CN101702421A - 一种白光led的制作方法 - Google Patents

一种白光led的制作方法 Download PDF

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CN101702421A
CN101702421A CN200910233705A CN200910233705A CN101702421A CN 101702421 A CN101702421 A CN 101702421A CN 200910233705 A CN200910233705 A CN 200910233705A CN 200910233705 A CN200910233705 A CN 200910233705A CN 101702421 A CN101702421 A CN 101702421A
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CN101702421B (zh
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胡建红
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Jiangsu Wenrun Optoelectronic Co Ltd
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Joint Venture Jiangsu Wenrun Optoelectronics Co Ltd
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Abstract

本发明公开了一种白光LED的制作方法，包括以下步骤：先在蓝色晶片上涂敷玻璃微珠混合粗粒径黄色荧光粉的硅氧烷混合胶水，形成第一涂敷层，烘烤固化；再在第一涂敷层上涂敷混合细粒径黄色荧光粉的胶水，形成第二涂敷层，烘烤固化。本发明采用聚硅氧烷胶水，操作工艺简单；采用二次涂敷的方法，由于粗粒径的荧光粉粒径大，减少了荧光粉对光线的反射率，提高了光线的出光效率，同时利用玻璃微珠的回归反射特性，可进一步提升蓝光晶片的取光效率，更多的光激发悬浮在胶水中的细粒径的黄色荧光粉，大大提高了白光的转换效率；采用本发明生产的白光LED出光效率比传统方式提高10％以上，同时降低了生产成本。

Description

一种白光LED的制作方法
技术领域
本发明涉及一种新型白光LED的制作方法，尤其是一种出光效率高的新型白光LED的制作方法，属于光电技术领域。
背景技术
LED发光二极管是一种固态的半导体器件，它可以直接把电转化为光。目前，小功率正面发光的白光LED均采用环氧树脂胶或硅胶配制荧光粉，经一次烘烤固化成型，再用环氧树脂胶封装外围。现有的白光LED采用传统小颗粒的荧光粉，由于荧光粉的粒径小(粒径小于10um)，对光线的反射率高，其出光效率很难得到提升，加上蓝光晶片的取光效率也受到限制，导致正面发光的白光LED产品的出光效率无法取得重大突破，生产成本居高不下，从而制约其进行市场扩张。
发明内容
本发明的目的是提供一种操作工艺简单、产品出光效率高、成本低的新型白光LED的制作方法。
本发明通过以下技术方案予以实现：
一种白光LED的制作方法，包括以下步骤：
1)将蓝色晶片固定在基座底部，焊好线；
2)将聚硅氧烷胶水和固化剂按比例混合，搅拌均匀；
3)在聚硅氧烷胶水中按比例加入粗粒径的黄色荧光粉，搅拌均匀；
4)按比例加入玻璃微珠，搅拌均匀；
5)将配制好的玻璃微珠混合荧光粉的聚硅氧烷胶水涂敷在蓝色晶片上，形成第一涂敷层；
6)低温烘烤第一涂敷层，烘烤温度为60℃～80℃，烘烤时间1～2小时；
7)升温至120℃～150℃，继续烘烤1～2小时，取出；
8)在聚硅氧烷胶水中按比例加入细粒径的黄色荧光粉，搅拌均匀，涂敷在第一涂敷层上，形成第二涂敷层，平杯口；
9)烘烤固化第二涂敷层，烘烤温度为120℃～150℃，烘烤时间2～3小时；
10)用环氧树脂胶体包封基座的外围。
本发明的目的还可以通过以下技术措施来进一步实现。
前述的一种白光LED的制作方法，其中步骤2)中所述聚硅氧烷胶水和固化剂的配比为1∶1～2。
前述的一种白光LED的制作方法，其中步骤3)中所述黄色荧光粉的粒径为15～25um，与聚硅氧烷胶水混合时，所述黄色荧光粉的重量占聚硅氧烷胶水重量的5％～10％。
前述的一种白光LED的制作方法，其中步骤4)中所述玻璃微珠的折射率大于2，与聚硅氧烷胶水混合时，所述玻璃微珠的重量占聚硅氧烷胶水重量的2％～4％。
前述的一种新型白光LED的制作方法，其中步骤8)中所述黄色荧光粉的粒径为3～6um，与聚硅氧烷胶水混合时，所述黄色荧光粉的重量占聚硅氧烷胶水重量的5％～10％。
本发明操作工艺简单，采用二次涂敷的方法，先将粗粒径黄色荧光粉及高折射率的玻璃微珠沉淀在蓝光晶片的表面，由于荧光粉粒径大，所需数量少，减少了荧光粉对光线的反射率，提高了光线的出光效率，同时利用玻璃微珠的回归反射特性，可进一步提升蓝光晶片的取光效率，更多的光激发悬浮在胶水中的细粒径的黄色荧光粉产生黄光，黄光混合蓝光产生白光，大大提高了白光的转换效率；采用本发明生产的白光LED出光效率比传统方式提高10％以上，同时降低了生产成本。
本发明的优点和特点，将通过下面优选实施例的非限制性说明进行图示和解释，这些实施例，是参照附图仅作为例子给出的。
附图说明
图1是本发明的剖视结构示意图；
具体实施方式
下面结合附图和实施例对本发明作进一步说明。
如图1所示，本发明包括基座1、蓝色晶片2、金线3、固晶胶4、第一涂敷层5、第二涂敷层6；蓝色晶片2用固晶胶4固定在基座1的底部，金线3将蓝色晶片2的电极与基座1的电极相连；第一涂敷层5覆盖在蓝色晶片2上，第二涂敷层6覆盖在第一涂敷层5的上方。
本发明的制作方法如下：
实施例一
1)将蓝色晶片2固定在基座1的底部，焊好金线3；
2)将聚硅氧烷胶水和固化剂按1∶1～2的比例混合，搅拌均匀；
3)在聚硅氧烷胶水中加入黄色荧光粉，黄色荧光粉的粒径为15～25um，与聚硅氧烷胶水混合时，黄色荧光粉的重量占聚硅氧烷胶水重量的5％，搅拌均匀；
4)加入玻璃微珠，玻璃微珠的折射率大于2，与聚硅氧烷胶水混合时，玻璃微珠的重量占聚硅氧烷胶水重量的2％，搅拌均匀；
5)将配制好的玻璃微珠混合荧光粉的聚硅氧烷胶水少量涂敷在蓝色晶片2上，形成第一涂敷层5，第一涂敷层5应将蓝色晶片2完全包封；
6)低温烘烤第一涂敷层5，烘烤温度为60℃～80℃，烘烤时间1～2小时；
7)升温至120℃～150℃，继续烘烤1～2小时，取出；
8)在聚硅氧烷胶水中加入黄色荧光粉，黄色荧光粉的粒径为3～6um，与聚硅氧烷胶水混合时，黄色荧光粉的重量占聚硅氧烷胶水重量的5％，搅拌均匀，涂敷在第一涂敷层5上，形成第二涂敷层6，第二涂敷层6应将第一涂敷层5完全覆盖，平杯口；
9)烘烤固化第二涂敷层，烘烤温度为120℃～150℃，烘烤时间2～3小时；
10)用环氧树脂胶体包封基座的外围。
实施例二
本实施例的制作方法与实施例一基本相同，不同之处在于，在步骤3)、4)、5)中不同粒径的黄色荧光粉、玻璃微珠的重量百分比分别采用8％、3％、8％，再进行调配。
实施例三
本实施例的制作方法与实施例一基本相同，不同之处在于，在步骤3)、4)、5)中不同粒径的黄色荧光粉、玻璃微珠的重量百分比分别采用10％、4％、10％，再进行调配。
除上述实施例外，本发明还可以有其他实施方式，凡采用等同替换或等效变换形成的技术方案，均落在本发明要求的保护范围内。

Claims (5)

1.一种白光LED的制作方法，其特征在于：包括以下步骤：
1)将蓝色晶片固定在基座底部，焊好线；
2)将聚硅氧烷胶水和固化剂按比例混合，搅拌均匀；
3)在聚硅氧烷胶水中按比例加入粗粒径的黄色荧光粉，搅拌均匀；
4)按比例加入玻璃微珠，搅拌均匀；
5)将配制好的玻璃微珠混合荧光粉的聚硅氧烷胶水涂敷在蓝色晶片上，形成第一涂敷层；
6)低温烘烤第一涂敷层，烘烤温度为60℃～80℃，烘烤时间1～2小时；
7)升温至120℃～150℃，继续烘烤1～2小时，取出；
8)在聚硅氧烷胶水中按比例加入细粒径的黄色荧光粉，搅拌均匀，涂敷在第一涂敷层上，形成第二涂敷层，平杯口；
9)烘烤固化第二涂敷层，烘烤温度为120℃～150℃，烘烤时间2～3小时；
10)用环氧树脂胶体包封基座的外围。
2.如权利要求1所述的一种白光LED的制作方法，其特征在于：步骤2)中所述聚硅氧烷胶水和固化剂的配比为1∶1～2。
3.如权利要求1所述的一种白光LED的制作方法，其特征在于：步骤3)中所述黄色荧光粉的粒径为15～25um，与聚硅氧烷胶水混合时，所述黄色荧光粉的重量占聚硅氧烷胶水重量的5％～10％。
4.如权利要求1所述的一种白光LED的制作方法，其特征在于：步骤4)中所述玻璃微珠的折射率大于2，与聚硅氧烷胶水混合时，所述玻璃微珠的重量占聚硅氧烷胶水重量的2％～4％。
5.如权利要求1所述的一种白光LED的制作方法，其特征在于：步骤8)中所述黄色荧光粉的粒径为3～6um，与聚硅氧烷胶水混合时，所述黄色荧光粉的重量占聚硅氧烷胶水重量的5％～10％。
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