CN101690434B - Method for manufacturing substrate having built-in components - Google Patents

Method for manufacturing substrate having built-in components Download PDF

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Publication number
CN101690434B
CN101690434B CN 200880021726 CN200880021726A CN101690434B CN 101690434 B CN101690434 B CN 101690434B CN 200880021726 CN200880021726 CN 200880021726 CN 200880021726 A CN200880021726 A CN 200880021726A CN 101690434 B CN101690434 B CN 101690434B
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region
step
formed
metal foil
solder
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CN 200880021726
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Chinese (zh)
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CN101690434A (en )
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平山克郎
西村重夫
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株式会社村田制作所
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081Compound repelling a metal, e.g. solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/243Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/611Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control the product being a printed circuit board [PCB]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating

Abstract

Provided is a method for manufacturing a part built-in substrate, which made highly reliable by preventing such a short as might otherwise be caused by the spread of solder or a conductive adhesive. In the method, a land region (3a) to be connected with a circuit part (6) and a wetness preventing region (4) to enclose the land region are formed over one principal face of a metal foil (1). A terminal electrode (6a) of the circuit part (6) is electrically connected with the land region (3a) by means of solder (5), and an unset resin (7) is contact-bonded over the metal foil (1) and the circuit part, thereby to form the resin layer (7) having the circuit part buried therein. After this, the metal foil (1) is worked to form a wiring pattern (1b). The wetness preventing region (4) is so made of either a region having roughed or oxidized one principal face of the metal foil (1) or a metal having a poor solder wettability as may have a poorer solder wettability than that of the land region (3a).

Description

元器件内置基板的制造方法 The method of manufacturing a component-embedded substrate

技术领域 FIELD

[0001] 本发明涉及在树脂层的内部埋设电路元器件的元器件内置基板的制造方法。 [0001] The present invention relates to a resin layer is embedded inside the substrate manufacturing method of the circuit component built-in components. 背景技术 Background technique

[0002] 近年来,随着电子设备的小型化,要求用于安装片状电容器等电路元器件的电路基板实现小型化。 [0002] In recent years, with miniaturization of electronic devices, it requires a circuit board for mounting a chip capacitor and other circuit components of miniaturization. 受此要求,通过在电路基板内部埋设电路元器件来制作模块,从而削减电路元器件的安装面积,力图实现电路基板的小型化。 From this requirement, to make the circuit module is embedded in the internal circuit board components, thereby reducing the mounting area of ​​the circuit components, trying to achieve miniaturization of the circuit board. 其中,在树脂基板的内部埋设电路元器件的元器件内置基板有以下优点:重量轻,而且由于无需像陶瓷基板那样进行高温烧成,所以对内置的电路元器件限制少。 Wherein the circuit component is buried inside the resin substrate component-embedded substrate has the following advantages: light weight, such as a ceramic substrate and it is not necessary that a high temperature calcination, the low limit circuit built-in component.

[0003] 专利文献1中提出了一种元器件内置基板的制造方法:即,通过导电性粘接剂在金属箔上安装电路元器件,将由无机填料和热固化性树脂构成的树脂片材重叠在金属箔上并进行压接,使树脂片材热固化,从而形成埋设了电路元器件的树脂层,其后加工金属箔而形成布线图案。 [0003] Patent Document 1 proposes a method of manufacturing a component-embedded substrate: i.e., by conductive adhesive circuit components mounted on the metal foil, by overlapping the resin sheet and an inorganic filler composed of a thermosetting resin on the metal foil and pressed against the thermosetting resin sheet, thereby forming a buried layer of the circuit components of the resin, subsequent processing of the metal foil wiring pattern is formed.

[0004] 然而,所述制造方法中,在安装电路元器件或压接树脂片材时,由于导电性粘接剂沿金属箔的主面方向蔓延,所以导电性粘接剂彼此接触,或导电性粘接剂搭接到相邻的布线图案,而可能发生短路。 [0004] However, the manufacturing method, when mounting the circuit components or crimping resin sheet, since the main surface direction of the conductive adhesive is spread in the metal foil, the conductive adhesive contact with each other, or the conductive adhesive landed on the neighboring wiring patterns, a short circuit may occur. 如上所述的问题在使用焊料来代替导电性粘接剂时也发生。 Problems described above can also occur when using solder instead of the conductive adhesive. 例如,在为了安装电路元器件而进行回流焊接时,由于熔融的焊料沿金属箔的主面方向蔓延, 因此可能在相邻连接盘间发生短路。 For example, when mounting the circuit components in order to perform reflow soldering, the molten solder in the main surface direction of the metal foil spread, thus short circuit may occur between adjacent lands. 特别是,元器件内置基板采用多层化结构时,由于回流时的热量经过多次作用于最先安装的电路元器件,所以有可能焊料再熔融从而发生焊料迸流。 In particular, the component-embedded substrate of the multilayer structure, due to heat during reflow after several circuit components acting on the first installation, it is possible to re-melt the solder so that solder Beng flow occurs.

[0005] 专利文献2提出了一种元器件内置基板的制造方法,该制造方法通过在金属箔的一个主面上形成具有开口部的绝缘层,来防止焊料、或导电性粘接剂的蔓延。 [0005] Patent Document 2 proposes a method of manufacturing a component-embedded substrate, the manufacturing method is formed by the insulating layer having an opening portion on a main surface of a metal foil, to prevent the spread of solder or a conductive adhesive .

[0006] 图9表示专利文献2所示的元器件内置基板的制造方法的一个示例。 [0006] FIG. 9 shows an example of a method of manufacturing the component-embedded substrate shown in Patent Document 2 built. 以下,使用图9说明现有的元器件内置基板的制造方法。 Hereinafter, using FIG. 9 illustrates a conventional method of manufacturing a component-embedded substrate.

[0007] 如图9的(a)所示,在金属箔51上形成绝缘层52,该绝缘层52具有使金属箔51 的一部分露出的开口部52a。 [0007] As shown in (a), an insulating layer 9 on the metal foil 51 is 52, the insulating layer 52 has an opening portion 52a of the metal foil 51 is partially exposed.

[0008] 接着,如图9的(b)所示,在开口部52a的内部填充焊料53。 [0008] Next, as shown in FIG. 9 (b), inside the opening portion 52a is filled with solder 53.

[0009] 接着,如图9的(c)所示,在绝缘层52上配置电路元器件54,以使焊料53与电路元器件54的端子电极54a接触,并将焊料53与端子电极54a进行焊接。 [0009] Next, as shown in FIG. 9 (c), the circuit components 54 disposed on the insulating layer 52, the solder 53 to contact with the terminal electrode 54a of the circuit components 54, 53 and the solder and the terminal electrode 54a welding.

[0010] 接着,如图9的(d)所示,在绝缘层52及电路元器件54上,重叠由无机填料和热固化性树脂构成的树脂片材并进行压接,形成埋设了电路元器件54的树脂层55。 [0010] Next, as shown in FIG. 9 (d), on the insulating layer 52 and the circuit components 54, the overlapping resin sheet made of an inorganic filler and a thermosetting resin and pressed to form a buried circuit elements the resin layer 55 of the device 54. 此外,在树脂层55形成的同时,也将背面侧的金属箔56进行接合。 Further, while the resin layer 55 is formed, the metal foil 56 will be engaging the back side.

[0011] 最后,通过加工正反面的金属箔51、56,形成布线图案51a、56a。 [0011] Finally, by processing the metal foils 51, 56 of the front and back surfaces, a wiring pattern 51a, 56a.

[0012] 所述方法中,绝缘层52的开口部52a起到作为防止焊料53蔓延的围栏的作用。 The [0012] method, the opening portion 52a of the insulating layer 52 serves to prevent the spread of solder 53 functions as a fence. 然而,由于需要在开口部52a填充焊料53或导电性粘接剂,所以需要较多的量的焊料或导电性粘接剂。 However, since the solder 53 or 52a filled conductive adhesive opening portion, therefore we need more amount of solder or a conductive adhesive. 特别是,在使用焊料的情况下,因焊料量多而发生焊料迸流的可能性增大,因此存在可靠性方面的问题。 In particular, in the case of using the solder, and because the possibility of occurrence of solder amount of the solder Beng stream increases, so reliability problems exist. 另外,当树脂层55与绝缘层52由不同种材料形成时,不同种界面之间的粘着强度降低,也可能因此发生焊料迸流。 Further, when the resin layer 55 and the insulating layer 52 is formed of different materials, the adhesion strength between different kinds of interfaces decreases, the solder may therefore occur Beng stream. 近年来,随着小型化、和高密度化,安装内置于元器件内置基板的元器件的连接盘间隔变得非常小,从而要求较高的抗焊料迸流性能。 In recent years, with miniaturization and high density mounting of components built in the component-embedded substrate lands interval becomes very small, thus requiring a higher resistance to flow of solder Beng performance.

[0013] 专利文献1 :日本国专利特开平11-220262号公报 [0013] Patent Document 1: Japanese Laid-Open Patent Publication No. 11-220262

[0014] 专利文献2 :日本国专利特开2005-26573号公报 [0014] Patent Document 2: Japanese Patent Laid-Open Publication No. 2005-26573

发明内容 SUMMARY

[0015] 因此,本发明的优选实施方式的目的在于,提供一种防止因焊料或导电性粘接剂的蔓延所造成的短路、可靠性高的元器件内置基板的制造方法。 [0015] Accordingly, an object of preferred embodiments of the present invention is to provide a method for preventing the spread of a short circuit due to a solder or a conductive adhesive agent caused by substrate manufacturing method of a highly reliable component-embedded.

[0016] 为了实现上述目的,本发明提供一种包含以下(a)〜(d)的工序的元器件内置基板的制造方法。 [0016] To achieve the above object, the present invention provides a composition comprising the following (a) ~ (d) a component built-step method of manufacturing a substrate. 即,包括: That includes:

[0017] (a)在金属箔的一个主面上形成连接盘区域和防湿区域的工序,所述连接盘区域应连接电路元器件,所述防湿区域包围所述连接盘区域,其焊料或导电性粘接剂的润湿性比所述连接盘区域要差; [0017] (a) forming a connecting area and the moisture-proof plate region on one main surface of the metal foil, the land area of ​​the circuit components to be connected, the moisture-proof disc region surrounding the connection region, which is a solder or a conductive wettability than the land area of ​​the adhesive to be worse;

[0018] (b)使用所述焊料或导电性粘接剂将所述电路元器件的端子电极与所述连接盘区域电连接的工序; [0018] (b) the use of solder or conductive adhesive to the step of the terminal electrodes of the circuit component electrically connected to the land area;

[0019] (c)在所述金属箔及所述电路元器件上、形成埋设了所述电路元器件的树脂层的工序;以及 [0019] (c) on the metal foil and the circuit components, a step of forming a resin layer embedding the circuit components; and

[0020] (d)加工所述金属箔、而形成布线图案的工序。 [0020] (d) processing the metal foil, a step of forming a wiring pattern.

[0021] 本发明的制造方法中,首先在金属箔的一个主面上,形成应连接电路元器件的连接盘区域和防湿区域。 [0021] In the manufacturing method of the present invention, the first main surface of a metal foil, and forming a connection region moisture disk region to be connected to circuit components. 所谓连接盘区域,是指应使用焊料或导电性粘接剂与电路元器件的端子电极电连接的部位。 The so-called land zone, means should be used or the terminal electrode portions solder conductive adhesive connecting the circuit components. 这些连接盘区域与端子电极的位置、和数量对应而形成。 The position of the terminal electrodes connected to the pad region, and the corresponding number is formed. 连接盘区域最好以不横跨多个端子电极间的方式形成,连接盘区域与电路元器件的端子电极最好一对一地形成。 Preferably in land region without cross manner between a plurality of terminal electrodes are formed, an electrode terminal connection region of the circuit plate is preferably one component is formed. 此外,也可以将适当布线区域与连接盘区域连结形成。 Further, the wiring region may be suitably connected to the connecting pad region is formed.

[0022] 另一方面,防湿区域是焊料或导电性粘接剂的润湿性比连接盘区域要差的区域, 例如粗化或氧化了金属箔的一个主面的区域,即,可以由粗面或氧化膜形成,也可以由焊料或导电性粘接剂的润湿性比构成连接盘区域的金属要差的金属形成。 [0022] On the other hand, moisture is the area ratio of land area wettability of solder or a conductive adhesive to a difference, e.g. roughening or oxidation of the main surface area of ​​a metal foil, i.e., it may be made of crude or a surface oxide film, may be formed of solder wettability than the adhesive or a conductive metal of the metal plate is connected to the difference forming region. 也可以在粗面上形成氧化膜。 An oxide film may be formed on the surface rough. 由粗面或氧化膜构成的防湿区域与连接盘区域相比,具有焊料或导电性粘接剂不易润湿蔓延的性质。 Compared moisture from the area and the land area or rough oxide film having properties of a solder or a conductive adhesive is not easily wetted spreading. 另外,当连接盘区域由铜或铜合金构成时,也可以由钴、镍、钨、钼、铝、 铬、铁、锌或这些金属的合金形成防湿区域。 Further, when the connecting pad region is made of copper or a copper alloy, may be formed of a moisture-proof region consisting of cobalt, nickel, tungsten, molybdenum, aluminum, chromium, iron, zinc, or alloys of these metals. 防湿区域虽然也可以包围连接盘区域的整个周边,但在将布线区域与连接盘区域连结形成时,防湿区域只要包围除布线区域被引出的部分以外的连接盘区域的周围即可。 Although the moisture-proof region can surround the entire periphery of the land area, but in the wiring area and the land area links is formed, as long as the moisture-proof region can surround the land regions other than the wiring portion is drawn out of the region.

[0023] 在形成了连接盘区域和防湿区域的金属箔中,在该连接盘区域装载电路元器件, 使用焊料或导电性粘接剂将电路元器件的端子电极与连接盘区域电连接。 [0023] In the land area and the area of ​​the metal foil moisture loaded in the connecting circuit components disk area, using solder or a conductive adhesive to the electrode terminals of the circuit component is electrically connected to the connecting pad region is formed. 此时,由于焊料或导电性粘接剂只要是为了连接端子电极与连接盘区域所需的最少量即可,所以能够减少其绝对量。 At this time, since the solder or conductive adhesive agent for as long as the minimum amount required to the terminal electrode connected to the land areas, and the absolute amount thereof can be reduced. 而且,由于连接盘区域的周围是防湿区域,所以能够防止焊料或导电性粘接剂的蔓延,能够降低短路发生的风险。 Further, since the surrounding land area is moisture region, it is possible to prevent the spread of solder or a conductive adhesive agent, can reduce the risk of a short circuit.

[0024] 另外,在金属箔及电路元器件上重叠未固化的树脂并进行压接时,由于无需形成现有技术那样的绝缘层,因此不存在绝缘层与树脂层为不同种材料时的那样的不同种界面。 As at [0024] Further, overlapping the uncured resin on the metal foil and the circuit components and pressed, it is not necessary to form an insulating layer such as the prior art, and therefore does not present the insulating layer and the resin layer are different kinds of materials the different types of interfaces. 因而,在使用焊料固定电路元器件的情况下,也能降低焊料迸流发生的风险。 Thus, in the case of using the solder fixing circuit components, it can reduce the risk of solder Beng stream.

[0025] 作为树脂层,虽然例如可以使用仅由热固化性树脂构成的树脂片材,也可以使用包含无机填料和热固化性树脂的树脂片材,但无论在什么情况下,都最好在软化状态或半固化状态(例如,B阶段)将其重叠在金属箔及电路元器件上并进行压接。 [0025] As the resin layer, it may be used, for example, although only the resin sheet made of a thermosetting resin, may be used a resin sheet containing an inorganic filler and a thermosetting resin, but whatever the case, preferably softened state or a semi-cured state (e.g., B phase) which is superimposed on the metal foil and the circuit components and crimping. 在此情况下,树脂层进入到金属箔与电路元器件的间隙、和电路元器件彼此的间隙,而且树脂层也粘着在金属箔的表面。 In this case, the resin layer and the metal foil into the gap of the circuit components, and gaps between circuit components, but also a resin layer adhered to the surface of the metal foil. 特别是,若在压接时进行真空压制,则能够防止在树脂层内部产生气泡,并且能够在电路元器件与金属箔的间隙中可靠地填充树脂。 In particular, when the vacuum pressing at the time of crimping, it is possible to prevent the generation of air bubbles in the resin layer, and can be reliably filled with the resin component in the gap with the metal circuit foil. 在防湿区域为粗面的情况下或为具有凹凸的氧化膜的情况下,树脂材料进入到其表面的微细凹凸中,从而能够提高与金属箔的结合力。 In the case of an oxide film having irregularities in the region under moisture conditions or rough surface of the resin material into which the fine irregularities in the surface, thereby improving bonding force to the metal foil. 因此,能够更可靠地防止焊料迸流现象(在使用焊料的情况下)。 Accordingly, it is possible to more reliably prevent the phenomenon of solder flow Beng (in the case of using solder). 此外,也可以通过注射成型等形成树脂层。 Further, the resin layer may be formed by injection molding or the like.

[0026] 在形成粗面作为防湿区域时,有以下方法:S卩,粗化金属箔的一个主面来形成粗面,在所述粗面上的与所述防湿区域对应的区域形成抗镀层,在除所述抗镀层的形成区域以外的所述粗面上,形成所述焊料或导电性粘接剂的润湿性好的金属镀敷层,通过这样形成所述连接盘区域,去除所述抗镀层,形成由所述粗面构成的防湿区域。 [0026] When moisture is formed as a roughened surface region, there are the following methods: S Jie, a main surface of the metal foil is roughened to form the rough surface, the rough surface of the plating resist is formed and a region corresponding to the region moisture in addition to the rough surface of the plating resist is formed in the region, forming a metal having good wettability of the solder or a conductive adhesive plating layer thus formed by the land area, removing the said plating resist formed area composed of the moisture rough surface. 使用该方法时,由于在连接盘区域与防湿区域(粗面)之间形成高度差,所以能够有效地抑制连接盘区域上的焊料或导电性粘接剂向防湿区域蔓延。 When using this method, since the height difference is formed between the moisture-proof area (rough) and the lands in the region, it is possible to effectively suppress a solder or a conductive adhesive is spread on the land area of ​​the moisture zone. 即使或多或少的焊料或导电性粘接剂向防湿区域润湿蔓延,但也由于到达相邻连接盘区域的沿面距离变长,因此能够降低短路发生的风险。 Even more or less solder or a conductive adhesive to spread moisture wetting region, but since the creeping distance reaches an adjacent land area becomes long, it is possible to reduce the risk of a short circuit. 另外,由于能够在将电路元器件安装于连接盘的状态下在电路元器件与其下侧的防湿区域之间设置预定的间隙,所以压接未固化的树脂时,树脂也容易回填到元器件的下侧,能够用树脂包围元器件的周围。 Further, since the predetermined gap between its lower moisture regions can be in a state where the circuit components mounted on the circuit components connected to the side of the disk, so that the time of crimping the uncured resin, the resin component is easily backfilled a lower side, can be surrounded with a resin around the component. 因此,在后面的工序中为了形成布线图案而对金属箔进行蚀刻处理时,能够防止因蚀刻液而对电路元器件造成损坏。 Thus, when the metal foil is etched to form a wiring pattern in a later step, the etching solution can be prevented and damage to circuit components.

[0027] 在形成氧化膜作为防湿区域时,有以下方法:S卩,在金属箔的一个主面形成氧化膜,在所述氧化膜上的与所述防湿区域对应的区域形成抗镀层,将除所述抗镀层的形成区域以外的所述氧化膜去除,在去除了所述氧化膜的区域上,形成所述焊料或导电性粘接剂的润湿性好的金属镀敷层,通过这样形成所述连接盘区域后,去除所述抗镀层,形成由所述氧化膜构成的防湿区域。 [0027] In forming the oxide film as a moisture region, the following methods: S Jie, an oxide film is formed on one main surface of the metal foil, plating resist is formed in a region corresponding to a region of the oxide film and the moisture-proof, the the plating resist except the region formed of the oxide film is removed in the region of the oxide film is removed to form a good wettability of the solder metal or a conductive adhesive layer is plating, by this after forming the land area, removing the plating resist, is formed by the region of the moistureproof film of the oxide. 本方法也与形成粗面时相同,由于连接盘区域处于比防湿区域(氧化膜)要高的位置,因此能够有效地抑制连接盘区域上的焊料或导电性粘接剂向防湿区域蔓延,而且未固化的树脂容易回填到元器件的下侧。 The present method is also the same when the rough surface is formed, since the region is connected to the disk position higher than the moisture-proof region (oxide film), it is possible to effectively suppress a solder or a conductive adhesive is spread on the land area to the area of ​​moisture, and uncured resin to the lower side of the backfill readily components. 另外,对于氧化膜,由于能用热处理、或化学处理等已知的方法容易地形成一定膜厚的氧化膜,因此能够形成均勻的防湿区域。 Further, the oxide film is easily formed because an oxide film thickness can be certain methods known heat treatment or chemical treatment, it is possible to form a uniform moisture-proof area.

[0028] 在作为防湿区域是由润湿性比构成连接盘的金属要差的金属形成时,也可以准备金属箔,所述金属箔在一个主面上形成焊料或导电性粘接剂的润湿性差的金属,在金属箔上的与防湿区域对应的区域形成抗镀层,在除抗镀层的形成区域以外的金属箔上,形成焊料或导电性粘接剂的润湿性好的金属镀敷层,通过这样形成连接盘区域,去除抗镀层,形成露出焊料或导电性粘接剂的润湿性差的金属的防湿区域。 [0028] When a metal is formed of a metal than the wettability to the lands of the difference region as moisture, may be prepared a metal foil, said metal foil or a conductive solder fountain adhesive on one main surface poor wet metal foil formed on the metal plating resist moisture region corresponding to a region, on the metal foil other than the formation area of ​​the plating resist, forming a good wettability of solder or a conductive metal plating adhesive layer, moisture-proof region of the metal thus formed by the lands area, removing the plating resist, is formed to expose poor wettability of solder or a conductive adhesive agent. 本方法也由于连接盘区域处于比防湿区域要高的位置,所以能够有效地抑制连接盘区域上的焊料或导电性粘接剂向防湿区域蔓延,而且未固化的树脂容易回填到元器件的下侧。 The method also since the connecting pad region is at a position higher than the moisture region, it is possible to effectively suppress a solder or a conductive adhesive is spread on the land area to the moisture-proof area, the uncured resin and backfill readily to the components side. 另外,由于能通过镀敷法形成连接盘区域,所以能够廉价地制造。 Further, since the plating formed by land areas, it can be manufactured at low cost. [0029] 作为加工金属箔、而形成布线图案的工序,可考虑两种方法。 Step [0029] As the metal foil and to form a wiring pattern, two methods may be considered. 第一种方法是:在工序(a)中,在连接盘区域预先连续地形成布线区域,在工序(d)中,通过蚀刻或研磨从金属箔的另一个主面侧去除预定厚度量,从而形成具有连接盘区域及布线区域的布线图案。 The first method is: in the step (a) in advance are continuously formed in the wiring area connecting disc region, in the step (d), is removed by a predetermined thickness from the other main surface side of the metal foil by etching or grinding, so that forming a wiring pattern having a land region and a wiring region. 此方法中,由于连接盘区域与布线区域高度相同,所以蔓延方向仅限于布线区域,不向其它防湿区域蔓延,因此能够降低短路等的风险。 In this method, since the same region and the wiring region height lands, the wiring area is limited to the direction of spread, not spread to areas other moisture, it is possible to reduce the risk of a short circuit or the like.

[0030] 第二种方法是:在工序(a)中,以防湿区域包围连接盘区域的整个周边的形式形成岛状的连接盘区域,在工序(d)中,通过对金属箔进行图案蚀刻,形成具有连接盘区域及与连接盘区域连接的布线区域的布线图案。 [0030] The second method is: in the step (a) just in the form of a wet region surrounding the entire periphery of the connecting pad region is formed island-like region is connected to the disc, in step (d) by etching the metal foil pattern forming a wiring pattern having a land region and a wiring region connected to the land region. 在此方法中,由于在连接盘区域与布线区域之间形成高度差,连接盘区域以外都处于较低位置,所以能够进一步降低连接盘区域上的焊料或导电性粘接剂沿平面方向蔓延的可能性。 In this method, since the difference in height between the connection pad region and the wiring region, other than the land areas are in the lower position, it is possible to further reduce a solder or a conductive adhesive is spread on the land area in the plane direction possibility. 作为图案蚀刻的方法,例如采用将光刻与蚀刻结合使用的减成法即可。 As a method for etching a pattern, for example using the subtractive photolithography and etching, can be used in combination.

[0031] 作为工序(b),也可以通过在连接盘区域进行作为无铅(Pb)焊料材料的锡(Sn)或锡合金镀敷,形成预敷层,将电路元器件的端子电极对连接盘区域进行预敷安装。 [0031] As the step (B), can also be used as lead (Pb) solder material of tin (Sn) or tin alloy plating on the lands area, precoat is formed, the connection terminal electrodes of the circuit components pre-coating the disk mounting area. 在此情况下,由于预敷层为薄膜,焊料量极少即可,因此能够进一步降低焊料迸流的风险。 In this case, since the precoat is a thin film, can be a very small amount of solder, it is possible to further reduce the risk of solder Beng stream.

[0032] 在金属箔由铜箔构成、且金属镀敷层由铜镀敷层或铜合金镀敷层形成时,由于金属箔与金属镀敷层为同种材料,所以其接合性好,无需担心剥离等发生。 When [0032] the metal foil formed of copper, and the metal plating layer plated layer made of copper or a copper alloy plating layer is formed, since the metal foil and the metal plating layer of the same material, so that the engagement is good, no worry about peeling occurs.

[0033] 如上所述,根据本发明,由于在金属箔的一个主面上形成连接盘区域和包围该连接盘区域的防湿区域,使用焊料或导电性粘接剂将电路元器件的端子电极与连接盘区域连接,其上形成树脂层,因此,能够通过防湿区域限制焊料或导电性粘接剂的蔓延,而且与使用现有的绝缘层的方法相比,由于能够减少焊料或导电性粘接剂的绝对量,所以能够降低焊料迸流、和短路的发生风险。 [0033] As described above, according to the present invention, since the land area and the land area surrounding the moisture-proof area, using solder or a conductive adhesive with terminal electrodes of the circuit component on one main surface of the metal foil, connecting region of the connecting plate, the resin layer formed thereon, it is possible to limit the spread of solder or a conductive adhesive by moisture region, and compared with the conventional method using the insulating layer, it is possible to reduce a solder or a conductive adhesive the absolute amount of the agent, the solder can be reduced Beng stream, and the risk of a short circuit. 另外,在现有方法中的绝缘层与树脂层为不同种材料的情况下,不同种界面间粘着强度降低,可能因此产生焊料迸流等问题,但本发明中,由于无需使用绝缘层,所以能够消除这种问题。 In addition, when the conventional method in the insulating layer and the resin layer different kinds of material, different types of interface adhesion strength is lowered, therefore a problem may Beng solder flow, etc., the present invention, since without the use of an insulating layer, It is able to eliminate this problem.

附图说明 BRIEF DESCRIPTION

[0034] 图1是本发明第一实施方式的元器件内置基板的前半部分制造工序图。 [0034] FIG. 1 is a first embodiment of the present invention, the first part of a component-embedded substrate manufacturing step of FIG.

[0035] 图2是抗镀膜的一个示例的图案图。 [0035] FIG. 2 is a diagram of an example of a pattern of plating resist.

[0036] 图3是本发明第一实施方式的元器件内置基板的后半部分制造工序图。 [0036] FIG. 3 is a first embodiment of the present invention, the latter half of the component-embedded substrate manufacturing step of FIG.

[0037] 图4是本发明第二实施方式的元器件内置基板的制造工序图。 [0037] FIG 4 is a second embodiment of the present invention, the component-embedded substrate manufacturing step of FIG.

[0038] 图5是本发明第三实施方式的元器件内置基板的制造工序图。 [0038] FIG. 5 is a third embodiment of the present invention, the component-embedded substrate manufacturing step of FIG.

[0039] 图6是本发明第四实施方式的元器件内置基板的制造工序图。 [0039] FIG. 6 is a fourth embodiment of the present invention, the component-embedded substrate manufacturing step of FIG.

[0040] 图7是抗镀膜的其它示例的图案图。 [0040] FIG. 7 is a pattern showing another example of the anti-plating film.

[0041] 图8是本发明第五实施方式的元器件内置基板的制造工序图。 [0041] FIG. 8 is a fifth embodiment of the present invention, the component-embedded substrate manufacturing step of FIG.

[0042] 图9是现有的元器件内置基板的制造工序图。 [0042] FIG. 9 is a conventional component-embedded substrate manufacturing step of FIG.

[0043] 标号说明 [0043] DESCRIPTION OF REFERENCE NUMERALS

[0044] 1、11、21、31、40 金属箔 [0044] The metal foil 1,11,21,31,40

[0045] la、2Ia 粗面 [0045] la, 2Ia rough

[0046] Ila氧化膜 [0046] Ila oxide film

[0047] 2抗镀层[0048] 3金属镀敷层 [0047] The plating resist 2 [0048] The metal plating layer 3

[0049] 3a连接盘区域 [0049] 3a land area

[0050] 3b布线区域 [0050] 3b wiring region

[0051] 4防湿区域 [0051] 4 region moisture

[0052] 5a 焊料 [0052] 5a solder

[0053] 6电路元器件 [0053] The circuit components 6

[0054] 6a端子电极 [0054] 6a terminal electrode

[0055] 7树脂片材 [0055] The resin sheet 7

[0056] 7a树脂层 [0056] 7a resin layer

[0057] 8金属箔 [0057] The metal foil 8

具体实施方式 detailed description

[0058] 实施方式1 [0058] Embodiment 1

[0059] 下面,参照图1说明本发明的元器件内置基板的制造方法的第一实施方式。 [0059] Next, described with reference to FIG. 1 of the present invention component embedded substrate manufacturing method of the first embodiment. 为了简化说明,图1中示出了包含一个电路元器件的元器件内置基板的一部分的制造工序,但实际的元器件内置基板包含多个电路元器件。 To simplify the description, FIG. 1 shows a part of the manufacturing process of the circuit components comprises a component-embedded substrate, but the actual component-embedded substrate comprising a plurality of circuit components. 而且,在实际的制造工序中,先制作母基板状态的元器件内置基板,其后切成子基板状态。 Further, in an actual manufacturing process, before making a state of the mother substrate component-embedded substrate, and thereafter cut submount state.

[0060] 图1的(a)为第一工序,准备金属箔1,所述金属箔1在一个主面上的整个面为粗面la。 [0060] FIG. 1 (a) is a first step of preparing a metal foil, the metal foil 1 on the entire surface of one main surface is a rough surface la. 金属箔1在后文所述的第八工程中被加工,构成元器件内置基板的单面的布线图案。 The metal foil 1 to be processed later according to the eighth project constituting one side of a wiring pattern of a component-embedded substrate. 在此,表示了在金属箔1的整个面形成粗面Ia的示例,但如后文所述,只要形成粗面Ia 使其至少包括安装电路元器件6的区域即可。 Here, the example shows a rough surface Ia is formed on the entire surface of the metal foil 1, but as described later, as long as it is formed rough surface Ia mounting circuit components including at least the region to 6. 作为金属箔1的材料,例如可以任意选择铜(Cu)、镍(Ni)、铝(Al)等,但考虑到操作性、成本,最好选择铜箔。 As the material of the metal foil 1, for example, you can select any of copper (Cu), Nickel (Ni), aluminum (Al) and the like, but considering the operability, cost, best choice foil. 金属箔1的厚度最好为5〜100微米(μπι)。 The thickness of the metal foil 1 is preferably 5~100 microns (μπι). 粗面Ia的表面粗度最好为后文所述的能够防止焊料或导电性粘接剂流动的粗度,十点表面粗度的指标Rz最好满足1. 0微米< Rz ^ 20微米。 The surface roughness of the rough surface Ia is described later is preferably capable of preventing the thickness of a solder or a conductive adhesive to flow, the ten-point surface roughness Rz index of preferably satisfies 1.0 m <Rz ^ 20 microns. 作为粗化金属箔1 的表面的方法,无特别限定,可以通过蚀刻等化学处理,也可以通过研磨、喷砂等机械处理。 As a method of roughening the surface of the metal foil 1 is not particularly limited, and can be treated by chemical etching, or by grinding, sand blasting and other mechanical process. 另外,若是铜箔,则也可以使用市面出售的粗面化铜箔。 Further, if the copper foil is roughened can be used as commercially available copper foil.

[0061] 图1的(b)为第二工序,表示在金属箔1的粗面Ia上形成了抗镀膜2的图案的状态。 [0061] FIG. 1 (b) is a second step, it shows a state of the plating resist pattern on the metal foil 2 in the rough surface 1 Ia. 关于抗镀膜2,如后文所述,形成在与防湿区域4对应的区域。 About plating resist 2, as described later, is formed in a region corresponding to the region 4 moisture. 抗镀膜2例如能够通过将薄膜抗蚀剂与金属箔1进行层压,并进行曝光、显影处理而形成。 2, for example, the plating resist can be carried out by the resist film and the metal foil laminate 1, and subjected to exposure, development processes. 另外,也能够通过丝网印刷法等其它方法形成抗镀膜2。 Further, it is possible to form an anti-plating film 2 by other methods, a screen printing method or the like. 最好使抗镀膜2的厚度比后文所述的金属镀层3要厚,最好使其为10〜50微米左右。 3 is preferable that the thickness of the plating resist 2 is thicker than the metal plating layer described later, it is preferably about 10~50 microns.

[0062] 图2表示抗镀膜2的图案形状的一个示例。 [0062] FIG. 2 shows an example of the plating resist pattern shape 2. 对于抗镀膜2,在后文所述的工序中, 在应形成元器件安装用连接盘区域3a及通孔用连接盘区域北的位置分别形成开口部2a、 2b,并形成成为布线区域的开口部2c,使其连在开口部加、213之间。 2 for the plating resist, in the step described later, to be formed in the component mounting land region 3a and the through hole formed in the opening portions 2a, 2b with the position of the region north lands respectively, and an opening formed in a wiring region portion 2C, so that even in the opening portions addition, between 213 图1的(b)是图2的一部分(图2中的A部分所表示的部分)的横截端面视图,示出了不包括成为布线区域的开口部2c的横截面。 Figure 1 (b) of FIG. 2 is a part (part A in FIG. 2 represented) cross-sectional end view showing the cross section does not include the opening portion becomes a wiring region 2c. 连接盘用开口部加形成在与电路元器件6的各端子电极对应的位置, 最好与电路元器件6的端子电极一对一地形成。 Lands plus the opening portion is formed at a position of the circuit component corresponding to each of the terminal electrode 6 is preferably formed with one terminal electrode 6 of the circuit component. 图2中,通孔用开口部2b形成为两种大小的圆形,这是由于随着通孔导体的直径不同而连接盘的大小也不同。 In FIG. 2, the through hole 2b is formed with a circular opening of two sizes, with different diameters, due to the through-hole conductors are connected to different disc sizes. 虽然布线用开口部2c 形成为连接连接盘用开口部加与通孔用开口部2b之间、或连接盘用开口部加相互之间的 While the wiring portion 2c is formed with an opening for the connection plus the disc opening portion between the opening and the adding portions 2b, lands or through holes with an opening portion to each other

8带状,但其可为任意形状。 The strip 8, but it may be any shape. 在本例中,防湿区域4形成在除元器件安装用连接盘区域3a、通孔用连接盘区域北以及布线区域以外的区域。 In the present embodiment, the moisture component region 4 is formed in the other mounting land region 3a, regions other than the through hole and a wiring area of ​​the northern region of the disc is connected with.

[0063] 图1的(c)为第三工序,表示在除抗镀膜2的形成区域以外的粗面Ia上、形成了焊料或导电性粘接剂的润湿性好的金属镀层3的状态。 [0063] FIG. 1 (c) a third step, the rough surface Ia indicates other than the plating resist formed area 2, the state of forming a good wettability of solder or a conductive metal plating adhesive 3 . 此金属镀层3形成后文所述的连接盘区域及布线区域。 And the wiring area connecting pad region after forming the metal plating layer 3 described above. 此外,在形成金属镀层3之前的阶段,除抗镀层2的形成区域以外的粗面Ia上最好不被氧化。 Further, in the stage before the metal plating layer 3 is formed on the rough surface Ia formation region other than the plating resist 2 is preferably not oxidized. 金属镀敷层3的材质虽然不特别限于铜、镍等,但考虑到电气特性及成本,最好为镀铜。 Metal plating layer 3 is made, though not particularly limited to copper, nickel and the like, but considering the electrical characteristics and cost, preferably copper. 镀敷法可以采用电解镀敷法、非电解镀敷法等中的任一种方法。 A method according to any plating in an electrolytic plating method, electroless plating method and the like may be employed. 金属镀敷层3的膜厚最好采用其表面比粗面Ia的顶点要高的厚度。 Thickness of the cladding layer 3 is preferable to use a metal-plated surface which is higher than apex rough surface Ia of the thickness.

[0064] 图1的(d)为第四工序,表示从金属箔1去除了抗镀膜2的状态。 [0064] FIG. 1 (d) is a fourth step represents the state of the metal foil 1 to 2 except the plating resist. 抗镀膜2通过使用氢氧化钠(NaOH)溶液等剥离液,能够容易去除。 2 by using a plating resist hydroxide (NaOH) solution stripping solution or the like, can be easily removed. 通过去除抗镀膜2,在金属箔1上,形成由金属镀敷层构成的具有平滑表面的元器件安装用连接盘区域3a、通孔用连接盘区域3b以及布线区域,并以包围其周围的形式形成由粗面构成的防湿区域4,并使防湿区域4较低。 2 by removing the plating resist, the metal foil 1, a metal plating layer having a smooth surface of the component mounting land region 3a, the through hole land area 3b and a wiring region, and configured to surround the periphery of the in the form of moisture forming region 4 made of a rough surface, and having relatively low moisture region 4. 即,连接盘区域3a、3b以及布线区域形成在高于防湿区域4的位置。 That is, the land areas 3a, 3b and the wiring region is formed at a position higher than the moisture region 4.

[0065] 图1的(e)为第五工序,表示在金属箔1的元器件安装用连接盘区域3a上涂敷了焊料糊料5的状态。 [0065] FIG. 1 (e) the fifth step, represents the mounting state of the solder paste 5 is applied on the land regions 3a in Component 1 of the metal foil. 焊料糊料5的涂敷能够通过印刷法等已知的方法容易地实施。 Applying solder paste 5 can be easily carried out by a known method such as printing method or the like. 此外, 无需将焊料糊料5形成在通孔用连接盘区域北、和布线区域上。 In addition, the solder paste 5 need not be formed on the through hole lands North region, and a wiring region.

[0066] 图1的(f)为第六工序,表示在涂敷了焊料糊料5的元器件安装用连接盘区域3a 上配置电路元器件6、并利用回流等将其安装后的状态。 [0066] FIG. 1 (f) the sixth step, solder paste is applied is shown in a mounting configuration component 5 with the circuit components 6 on the land regions 3a, and the like using a reflow the mounted state. 此时,电路元器件6的端子电极6a 与连接盘区域3a通过焊料fe电连接。 At this time, the circuit components and the terminal electrodes 6a lands 3a of region 6 is electrically connected by a solder fe. 焊料fe熔融时,由于表面张力使焊料fe填满端子电极6a与连接盘区域3a的间隙,同时焊料fe的一部分漫上端子电极6a的侧面,形成焊角。 Fe melting the solder due to surface tension of the solder to fill the gap fe terminal electrodes 6a and the land area 3a, while the upper part of the solder fe diffusely side terminal electrode 6a is formed fillet. 焊料如由于其表面张力而停在连接盘区域3a,而且连接盘区域3a形成在高于防湿区域4的位置,因此焊料fe不向外侧的防湿区域4润湿蔓延。 The solder stop due to surface tension in the land region 3a, and the land region 3a formed at a position higher than the moisture region 4, so solder does not spread to a moisture fe region outside the 4 wetted. 另外,连接盘区域3a形成在高于防湿区域4的位置,从而在安装电路元器件6时,在电路元器件6与其下方的防湿区域4 之间,形成后文所述的树脂能够容易进入的预定间隙S。 Further, the land region 3a formed at a position higher than the moisture-proof region 4, so that when mounting the circuit components 6, between the area of ​​the circuit element 6 and its moisture below 4, after forming the resin can be described easily accessible a predetermined gap S. 虽然此实施方式的电路元器件6 是两端子的片状元器件,但也可以是三端子的片状元器件或集成电路之类的多端子的电子元器件。 Although this embodiment mode 6 is the circuit components of the two-terminal chip components, but may also be a three-terminal integrated circuit chip components or the like of the multi-terminal electronic component.

[0067] 在本实施方式中,虽然示出了使用焊料fe将电路元器件6安装到元器件安装用连接盘区域3a的示例,但使用导电性粘接剂来代替焊料fe,也同样能够进行安装。 [0067] In the present embodiment, although the use of solder illustrated fe circuit components 6 mounted to the exemplary component mounting land area 3a, but using a conductive adhesive instead of solder fe, can be similarly performed installation. 但是,在使用导电性粘接剂时,为了使其中包含的热固化性树脂固化,需要进行热固化处理。 However, when using a conductive adhesive, in order to make the cured thermosetting resin contained therein, the need for heat-curing treatment.

[0068] 图1的(g)是第七工序,在金属箔1及电路元器件6上重叠树脂片材7及金属箔8并进行压接。 [0068] FIG. 1 (g) a seventh step, the overlapping resin sheets 7 and 8 on the metal foil 6 and the circuit components of the metal foil 1 and pressed. 树脂片材7例如为包含无机填料和热固化性树脂的半固化(例如B阶段) 状态的片材。 7, for example, a resin sheet containing an inorganic filler and a thermosetting resin is semi-cured (e.g., B-stage) state of the sheet. 压接树脂片材7时,树脂片材7进入到金属箔1与电路元器件6的间隙δ、和电路元器件6彼此的间隙,而且也粘着在金属箔1的表面。 7 crimping resin sheet, the resin sheet 7 enters the gaps between the metal foil 1 and the circuit components 6 of the gap [delta], and the circuit components 6, but also adhered to the surface of the metal foil 1. 特别是,在安装了电路元器件6 的状态下,由于在电路元器件6与其下方的防湿区域4之间形成预定间隙δ,因此能够将树脂填充到此间隙δ。 In particular, in a state where circuit components 6 are installed, since a predetermined gap [delta] between the circuit components 6 and its moisture region below 4, it is possible to fill the resin into this gap δ. 此外,若在压接时进行真空压制,则能够防止在树脂片材7内部产生气泡,而且树脂的填充变得更容易。 Further, when the vacuum pressing at the time of crimping, it is possible to prevent the generation of air bubbles inside the resin sheet 7, and the filling of the resin easier. 由于在包围连接盘区域3a的防湿区域4形成有粗面,所以树脂材料进入到其表面的微细的凹凸,从而能够提高金属箔1与树脂片材7的结合力。 Since the rough surface is formed with a land area surrounding the moisture-proof area 3a 4, the resin material into the fine irregularities of the surface thereof, thereby improving the metal foil 1 and the binding force of the resin sheet 7.

[0069] 在压接树脂片材7时或在压接后,最好进行加热。 [0069] In the pressure-bonding or the resin sheet 7 after crimping, it is preferably heated. 由此,树脂片材7中包含的热固化性树脂固化,形成树脂层7a,从而能够使树脂层7a与金属箔1、8和电路元器件6的结合状态良好。 Accordingly, the thermosetting resin contained in the resin sheet 7 is cured to form a resin layer 7a, 7a it is possible that the resin layer and the metal foil 8 and the circuit components 6 good bonding state. 树脂层7a也可以无需在压接树脂片材7后马上固化,例如,当压接多个树脂片材而构成多层基板时,可以使所有的树脂片材同时进行热固化。 7a without the resin layer may be press-bonding the resin sheet immediately after curing 7, for example, when a plurality of crimping the resin sheets constituting the multilayer substrate, so that all of the resin sheet while thermally cured.

[0070] 在本实施方式中,虽然为了形成树脂层7a而使用了树脂片材7,但也可以使用不包含无机填料的热固化性树脂片材。 [0070] In the present embodiment, although the resin layer 7a to be formed using a resin sheet 7, it is also possible to use a thermosetting resin sheet does not contain an inorganic filler. 另外,也可以无需使压接时的树脂层处于半固化(例如B阶段)状态,而使其处于比B阶段软的状态。 Further, the resin layer may not need to crimp a semi-cured (e.g., B-stage) state, while it is in state B than the soft phase.

[0071] 图1的(h)为第八工序,表示对树脂层7a的下表面及上表面的金属箔1、8进行蚀刻或研磨而形成了布线图案lb、8a的状态。 [0071] FIG. 1 (h) an eighth step of indicating to the lower surface of the resin layer and the metal foils 7a, 8 on the surface is etched or polished to form a wiring pattern LB, state 8a. 在此例中,上表面的布线图案8a通过光刻及蚀刻而形成,但下表面的布线图案Ib按照以下方式形成:即,对金属箔1的另一个主面侧遍及整个面进行蚀刻或研磨,直至去除防湿区域4,从而仅留下连接盘区域3a、3b以及布线区域。 In this embodiment, the upper surface 8a of the wiring pattern is formed by photolithography and etching, but the lower surface of the wiring pattern Ib is formed in the following manner: That is, the other main surface of the metal foil 1 side over the entire surface is etched or polished until the moisture removal region 4, leaving only the land regions 3a, 3b and the wiring region.

[0072] 虽然在图1的(h)中将金属箔1的另一个主面侧遍及整个面仅去除一定厚度,但作为此方法的替代,也可以如图1的(i)那样,将下表面侧的金属箔1通过光刻及蚀刻而形成图案。 [0072] Although over the entire surface (h) in the other main surface of the metal foil 1 side in FIG. 1 to remove only a certain thickness, but as an alternative to this method, as shown in (i) as one of the next 1, the metal foil surface side and patterned by photolithography and etching. 在此情况下,也可以仅去除防湿区域4中的一部分,使其它部分起到作为布线区域的作用。 In this case, only a portion of the moisture can be removed in the region 4, so that the other portions function as a wiring region. 另外,能够使连接盘区域3a、!3b及布线区域的厚度大于图1的(h)的情况。 Further, it is possible to make the land area. 3A,! 3b and the thickness of the wiring region is greater than the case of FIG. 1 (h),.

[0073] 在如上所述形成元器件内置基板后,如图3的(a)所示,从上方贯穿树脂层7a及布线图案8a,形成到达通孔用连接盘区域北的通孔导体用孔9。 After [0073] The component-embedded substrate is formed as described above, as shown in FIG. 3 (a), from above through the resin layer 7a and the wiring pattern 8a, through holes are formed through-hole reaching the land conductor region North hole 9. 作为通孔导体用孔9的形成方法,可使用激光、或钻头等。 As a method of forming a through hole conductor holes 9 may be used such as laser, or drill. 此外,虽然在本实施方式中在形成了布线图案8a的状态下将通孔导体用孔9形成在树脂层7a上,但也可以在未配置形成布线图案8a的金属箔8的状态下将通孔导体用孔形成在树脂层7a,过后再形成布线图案8a。 The state of the metal foil 8. In addition, in the state while in the present embodiment, the formation of the wiring pattern 8a of the through-hole conductor formed holes 9 on the resin layer 7a, but may be not configured to form a wiring pattern 8a in will pass hole conductor holes formed in the resin layer 7a, the wiring pattern is formed again after 8a.

[0074] 接着,如图3的(b)所示,在通孔导体用孔9内形成通孔导体9a。 Subsequently, as shown in [0074] FIG. 3 (B), the through hole conductor is formed with a hole 9a in the through-hole conductors 9. 对于通孔导体9a,可以在通孔导体用孔9的内表面实施镀敷,也可以在通孔导体用孔9的内部填充导电性糊料。 For the via hole conductors 9a, can be implemented with the inner surface of the plated hole 9 in the through-hole conductor may be filled with a conductive paste in the inner hole 9 through-hole conductors. 通过形成通孔导体9a,布线图案8a与通孔用连接盘区域北即布线图案Ib电导通。 By forming the through-hole conductors 9a, the wiring pattern 8a and the through hole that is electrically conductive wiring pattern of lands Ib North region. 此外,作为通孔导体用孔9及通孔导体9a的形成方法,可以如上所述在压接树脂层7a后形成通孔导体用孔9及通孔导体9a,也可以在压接前的树脂层7a上预先形成通孔导体用孔9 及通孔导体9a。 Further, as the method for forming through-hole conductors and via hole conductors 9a 9 may be formed after crimping as described above in the resin layer 7a via-hole conductor 9 and the via hole conductors 9a, the resin may be crimped before 9 and the through-hole conductor layer 9a via conductors 7a previously formed hole. 另外,上述通孔导体用孔9及通孔导体9a不是必须的要素,按照导通连接的需要将其形成即可。 Further, the through-hole conductors and via conductors 9 are not essential elements of holes 9a, as required conductively connected to be formed.

[0075] 其后,如图3的(c)所示,也可以在布线图案8a上安装另外的电路元器件6。 [0075] Thereafter, as shown in (c), may be mounted additional circuit components 63 on the wiring pattern 8a. 此外,也可以在布线图案8a上层叠另外的树脂层而采用多层结构。 Further, another resin may be laminated on the wiring pattern layer 8a employed a multilayer structure. 树脂层的层数、和电路元器件的安装方式可以任选。 The number of layers of the resin layer, and mounting the circuit components may be optionally. 虽然图1中在树脂层7a的上表面侧形成了布线图案8a,但也能够将此布线图案8a省略。 Although FIG. 8a wiring pattern 1 is formed on the surface side of the resin layer 7a, but this can be omitted, the wiring pattern 8a. 另外,也可以不使金属箔8形成图案,而是形成覆盖树脂层7a的上表面整个面的屏蔽电极。 Further, the metal foil 8 may not patterned but is formed to cover the entire surface of the shield electrode 7a of the resin layer on the surface. 由此,可屏蔽内置元器件以免受外部的电磁场的影响。 Thus, components can be built to shield the outside from electromagnetic fields.

[0076] 在本实施方式中,虽然在图1的(g)的工序中将不具有防湿区域的金属箔8固定在树脂层7a的上表面,但作为此金属箔8,也可以与图1的(d)的阶段中的金属箔1 一样, 使用具有连接盘区域和防湿区域的金属箔。 [0076] In the present embodiment, the metal foil moisture while not having in the region of FIG. 1 (g), the step 8 is fixed on the surface of the resin layer 7a, but as the metal foil 8, FIG. 1 may also be (d) of stage 1 as a metal foil, a metal foil having a land area and the area of ​​the moisture. 在此情况下,能够以多层结构来构成具有图1 的(h)或(i)的结构的元器件内置基板。 In this case, it is possible to constitute a component having a multilayer structure of FIG. 1 (h), or structure (i) embedded substrate.

[0077] 实施方式2 [0077] Embodiment 2

[0078] 接着,参照图4说明本发明的元器件内置基板的制造方法的第二实施方式。 [0078] Next, with reference to FIG. 4 described components of the present invention embedded substrate manufacturing method of the second embodiment.

[0079] 图4的(a)为第一工序,在金属箔11的一个主面上的整个面形成氧化膜11a。 [0079] FIG. 4 (a) is a first step, an oxide film 11a is formed on the entire surface of one main surface of the metal foil 11. 金属箔11的材质、厚度与第一实施方式相同。 The metal foil 11 is made, the same thickness as the first embodiment. 作为氧化膜Ila的形成方法,可以使用热处理、化学处理等中的任一种方法。 As a method of forming an oxide film Ila may be used any of a method of heat treatment, chemical treatment and the like. 虽然此例中在金属箔11的平滑表面形成了氧化膜11a,但也可以对如图1所示那样粗化了的金属箔表面进行氧化处理。 Although in this embodiment the oxide film 11a is formed on a smooth surface of the metal foil 11, but may be subjected to oxidation treatment such as roughening the surface of the metal foil 1 as shown in FIG.

[0080] 图4的(b)为第二工序,表示在金属箔11的氧化膜Ila上形成了抗镀膜12的图案的状态。 [0080] FIG. 4 (b) is a second step, it shows a state of the plating resist pattern 12 on the metal oxide film Ila 11 of the foil. 抗镀膜12的材质、和图案形成方法与第一实施方式相同,在后文所述的工序中在应形成连接盘区域13a的区域以及应形成布线区域13b的区域形成开口部。 The method of the same material the plating resist 12 and patterning of the first embodiment, in the later step to be formed in the region of the connection region 13a of the disc and a region of a wiring region 13b to be formed to form an opening portion. 开口部的形状与图2相同。 The same shape as the opening portion 2 of FIG.

[0081] 图4的(c)为第三工序,将除抗镀膜12的形成区域以外的氧化膜Ila去除。 [0081] FIG. 4 (c) is a third step, the oxide film forming region except Ila plating resist 12 is removed. 即,去除从开口部露出的氧化膜11a。 That is, removing the oxide film exposed from the opening portion 11a. 作为氧化膜Ila的去除方法,可以使用例如浸渍到盐酸•硫酸等酸中、或利用等离子等的干法蚀刻的方法,也可以使用除以之外的已知的方法。 As a method of removing an oxide film Ila may be used, for example, a method of etching immersed • hydrochloric and sulfuric acid, or other ions using a dry process are also divided by the known method may be used outside. 通过去除氧化膜11a,使金属箔11的未氧化的表面从抗镀膜12的形成区域以外的区域(开口部)露出。 By removing the oxide film 11a, the surface of the metal foil 11 unoxidized region (opening portion) is formed from a region other than the plating resists 12 are exposed.

[0082] 图4的(d)为第四工序,表示在除抗镀膜12的形成区域以外的金属箔11的上表面、形成了焊料或导电性粘接剂的润湿性好的金属镀敷层13的状态。 [0082] FIG. 4 (d) is a fourth step, expressed on the surface of the metal foil other than the plating resist 12 is formed in the region 11, forming a good wettability to a metal solder or a conductive adhesive plating 13 layer state. 此金属镀敷层13形成后文所述的连接盘区域13a及布线区域13b。 This land area of ​​the metal plating layer 13 is formed above the wiring area 13a and 13b. 由于金属镀敷层13形成在未氧化的金属箔11的表面,所以金属镀敷层13与金属箔11的粘着强度增加。 Since the metal plating layer 13 is formed on the surface of non-oxidized metal foil 11, the metal plating layer 13 increases the adhesion strength of the metal foil 11. 最好形成金属镀敷层13,使其表面比氧化膜Ila的上表面要高。 Preferably the metal plating layer 13 is formed plating, its surface is higher than the upper surface of the oxide film Ila.

[0083] 图4的(e)为第五工序,表示从金属箔11去除了抗镀膜12的状态。 [0083] FIG. 4 (e) a fifth step of indicating the state of the plating resist 12 is removed from the metal foil 11. 通过去除抗镀膜12,在金属箔11上形成由金属镀敷层构成的具有平滑表面的平台状连接盘区域13a及布线区域13b、以及包围其周围的由氧化膜构成的防湿区域14。 12, a moisture-proof area 14 is formed of a metal plated layer having a plateau-like land regions 13a and 13b of the wiring region formed of a smooth surface, and surround the periphery of an oxide film on the metal foil 11 by removing the plating resist. 连接盘区域13a及布线区域1¾形成在高于防湿区域14的位置。 Land area 13a, and the wiring region is formed at a position higher than the moisture 1¾ region 14.

[0084] 图4的(f)为第六工序,表示通过印刷法等在金属箔11的连接盘区域13a上涂敷了焊料糊料15的状态。 [0084] FIG. 4 (f) the sixth step, by a printing method or the like showing a state where solder paste is coated on a metal foil 15 is connected to the pad region 13a 11. 此外,也可以在布线区域1¾上不涂敷焊料糊料15。 In addition, the solder paste may not be coated on the wiring area 15 1¾.

[0085] 图4的(g)为第七工序,表示在涂敷了焊料糊料15的连接盘区域13a上配置电路元器件16、并利用回流等将其安装后的状态。 [0085] FIG. 4 (g) a seventh step, shown in a solder paste is applied on the connection pad region 13a 15 arranged circuit components 16, and the like using a reflow installed state thereof. 此时,电路元器件16的端子电极16a与连接盘区域13a通过焊料15a电连接。 At this time, the circuit components and the terminal electrode 16a is connected to 16 disk area 13a are electrically connected by a solder 15a. 连接盘区域13a形成在高于防湿区域14的位置,而且在防湿区域14形成氧化膜11a,因此熔融的焊料1¾停在连接盘区域13a,不会向其外侧的防湿区域14润湿蔓延。 Land region 13a is formed at a position higher than the moisture-proof area 14, and the moisture in the oxide film 11a is formed region 14, the molten solder lands 1¾ parked in area 13a, to which moisture does not spread outside the area 14 wetted. 另外,在利用导电性粘接剂将电路元器件16安装到连接盘区域13a 上的情况下,也可以得到相同的效果。 Further, in the case of using a conductive adhesive to the circuit component 16 is mounted on the connecting plate area 13a, the same effect can be obtained.

[0086] 图4的(h)是第八工序,在金属箔11及电路元器件16上重叠树脂片材17及金属箔18并进行热压接。 [0086] FIG. 4 (h) is the eighth step, the overlapping resin sheet 17 and the metal foil in the metal foil 18 and the circuit components 16 and 11 by thermocompression bonding. 树脂片材17的材质、和压接方法与第一实施方式相同。 Resin sheet material 17, and a crimping method in the first embodiment. 树脂片材17 进入到金属箔11与电路元器件16的间隙、和电路元器件16彼此的间隙,并且也粘着在金属箔11的表面。 The resin sheet 17 into the gaps between the gap 11 and the metal foil of the circuit components 16, 16 and circuit components, and is also adhered to the surface of the metal foil 11. 由于在包围连接盘区域13a的防湿区域14形成有氧化膜11a,所以树脂材料进入到其表面的微细的凹凸,从而能够提高金属箔11与树脂片材17的结合力。 Since the oxide film 11a in the region 14 is formed surrounding the moisture land area 13a, the resin material into the fine irregularities of the surface thereof, the metal foil 11 can be improved and the binding force of the resin sheet 17. 树脂片材17中包含的热固化性树脂固化,形成树脂层17a。 A thermosetting resin contained in the resin sheet 17 is cured to form the resin layer 17a.

[0087] 图4的(i)为第九工序,对树脂层17a的下表面及上表面的金属箔11、18进行蚀刻或研磨而形成了布线图案llb、18a。 [0087] FIG. 4 (i) is the ninth step, a wiring pattern is formed on the lower surface llb of the resin layer 17a and the metal foils 11, 18 on the surface is etched or polished, 18a. 在此例中,上表面的布线图案18a通过光刻及蚀刻而形成,但下表面的布线图案1 Ib按照以下方式形成:即,对金属箔11的另一个主面侧遍及整个面进行蚀刻或研磨,直至去除防湿区域14,从而仅留下连接盘区域13a及布线区域13b。 In this embodiment, the upper surface 18a of the wiring pattern is formed by photolithography and etching, but in the wiring pattern surface 1 Ib is formed in the following manner: That is, the other main surface of the metal foil 11 side over the entire surface is etched or grinding until the moisture removal region 14, leaving only the land area 13a and the wiring region 13b.

[0088] 作为图4的(i)的工序的替代工序,也可以如图4的(j)那样,通过光刻及蚀刻也形成下表面的布线图案lb。 [0088] As an alternative process step of FIG. 4 (i) is, as shown in (j) above 4, the surface of the wiring pattern is also formed by photolithography and etching under lb. 在此情况下,是通过仅去除与防湿区域14对应的地方、而留下连接盘区域13a及布线区域13b的方法。 In this case, by removing only the local area 14 corresponding to the moisture, leaving lands method and a wiring area 13a region 13b.

[0089] 在所述第一实施方式中,形成了具有凹凸的粗面作为防湿区域,在第二实施例中是形成了氧化膜,但也可以将两者组合。 [0089] In the first embodiment, is formed as a rough surface having unevenness moisture region, in the second embodiment is the formation of an oxide film, but may be a combination of both. 即,也可以在粗面的表面形成氧化膜。 That is, an oxide film may be formed on the roughened surface. 由于此情况下的制造工序与第二实施方式相同,因此省略其说明。 Is the same as the manufacturing process in this case of the second embodiment, description thereof is omitted. 在此情况下,由于防湿区域为粗面而且具有氧化膜,所以能够更有效地抑制焊料或导电性粘接剂的润湿蔓延。 In this case, due to the moisture and has a rough surface region of the oxide film, it is possible to more effectively suppress the spread of solder wetting agent or a conductive adhesive.

[0090] 实施方式3 [0090] Embodiment 3

[0091] 接着,参照图5说明本发明的元器件内置基板的制造方法的第三实施方式。 [0091] Next, with reference to FIG. 5 illustrates components of the present invention embedded substrate manufacturing method of the third embodiment. 由于图5的(a)〜(c)的工序与图1的(a)〜(c)相同,因此附加相同的标号并省略其说明。 Since FIG. 5 (a) ~ (c) of FIG step (a) ~ (c) 1 is the same, so the same reference numerals, and description thereof is omitted.

[0092] 在图5的(d)的工序中,通过在形成了抗镀膜2的金属箔1的表面进行锡或锡合金镀敷,形成预敷层20。 [0092] In the step of FIG. 5 (d), by forming a plating resist surface of the metal foil 2 is a tin or tin alloy plating, the pre-cladding layer 20 is formed. 此例中,由于连接盘区域3a和布线区域北从抗镀膜2的开口部露出,所以在这些区域上形成预敷层20。 In this embodiment, since the land region 3a and a wiring region North plating resist is exposed from the opening portion 2, so that the pre-formed cladding layer 20 in these regions. 作为锡合金,例如有锡-银(Sn-Ag)、锡-铋(Sn-Bi)、 锡-银-铜(Sn-Ag-Cu)等。 The tin alloys, for example tin - silver (Sn-Ag), tin - bismuth (Sn-Bi), tin - silver - copper (Sn-Ag-Cu) and the like. 对于镀敷方法,可以使用电解镀敷法、非电解镀敷法等中的任一种方法,但最好使预敷层20的厚度采用对于预敷安装所需的最小厚度。 For plating method, a method may be used in any electrolytic plating method, electroless plating method, plating, it is preferable that the thickness of the precoat layer 20 with a minimum thickness required for the pre-coating installation.

[0093] 图5的(e)表示从金属箔1去除了抗镀膜2的状态。 [0093] FIG. 5 (e) shows the state of the plating resist 2 is removed from the metal foil 1. 通过去除抗镀膜2,在金属箔1形成具有预敷层20的平台状连接盘区域3a以及布线区域3b,使其高于包围其周围的由粗面构成的防湿区域4。 2, the metal foil 1 having a plating resist was removed by precoat internet connection disc-shaped region 20 and the wiring region 3a 3B, it is higher than the region surrounded by a thick surface moisture surrounding configuration 4.

[0094] 图5的(f)表示在设置了预敷层20的连接盘区域3a预敷安装电路元器件6后的状态。 [0094] FIG. 5 (f) shows a land region is provided in the pre-cladding layer 20 is deposited 3a pre-mounted state of the circuit components 6. 此时,预敷层20熔融,形成焊料20a,但其绝对量非常少。 At this time, the molten precoat layer 20, a solder 20a, but the absolute amount is very small. 而且,由于连接盘区域3a 形成在高于包围其周围的防湿区域4的位置,所以焊料20a不润湿蔓延。 Further, since the land region 3a formed at a position higher than the surrounding moisture surrounds region 4, so the spread of non-wetting solder 20a.

[0095] 其后,图5的(g)〜(i)的工序的实施与图1的(g)〜(i)的工序的实施相同。 [0095] Then, embodiment of the process of FIG. 5 (g) ~ (i), (g) ~ same embodiment (i) of Step 1. 在本实施方式中,由于如上所述焊料20a的绝对量非常少,又在连接盘区域3a的周围形成防湿区域4,而且连接盘区域3a形成在高于防湿区域4的位置,因此在预敷安装时能够防止焊料20a向连接盘区域3a的外侧润湿蔓延。 In the present embodiment, since the absolute amount of solder 20a is very small as described above, but also in the surrounding land region 3a moistureproof region 4 is formed, and the land region 3a formed at a position higher than the moisture region 4, so the pre-coating wetting solder can be prevented from spreading to the outside 20a land region 3a of the installation. 而且,完成了元器件内置基板后,即使在将该元器件内置基板对布线基板等进行回流焊时的热量使焊料20a再熔融的情况下,由于上述理由也能够可靠地防止焊料的蔓延。 Further, after completion of the component-embedded substrate, even when the heat component-embedded substrate of the wiring board for the reflow of the solder remelting 20a case, for the above reasons it is possible to surely prevent the spread of the solder.

[0096] 实施方式4 [0096] Embodiment 4

[0097] 接着,参照图6说明本发明的元器件内置基板的制造方法的第四实施方式。 [0097] Next, with reference to FIG. 6 described components of the present invention embedded substrate manufacturing method of the fourth embodiment.

[0098] 图6的(a)为第一工序,在金属箔31的一个主面上的整个面形成氧化膜31a。 [0098] FIG. 6 (a) as a first step, an oxide film 31a is formed on the entire surface of one main surface of the metal foil 31. 金属箔31及氧化膜31a与第二实施方式相同。 31 and the same oxide film 31a and the second embodiment of the metal foil.

[0099] 图6的(b)为第二工序,在金属箔31的氧化膜31a上仅形成连接盘图案的抗镀膜32。 [0099] FIG. 6 (b) is a second step of forming an anti-land pattern plating film 32 only on the metal foil of the oxide film 31a 31. 抗镀膜32的图案形状如图7所示,仅在应形成后文所述的元器件安装用连接盘区域33a及通孔用连接盘区域3¾的区域独立地形成开口部32a、32b,在与布线区域对应的部位不形成开口部。 The plating resist pattern shape 32 shown in Figure 7, described to be formed only after the opening portion of the component mounting regions 33a and 32a lands and vias are independently formed region of the connection of the disk area 3¾, 32b, with wiring region corresponding to the opening portion is not formed.

[0100] 图6的(c)为第三工序,将除抗镀膜32的形成区域以外的氧化膜31a去除。 [0100] FIG. 6 (c) is a third step of forming an oxide film other than the region 31a of the plating resist 32 is removed. 艮口, 去除与开口部3h、32b对应的位置的氧化膜31a。 Gen port, removing the opening portion 3h, the oxide film 32b corresponding to the position 31a.

[0101] 图6的(d)为第四工序,在除抗镀膜32的形成区域以外的金属箔31的上表面即开口部32a、32b内,形成金属镀敷层33。 [0101] FIG. 6 (d) is a fourth step, the surface of the metal foil other than the plating resist 32 formed area of ​​the opening portion 31, i.e., 32a, within 32b, the metal plating layer 33 is formed. 此金属镀敷层33形成后文所述的连接盘区域33a、 33b。 This metal plating layer 33 is formed above the connecting plate area 33a, 33b. [0102] 图6的(e)为第五工序,表示从金属箔31去除了抗镀膜32的状态。 [0102] FIG. 6 (e) a fifth step of indicating the state of the plating resist 32 is removed from the metal foil 31. 通过去除抗镀膜32,在金属箔31形成由金属镀敷层构成的具有平滑表面的连接盘区域33a、33b,使其较高,并且形成包围其周围的具有氧化膜31a的防湿区域34,使其较低。 32, the metal foil 31 is formed by removing the plating resist made of a metal plated layer having a smooth surface land area constituted 33a, 33b, so high, and formed surrounding the regions having an oxide film 31a moisture of around 34, so its low. 这样,各连接盘区域33a、3!3b形成为岛状,防湿区域34包围着其周围的整个周边。 Thus, each of the land regions 33a, 3! 3b surrounds the entire periphery thereof is formed around the island-shaped moisture-proof area 34. 在此阶段,未形成布线区域。 At this stage, the wiring region is not formed.

[0103] 图6的(f)为第六工序,表示通过印刷法等在金属箔31的连接盘区域33a上形成了焊料糊料35的状态。 [0103] FIG. 6 (f) the sixth step, the solder paste shows a state on the metal foil 35 is connected to pad region 33a 31 by a printing method or the like. 此外,通孔用连接盘区域3¾上未形成焊料糊料35。 Further, through holes 35 are not formed of the solder paste on the land area of ​​3¾.

[0104] 图6的(g)为第七工序,表示在形成了焊料糊料35的连接盘区域33a上配置电路元器件36、并利用回流等将其安装后的状态。 [0104] FIG. 6 (g) a seventh step, showing a state after the formation of the solder paste is mounted on the lands 35 of the region 33a arranged circuit components 36, and reflow and the like. 此时,电路元器件36的端子电极36a与连接盘区域33a通过焊料35a电连接。 At this time, the circuit components and the terminal electrode 36a is connected to 36 disk area 33a are electrically connected by a solder 35a. 在此实施方式中,由于连接盘区域33a为岛状,即在连接盘区域33a没有连续地形成高度相同的布线区域,而且连接盘区域33a形成在高于由氧化膜构成的防湿区域34的位置,因此熔融的焊料3¾停在连接盘区域33a,能够可靠地防止向外侧的润湿蔓延。 In this embodiment, since the island-shaped land area 33a, i.e., the height is not continuously formed in the same wiring region 33a connected to the disc area, and land area 33a is formed at a position higher than the moisture-proof film made of an oxide region 34 , the molten solder lands 3¾ parked in area 33a, can be reliably prevented from spreading to the outside of wetting.

[0105] 图6的(h)是第八工序,在金属箔31及电路元器件36上重叠树脂片材37及金属箔38并进行热压接。 [0105] FIG. 6 (h) is the eighth step, the overlapping resin sheet 37 and the metal foil 38 and the circuit components 31 on the metal foil 36 and the thermocompression bonding.

[0106] 图6的(i)为第九工序,通过对树脂层37a的下表面及上表面的金属箔31、38 — 起进行光刻及蚀刻,形成了布线图案38a、39。 [0106] FIG. 6 (i) is the ninth step, by the lower surface of the resin layer 37a and the upper surface of the metal foil 31 and 38 - carried out from photolithography and etching to form a wiring pattern 38a, 39. 由于在图6的(h)阶段还未在金属箔31形成布线区域,所以通过对金属箔31进行图案蚀刻,首次形成布线区域39。 Since the wiring area not formed in the metal foil 31 (h) stage of FIG. 6, the metal foil 31 by pattern etching, the first wiring region 39 is formed. 对于布线区域39 的形状,例如形成如图2所示那样的形状即可。 The shape of the wiring region 39 is formed, for example a shape as shown in FIG. 2.

[0107] 实施方式5 [0107] Embodiment 5

[0108] 接着,参照图8说明本发明的元器件内置基板的制造方法的第五实施方式。 [0108] Next, with reference to FIG. 8 illustrates components of the present invention embedded substrate manufacturing method of the fifth embodiment.

[0109] 图8的(a)为第一工序,在铜箔等金属箔40的一个主面上的整个面形成焊料润湿性差的金属膜41。 [0109] FIG. 8 (a) is a first step, solder wettability metal film 41 is formed on the entire surface of the difference between a main surface of a metal foil such as copper foil 40. 作为焊料润湿性差的金属,可使用钴、镍、钨、钼、铝、铬、铁、锌或包含这些金属的合金。 As a poor solder wettability metal may be cobalt, nickel, tungsten, molybdenum, aluminum, chromium, iron, zinc or alloys containing these metals. 镀敷厚度的有效范围是0. 5微米〜5微米(最好为0. 5〜1微米左右)。 The valid range plating thickness is 0.5 ~ 5 microns microns (preferably about 0.5 microns 5~1).

[0110] 图8的(b)为第二工序,表示在焊料润湿性差的金属膜41上涂敷抗镀膜42、形成图案后的状态。 [0110] FIG. 8 (b) is a second step, expressed on the metal film 41 has poor wettability of solder plating resist 42 is applied, a state after the patterning. 此外,也可以使用薄膜抗蚀剂。 Further, the resist film may be used. 抗镀膜42的材质、和图案形成方法与第一实施方式相同,在后文所述的工序中在应形成连接盘区域及布线的区域形成开口部42a。 The method of the same material the plating resist 42 and patterning of the first embodiment, in the step described later disc region and a wiring region of the connection to be formed in an opening portion 42a is formed. 开口部42a的形状可以与图2或图7相同。 Shape of the opening portion 42a may be the same as in FIG. 2 or FIG.

[0111] 图8的(c)为第三工序,在除抗镀膜42的形成区域以外的金属膜41上,形成焊料润湿性好的金属镀敷层43。 [0111] FIG. 8 (c) a third step of, on the metal film other than the plating resist 42 is formed in the region 41, is formed of metal having good solder wettability plating layer 43. 作为焊料润湿性好的金属,例如可以使用铜。 As a metal having good solder wettability, for example, copper. 由此,在从抗镀膜42的开口部42a露出的金属膜41上形成金属镀敷层43,从而形成连接盘区域及布线区域。 Thereby, the metal plating layer 43 is formed on the metal film 42 from the opening portion 42a of the plating resist 41 is exposed, thereby forming a connecting pad region and a wiring region. 此外,也可以在铜镀敷层43上形成通过锡镀敷形成的锡预敷层。 In addition, the plating layer may be formed by pre-deposited tin layer is formed on the tin plating 43 on the copper.

[0112] 图8的(d)为第四工序,表示从金属膜41去除了抗镀膜42的状态。 [0112] FIG. 8 (d) is a fourth step, showing a state removed from the plating resist 42 the metal film 41. 通过去除抗镀膜42,在由焊料润湿性差的金属膜41构成的防湿区域上,形成由焊料润湿性好的金属镀敷层43构成的连接盘区域及布线区域。 42 by removing the plating resist, the metal in the area of ​​the moisture-proof film is poor wettability of solder 41 configured to form a good solder wettability of the plating metal back region and a wiring connecting pad region 43 formed. 连接盘区域及布线区域形成在高于防湿区域的位置。 And a wiring region connecting pad region is formed at a position higher than the moisture-proof area.

[0113] 图8的(e)为第五工序,表示通过印刷法等在由焊料润湿性好的金属镀敷层43构成的连接盘区域上涂敷了焊料糊料44的状态。 [0113] FIG. 8 (e) a fifth step of indicating by printing or the like plated by a good solder wettability on a metal cladding layer 43 composed of the land area of ​​the state of the solder paste 44 is applied to. 此外,也可以在布线区域上不涂敷焊料糊料44。 In addition, the solder paste may not be coated on the wiring area 44. 另外,在第三工序中,当在焊料润湿性好的金属镀敷层43上形成锡预敷层时,无需涂敷焊料糊料44。 Further, in the third step, when the plating metal layer having good solder wettability cladding layer 43 when the pre-tin, solder paste 44 is formed without coating.

[0114] 图8的(f)为第六工序,表示在涂敷了焊料糊料44的连接盘区域43上配置电路元器件45、并利用回流等将其安装后的状态。 [0114] FIG. 8 (f) the sixth step, the solder paste is applied is shown in region 44 is disposed lands 43 on the circuit component 45, and the like using a reflow installed state thereof. 此时,电路元器件45的端子电极4¾与连接盘区域43通过焊料44a电连接。 At this time, the circuit components and the terminal electrodes 4¾ land region 45 43 is electrically connected by solder 44a. 连接盘区域43形成在高于防湿区域41的位置,而且防湿区域41由焊料润湿性差的金属形成,因此熔融的焊料4½停在连接盘区域43,不会向其外侧的防湿区域41润湿蔓延。 The land area 43 is formed at a position higher than the moisture-proof area 41, and region 41 is formed by the moisture poor wettability of solder metal, the molten solder lands 4½ parked in area 43, 41 is not wetted area outside of its moisture spread. 另外,在利用导电性粘接剂将电路元器件45安装到连接盘区域43上的情况下,也可以得到相同的效果。 Further, in the case of using a conductive adhesive to connect the circuit components 45 mounted on the disk area 43, the same effect can be obtained.

[0115] 图8的(g)是第七工序,在金属膜41及电路元器件45上重叠热固化性树脂片材46及金属箔47并进行热压接。 [0115] FIG. 8 (g) a seventh step of overlapping a thermosetting resin sheet 46 and the metal foil on the metal film 41 and the circuit components 45 47 and the thermocompression bonding. 树脂片材46的材质、和压接方法与第一实施方式相同。 Resin sheet material 46, and a crimping method in the first embodiment. 树脂片材46进入到金属膜41与电路元器件45的间隙、和电路元器件45彼此的间隙,并且也粘着在金属膜41的表面。 The resin sheet 46 into the gap between the metal film 41 of circuit components 45, 45 and the gaps between the circuit components, and is also adhered to the surface of the metal film 41. 树脂片材46中包含的热固化性树脂固化,形成树脂层。 A thermosetting resin contained in the resin sheet 46 is cured to form a resin layer.

[0116] 图8的(h)为第八工序,对树脂层46的上表面的金属箔47进行蚀刻或研磨而形成布线图案47a,而且对下表面的金属箔40进行蚀刻或研磨而形成布线图案。 [0116] FIG. 8 (h) an eighth step of, on the surface of the metal foil 47 of the resin layer 46 by etching or grinding the wiring pattern 47a is formed, and the lower surface metal foil 40 is etched or milled to form a wiring pattern. 在此示例中,上表面的布线图案47a是通过光刻或蚀刻而形成的,对下表面的金属箔40进行蚀刻或研磨, 直至去除防湿区域41,从而留下安装用连接盘区域40a和通孔用连接盘区域40b。 In this example, the upper surface 47a of the wiring pattern is formed by photolithography or etching, the lower surface of the metal foil 40 by etching or grinding, until the moisture removal region 41, leaving the mounting pad and the through region 40a hole lands region 40b. 此外,也可以留下布线区域(未图示)。 It is also possible to leave the wiring area (not shown).

[0117] 图8的(i)为第九工序,形成从上表面的布线图案47a到下表面的通孔用连接盘区域40b的通路孔48,在其中填充导电糊料而形成通孔导体。 [0117] FIG. (I) 8 to a ninth step, the through-hole from the surface of the wiring pattern on the lower surface of the passage hole 47a to the region 40b of the lands 48 is formed, in which the conductive paste filling the through-hole conductors are formed.

[0118] 在此实施方式的情况下,也由于在连接盘区域43的周围形成了由焊料润湿性差的金属构成的防湿区域41,所以能够有效地抑制焊料或导电性粘接剂的润湿蔓延。 [0118] In the case of this embodiment, since moisture is also composed of a region of poor wettability of solder 41 is formed in the metal plate around the connection area 43, it is possible to effectively suppress wetting solder or a conductive adhesive spread.

[0119] 实施例 [0119] Example

[0120]制法 1 [0120] Method 1

[0121] 基于实施方式1,通过以下步骤制作元器件内置基板的样品。 [0121] 1, the sample substrate prepared by the steps component built based on the embodiments.

[0122] (1)使用18微米厚的铜箔(日金属制造)作为金属箔(100毫米(mm) X 100毫米), 在其粗化面层压25微米厚的薄膜抗蚀剂(东京应化制造)后,实施曝光、显影处理,通过这样在除连接盘区域及布线区域以外的地方形成抗镀层。 [0122] (1) using 18 micrometer thick copper foil (Japan Metal) as a metal foil (100 millimeters (mm) X 100 mm) in the resist films roughened surface 25 micrometer thick laminate (Tokyo Ohka after manufacturing), to exposure, development processing, plating resist is formed by such a place other than the connecting pad region and a wiring region.

[0123] (2)使用硫酸铜镀液,形成膜厚为20微米的铜镀敷层。 [0123] (2) using a copper sulfate plating solution, having a thickness of 20 microns copper plated layer. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0124] (3)在3 %的氢氧化钠(NaOH)溶液中去除抗镀层。 [0124] (3) removing the plating resist in a 3% sodium hydroxide (NaOH) solution.

[0125] (4)在元器件安装用连接盘区域上印刷焊料糊料,并安装100个片状电容器。 [0125] (4) mounted on the printed solder paste using Component connection disk area, the chip capacitors 100 and install.

[0126] (5)在金属箔及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米的铜箔,将元器件埋设在树脂中。 [0126] (5) 500 m laminated on the metal foil and the chip capacitors resin sheet made of an epoxy type resin, and a copper foil of 18 microns, will be embedded in the resin component. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0127] (6)通过光刻·蚀刻使树脂层上表面的铜箔形成布线,通过蚀刻去除下表面的铜箔,形成布线图案。 [0127] (6) passing through the photolithography-etching the copper foil on the resin layer on the surface of a wiring is formed, it is removed by etching the lower surface of the copper foil wiring pattern is formed.

[0128]制法 2 [0128] Method 2

[0129] 基于实施方式2,通过以下步骤制作元器件内置基板的样品。 [0129] 2, the sample substrate prepared by the steps component built based on the embodiments.

[0130] (1)在空气中对12微米厚的铜箔(日金属制造)进行60分钟200度(°C )的热处理,在铜箔表面形成氧化膜。 [0130] (1) 12 micron thick copper foil (manufactured metal day) 200 degrees 60 minutes heat treatment (° C) in air, an oxide film is formed on the copper foil surface.

[0131] (2)使用上述铜箔作为金属箔(100毫米X 100毫米),在其氧化膜上层压25微米厚的薄膜抗蚀剂(东京应化制造)后,实施曝光、显影处理,通过这样在除连接盘区域及布线区域以外的地方形成抗镀层。 After [0131] (2) using the copper foil as the metal foil (100 mm X 100 mm) in which the resist film laminate oxide film 25 microns thick (manufactured by Tokyo Ohka), subjected to exposure, development processing, by such plating resist is formed by other than the connecting pad region and a wiring region.

[0132] (3)使用硫酸铜镀液,形成膜厚为20微米的铜镀敷层。 [0132] (3) copper sulfate plating solution, having a thickness of 20 microns copper plated layer. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0133] (4)在3 %的氢氧化钠(NaOH)溶液中去除抗镀层。 [0133] (4) plating resist was removed in a 3% sodium hydroxide (NaOH).

[0134] (5)在元器件安装用连接盘区域上印刷焊料糊料,并安装100个片状电容器。 [0134] (5) mounted on the printed solder paste is used in land area component, and mounting the chip capacitors 100.

[0135] (6)在金属箔及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米厚的铜箔,将元器件埋设在树脂中。 [0135] (6) 500 microns laminated on the metal foil and the chip capacitors resin sheet made of an epoxy type resin, and a copper foil 18 m thick, the components embedded in the resin. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0136] (7)通过光刻·蚀刻使树脂层上表面的铜箔形成布线,通过蚀刻去除下表面的铜箔,形成布线图案。 [0136] (7) The copper foil by photolithography-etching the surface of the resin layer for forming a wiring, is removed by etching the lower surface of the copper foil wiring pattern is formed.

[0137]制法 3 [0137] Method 3

[0138] 基于实施方式1及2,通过以下步骤制作元器件内置基板的样品。 [0138] Based on Embodiment 1 and Embodiment 2, the sample prepared by the steps component built-in substrate. 即,使用了在具有粗面的金属箔的表面形成了氧化膜的金属箔。 That is, the metal foil is formed on a surface oxide film having a rough surface of the metal foil.

[0139] (1)在空气中对35微米厚的铜箔(日金属制造)进行60分钟200度(°C )的热处理,在铜箔的粗化面上形成氧化膜。 [0139] (1) 35 micron copper foil on (date of metal) thick heat-treated 60 minutes 200 degrees (° C) in air, forming an oxide film on the roughened surface of the copper foil.

[0140] (2)使用上述铜箔作为金属箔(100毫米X 100毫米),在其粗化面的氧化膜上层压25微米厚的薄膜抗蚀剂(东京应化制造)后,实施曝光、显影处理,通过这样在除连接盘区域及布线区域以外的地方形成抗镀层。 After [0140] (2) using the copper foil as the metal foil (100 mm X 100 mm) in the resist films roughened surface oxide film 25 micron thick laminate (manufactured by Tokyo Ohka), the exposure, development processing, plating resist is formed by such a place other than the connecting pad region and a wiring region.

[0141] (3)使用硫酸铜镀液,形成膜厚为20微米的铜镀敷层。 [0141] (3) copper sulfate plating solution, having a thickness of 20 microns copper plated layer. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0142] (4)在3%的氢氧化钠(NaOH)溶液中去除抗镀层。 [0142] (4) plating resist was removed in a 3% sodium hydroxide (NaOH).

[0143] (5)在元器件安装用连接盘区域上印刷焊料糊料,并安装100个片状电容器。 [0143] (5) mounted on the printed solder paste is used in land area component, and mounting the chip capacitors 100.

[0144] (6)在金属箔及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米厚的铜箔,将元器件埋设在树脂中。 [0144] (6) 500 microns laminated on the metal foil and the chip capacitors resin sheet made of an epoxy type resin, and a copper foil 18 m thick, the components embedded in the resin. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0145] (7)通过光刻·蚀刻使树脂层上表面的铜箔形成布线,通过蚀刻去除下表面的铜箔,形成布线图案。 [0145] (7) The copper foil by photolithography-etching the surface of the resin layer for forming a wiring, is removed by etching the lower surface of the copper foil wiring pattern is formed.

[0146]制法 4 [0146] Method 4

[0147] 基于实施方式3,通过以下步骤制作元器件内置基板的样品。 [0147] 3, the sample substrate prepared by the steps component built based on the embodiments.

[0148] (1)使用100微米厚的铜箔(日金属制造)作为金属箔(100毫米X 100毫米), 在其粗化面层压25微米厚的薄膜抗蚀剂(东京应化制造)后,实施曝光、显影处理,通过这样在除连接盘区域及布线区域以外的地方形成抗镀层。 [0148] (1) 100 m thick copper foil (Japan Metal) as a metal foil (100 mm X 100 mm) in the resist films roughened surface 25 micrometer thick laminate (manufactured by Tokyo Ohka) after the exposure, development processing, thus formed by the plating resist except where the pad region and connected to the wiring area.

[0149] (2)使用硫酸铜镀液,形成膜厚为20微米的铜镀敷层。 [0149] (2) using a copper sulfate plating solution, having a thickness of 20 microns copper plated layer. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0150] (3)在元器件安装用连接盘区域表面实施1微米的锡-银置换镀敷,形成预敷层。 [0150] (3) In the embodiment 1 micron tin component mounting region of the surface of the lands - Silver displacement plating to form a precoat.

[0151] (4)在溶剂式剥离液中去除抗镀层。 [0151] (4) removing the plating resist stripper solution in a solvent.

[0152] (5)在元器件安装用连接盘区域上涂敷助焊剂后,安装100个片状电容器。 [0152] (5) after the component mounting land area flux coating, chip capacitors 100 mounted.

[0153] (6)在金属箔及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米厚的铜箔,将元器件埋设在树脂中。 [0153] (6) 500 microns laminated on the metal foil and the chip capacitors resin sheet made of an epoxy type resin, and a copper foil 18 m thick, the components embedded in the resin. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0154] (7)通过进行光刻·蚀刻使树脂层上表面的铜箔形成布线,通过研磨去除下表面的铜箔,形成布线图案。 [0154] (7) passing through the photolithography-etching the copper foil on the resin layer on the surface of a wiring is formed, it is removed by polishing the lower surface of the copper foil wiring pattern is formed.

[0155]制法 5 [0155] Method 5

[0156] 基于实施方式4,通过以下步骤制作元器件内置基板的样品。 [0156] 4, the sample substrate prepared by the steps component built based on the embodiments.

[0157] (1)在空气中对18微米厚的铜箔(日金属制造)进行60分钟200度(°C )的热处理,在铜箔表面形成氧化膜。 [0157] (1) 18 micron copper foil on (date of metal) thick heat-treated 60 minutes 200 degrees (° C) in air, an oxide film is formed on the copper foil surface.

[0158] (2)使用上述铜箔作为金属箔(100毫米X 100毫米),在其氧化膜上层压25微米厚的薄膜抗蚀剂(东京应化制造)后,实施曝光、显影处理,通过这样在除连接盘区域以外的地方形成抗镀层。 After [0158] (2) using the copper foil as the metal foil (100 mm X 100 mm) in which the resist film laminate oxide film 25 microns thick (manufactured by Tokyo Ohka), subjected to exposure, development processing, by such plating resist is formed by other than the land area.

[0159] (3)使用硫酸铜镀液,形成膜厚为20微米的仅为连接盘区域的铜镀敷层。 [0159] (3) copper sulfate plating solution, having a thickness of 20 microns is only connected to the copper plating layer disk area. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0160] (4)在3 %的氢氧化钠(NaOH)溶液中去除抗镀层。 [0160] (4) plating resist was removed in a 3% sodium hydroxide (NaOH).

[0161] (5)在元器件安装用连接盘上印刷焊料糊料,并安装100个片状电容器。 [0161] (5) a solder paste is printed on the component mounting land, the chip capacitors 100 and install.

[0162] (6)在金属箔及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米厚的铜箔,将元器件埋设在树脂中。 [0162] (6) 500 microns laminated on the metal foil and the chip capacitors resin sheet made of an epoxy type resin, and a copper foil 18 m thick, the components embedded in the resin. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0163] (7)通过光刻·蚀刻使树脂层上表面的铜箔形成布线,同时通过对下表面的铜箔进行光刻·蚀刻形成也包括连接盘间的布线区域的布线图案。 [0163] (7) the surface of the copper foil on the resin layer for forming a wiring by photolithography-etching, while the lower surface of the copper foil by photolithography-etching also includes a wiring pattern connected to the wiring area between the discs.

[0164][比较例] [0164] [Comparative Example]

[0165] 为了与基于所述各实施方式的元器件内置基板进行比较,基于专利文献2按照以下步骤制作了元器件内置基板。 [0165] For each of the embodiments based on the embodiment of the component-embedded substrate compared embedded substrate manufactured based on Patent Document 2 Component following steps.

[0166] (1)使用18微米厚的铜箔(日金属制造)作为金属箔(100毫米X 100毫米),在其光亮面即未粗化的面形成仅使连接盘区域开口的15微米厚的环氧式阻焊膜(太阳油墨制造)。 [0166] (1) using 18 micrometer thick copper foil (Japan Metal) as a metal foil (100 mm X 100 mm) and the connecting plate are formed only in the region of the opening 15 micrometers thick in its roughened surface i.e. not shiny surface type epoxy solder mask (Taiyo ink Mfg.).

[0167] (2)在元器件安装用连接盘区域上印刷焊料糊料,并安装100个片状电容器。 [0167] (2) mounted on the printed solder paste is used in land area component, and mounting the chip capacitors 100. 使元器件安装用连接盘区域的间隔为100微米。 That the lands for mounting components spacer region is 100 microns.

[0168] (3)在元器件安装用连接盘区域及片状电容器上层叠500微米的由环氧式树脂构成的树脂片材、和18微米厚的铜箔,将元器件内置于树脂中。 [0168] (3) in the resin sheet made of an epoxy resin of formula 500 microns by laminating the component mounting lands on the region and the chip capacitor, and a 18 m thick copper foil, the component-embedded in the resin. 其后,使树脂片材固化,作为树脂层。 Thereafter, the cured resin sheet, a resin layer.

[0169] (4)通过对树脂层上表面及下表面的铜箔进行光刻·蚀刻,形成布线图案。 [0169] (4) by the copper foil surface and the lower surface of the resin layer lithography-etched to form a wiring pattern.

[0170] 将用以上方法试制出的元器件内置基板供进行以下条件的试验后,通过透射X射线观察对有无因焊料迸流而造成短路进行了确认。 After [0170] The trial out by the above method of testing a component-embedded substrate for the following conditions, due to the presence or absence of a short circuit caused by solder flow Beng by transmitted X-ray observation was confirmed.

[0171] 条件1 :85度、85% RHX 168小时(h)—回流(最高温为260度)X 5次 [0171] Condition 1: 85 ° C, 85% RHX 168 hours (h) - reflux (maximum temperature 260 °) X 5 times

[0172] 条件2 :60度、60% RHX40小时一回流(最高温为260度)X4次 [0172] Condition 2: 60 degrees, 60% RHX40 one hour at reflux (maximum temperature of 260 degrees) X4 times

[0173]表 1 [0173] TABLE 1

[0174] [0174]

Figure CN101690434BD00161
Figure CN101690434BD00171

[0175] 〇:不发生短路,X :发生短路 [0175] ○: no short-circuit, X: short-circuited

[0176] 根据以上试验结果,可获知以下情况。 [0176] Based on the above test results, the following is known.

[0177] (1)在制法1〜3中,由于连接盘区域的周围由润湿性差的防湿区域包围,而且在基板内不产生现有技术那样的绝缘层/树脂层的不同种界面,因此能获得优良的抗焊料迸流性。 [0177] (1) In the production method 1~3, since the surrounding land region surrounded by the poor wettability moisture region, but does not produce different types of interfaces such as the prior art insulating layer / a resin layer in the substrate, it is possible to obtain an excellent resistance to flow of solder Beng. 但是,在以条件1那样的高温、高湿度长时间放置且回流次数多的试验中,有发生短路的可能性。 However, under the conditions such as a high-temperature, high-humidity place for a long time and many times reflux test, there is a possibility of a short circuit.

[0178] (2)在制法4中,由于将锡-银镀敷用作焊料,所以焊料量较少,抗焊料迸流性比制法1〜3得到进一步的提高。 [0178] (2) In the production method 4, since the Sn - Ag solder plating used, there is less amount of solder, solder resist Beng flow resistance can be further improved than 1~3 production method.

[0179] (3)在制法5中,由于焊料只存在于连接盘区域,而且在连接盘区域与布线区域之间形成高度差,因此抗焊料迸流性比制法1〜3得到进一步的提高。 [0179] (3) In the production method 5, since the solder exists only in the land areas, and a height difference is formed between the connecting pad region and the wiring region, the flow of the solder resist Beng further than Method 1 ~ 3 improve.

[0180] 在所述实施方式中,虽然都将连接盘区域形成在高于防湿区域的位置,但两区域也可形成在相同高度。 [0180] In the above embodiment, although the connection of the disk region are formed at a position higher than the moisture region, but both regions may be formed at the same height. 由于焊料或导电性粘接剂对于由粗面或氧化膜构成的防湿区域不易润湿蔓延,因此能降低发生焊料迸流等的风险。 Since the solder or the conductive adhesive from the rough area for moisture or wetting oxide film is less likely to spread, so the risk of solder flow or the like can be reduced Beng occur.

17 17

Claims (12)

  1. 1. 一种元器件内置基板的制造方法,包括以下工序:(a)在金属箔的一个主面上形成连接盘区域和防湿区域的工序,所述连接盘区域应连接电路元器件,所述防湿区域包围所述连接盘区域,其焊料或导电性粘接剂的润湿性比所述连接盘区域要差;(b)使用所述焊料或导电性粘接剂将所述电路元器件的端子电极与所述连接盘区域电连接的工序;(c)在所述金属箔及所述电路元器件上、形成埋设了所述电路元器件的树脂层的工序;以及(d)加工所述金属箔、而形成布线图案的工序。 CLAIMS 1. A method for manufacturing a component-embedded substrate, comprising the steps of: (a) forming a connecting area and the moisture-proof plate region on one main surface of the metal foil, the land area of ​​the circuit components to be connected, the moisture region surrounding the land area, wettability than the land area which solder or a conductive adhesive is worse; (b) the use of solder or conductive adhesive to the circuit component region of the terminal electrode is electrically connected to the land step; (c) on the metal foil and the circuit components, a step of forming a resin layer embedding the circuit component; and (d) processing said a metal foil, a step of forming a wiring pattern.
  2. 2.如权利要求1所述的元器件内置基板的制造方法,其特征在于,在所述工序(a)中, 所述防湿区域是粗化所述金属箔而形成的。 2. The component according to claim 1 built-in substrate manufacturing method, wherein, in the step (a), the moisture is roughened area formed by the metal foil.
  3. 3.如权利要求2所述的元器件内置基板的制造方法,其特征在于,所述工序(a)包括:(e)粗化金属箔的一个主面而形成粗面的工序;(f)在所述粗面上的与所述防湿区域对应的区域形成抗镀层的工序;(g)通过在除所述抗镀层的形成区域以外的所述粗面上形成所述焊料或导电性粘接剂的润湿性好的金属镀敷层、而形成所述连接盘区域的工序;以及(h)去除所述抗镀层、而形成由所述粗面构成的防湿区域的工序。 3. The component according to claim 2 of the built-in substrate manufacturing method, wherein said step (a) comprises: (e) main surface of a roughened metal foil surface to form a rough step; (f) forming the solder or a conductive adhesive other than through the rough surface of the plating resist is formed in a region other of (G); and the step of forming a moisture-proof area of ​​the region corresponding to the plating resist rough surface good wettability to the metal plating layer agent, to form said land area; and (h) removing the plating resist, a step of forming a moisture-proof region is constituted by the rough surface.
  4. 4.如权利要求1所述的元器件内置基板的制造方法,其特征在于,在所述工序(a)中, 所述防湿区域是氧化所述金属箔而形成的。 4. The component according to claim 1 built-in substrate manufacturing method, wherein, in the step (a), the moisture of the region is formed by oxidation of the metal foil.
  5. 5.如权利要求4所述的元器件内置基板的制造方法,其特征在于,所述工序(a)包括:(i)在金属箔的一个主面形成氧化膜的工序;(j)在所述氧化膜上的与所述防湿区域对应的区域形成抗镀层的工序; (k)将除所述抗镀层的形成区域以外的所述氧化膜去除的工序; (1)通过在去除了所述氧化膜的区域形成所述焊料或导电性粘接剂的润湿性好的金属镀敷层、而形成所述连接盘区域的工序;以及(m)去除所述抗镀层、而形成由所述氧化膜构成的防湿区域的工序。 The method for manufacturing the component-embedded substrate as claimed in claim 4, wherein said step (a) comprises: (i) a step of forming an oxide film on a main surface of the metal foil; (j) in the said step of forming the oxide film corresponding to a region of the moisture-proof plating resist region; (K) other than the oxide film formed in the region of the plating resist removing step; (1) through said removed in good wettability to the metal oxide film forming region of the solder or a conductive adhesive layer is plating, to form said land area; and (m) removing said plating resist, is formed by the step moisture in the oxide film region.
  6. 6.如权利要求1所述的元器件内置基板的制造方法,其特征在于,在所述工序(a)中, 所述防湿区域是由焊料或导电性粘接剂的润湿性比构成所述连接盘区域的金属要差的金属构成的。 The method of manufacturing a component-embedded substrate according to claim 1, wherein, in the step (a), the region is defined by moisture wettability of solder or a conductive adhesive agent constituting ratio said metal plate metal connection region configured to be poor.
  7. 7.如权利要求6所述的元器件内置基板的制造方法,其特征在于,所述连接盘区域是由铜或铜合金形成的,所述防湿区域是由钴、镍、钨、钼、铝、铬、铁、锌及这些金属的合金中的任一种形成的。 7. The component according to claim 6 embedded substrate manufacturing method, characterized in that said land areas are formed of copper or a copper alloy, the moisture-proof region is made of cobalt, nickel, tungsten, molybdenum, aluminum , chromium, iron, zinc and any alloys of these metals in a formation.
  8. 8.如权利要求6或7所述的元器件内置基板的制造方法,其特征在于,所述工序(a)包括:(η)准备金属箔的工序,所述金属箔在一个主面形成有焊料或导电性粘接剂的润湿性差的金属;(p)在所述金属箔上的与所述防湿区域对应的区域形成抗镀层的工序; (P)通过在除所述抗镀层的形成区域以外的所述金属箔上形成所述焊料或导电性粘接剂的润湿性好的金属镀敷层、而形成所述连接盘区域的工序;以及(q)去除所述抗镀层、而形成使所述焊料或导电性粘接剂的润湿性差的金属露出的防湿区域的工序。 8. The component of claim 6 or claim 7 built-in substrate manufacturing method, wherein said step (a) comprises: (η) preparing a metal foil, the metal foil is formed on one main surface poor wettability metal solder or a conductive adhesive; (P) on the metal foil is formed with a step region corresponding to the region of the plating resist moisture; (P) by forming a plating resist in addition to the good wettability to solder or a conductive metal forming the adhesive on the metal foil other than the region plating layer, to form said land area; and (q) removing the plating resist, and forming said solder or a conductive adhesive forming a metal moisture-proof area exposed poor wettability.
  9. 9.如权利要求1至7中的任一项所述的元器件内置基板的制造方法,其特征在于, 在所述工序(a)中,在所述连接盘区域连续地形成布线区域,在所述工序(d)中,通过蚀刻或研磨从所述金属箔的另一个主面侧去除预定厚度量, 从而形成具有所述连接盘区域及布线区域的布线图案。 9. claims 1 to 7 claims component-embedded substrate manufacturing method, wherein, in the step (a), a wiring region formed continuously in the land area, the step (d), is removed by a predetermined thickness from the other main surface side of the metal foil by etching or grinding, to thereby form a wiring pattern having a land region and a wiring region.
  10. 10.如权利要求1至7中的任一项所述的元器件内置基板的制造方法,其特征在于, 在所述工序(a)中,所述连接盘区域形成为岛状,所述防湿区域包围着所述连接盘区域的整个周边,在所述工序(d)中,通过对所述金属箔进行图案蚀刻,形成具有所述连接盘区域及与该连接盘区域连接的布线区域的布线图案。 As claimed in any of claims 1 to 7, the component-embedded substrate manufacturing method, wherein, in the step (a), the land area is formed in an island shape, the moisture-proof region surrounding the entire perimeter of the land area, in the step (d), by performing pattern etching of the metal foil, forming a wiring having the connection pad region and the wiring region connected to the connecting plate region pattern.
  11. 11.如权利要求1至7中的任一项所述的元器件内置基板的制造方法,其特征在于,所述工序(b)包括:通过在所述连接盘区域进行锡或锡合金镀敷,形成作为焊料的预敷层, 将所述电路元器件的端子电极对所述连接盘区域进行预敷安装。 As claimed in any of claims 1 to 7, the substrate manufacturing method according to a built-in component, characterized in that said step (b) comprises: by the tin or tin alloy plating land area forming a pre-solder coating, the terminal electrodes of the circuit component of the land pre-coating installation area.
  12. 12.如权利要求3或5所述的元器件内置基板的制造方法,其特征在于,所述金属箔由铜箔构成,所述金属镀敷层为铜镀敷层或铜合金镀敷层。 12. A component according to claim 3 or claim 5 embedded substrate manufacturing method, characterized in that the metal foil is made of copper, the metal plating layer is a plating layer or a copper-plated copper alloy plating layer.
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