular hollow solder 200 can be the elliptical ring of the annular of non-closed, Guan Bi or non-closed, polygon ring etc..
Although in the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate described with reference to Fig. 2 to Fig. 5, employing tubular hollow solder 200, but the invention is not restricted to this.In the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate, spendable hollow solder can be include entity portion and the spherical hollow solder of hollow bulb at least partly surrounded by entity portion, hemispherical hollow solder, segment-shaped hollow solder, elliposoidal hollow solder, semielliptical shape hollow solder, polyhedron shape hollow solder, irregular shape hollow solder etc..In such a case, it is possible to stably placed by suitable method, there is variously-shaped hollow solder.
Term " hollow bulb at least partly surrounded by entity portion " refer to hollow bulb by entity portion partially around or by entity portion completely about.In other words, the hollow solder used in the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate can be the hollow solder that hollow bulb is completely enclosed by entity portion, or the hollow solder that hollow bulb is not completely enclosed by entity portion and communicates with outside.
The method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate can be formed, by the hollow solder that size is relatively large, the soldered ball that size is relatively small, therefore, it is simple to realize the soldered ball of super-small or Ultra fine pitch.
Additionally, the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate uses relatively large hollow solder, thus, it is possible to make it easy hollow solder is placed by existing soldered ball attachment means (such as, precoating tin cream and attachment) in ground.
In addition, in the method forming soldered ball according to an exemplary embodiment of the present invention on the pad of substrate, identical technique can be used to place and reflux and there are multiple hollow solders of homogeneous size, material and character, therefore can obtain size and the homogeneous multiple soldered balls of character.
Although the exemplary embodiment with reference to the present invention specifically illustrates and describes the present invention, it will be appreciated by those skilled in the art that without departing from the spirit and scope of the present invention, can make the various changes in form and in details.
Claims (9)
1. the method forming soldered ball on the pad of substrate, described method comprises the steps:
The substrate with pad is provided；
Placing hollow solder on the pad of substrate, hollow solder includes entity portion and the hollow bulb at least partly surrounded by entity portion；And
Centering missing solder material refluxes, to form soldered ball,
Wherein, the volume sum of the volume of the soldered ball volume less than entity portion and hollow bulb,
Wherein, the diameter of soldered ball equals to or less than 0.2mm.
2. method according to claim 1, wherein, substrate is printed circuit board (PCB).
3. method according to claim 2, wherein, substrate also has the semiconductor chip molded being arranged on the surface contrary with the surface residing for pad.
4. method according to claim 1, wherein, the entity portion of hollow solder includes at least one in Sn-Ag-Cu, SnBi solder and SnCu solder.
5. method according to claim 1, wherein, the shape of hollow solder is tubular, spherical, segment-shaped, elliposoidal, semielliptical shape, polyhedron shape or irregular shape.
6. method according to claim 1, wherein, the step that centering missing solder material carries out refluxing includes the material of centering missing solder under vacuum conditions and refluxes.
7. method according to claim 1, wherein, the volume of soldered ball equals to or less than the 90% of the volume in entity portion and the volume sum of hollow bulb.
8. method according to claim 1, wherein,
The step providing the substrate with pad includes providing the substrate with multiple pad；
Placing the step of hollow solder on the pad of substrate and include with placement hollow solder on the identical technique each pad in the plurality of pad, the hollow solder being placed on multiple pad has homogeneous size, material and character；
The step that centering missing solder material carries out refluxing includes by identical technique, the hollow solder being placed on multiple pad being refluxed, and is separately positioned on size on multiple pad and the homogeneous multiple soldered balls of character to be formed.
9. method according to claim 8, wherein, is separately positioned on the spacing between soldered ball adjacent in the multiple soldered balls on multiple pad equal to or less than 0.35mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310370783.8A CN103489793B (en) | 2013-08-23 | 2013-08-23 | The method forming soldered ball on the pad of substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310370783.8A CN103489793B (en) | 2013-08-23 | 2013-08-23 | The method forming soldered ball on the pad of substrate |
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| Publication Number | Publication Date |
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| CN103489793A CN103489793A (en) | 2014-01-01 |
| CN103489793B true CN103489793B (en) | 2016-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310370783.8A Active CN103489793B (en) | 2013-08-23 | 2013-08-23 | The method forming soldered ball on the pad of substrate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111821568A (en) * | 2019-03-30 | 2020-10-27 | 深圳硅基仿生科技有限公司 | Solder body of electronic package |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201536103U (en) * | 2009-09-24 | 2010-07-28 | 佛山市顺德区顺达电脑厂有限公司 | Cylindrical welding column packaging structure for members |
| US8162203B1 (en) * | 2011-02-18 | 2012-04-24 | International Business Machines Corporation | Spherical solder reflow method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4940758B2 (en) * | 2006-05-26 | 2012-05-30 | ソニー株式会社 | Solder ball, semiconductor device, and method of manufacturing solder ball |
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- 2013-08-23 CN CN201310370783.8A patent/CN103489793B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201536103U (en) * | 2009-09-24 | 2010-07-28 | 佛山市顺德区顺达电脑厂有限公司 | Cylindrical welding column packaging structure for members |
| US8162203B1 (en) * | 2011-02-18 | 2012-04-24 | International Business Machines Corporation | Spherical solder reflow method |
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| CN103489793A (en) | 2014-01-01 |
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