CN101666761A - AOI non-programming detection method - Google Patents
AOI non-programming detection method Download PDFInfo
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- CN101666761A CN101666761A CN200910236018A CN200910236018A CN101666761A CN 101666761 A CN101666761 A CN 101666761A CN 200910236018 A CN200910236018 A CN 200910236018A CN 200910236018 A CN200910236018 A CN 200910236018A CN 101666761 A CN101666761 A CN 101666761A
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Abstract
The invention provides an AOI non-programming detection method, comprising the following steps: memorizing the normal welding image and corresponding failure characteristic parameters of the element of a standard board in a database; detecting the welding element to be detected according to the normal welding image; determining the failure type of the failed welding element according to the failure characteristic parameter; comparing the images of the standard board with the images of the board to be detected at the non-element area of the board to be detected; and determining the failure areaaccording to the image difference and the failure image characteristic library.
Description
Technical field
The present invention relates to the communications field, in particular to a kind of AOI non-programming detection method.
Background technology
Present AOI (Automatic Optical Inspection, automated optical inspection) when the circuit-under-test plate is tested, at first need the element to be tested and the failure mode of circuit board are programmed, equipment could be tested these programmed point then.
The programming process of prior art generally uses two kinds of methods: a kind of is the method that adopts manual programming, and the position of detecting at needs draws detection block one by one; Another kind method is to adopt the chip data of chip mounter, and (position and component kind information are put in the subsides of element) is in conjunction with the component library system of AOI self, and be automatically that detection window is corresponding with measured device, the realization automated programming.
The inventor finds the available technology adopting manual programming or adopts chip mounter paster automated programming, be actually manually definite defect test is carried out in the artificial zone of determining, such as few tin, short circuit, the wrong part of element etc., but because the limitation of programming, have the zone that is not programmed in a large number, the defective that causes taking place in these zones can't be detected, and breaks such as printed board, the tin sweat(ing) that is scattered, unexpected dirty juice etc.
Summary of the invention
The present invention aims to provide a kind of AOI non-programming detection method, can solve in the prior art because there are the zones that are not programmed in a large number in the limitation of programming, the problem that the defective that causes taking place in these zones can't be detected.
In an embodiment of the present invention, provide a kind of AOI non-programming detection method, may further comprise the steps:
The normal welding image and the corresponding fault signature parameter thereof of the element of on-gauge plate are kept in the database;
Detect according to the soldered elements of normal welding image, and determine the fault type of the soldered elements that breaks down according to the fault signature parameter board under test;
To the negator zone of board under test, the image of on-gauge plate and board under test is compared, as feature database, determine the fault zone according to image difference and fault graph.
Preferably, in above-mentioned AOI non-programming detection method, negator zone to board under test, the image of on-gauge plate and board under test is compared, according to image difference and fault graph as feature database, determine that the fault zone specifically comprises: the image of on-gauge plate and board under test is compared, determine the plate differences; To belong to the plate differences filtering of normal difference, and the regional forecast that will meet " defect characteristic " comes out.
Preferably, in above-mentioned AOI non-programming detection method, normal difference comprises: silk-screen difference.
In the above-described embodiments, detect by soldered elements board under test, and determine fault type according to the fault signature parameter, and to the negator zone of board under test, by carrying out image comparison with on-gauge plate, determine the fault zone, reduced the technical difficulty that equipment uses, the shortcoming of having avoided existing pattern that the outer fault of program regions " is turned a blind eye to ", the various defectives on can the complete detection circuit board.So just can carry out full board test and not need in advance " programming ", overcome in the prior art, the problem that causes the defective in these zone generations to be detected because there are the zones that are not programmed in a large number in the limitation of programming to circuit board.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present invention, constitutes the application's a part, and illustrative examples of the present invention and explanation thereof are used to explain the present invention, do not constitute improper qualification of the present invention.In the accompanying drawings:
Fig. 1 shows AOI non-programming detection method process flow diagram according to an embodiment of the invention;
Fig. 2 shows the effect screen sectional drawing of preserving the welding picture of element according to an embodiment of the invention in the AOI database.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
Fig. 1 shows AOI non-programming detection method process flow diagram according to an embodiment of the invention, may further comprise the steps:
S102 is kept at the normal welding image and the corresponding fault signature parameter thereof of the element of on-gauge plate in the database;
S104 detects according to the soldered elements of normal welding image to board under test, and determines the fault type of the soldered elements that breaks down according to the fault signature parameter;
S106 to the negator zone of board under test, compares the image of on-gauge plate and board under test, as feature database, determines the fault zone according to image difference and fault graph.
In the present embodiment, detect by soldered elements board under test, and determine fault type according to the fault signature parameter, and to the negator zone of board under test, by carrying out image comparison with on-gauge plate, determine the fault zone, reduced the technical difficulty that equipment uses, the shortcoming of having avoided existing pattern that the outer fault of program regions " is turned a blind eye to ", the various defectives on can the complete detection circuit board.So just can carry out full board test and not need in advance " programming ", overcome in the prior art, the problem that causes the defective in these zone generations to be detected because there are the zones that are not programmed in a large number in the limitation of programming to circuit board.
Fig. 2 shows the effect screen sectional drawing of preserving the welding picture of element according to an embodiment of the invention in the AOI database.
Preferably, in above-mentioned AOI non-programming detection method, negator zone to board under test, the image of on-gauge plate and board under test is compared, according to image difference and fault graph as feature database, determine that the fault zone specifically comprises: the image of on-gauge plate and board under test is compared, determine the plate differences; To belong to the plate differences filtering of normal difference, and the regional forecast that will meet " defect characteristic " comes out.
Preferably, in above-mentioned AOI non-programming detection method, normal difference comprises: silk-screen difference.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. an AOI non-programming detection method is characterized in that, may further comprise the steps:
The normal welding image and the corresponding fault signature parameter thereof of the element of on-gauge plate are kept in the database;
Detect according to the soldered elements of described normal welding image, and determine the fault type of the described soldered elements that breaks down according to described fault signature parameter board under test;
To the negator zone of board under test, the image of described on-gauge plate and described board under test is compared, as feature database, determine the fault zone according to image difference and described fault graph.
2. AOI non-programming detection method according to claim 1, it is characterized in that,, the image of described on-gauge plate and described board under test is compared the negator zone of board under test, as feature database, determine that the fault zone specifically comprises according to image difference and described fault graph:
The image of described on-gauge plate and described board under test is compared, determine the plate differences;
To belong to the described plate differences filtering of normal difference, and the regional forecast that will meet " defect characteristic " comes out.
3. AOI non-programming detection method according to claim 2 is characterized in that, described normal difference comprises: silk-screen difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910236018A CN101666761A (en) | 2009-10-26 | 2009-10-26 | AOI non-programming detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910236018A CN101666761A (en) | 2009-10-26 | 2009-10-26 | AOI non-programming detection method |
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| CN101666761A true CN101666761A (en) | 2010-03-10 |
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| CN200910236018A Pending CN101666761A (en) | 2009-10-26 | 2009-10-26 | AOI non-programming detection method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102901737A (en) * | 2011-07-27 | 2013-01-30 | 何忠亮 | Automatic optical detection method |
| CN103037630A (en) * | 2012-12-11 | 2013-04-10 | 上海斐讯数据通信技术有限公司 | Double-screen achieving method of surface mount technology (SMT)-automated optical inspection (AOI) equipment |
| CN104458754A (en) * | 2014-11-19 | 2015-03-25 | 湖北三江航天红峰控制有限公司 | Method for obtaining solder testing threshold of English system 0603 packaging devices employing AOI detection |
| CN105203549A (en) * | 2015-09-10 | 2015-12-30 | 苏州威盛视信息科技有限公司 | Circuit board AOI (automated optical inspection) detection method |
| CN107561737A (en) * | 2017-08-21 | 2018-01-09 | 武汉精测电子技术股份有限公司 | A kind of method, apparatus and instrument of AOI system IPC parameter adjust automaticallies |
| WO2018072333A1 (en) * | 2016-10-18 | 2018-04-26 | 广州视源电子科技股份有限公司 | Method for detecting wrong component and apparatus |
| CN108693459A (en) * | 2017-10-19 | 2018-10-23 | 曹宁 | Two point VI curved scannings for various circuit boards compare method for diagnosing faults |
-
2009
- 2009-10-26 CN CN200910236018A patent/CN101666761A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102901737A (en) * | 2011-07-27 | 2013-01-30 | 何忠亮 | Automatic optical detection method |
| CN103037630A (en) * | 2012-12-11 | 2013-04-10 | 上海斐讯数据通信技术有限公司 | Double-screen achieving method of surface mount technology (SMT)-automated optical inspection (AOI) equipment |
| CN103037630B (en) * | 2012-12-11 | 2017-06-16 | 上海斐讯数据通信技术有限公司 | A kind of SMT AOI equipment double screen implementation method |
| CN104458754A (en) * | 2014-11-19 | 2015-03-25 | 湖北三江航天红峰控制有限公司 | Method for obtaining solder testing threshold of English system 0603 packaging devices employing AOI detection |
| CN105203549A (en) * | 2015-09-10 | 2015-12-30 | 苏州威盛视信息科技有限公司 | Circuit board AOI (automated optical inspection) detection method |
| WO2018072333A1 (en) * | 2016-10-18 | 2018-04-26 | 广州视源电子科技股份有限公司 | Method for detecting wrong component and apparatus |
| CN107561737A (en) * | 2017-08-21 | 2018-01-09 | 武汉精测电子技术股份有限公司 | A kind of method, apparatus and instrument of AOI system IPC parameter adjust automaticallies |
| CN107561737B (en) * | 2017-08-21 | 2020-05-22 | 武汉精测电子集团股份有限公司 | Method, device and tool for automatically adjusting IPC (International Process control) parameters of AOI (automatic Option identification) system |
| CN108693459A (en) * | 2017-10-19 | 2018-10-23 | 曹宁 | Two point VI curved scannings for various circuit boards compare method for diagnosing faults |
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Open date: 20100310 |