CN105277569A - Method for detecting circuit board based on three-dimensional characteristics - Google Patents
Method for detecting circuit board based on three-dimensional characteristics Download PDFInfo
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- CN105277569A CN105277569A CN201510846211.1A CN201510846211A CN105277569A CN 105277569 A CN105277569 A CN 105277569A CN 201510846211 A CN201510846211 A CN 201510846211A CN 105277569 A CN105277569 A CN 105277569A
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Abstract
The invention discloses a method for detecting a circuit board based on three-dimensional characteristics. The method comprises the following steps: acquiring three-dimensional coordinate data on each position of the detected circuit board; extracting each three-dimensional characteristic value according to the three-dimensional coordinate data on each position; judging if each three-dimensional characteristic value meets a standard value; and when the three-dimensional characteristic value does not meet the standard value, confirming the position corresponding to the three-dimensional characteristic value as a defect position. According to the scheme, the three-dimensional coordinate data on each point of the circuit board is collected, treated, compared and analyzed, so that the detecting result is acquired and the defects of all the circuit boards can be detected; the method is not influenced by the environments of oxidation, smudge, and the like; the false detecting rate or false reporting rate caused by the environmental influence is effectively reduced; besides, the sunken defect and the blind hole which cannot be detected by a traditional automatic optical detector can be detected.
Description
Technical field
The present invention relates to technical field of optical detection, particularly relate to a kind of wiring board detection method based on three-dimensional feature.
Background technology
Printed wiring board (PCB, PrintedCircuitBoard) be the substrate assembling electronic component, it is the critical electrical cross tie part of electronic product, be called as " mother of electronic system product ", therefore quality testing is carried out to it, there is important meaning, realized by automated optical inspection (AOI) during traditional detection to printed wiring board.
In the process that automated optical inspection detects printed wiring board, existing detection mode is the plane picture first obtaining product, then by this plane picture compared with standard picture, and then according to comparative result, defect dipoles is carried out to testing product.Particularly, from the angle detecting feature used, existing method is based on " gray feature of plane picture ".Because board substrate is different with the reflection characteristic of conductor, when appearance many copper defect, such as, during the defects such as short circuit, copper ashes, burr, high-brightness region should be there will be in the lower position of brightness; When appearance lacks copper defect, such as, during the defects such as open circuit, pin hole, breach, low brightness area should be there will be in the higher position of brightness.
But existing method of carrying out detecting based on product gradation of image feature, the shortcoming of existence comprises:
On the one hand due to the easily interference such as oxidated, dirty and cause flase drop of the product that detects.Field statistics data show, existing AOI equipment institute reported defects number is that in addition, these wrong reports take a large amount of reinspection acknowledging times and manpower due to oxidation and the dirty wrong report caused more than 40%; Cannot detect completely for some depression defects on the other hand.Such as, printed wiring board has a class defect be still there is conductor to connect, but conductor thickness is far below design load.This defect can cause intensity to reduce even impedance changing, need to detect, and existingly cannot detect this defect by AOI instrument based on the detection method of gradation of image feature.
Summary of the invention
The wiring board detection method based on three-dimensional feature is provided, to solve the problem in the embodiment of the present invention.
In order to solve the problems of the technologies described above, the embodiment of the invention discloses following technical scheme:
Based on a wiring board detection method for three-dimensional feature, described method comprises:
Obtain the three-dimensional coordinate data of each position on detected wiring board, described three-dimensional coordinate data comprises X-axis coordinate data, Y-axis coordinate data and Z axis coordinate data;
The three-dimensional feature value of each position is extracted according to the three-dimensional coordinate data of each position described;
Judge whether each described three-dimensional feature value meets standard value;
When three-dimensional feature value does not meet described standard value, determine that this position corresponding to three-dimensional feature value is defective locations.
Preferably, described acquisition is detected the three-dimensional coordinate data of each position on wiring board and comprises:
Obtain the measured data of each position on detected wiring board;
Described measured data is processed, obtains the three-dimensional coordinate data of each position described.
Preferably, describedly to process described measured data, the three-dimensional coordinate data obtaining each position described comprises:
Rejecting interference process is carried out to described measured data, obtains the three-dimensional coordinate data of each position described.
Preferably, the three-dimensional coordinate data of each position described in described basis extracts each three-dimensional feature value and also comprises:
The Z axis coordinate data of each described three-dimensional coordinate data is extracted according to the three-dimensional coordinate data of each position, and using described Z axis coordinate data as three-dimensional feature value.
Preferably, described three-dimensional feature value also comprises elevation, gradient magnitude and direction, level line or height step.
Preferably, describedly judge whether each described three-dimensional feature value meets standard value and comprise:
Judge whether each described three-dimensional feature value meets standard value, or, judge each described three-dimensional feature value whether within values.
Preferably, when judging whether each described three-dimensional feature value meets standard value, described method also comprises:
Processing quality according to described wiring board requires and production rule, determines described standard value.
Preferably, when judging that each described three-dimensional feature value is whether within preset threshold range, described method also comprises:
Obtain the design parameter of the reference plate line corresponding with described detected wiring board;
According to the design parameter of described reference plate line, obtain the reference three-dimensional coordinate data of each position on described reference plate line;
According to each described with reference to three-dimensional coordinate data, extract each described with reference to the reference three-dimensional feature value in three-dimensional coordinate data;
According to each described values determining each described three-dimensional feature value with reference to three-dimensional feature value.
Preferably, described reference three-dimensional feature value comprises elevation, gradient magnitude and direction, level line or height step.
Preferably, it is characterized in that, described method also comprises:
Add up all defective locations not meeting described standard value, and draw the simulation drawing corresponding with described detected wiring board.
A kind of wiring board detection method based on three-dimensional feature that this programme provides, by gathering the three-dimensional coordinate data of each position of PCB surface, extract the three-dimensional feature value of each three-dimensional coordinate data, again by comparing these three-dimensional feature values, when the three-dimensional feature value obtained does not meet standard value, show that position corresponding to this three-dimensional feature value is defective locations.Because this programme is that the three-dimensional coordinate data put for each on wiring board carries out gathering, process, compare and analyzing, obtain testing result.Due to when there is defect in detected wiring board, no matter be many copper or scarce copper defect, the conductor thickness of wiring board relevant position all can change relative to standard value or exceed allowed band, and the detection method that therefore this programme provides can detect all types of wiring board defect.Further the impact of the environment such as this detection method is not oxidated, dirty, even if wiring board is oxidized or dirty, the thickness of this wiring board can not also be affected, so, can reduce the false drop rate or rate of false alarm that cause because of environmental impact effectively.
In addition, compared to existing based on product gray level image detection method, this programme can also judge particular location, form, size, the type of wiring board defect, can detect the depression that traditional automated optical inspection cannot detect and defect; Because three-dimensional coordinate data directly can embody hole depth, therefore blind hole quality testing accurately can be realized.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, for those of ordinary skills, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The process flow diagram of a kind of wiring board detection method based on three-dimensional feature that Fig. 1 provides for the embodiment of the present invention;
The three-dimensional structure schematic diagram of a kind of detected wiring board that Fig. 2 provides for the embodiment of the present invention;
The another kind that Fig. 3 provides for the embodiment of the present invention is based on the process flow diagram of the wiring board detection method of three-dimensional feature;
The another kind that Fig. 4 provides for the embodiment of the present invention is based on the process flow diagram of the wiring board detection method of three-dimensional feature;
What a kind of wiring board detection method based on three-dimensional feature that Fig. 5 provides for the embodiment of the present invention detected with existing AOI compares schematic diagram.
Embodiment
Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
The invention provides a kind of wiring board detection method based on three-dimensional feature, as shown in Figure 1, the method comprises:
Step S110: the three-dimensional coordinate data obtaining each position on detected wiring board, described three-dimensional coordinate data comprises X-axis coordinate data, Y-axis coordinate data and Z axis coordinate data.
First need to set up a three-dimensional coordinate system, comprise X-axis, Y-axis and Z axis; Secondly, detected wiring board is placed in this three-dimensional coordinate system, each position on detected wiring board can both be showed by three dimensional space coordinate; Wherein any point all comprises X-axis coordinate data, Y-axis coordinate data and Z axis coordinate data.
Step S120: extract each position according to the three-dimensional coordinate data of each position described, and the three-dimensional feature value corresponding with described three-dimensional coordinate data.
Described three-dimensional feature value comprises Z axis coordinate data, or other value, and such as elevation, gradient magnitude and direction, level line or height step etc. can represent the value of detected wiring board feature.
Step S130: judge whether each described three-dimensional feature value meets standard value.
Because X-axis and Y-axis form horizontal plane, Y-axis coordinate represents height or the thickness of detected wiring board, thus detection line plate whether defectiveness time, usually can judge whether Z axis coordinate data meets standard value.
Step S140: when three-dimensional feature value does not meet described standard value, determines that the position that the three-dimensional coordinate data at this three-dimensional feature value place is corresponding is defective locations.Wherein do not meet standard value to comprise higher or lower than comparative standard value.
Step S141: when judging that this three-dimensional feature value meets standard value, time namely identical with standard value, determines this coordinate position zero defect.
A kind of wiring board detection method based on three-dimensional feature that the present embodiment provides, by gathering the three-dimensional coordinate data of each position of PCB surface, extract the three-dimensional feature value in these three-dimensional coordinate datas, and by these three-dimensional feature values compared with standard value, when not meeting standard value, show that the position that this three-dimensional data coordinate is corresponding is defective locations.Because this programme is different from existing according to reflection characteristic, namely the collection of plane picture gray feature is detected the information of wiring board, compare again, but the feature different according to the wiring board degree of depth, base material due to wiring board is a smooth flat board, conductor is in base material projection, projection thickness is generally at 30 microns to 500 microns, as shown in Figure 2, when a defect has occurred, no matter be many copper or scarce copper defect, the conductor thickness of wiring board relevant position can change relative to standard value (or design load), or exceed allowed band, based on this three-dimensional feature value, the technical program extracts the three-dimensional feature value of each position on detected wiring board, and these three-dimensional feature values are compared and analyzed, and then obtain testing result.
Even if the detected wiring board of the detection method that this programme provides is oxidized or dirty, also the thickness of this wiring board can not be affected, therefore, the impact of the environment such as this method is not oxidated, dirty, effectively can reduce the false drop rate or rate of false alarm that cause because of environmental impact, and the defect problem that wiring board is all can be detected.
As shown in Figure 3, in step s 110, described acquisition is detected the three-dimensional coordinate data of each position on wiring board and comprises:
Step S111: the measured data obtaining each position on detected wiring board; Wherein said three-dimensional coordinate data comprises X-axis coordinate data, Y-axis coordinate data and Z axis coordinate data.
Wherein, in step S111, by carrying out graph scanning to detected wiring board, then the results conversion of scanning being become data, namely obtaining described measured data; Or obtain described measured data by taking pictures to detected wiring board; The present embodiment includes but not limited to described graph scanning or two kinds of modes of taking pictures obtain the measured data of detected wiring board.
Step S112: process described measured data, obtains the three-dimensional coordinate data of each position described.
In order to reduce or eliminate the interference such as noise in measured data, affect testing result, process the measured data obtained in step S111, described process comprises the process such as filtering, denoising, amplification.
Preferably, in step S112, describedly to process described measured data, the three-dimensional coordinate data obtaining each position described comprises:
Step S1121: rejecting interference process is carried out to described measured data, obtains the three-dimensional coordinate data of each position described.Make the three-dimensional coordinate data of the detected wiring board of acquisition be detected the actual value of wiring board closer to reality, reduce to measure the error brought, further increase Detection job.
In the another aspect of above-described embodiment, step S120: extract each three-dimensional feature value according to the three-dimensional coordinate data of each position described and also comprise:
Step S121: the Z axis coordinate data extracting each described three-dimensional coordinate data according to the three-dimensional coordinate data of each position, and using described Z axis coordinate data as three-dimensional feature value.
In addition, in step S121, described three-dimensional feature value also comprises elevation, gradient magnitude and direction, level line or height step.Wherein, described elevation, gradient magnitude and direction, level line or height step all can be represented by the height above water formed higher than X-axis and Y-axis.According to the actual conditions of detected wiring board, the three-dimensional feature value extracted can also be determined.
In another embodiment, in step S130, judge whether each described three-dimensional feature value meets standard value and comprise:
Step S1301: judge whether each described three-dimensional feature value meets standard value, or, judge each described three-dimensional feature value whether within values.
Step S1301 is the alternative steps of step S130, is also the optimization to step S120.Step S130 is divided into two kinds of situations, and the first situation is equal by two values compared; In second, situation is unequal by two values compared, but these two values are very close, differ very little.The deterministic process of the first situation described is identical with abovementioned steps S130, does not repeat them here; In described the second situation, when the three-dimensional feature value compared and standard value unequal time, if both differences are in the scope that error allows, so determine that the position at this Z axis coordinate place is not defective locations, avoid due to trickle error, and be defect by flase drop, and then make testing result more accurate.
Identical with above-mentioned steps S141, if judge that described three-dimensional feature value is within values, then determine the position zero defect that the three-dimensional coordinate data at this three-dimensional feature value place is corresponding.
As shown in Figure 4, be the process flow diagram of the another kind of detection method that the present embodiment provides, the first situation in step S1301, when judging whether each described three-dimensional feature value meets standard value, described method also comprises:
Step S13011: the processing quality according to described wiring board requires and production rule, determines described standard value.
The information that when dispatching from the factory according to wiring board, instructions or related data provide, can obtain the standard value of this wiring board, or the three-dimensional feature value of standard, and this standard value or standard three-dimensional characteristic value collection are labeled as G.
The second situation in step S1301: when judging that each described three-dimensional feature value is whether within values, described method also comprises:
Step S131: the design parameter obtaining the reference plate line corresponding with described detected wiring board; Wherein, described design parameter includes but not limited to obtain from the instructions or the data relevant to instructions of detected wiring board.
Step S132: according to the design parameter of described reference plate line, obtains the reference three-dimensional coordinate data of each position on described reference plate line; Wherein, the acquisition described in this step comprises by Computer Analysis, the reference three-dimensional coordinate extracting each position, or directly reads according to design parameter, or self-defined with reference to three-dimensional coordinate data.Concrete integrating step S1221, the reference three-dimensional coordinate obtaining each position is normal data set G.
Step S133: according to each described feature with reference to three-dimensional coordinate data, extracts each described with reference to the three-dimensional feature value in three-dimensional coordinate data, and as reference three-dimensional feature value; The described step extracted with reference to three-dimensional feature value is identical with abovementioned steps S120, according to the parameter value of the actual characteristic determination extraction comparison of detected wiring board, but the three-dimensional feature value that should extract with detected wiring board of the reference three-dimensional feature value extracted is identical or belong to similar.
Step S134: according to each described values determining each described three-dimensional feature value with reference to the three-dimensional feature value in three-dimensional coordinate data.
Particularly, the large I of described values obtains according to the quality technique of the reference plate line corresponding with described detected wiring board or empirical data, namely obtains standard detection template M to be compared.
Corresponding to step S121, described reference three-dimensional feature value comprises Z axis coordinate data, elevation, gradient magnitude and direction, level line or height step.Can determine described with reference to three-dimensional feature value according to the design parameter of the actual conditions of this detection line plate or reference plate line, but, no matter be the feature determination three-dimensional feature value that basis is detected wiring board, or according to the design parameter determination three-dimensional feature value of reference plate line, as long as ensure that two kinds of three-dimensional feature values chosen belong to of the same type.Wherein, the described three-dimensional data feature that can be regarded as extraction of the same type is all level line, or is all elevation, or is all height step.
After standard detection template M determines, the three-dimensional feature value of detected wiring board is compared with this standard detection template M, draws testing result according to comparative result.
Above-mentioned steps S131 to step S134 is the detailed process of step S1301 values setting, and this process just determines a kind of method of its values, is not limited to the displacement of order between above-mentioned steps S131 to step S134.
Above-described embodiment another in, described method also comprises:
Step S160: add up all defective locations not meeting described standard value, and draw the simulation drawing corresponding with described detected wiring board.As shown in Figure 5, for traditional by AOI and this programme comparison diagram based on three-dimensional feature detection method, the simulation drawing that the method provided by this enforcement is generated clearly can judge the type of the defective locations on detected wiring board, because three-dimensional coordinate data directly can embody hole depth, therefore blind hole quality testing accurately can be realized.Such as, in 5 figure, can determine that (1) number position is open circuit; (2) number position is pad defect; (3) number position is depression; (4) number position is circuit defect.
The wiring board detection method that this programme provides, compared to existing based on product gray level image detection method, the particular location of wiring board defect, form, size, type can also be judged, the depression that traditional AOI (automated optical inspection) cannot detect and defect can be detected; Because three-dimensional coordinate data directly can embody hole depth, therefore can realize blind hole quality testing accurately, provide Detection job, testing result is more accurate.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention.
The device with same measuring ability, module corresponding to any wiring board detection method based on above-mentioned three-dimensional feature; equipment etc. have the technical scheme of physical objects; or be only the device replacement structurally corresponding to this method, also belong within the scope of protection of the invention.
Those skilled in the art can be well understood to the mode that technology in the embodiment of the present invention can add required general hardware platform by software and realize.Based on such understanding, technical scheme in the embodiment of the present invention can embody with the form of software product the part that prior art contributes in essence in other words, this computer software product can be stored in storage medium, as ROM/RAM, magnetic disc, CD etc., comprising some instructions in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) perform the method described in some part of each embodiment of the present invention or embodiment.
Although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention.Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (10)
1. based on a wiring board detection method for three-dimensional feature, it is characterized in that, described method comprises:
Obtain the three-dimensional coordinate data of each position on detected wiring board, described three-dimensional coordinate data comprises X-axis coordinate data, Y-axis coordinate data and Z axis coordinate data;
The three-dimensional feature value of each position is extracted according to the three-dimensional coordinate data of each position described;
Judge whether each described three-dimensional feature value meets standard value;
When three-dimensional feature value does not meet described standard value, determine that this position corresponding to three-dimensional feature value is defective locations.
2. method according to claim 1, is characterized in that, described acquisition is detected the three-dimensional coordinate data of each position on wiring board and comprises:
Obtain the measured data of each position on detected wiring board;
Described measured data is processed, obtains the three-dimensional coordinate data of each position described.
3. method according to claim 2, is characterized in that, describedly processes described measured data, and the three-dimensional coordinate data obtaining each position described comprises:
Rejecting interference process is carried out to described measured data, obtains the three-dimensional coordinate data of each position described.
4. method according to claim 3, is characterized in that, the three-dimensional coordinate data of each position described in described basis extracts each three-dimensional feature value and also comprises:
The Z axis coordinate data of each described three-dimensional coordinate data is extracted according to the three-dimensional coordinate data of each position, and using described Z axis coordinate data as three-dimensional feature value.
5. method according to claim 4, is characterized in that, described three-dimensional feature value also comprises elevation, gradient magnitude and direction, level line or height step.
6. method according to claim 5, is characterized in that, describedly judges whether each described three-dimensional feature value meets standard value and comprise:
Judge whether each described three-dimensional feature value meets standard value, or, judge each described three-dimensional feature value whether within values.
7. method according to claim 6, is characterized in that, when judging whether each described three-dimensional feature value meets standard value, described method also comprises:
Processing quality according to described wiring board requires and production rule, determines described standard value.
8. method according to claim 6, is characterized in that, when judging that each described three-dimensional feature value is whether within preset threshold range, described method also comprises:
Obtain the design parameter of the reference plate line corresponding with described detected wiring board;
According to the design parameter of described reference plate line, obtain the reference three-dimensional coordinate data of each position on described reference plate line;
According to each described with reference to three-dimensional coordinate data, extract each described with reference to the reference three-dimensional feature value in three-dimensional coordinate data;
According to each described values determining each described three-dimensional feature value with reference to three-dimensional feature value.
9. method according to claim 8, is characterized in that, described reference three-dimensional feature value comprises elevation, gradient magnitude and direction, level line or height step.
10. the method according to any one of claim 1 to 9, is characterized in that, described method also comprises:
Add up all defective locations not meeting described standard value, and draw the simulation drawing corresponding with described detected wiring board.
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Address after: 100094 Beijing city Haidian District Cui Hunan loop 13 Hospital No. 7 Building 7 room 701 Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 Beijing city Haidian District road Tamatsu wisdom Valley Center Building 2 Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |
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Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Beijing lingyunguang Technology Group Co.,Ltd. Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Beijing lingyunguang Technology Group Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |
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Effective date of registration: 20230713 Address after: 1st Floor - 2nd Floor, Building 2, Xinqi Industrial Park, No. 789, Changning Avenue, High tech Zone, Hefei City, Anhui Province, 230000 Patentee after: Hefei Jiuchuan Intelligent Equipment Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Lingyunguang Technology Co.,Ltd. |
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