CN101667676A - Application of printing and overlapping membrane method in preparation of multiaperture-type array ceramic filters - Google Patents
Application of printing and overlapping membrane method in preparation of multiaperture-type array ceramic filters Download PDFInfo
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- CN101667676A CN101667676A CN200910167695A CN200910167695A CN101667676A CN 101667676 A CN101667676 A CN 101667676A CN 200910167695 A CN200910167695 A CN 200910167695A CN 200910167695 A CN200910167695 A CN 200910167695A CN 101667676 A CN101667676 A CN 101667676A
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Abstract
The invention discloses an application of a printing and overlapping membrane method in the preparation of multiaperture-type array ceramic filters. The implementation steps are as follows: firstly, printing ceramic dielectric paste to form ceramic raw material membranes; and then printing metal inner electrode sizing on the ceramic raw material membranes in an interlacing manner; leading electrode patterns to be symmetrical by being overlapped up and down; or directly overlapping the ceramic raw material membranes; printing the metal inner electrode sizing on the ceramic raw material membranes in an interlacing manner; leading electrode patterns to be symmetrical by being overlapped up and down; printing the metal inner electrodes symmetrically and intercrossing the reverse side of the metal inner electrodes; and finally, overlapping accessory pieces or printing dielectric paste on the surfaces after being printed and laminated, wherein, the accessory pieces are ceramic raw material membranes. The printing and overlapping membrane method, the body preparation method, is applied in preparing ceramic filters with the multilayer plate-type array structure, which solves the problem ofaltitude difference existing in an embedded electrode medium and a pure medium in the current process, meets the requirements of high-capacity and high voltage resistance of filters in anti-electromagnetic interference systems, ensures lamination quality, enhances mechanical strength of filters, improves production efficiency and is easy to install.
Description
Technical field
The present invention relates to the technology of preparing of filter, the particularly application of printing and overlapping membrane method in the multiaperture-type array ceramic filters preparation.
Background technology
Board-like array-structure ceramic filter reduces cost and effective anti-EMI/RFI element extensive use in anti-electromagnetic interference equipment as a kind of energy conserve space and weight.The tubular structure pottery that adopts in the conventional filter is being restricted aspect the expansion of capacitance, dielectric withstanding voltage performance and the packing density.The board-like array-structure ceramic filter of newly-developed is highly reliable, easy for installation in performance, produce the requirement that will satisfy the filtering equipment aspect efficient, and the process when it is prepared has proposed high requirement, and its solution is not appeared in the newspapers always.Because repeatedly the type metal electrode causes the medium place of intercalation electrode and prefect dielectric place that difference in height is arranged, the lamination quality is not good.
Summary of the invention
The invention discloses the application of printing and overlapping membrane method in the preparation of multiaperture-type ceramic filter, this method is implemented as follows:
A. at first print the ceramic dielectric slurry, form the ceramic raw material film, then the metal inner electrode slurry alternately is imprinted on the ceramic raw material film, and make the electrode pattern symmetry that overlaps up and down, the ceramic raw material film perhaps directly superposes, and the metal inner electrode slurry alternately is imprinted on the ceramic raw material film, make the electrode pattern symmetry that overlaps up and down;
B. with the printing of metal inner electrode symmetry, the reverse side that intersects;
C. at last at the surface of printed layers poststack stack tag or printed medium slurry, tag is the ceramic raw material film.
This body preparation method of printing and overlapping membrane method is applied to prepare ceramic filter with multilayer plate-type array structure, solve the medium place of intercalation electrode in the present technology and the problem that there is difference in height at the prefect dielectric place, satisfied in the anti-electromagnetic interference system the big capacity of filter, high requirement of withstand voltage, guaranteed the lamination quality, increased the filter mechanical strength, improved production efficiency, be easy to install.
Description of drawings
Fig. 1 is for adopting the multi-layer plate-type array ceramic capacitor schematic diagram of the present invention's preparation;
Fig. 2 is the ceramic green front view;
Fig. 3 is Fig. 2 A-A view;
Fig. 4 remedies intercalation electrode medium place and electrodeless medium place difference in height schematic diagram for adopting the present invention.
Embodiment
Below making overall dimension L:40.2 ± 0.3mm, W:9.7 ± 0.3mm, the filtering of thickness 2.0 ± 0.5mm is that the present invention is described in detail for example with multi-layer plate-type array ceramic capacitor.
Consult Fig. 1 to figure Fig. 3, capacitance is 5000pF, the ceramic filter of operating voltage 200VDC.
A kind of ceramic filter with multilayer plate-type array structure, this ceramic filter comprises multi-layer ceramics matrix 1, metal inner electrode 2, pickup electrode exit 3, earth electrode exit 4, wherein multi-layer ceramics matrix 1 is multi-layer ceramics raw material diaphragms, its number of plies is 40 layers, metal inner electrode 2 numbers of plies are 10 layers, metal inner electrode 2 places in the multi-layer ceramics matrix 1, after becoming the raw material base substrate by high temperature sintering, pickup electrode exit 3 is positioned at the little internal surface of hole of ceramic wafer, earth electrode exit 4 is positioned at the peripheral surface place of ceramic wafer, and multi-layer ceramics matrix 1 is provided with additional materials with the raw material base substrate outer surface that metal inner electrode 2 is formed.Additional materials is a ceramic raw material film tag, and the number of plies is 20 layers.
The metal inner electrode slurry is adopted the nylon mesh printing process, alternately be printed on the stacked ceramic raw material film, the electrode pattern symmetry that must overlap up and down; Then with metal inner electrode 2 symmetry printings, the turn-over that intersects; Finish metal inner electrode 2 and dielectric layer seal poststack on the surface folded ceramic raw material diaphragm as tag; The raw material base substrate that produces is put into warm isostatic pressing machine and is carried out static pressure such as temperature, pressure 15～30Mpa, time 10～50min; Green machined adopts die stamping method or laser forming method to be processed into the ceramic body of required dimension of picture, and the raw material of sticking sintering integratedization of the row of employing become the porcelain method to carry out sintering under 900～1170 ℃, and sintering time was controlled at 1～3 hour; Electrode lead-out part branch in the ceramic wafer adopts manual roll coating process metallizing terminal electrode paste, carries out silver ink firing under 850～900 ℃, and the silver ink firing time was controlled at 0.5～1 hour; Ceramic wafer surface-coated protective material carries out the protective layer sintering under 500～550 ℃, sintering time was controlled at 0.5～1.5 hour, promptly got final products of the present invention.
At first print the ceramic dielectric slurry, form the ceramic raw material film; Then the metal inner electrode slurry alternately is imprinted on the ceramic raw material film, and makes the electrode pattern symmetry that overlaps up and down; Then with metal inner electrode 2 symmetry printings, the turn-over that intersects; Last surface printing dielectric paste at the printed layers poststack; Green machined adopts die stamping method or laser forming method to be processed into the ceramic body of required dimension of picture, and the raw material of sticking sintering integratedization of the row of employing become the porcelain method to carry out sintering under 900～1170 ℃, and sintering time was controlled at 1～3 hour; Electrode lead-out part branch in the ceramic wafer adopts manual roll coating process metallizing terminal electrode paste, carries out silver ink firing under 850～900 ℃, and the silver ink firing time was controlled at 0.5～1 hour; Ceramic wafer surface-coated protective material carries out the protective layer sintering under 500～550 ℃, sintering time was controlled at 0.5～1.5 hour, promptly got final products of the present invention.
Consult Fig. 4, because there are difference in height in the medium place 6 and the prefect dielectric place 7 of intercalation electrode, adopt the present invention then to set up additional materials 5 in the surface behind the printing lamination, set up additional materials 5 and can adopt stack tag or printed medium slurry, thereby remedied difference in height, solved problems of the prior art.
The filtering of table 1, the present invention's preparation multi-layer plate-type array ceramic capacitor performance table
| Sample number into spectrum | Dielectric withstanding voltage U R(V) | Insulation resistance Rj (M Ω) | Capacitance C (pF) |
| ??1 | ?600 | ?20000 | ?7804 |
| ??2 | ?600 | ?15000 | ?7915 |
| ??3 | ?600 | ?30000 | ?8034 |
| ??4 | ?600 | ?20000 | ?8020 |
| ??5 | ?600 | ?30000 | ?7695 |
| ??6 | ?600 | ?30000 | ?7968 |
| ??7 | ?600 | ?20000 | ?7836 |
| ??8 | ?600 | ?15000 | ?8064 |
| ??9 | ?600 | ?30000 | ?7679 |
| ??10 | ?600 | ?30000 | ?7928 |
| ??11 | ?600 | ?20000 | ?8016 |
| ??12 | ?600 | ?15000 | ?7768 |
| ??13 | ?600 | ?30000 | ?8024 |
| ??14 | ?600 | ?30000 | ?7782 |
| ??15 | ?600 | ?20000 | ?7896 |
| ??16 | ?600 | ?15000 | ?8006 |
| ??17 | ?600 | ?30000 | ?8102 |
| ??18 | ?600 | ?30000 | ?7683 |
| ??19 | ?600 | ?20000 | ?8032 |
| ??20 | ?600 | ?30000 | ?8025 |
| ??21 | ?600 | ?15000 | ?7820 |
| ??22 | ?600 | ?20000 | ?8014 |
| ??23 | ?600 | ?30000 | ?7963 |
| ??24 | ?600 | ?30000 | ?7768 |
| ??25 | ?600 | ?20000 | ?7856 |
Can draw by table 1, the ceramic filter with multilayer plate-type array structure porcelain body densification of the present invention's preparation, the mechanical strength height, good insulation preformance, its evenness height is convenient to install.
Claims (1)
1. the application of printing and overlapping membrane method in the multiaperture-type array ceramic filters preparation, it is characterized in that: this method is implemented as follows:
A. at first print the ceramic dielectric slurry, form the ceramic raw material film, then the metal inner electrode slurry alternately is imprinted on the ceramic raw material film, and make the electrode pattern symmetry that overlaps up and down, the ceramic raw material film perhaps directly superposes, and the metal inner electrode slurry alternately is imprinted on the ceramic raw material film, make the electrode pattern symmetry that overlaps up and down;
B. with the printing of metal inner electrode symmetry, the reverse side that intersects;
C. at last at the surface of printed layers poststack stack tag or printed medium slurry, tag is the ceramic raw material film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910167695A CN101667676A (en) | 2009-09-22 | 2009-09-22 | Application of printing and overlapping membrane method in preparation of multiaperture-type array ceramic filters |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910167695A CN101667676A (en) | 2009-09-22 | 2009-09-22 | Application of printing and overlapping membrane method in preparation of multiaperture-type array ceramic filters |
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| CN101667676A true CN101667676A (en) | 2010-03-10 |
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| CN200910167695A Pending CN101667676A (en) | 2009-09-22 | 2009-09-22 | Application of printing and overlapping membrane method in preparation of multiaperture-type array ceramic filters |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492447A (en) * | 2017-08-01 | 2017-12-19 | 成都菲奥特科技有限公司 | The preparation method of filter connector multi-layer plate-type ceramics through condenser chip |
-
2009
- 2009-09-22 CN CN200910167695A patent/CN101667676A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492447A (en) * | 2017-08-01 | 2017-12-19 | 成都菲奥特科技有限公司 | The preparation method of filter connector multi-layer plate-type ceramics through condenser chip |
| CN107492447B (en) * | 2017-08-01 | 2019-08-20 | 成都菲奥特科技有限公司 | The preparation method of filter connector multi-layer plate-type ceramics through condenser chip |
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Application publication date: 20100310 |