CN101688287B - 用于制备内含层的方法 - Google Patents

用于制备内含层的方法 Download PDF

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Publication number
CN101688287B
CN101688287B CN200880016194.7A CN200880016194A CN101688287B CN 101688287 B CN101688287 B CN 101688287B CN 200880016194 A CN200880016194 A CN 200880016194A CN 101688287 B CN101688287 B CN 101688287B
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CN
China
Prior art keywords
layer
radiation
organic active
rsa
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880016194.7A
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English (en)
Chinese (zh)
Other versions
CN101688287A (zh
Inventor
C·D·朗
A·戈纳佳
P·A·桑托
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101688287A publication Critical patent/CN101688287A/zh
Application granted granted Critical
Publication of CN101688287B publication Critical patent/CN101688287B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
CN200880016194.7A 2007-05-18 2008-05-16 用于制备内含层的方法 Expired - Fee Related CN101688287B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US93879407P 2007-05-18 2007-05-18
US60/938,794 2007-05-18
PCT/US2008/063825 WO2008144467A1 (en) 2007-05-18 2008-05-16 Process for making contained layers

Publications (2)

Publication Number Publication Date
CN101688287A CN101688287A (zh) 2010-03-31
CN101688287B true CN101688287B (zh) 2015-03-18

Family

ID=39825546

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880016194.7A Expired - Fee Related CN101688287B (zh) 2007-05-18 2008-05-16 用于制备内含层的方法

Country Status (7)

Country Link
US (1) US20080286487A1 (cg-RX-API-DMAC7.html)
EP (1) EP2147129A1 (cg-RX-API-DMAC7.html)
JP (1) JP5457337B2 (cg-RX-API-DMAC7.html)
KR (1) KR101516447B1 (cg-RX-API-DMAC7.html)
CN (1) CN101688287B (cg-RX-API-DMAC7.html)
TW (1) TW200901531A (cg-RX-API-DMAC7.html)
WO (1) WO2008144467A1 (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090142556A1 (en) * 2007-11-29 2009-06-04 E. I. Du Pont De Nemours And Company Process for forming an organic electronic device including an organic device layer
US8040048B2 (en) * 2007-12-12 2011-10-18 Lang Charles D Process for forming an organic electronic device including an organic device layer
WO2010114583A1 (en) 2009-04-03 2010-10-07 E. I. Du Pont De Nemours And Company Electroactive materials
EP2459379A4 (en) * 2009-07-27 2015-05-06 Du Pont METHOD AND MATERIALS FOR PRODUCING RESTRICTED LAYERS AND DEVICES MADE THEREFOR
EP2795692A4 (en) 2011-12-20 2015-08-19 Du Pont METHOD AND MATERIALS FOR PRODUCING RESTRICTED LAYERS AND DEVICES MADE THEREFOR
KR20140033671A (ko) * 2012-09-10 2014-03-19 삼성디스플레이 주식회사 유기발광 표시장치 및 그 제조 방법
KR102019465B1 (ko) 2012-12-13 2019-09-06 주식회사 엘지화학 적층된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1128438A1 (en) * 2000-02-23 2001-08-29 Dai Nippon Printing Co., Ltd. Electroluminescent device and process for producing the same
CN1489420A (zh) * 2002-07-31 2004-04-14 �����ձ������ƶ���ʾ��ʽ���� 电致发光器件的制造方法
CN1711652A (zh) * 2002-11-15 2005-12-21 通用显示公司 有机器件结构及其制造方法

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US6303238B1 (en) * 1997-12-01 2001-10-16 The Trustees Of Princeton University OLEDs doped with phosphorescent compounds
TW472503B (en) * 2000-04-26 2002-01-11 Ritdisplay Corp Manufacture method of photosensitive polyimide pattern definition layer for organic light-emitting diodes display
US6670645B2 (en) * 2000-06-30 2003-12-30 E. I. Du Pont De Nemours And Company Electroluminescent iridium compounds with fluorinated phenylpyridines, phenylpyrimidines, and phenylquinolines and devices made with such compounds
EP1374641B1 (en) * 2001-03-02 2017-12-27 The Trustees Of Princeton University Double doped-layer, phosphorescent organic light emitting devices
JP2003058077A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
JP2003123967A (ja) * 2001-10-10 2003-04-25 Matsushita Electric Ind Co Ltd 発光素子の製造方法
JP4231645B2 (ja) * 2001-12-12 2009-03-04 大日本印刷株式会社 パターン形成体の製造方法
JP2004047176A (ja) * 2002-07-09 2004-02-12 Sharp Corp 有機エレクトロルミネッセンス素子
JP4165692B2 (ja) * 2002-08-05 2008-10-15 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
ATE404609T1 (de) * 2002-09-24 2008-08-15 Du Pont Wasserdispergierbare polythiophene hergestellt unter verwendung von kolloiden auf basis von polymersäuren
EP1549696A1 (en) * 2002-09-24 2005-07-06 E.I. Du Pont De Nemours And Company Water dispersible polyanilines made with polymeric acid colloids for electronics applications
JP2004355949A (ja) * 2003-05-29 2004-12-16 Tdk Corp 有機ｅｌ表示体の製造方法および有機ｅｌ製造装置
CN1574214A (zh) * 2003-06-03 2005-02-02 国际商业机器公司 用于制造电子器件的基于熔化的图案化工艺
CN101088181A (zh) * 2004-12-28 2007-12-12 出光兴产株式会社 有机电致发光元件
KR20070103402A (ko) * 2004-12-30 2007-10-23 이 아이 듀폰 디 네모아 앤드 캄파니 격납 구조체 및 방법
US20080309221A1 (en) * 2004-12-30 2008-12-18 E.I. Du Pont De Nemours And Company Containment Structure For an Electronic Device
US8053024B2 (en) * 2005-04-27 2011-11-08 Konica Minolta Holdings, Inc. Method for manufacturing organic electroluminescent device
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
US20070020395A1 (en) * 2005-06-27 2007-01-25 Lang Charles D Process for making an electronic device
US8124172B2 (en) * 2006-03-02 2012-02-28 E.I. Du Pont De Nemours And Company Process for making contained layers and devices made with same
US20080087882A1 (en) * 2006-06-05 2008-04-17 Lecloux Daniel D Process for making contained layers and devices made with same
JP5337811B2 (ja) * 2007-10-26 2013-11-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 閉じ込め層を製造するための方法および材料、ならびにそれを使用して製造したデバイス
US20090130296A1 (en) * 2007-11-15 2009-05-21 Universal Display Corporation Fabrication of Organic Electronic Devices by Ink-Jet Printing at Low Temperatures
US20110092076A1 (en) * 2008-05-19 2011-04-21 E.I. Du Pont De Nemours And Company Apparatus and method of vapor coating in an electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1128438A1 (en) * 2000-02-23 2001-08-29 Dai Nippon Printing Co., Ltd. Electroluminescent device and process for producing the same
CN1489420A (zh) * 2002-07-31 2004-04-14 �����ձ������ƶ���ʾ��ʽ���� 电致发光器件的制造方法
CN1711652A (zh) * 2002-11-15 2005-12-21 通用显示公司 有机器件结构及其制造方法

Also Published As

Publication number Publication date
KR101516447B1 (ko) 2015-05-04
WO2008144467A1 (en) 2008-11-27
US20080286487A1 (en) 2008-11-20
EP2147129A1 (en) 2010-01-27
KR20100018570A (ko) 2010-02-17
CN101688287A (zh) 2010-03-31
JP5457337B2 (ja) 2014-04-02
JP2010528427A (ja) 2010-08-19
TW200901531A (en) 2009-01-01

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150318

Termination date: 20160516

CF01 Termination of patent right due to non-payment of annual fee