CN101682997A - 用于向面式的基体上施加介质的方法和装置 - Google Patents
用于向面式的基体上施加介质的方法和装置 Download PDFInfo
- Publication number
- CN101682997A CN101682997A CN200880013213A CN200880013213A CN101682997A CN 101682997 A CN101682997 A CN 101682997A CN 200880013213 A CN200880013213 A CN 200880013213A CN 200880013213 A CN200880013213 A CN 200880013213A CN 101682997 A CN101682997 A CN 101682997A
- Authority
- CN
- China
- Prior art keywords
- matrix
- medium
- distributor
- supervising device
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
本发明涉及一种用于向面式的基体(2)上、特别是向印刷电路板上施加介质的装置(1),具有:用于按照一种印刷方法向基体(2)上施加介质的印刷装置;用于检查基体(2)相对于印刷装置的布置和/或定向的光学的监控装置;以及用于向基体(2)上补充施加介质的分配器(10),在该装置中设定,所述分配器(10)相对于所述光学的监控装置按固定的关系设置。
Description
技术领域
本发明涉及一种用于向面式的基体上、特别是向印刷电路板上施加介质的方法和装置。待施加的介质例如可以是粘结剂或焊膏。
背景技术
为了能够有效地给面式的基体设置介质、例如焊膏或粘接剂,在过去开发出了各种不同的方法,这些方法使得可以基本上同时地向印刷电路板的接近整个表面上施加所述介质。这里特别是所谓的丝网印刷法较为成功,在这种方法中可以借助于相应的印刷模板按相应希望的图案以简单的方式在基体上施加导体线路。
丝网印刷法构成一种将介质施加到基体上的经济的且有效的解决方案。但已经证明,通常在至少几个位置处,借助于丝网印刷法不能以足够令人满意的方式实现介质的施加。这特别是指这样的位置,所述位置与利用印刷模板可以实现的情况相比需要更多或更少的介质。
在这种情况下,介质的施加必须单独或点状地进行,其中为此通常使用所谓的且已知的分配器。借助于这种装置,尽管存在在印刷电路板的各单个位置按希望的量施加介质的可能性,但这种方法的效率要比前面所述的丝网印刷法低,因此,这种方法比较不适于常用地向印刷电路板上施加介质。如果设想,作为丝网印刷法的补充只是在几个确定的位置借助于分配器施加介质,则存在这样的问题,即,用于加工基体的相应的装置要设计得非常复杂。
发明内容
因此本发明的目的是,提供一种向基体上施加介质的改进的可能性。这里特别是应开创这样的可能性,即,即使是借助于分配器进行介质的补充施加也可以以简单和有效的方式进行。
所述目的通过根据权利要求1的方法以及通过根据权利要求6的装置来实现。本发明有利的改进方案是各从属权利要求的内容。
原则上本发明基于这样的构思,即,除了常见的对基体的印刷以外,还应借助于一分配器补充地施加介质。这里尽可能有效地利用已经是印刷基体必需的装置,以便使得也可以借助于分配器进行补充的施加介质。这里特别设想,将印刷基体本来就需要的光学的监控装置用于保持分配器,以便使分配器相对于所述监控装置按固定的关系设置,借助于所述监控装置确保基体相对于印刷装置的布置和正确定向(对齐)。
特别是可以设想,所述分配器固定在一照相机上,借助于该照相机可以在印刷方法的范围内监控标志,借助于所述标志确定基体的正确布置和定向。现在可以利用本来已经存在的照相机轴(线),一别借助于分配器例如在印刷电路板上放置粘结剂或焊料。这里分配器可以完全利用照相机轴的移动范围,以便到达全部待补充分配的位置。
因此,通过根据本发明的解决方案,明显地降低了总费用,因为不需要单独的用于借助于分配器施加介质的装置。此外,还可以利用所述照相机来确保分配器以正确的方式设置。以这种途径最终可以整体上提高在施加介质中的质量或精度。
附图说明
下面应根据附图对本发明进行详细说明。其中:
图1示出根据本发明的用于向面式的基体施加介质的装置的视图;
图2示出图1的视图的放大的局部。
具体实施方式
图1示出整体上用附图标记1表示的装置,借助于该装置可以将介质、例如粘结剂或焊膏施加到面式的基体上。这里示意性示出的基体2是一印刷电路板,该印刷电路板特别是应设有导体线路。
根据本发明设想,在一第一步骤中首先按照一种丝网印刷法施加待施加的介质的大部分。为此,示意性地示出一丝网印刷模板3,该丝网印刷模板此时为了以后的印刷工艺可以设置在印刷电路板2的表面上。这里重要的是,模板3相对于基体2以正确的方式设置和定向。
模板3相对于基体2的设置和定向借助于一光学的监控装置按已知的方式监控,该监控装置的主要组成部件是一照相机5。如图2中的放大视图所示,在照相机5的壳体6的上侧上设有一照相机窗口7,借助于该照相机窗口,可以观察位于照相机上方的印刷模板3。以相同的方式在壳体6的下侧上设有一第二照相机窗口,该照相机窗口用于,可以对位于照相机下方的印刷电路板2进行光学扫描。此时,借助于所述连个照相机窗口可以检测到设置在模板3上或印刷电路板2上的标志,通过所述标志可以识别,印刷电路板2是否正确地设置或定向,或者必要时是否需要相应的校正。在通过监控装置确认正确的设置之后,此时使印刷模板3下降到印刷电路板2上,以便启动印刷过程。
根据本发明,此外在照相机壳体6上还借助于一夹紧件8设置一分配器10,借助于所述分配器可以在另一个方法步骤中点状地并且对前面所述的丝网印刷法补充地向印刷电路板2上施加介质。在所示实施例中,涉及一种本身已知的所谓螺旋分配器10,在该螺旋分配器的前端部上设有一指向下面的针11,借助于一马达13通过该针将位于一筒(Kartusche)12中的介质施加到印刷电路板2上。例如可以在筒12中容纳粘结剂或焊膏。
根据本发明的解决方案的特别之处在于,分配器10固定地设置在照相机5上。这里由此得到第一个优点,即,照相机5的通过在图1中示出的各种不同的并且本身已知的部件实现的可移动性也可以用于相应地设置分配器10。分配器10由此可以在印刷电路板2的平面内在照相机5的运动范围内移动,而不必为此需要附加的机构。用于实现用于借助于丝网印刷法以及借助于分配器施加介质的组合式装置的费用可以以这种途径明显地降低。
另一个优点在于,分配器10按已知的相对于照相机5、具体地讲是相对于照相机窗口的布置形式设置。这意味着,在以后借助于分配器10补充施加介质时,照相机5也可以用于确保,分配器10以正确的方式定位。以这种途径,在施加介质时可以进一步改善精度。
因此,通过根据本发明的组合有助于实现精确地以及正确地将介质施加到基体上。同时还降低了用于实现相应装置的费用。
Claims (9)
1.用于向面式的基体(2)上、特别是向印刷电路板上施加介质的方法,具有以下步骤:
a)将基体(2)设置在印刷装置中,
b)借助于光学的监控装置使基体(2)相对于印刷装置定向,
c)借助于一种印刷方法向基体(2)上施加介质,以及
d)借助于分配器(10)向基体(2)上补充施加介质,
其特征在于,
分配器(10)相对于所述光学的监控装置按固定的关系设置。
2、根据权利要求1的方法,其特征在于,在步骤c)中介质的施加按照丝网印刷法来进行,其中,借助于所述光学的监控装置检查基体(2)相对于印刷装置的印刷模板(3)的布置和/或定向。
3、根据权利要求1或2的方法,其特征在于,所述光学的监控装置包括照相机(5)。
4、根据权利要求3的方法,其特征在于,所述分配器(6)固定在照相机(5)的壳体(6)上。
5、根据上述权利要求中任一项所述的方法,其特征在于,在借助于分配器(10)补充施加介质时,所述光学的监控装置用于检查分配器(10)的位置。
6、用于向面式的基体(2)上、特别是向印刷电路板上施加介质的装置(1),具有:
i)用于按照一种印刷方法向基体(2)上施加介质的印刷装置,
ii)用于检查基体(2)相对于印刷装置的布置和/或定向的光学的监控装置,以及
iii)用于向基体(2)上补充施加介质的分配器(10),
其特征在于,
所述分配器(10)相对于所述光学的监控装置按固定的关系设置。
7、根据权利要求6的装置,其特征在于,所述印刷装置构成为用于按照丝网印刷法施加介质。
8、根据权利要求6或7的装置,其特征在于,所述光学的监控装置包括照相机(5)。
9、根据权利要求8的装置,其特征在于,所述分配器(6)固定在照相机(5)的壳体(6)上。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007019073.7 | 2007-04-23 | ||
DE102007019073A DE102007019073A1 (de) | 2007-04-23 | 2007-04-23 | Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate |
PCT/EP2008/003219 WO2008128754A1 (de) | 2007-04-23 | 2008-04-22 | Verfahren und vorrichtung zum aufbringen von medien auf flächige substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101682997A true CN101682997A (zh) | 2010-03-24 |
Family
ID=39710997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880013213A Pending CN101682997A (zh) | 2007-04-23 | 2008-04-22 | 用于向面式的基体上施加介质的方法和装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100116157A1 (zh) |
EP (1) | EP2140744A1 (zh) |
KR (1) | KR20100015817A (zh) |
CN (1) | CN101682997A (zh) |
DE (1) | DE102007019073A1 (zh) |
WO (1) | WO2008128754A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476588A (zh) * | 2010-12-08 | 2013-12-25 | 伊利诺斯工具制品有限公司 | 用于通过组合式模板印刷机和分配器在基板上沉积粘性材料的方法 |
CN103502010A (zh) * | 2010-12-08 | 2014-01-08 | 伊利诺斯工具制品有限公司 | 组合式模板印刷机和分配器以及相关方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2446884B (en) | 2007-02-20 | 2012-02-01 | Dtg Int Gmbh | Screen printing machine |
US8474377B2 (en) | 2010-12-08 | 2013-07-02 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
US8746139B2 (en) * | 2010-12-08 | 2014-06-10 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
DE102014202170A1 (de) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Vorrichtung und Verfahren zum Bedrucken von Substraten |
DE102015120185A1 (de) | 2015-11-20 | 2017-05-24 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren und Vorrichtung zum Auswählen einer Pastenschablone für einen Pastendruck sowie zum Auftragen von Paste auf ein Substrat mittels der ausgewählten Pastenschablone |
DE102016116201B4 (de) | 2016-08-31 | 2018-06-21 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker |
US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5110615A (en) * | 1990-01-31 | 1992-05-05 | Asymptotic Technologies, Inc. | Method for dispensing viscous materials a constant height above a workpiece surface |
GB2323664A (en) * | 1997-03-25 | 1998-09-30 | Dek Printing Machines Ltd | Viewing and imaging systems |
WO2001067835A1 (en) * | 2000-03-10 | 2001-09-13 | Ari Co., Ltd. | Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste |
US6510356B2 (en) * | 2001-04-02 | 2003-01-21 | Hewlett-Packard Company | Method and apparatus for programming a paste dispensing machine |
GB2377908A (en) * | 2001-05-31 | 2003-01-29 | Blakell Europlacer Ltd | Screen printer for PCB with alignment apparatus |
US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
GB2446884B (en) * | 2007-02-20 | 2012-02-01 | Dtg Int Gmbh | Screen printing machine |
-
2007
- 2007-04-23 DE DE102007019073A patent/DE102007019073A1/de not_active Ceased
-
2008
- 2008-04-22 KR KR1020097022133A patent/KR20100015817A/ko not_active Application Discontinuation
- 2008-04-22 US US12/596,920 patent/US20100116157A1/en not_active Abandoned
- 2008-04-22 CN CN200880013213A patent/CN101682997A/zh active Pending
- 2008-04-22 WO PCT/EP2008/003219 patent/WO2008128754A1/de active Application Filing
- 2008-04-22 EP EP08735352A patent/EP2140744A1/de not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476588A (zh) * | 2010-12-08 | 2013-12-25 | 伊利诺斯工具制品有限公司 | 用于通过组合式模板印刷机和分配器在基板上沉积粘性材料的方法 |
CN103502010A (zh) * | 2010-12-08 | 2014-01-08 | 伊利诺斯工具制品有限公司 | 组合式模板印刷机和分配器以及相关方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20100015817A (ko) | 2010-02-12 |
WO2008128754A1 (de) | 2008-10-30 |
DE102007019073A1 (de) | 2008-11-06 |
EP2140744A1 (de) | 2010-01-06 |
US20100116157A1 (en) | 2010-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101682997A (zh) | 用于向面式的基体上施加介质的方法和装置 | |
KR100436017B1 (ko) | 스크린인쇄방법과그장치 | |
US10589514B2 (en) | Screen printing device having conveyance section for discharging and introducing both the screen mask and board support member | |
US20150075721A1 (en) | Screen printer and component mounting line | |
JP2003504833A (ja) | 自動装着装置で装填チェックする方法 | |
CN102736445B (zh) | 掩模与工件的对齐方法 | |
US20120024573A1 (en) | Printed circuit board and manufacturing method thereof | |
US20140293258A1 (en) | Manufacturing apparatus of electronic component and manufacturing method thereof | |
WO2002097534A3 (en) | Apparatus and method for aligning an article with a reference object | |
CN103269855B (zh) | 丝网印刷装置和丝网印刷方法 | |
JP4857828B2 (ja) | スクリーン印刷装置およびスクリーン印刷方法 | |
JP4122352B2 (ja) | 基板検査装置及びその制御方法 | |
CN109986896A (zh) | 基于ccd的自动对位丝印方法 | |
JP5906398B2 (ja) | スクリーン印刷装置及びスクリーン印刷装置におけるマスク位置決め方法 | |
KR101309271B1 (ko) | 국소 패턴의 인쇄 장치, 시스템, 및 방법 | |
JP6785404B2 (ja) | スクリーン印刷装置及び部品実装ライン | |
DE112020001298T5 (de) | Bauteilmontagevorrichtung und Bauteilmontageverfahren, Montagesubstrat-Herstellungssystem und Montagesubstrat-Herstellungsverfahren, und Montiertes-Bauteil-Prüfvorrichtung | |
CN105844316A (zh) | 一种标识码的制作方法、摄像模组和电子设备 | |
CN103302969B (zh) | 打印机及其打印方法 | |
KR100769529B1 (ko) | 기판 정렬 방법 및 장치 | |
JPS63207646A (ja) | スクリ−ン印刷装置における版合わせ方法 | |
JP2004136569A (ja) | スクリーン印刷装置のアライメント方法 | |
JP4436721B2 (ja) | スクリーン印刷方法、生産ライン及びプログラム | |
CN111315147A (zh) | 丝网印刷装置以及部件安装线 | |
JP2008218538A (ja) | 電子部品実装システムおよび電子部品実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100324 |