CN101653704A - Preparation method of inorganic powder cataplasm - Google Patents
Preparation method of inorganic powder cataplasm Download PDFInfo
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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Abstract
When preparing an inorganic powder cataplasm wherein the solvent contains inorganic powder component and can imprve the dispersibility of the inorganic powder component by organic compound adsorbed onthe inorganic powder component, if the inorganic powder component is micronized, the organic compound cannot sufficiently adhered to the surface of the inorganic powder component, and the dispersibility of the inorganic powder cataplasm is reduced. The method includes: obtaining a first mixture 1 at least containing inorganic component and a second mixture 2 at least containing solvent and organic compound but not containing inorganic powder; applying shearing force to the second mixture 2; and then mixing the first mixture 1 and the second mixture 2.
Description
Technical field
The present invention relates to the manufacture method of inorganic powder cataplasm, relate in particular to the manufacture method of the inorganic powder cataplasm of the conductive paste manufacture method that can be used to form inner conductor in the monolithic ceramic electronic component.
Background technology
In solvent, disperse small inorganic powder, when obtaining inorganic powder cataplasm, importantly inorganic powder is evenly disperseed in paste.As being used for inorganic powder, in the inorganic powder absorption method as the organic compound of the dispersant that is used to improve the inorganic powder dispersion stabilization is for example arranged in the homodisperse method of paste.In the method, how with organic compound with optimum state attached to being key point on the inorganic powder.
The common viscosity of inorganic powder cataplasm is higher, therefore is difficult to inorganic powder is evenly disperseed.Therefore, for example open to have put down in writing in the 2001-67951 communique (patent documentation 1) and add low-boiling dilution solvent when disperseing, after inorganic powder is evenly disperseed, only volatilize and remove dilution with the such method of solvent the spy.As described in patent documentation 1,, reduce viscosity, thereby can fully be adsorbed with organic compounds on the surface of inorganic powder by when disperseing, using the dilution solvent.
Yet, if the further micronize of inorganic powder, only by could be in the surface attachment of the inorganic powder enough organic compound of said method.Therefore, the present inventor finds to disperse as high molecular organic compound by giving shearing force to organic compound in order to solve this problem, can be effectively attached to the state on the inorganic powder thereby can form.Specifically, by to paste pressurization, the wet type HIGH PRESSURE TREATMENT state that sprays or shearing blender etc., thus the shearing force of giving.
Yet the inventor finds containing under the state of inorganic powder, even as above give shearing force, the new like this problem of dispersion effect that can't obtain to expect also can occur.This problem is if there is inorganic powder, then in order to obtain and the equal state that does not contain under the inorganic powder situation, then must adopt very large shearing force, is difficult to obtain so big shearing force basically by existing equipment.
[patent documentation 1] spy opens the 2001-67951 communique
Summary of the invention
The problem that invention will solve
Therefore, the invention provides a kind of manufacture method of the inorganic powder cataplasm that can address the above problem.
Be used to solve the method for problem
The present invention aims to provide a kind of inorganic powder composition and having by being adsorbed on the above-mentioned inorganic powder composition of containing in solvent, thereby improve the organic compound of the effect of this inorganic powder composition dispersiveness, be used to make the method for inorganic powder cataplasm, in order to solve the problems of the technologies described above, it is characterized in that having the operation that acquisition contains the 1st mixture of inorganic powder composition at least, obtain to contain at least solvent and organic compound but do not contain the operation of the 2nd mixture of inorganic powder composition, the 2nd mixture is given the operation of shearing force and then mixed the 1st mixture and the operation of the 2nd mixture.
As mentioned above, the invention is characterized in the operation that under the state that does not have the inorganic powder composition, applies shearing force, in this case, can make the 1st mixture that contains the inorganic powder composition and the 2nd mixture that contains organic compound respectively, mix at last, perhaps can also mix at the beginning, then separate organic compound from mixture, apply shearing force, and then mix.
Under the situation of a back embodiment, also have operation that preparation contains the mixture of inorganic powder composition, solvent and organic compound at least, isolate the operation of organic compound by mixture at least.In addition, contained inorganic powder composition is by carrying out being isolated by mixture the operation of organic compound in the 1st mixture, thereby remove residual composition behind the organic compound by mixture, contained organic compound is by carrying out isolating organic compound by mixture, from the composition of mixture taking-up in the 2nd mixture.
Inorganic powder composition contained in the 1st mixture is preferably the state that disperses in solvent.
The inorganic powder composition preferably contains the conductive metal powder that average grain diameter is 10～300nm.
Preferred its weight average molecular weight of organic compound is 100～50000, and its soda acid amount is 100～2000 μ mol/g.
The operation that the 2nd mixture is applied shearing force comprises the operation that the 2nd mixture is exerted pressure and sprayed the 2nd mixture by the jet of regulation, and the pressure of granting the 2nd mixture is preferably selected from 50～300MPa.
According to the present invention, in the inorganic powder cataplasm of wishing to get in the ingredient, owing at least the 2nd mixture of removing inorganic powder is applied shearing force, after being formed with organic compounds and being easy to be adsorbed on state on the inorganic powder, the 2nd mixture is mixed with the 1st mixture that contains the inorganic powder composition, so easily organic compound is given sufficient shearing force and it is easy to attached on the inorganic powder.Even therefore use small inorganic powder, also can embody excellent dispersiveness, the inorganic powder cataplasm that can obtain to have good dispersion.
Therefore, if above-mentioned inorganic powder composition contains the conductive metal powder that average grain diameter is 10～300nm, then the present invention is remarkable in the meaning that improves aspect dispersed.That is, even,, also can obtain the conductive paste of favorable dispersibility according to the present invention containing under the situation that average grain diameter is the small like this conductive metal powder of 10～300nm.Therefore,, then can improve the surface smoothing that conductive paste is filmed, reduce poor short circuit thus if conductive paste constructed in accordance is used to form inner conductor in the monolithic ceramic electronic component.
The manufacture method of inorganic powder cataplasm of the present invention also has preparation and contains the inorganic powder composition at least, the operation of the mixture of solvent and organic compound, at least isolate the operation of organic compound by this mixture, contained inorganic powder composition is a residual material after removing organic compound by mixture in above-mentioned the 1st mixture, contained organic compound is under the situation by the material that takes out in the mixture in above-mentioned the 2nd mixture, as mixture, if use the inorganic powder cataplasm that adopts manufacture method of the present invention to make, then can repeat the 2nd mixture is applied the operation of shearing force and mixes the 1st mixture afterwards and the operation of the 2nd mixture, can obtain dispersed more excellent inorganic powder cataplasm.
If inorganic powder composition contained in the 1st mixture is the state that disperses, then can improve the treatment effeciency of the 1st mixture that contains the inorganic powder composition in solvent.
If the weight average molecular weight of organic compound is 100～50000, the soda acid amount is 100～2000 μ mol/g, and then organic compound more can be adsorbed on the inorganic powder, improves dispersed.
When the 2nd mixture is applied shearing force, can when being exerted pressure, the 2nd mixture spray the 2nd mixture by the jet of stipulating, at this moment, if the 2nd mixture applied pressure is selected from 50～300MPa, then can positively apply shearing force to the 2nd mixture.
Description of drawings
Fig. 1 is the process chart of manufacture method of the inorganic powder cataplasm of expression the present invention the 1st embodiment.
Fig. 2 is the process chart of manufacture method of the inorganic powder cataplasm of expression the present invention the 2nd embodiment.
Symbol description
1 the 1st mixture
2 the 2nd mixtures
3 shear actions apply operation
4 mixed processes
5 inorganic powder cataplasms
11 mixed slurry
12 separation circuits
Preferred forms
Fig. 1 is the process chart of manufacture method of the inorganic powder cataplasm of expression the present invention the 1st embodiment.Thereby the inorganic powder cataplasm of wishing to get contains inorganic powder composition and can be by being adsorbed on the organic compound that can improve inorganic powder composition dispersiveness on this inorganic powder composition in solvent.
In order to prepare this inorganic powder composition, can obtain to contain at least the inorganic powder composition the 1st mixture 1 operation and obtain to contain solvent and organic compound at least, but do not contain the operation of the 2nd mixture 2 of inorganic powder composition.
Then, the shear action of carrying out the 2nd mixture 2 is applied shearing force applies operation 3, then, carries out mixed processes 4 that the 1st mixture 1 and the 2nd mixture 2 are mixed, obtains inorganic powder cataplasm 5 thus.In order to obtain inorganic powder cataplasm 5, as required, can add resin again.
The 1st mixture 1 contains solvent usually except the inorganic powder composition, be preferably the state that the inorganic powder composition disperses in solvent.In addition, the necessary condition of the 2nd mixture 2 is wherein must contain organic compound.In addition, the 1st mixture 1 also can contain contained organic compound in the 2nd mixture 2.
Below, describe for the situation of conductive paste for inorganic powder cataplasm 5.
For under the situation of conductive paste, the 1st mixture 1 contains the conductive metal powder as the inorganic powder composition at the inorganic powder cataplasm 5 that will make.Be used to form under the situation of inner conductor in the monolithic ceramic electronic component at conductive paste, as the metal ingredient that constitutes the conductive metal powder, the sintering temperature of the pottery of sintering and the material of atmosphere get final product so long as can tolerate simultaneously, can use for example Ni, Pd, Ag, Au, Pt or Cu or their mixture or alloy.
Proportional 20～70 weight % that are preferably selected from that contain as the conductive metal powder of solid constituent in the conductive paste.Proportional by in this scope, adjusting containing of solid constituent, obtain target printing coating thickness thereby can stablize.In addition, when the particle diameter of conductive metal powder is positioned at the scope of 10～300nm in average grain diameter, usually the aggegation effect is remarkable, but owing to can improve dispersiveness according to the present invention, therefore be under the situation of 10～300nm in average grain diameter, we can say that the effect that especially improves dispersiveness according to the present invention is remarkable.In addition, from whether bringing into play the viewpoint of effect of the present invention, there is not lower limit in average grain diameter, if but the not enough 10nm of average grain diameter, then conductive paste is sticking excessively, and treatment effeciency reduces, and is not preferred therefore.
In the 1st mixture 1, except the conductive metal powder,, can also add the part of oxide solid composition as the inorganic powder composition in order to delay the sintering of conductive metal powder.As the oxide solid composition, can use various oxides such as for example Ba, Ti, Zr, Dy, Mg, Si, Y or these oxides be mixed the material that obtains.In the conductive paste oxide solid composition contain proportional agglutinating property according to the conductive metal powder, can in the scope of 1～40 weight %, suitably adjust, preferred especially is the such additions of 5～20 weight % with respect to the conductive metal powder.
As the 2nd mixture 2 in contained solvent, preferably contain the main solvent that in the gained conductive paste, stays, and the retarder thinner that in conductive paste, does not stay, only in the conductive paste manufacture process, use.In order to promote the absorption of organic compound, the solubility parameter of main solvent is preferably 8.0～10.5, and the solubility parameter of retarder thinner is preferably 7.4～13.8.Specifically,, ester class, terpenes, ketone, ethers, alcohols equal solvent can be used,, ketone, alcohols, hydrocarbon equal solvent can be used as retarder thinner as main solvent.Main solvent contains proportional 10～70 weight % that are preferably in the gained conductive paste.
As contained organic compound in the 2nd mixture 2, comprise dispersant, resin, additive etc.Organic compound, especially dispersant, preferably its weight average molecular weight is 100～50000, the soda acid amount is the anionic property dispersant of 100～2000 μ mol/g, can use for example carboxylic acid compound, sulfonic compound, phosphate compound.The addition of dispersant is selected from 0.1～10 weight % with respect to powder composition (comprising conductive metal powder and oxide solid composition).
As resin, especially preferably use ethyl cellulose resin, at this moment, can also use allyl resin, polyurethane resin, phenolic resin etc.To be preferably selected from respect to conductive paste be 1～10 weight % to the ratio that contains of resin.
In order to adjust the viscosity of conductive paste, as required, can add additive, preferably use for example amine resins.The addition of additive is 0.1～10 weight % with respect to the powder composition preferably.
Apply in the operation 3 in the shear action that the 2nd mixture 2 is applied, can use for example wet type high-pressure treatment apparatus, when the 2nd mixture 2 is exerted pressure, spray the 2nd mixture 2 from the jet of stipulating.At this moment, applied pressure is preferably selected from 50～300MPa on the 2nd mixture 2.Apply in the operation 3 in shear action,, can also use shearing blender except the wet type high-pressure treatment apparatus.
In mixed processes 4, make and finish the 2nd mixture 2 and 1 collision of the 1st mixture that above-mentioned shear action applies operation 3.Thus, by making the 2nd mixture 2 and 1 collision of the 1st mixture of paying after the shear action, thereby can make contained dispersing organic compound in the 2nd mixture effectively attached to the surface of the 1st mixture 1 contained inorganic powder.In this mixed processes 4, preferably be adjusted to the temperature of the 2nd mixture 2 more than 25 ℃ and be lower than the boiling point of solvent.
Fig. 2 is the process chart of the manufacture method of expression the present invention the 2nd embodiment inorganic powder cataplasm.In Fig. 2, the key element suitable with key element among Fig. 1 gives identical reference marks, and the repetitive description thereof will be omitted.
In the 2nd embodiment, it is characterized in that having the mixed slurry of preparing as containing the mixture of inorganic powder composition, solvent and organic compound at least 11, this mixture slurry 11 is passed through filter, thereby separate the separation circuit 12 of organic compound and solvent.In addition, contained inorganic powder composition is by carrying out separation circuit 12 in the 1st mixture 1, remove residual composition behind the organic compound by mixed slurry 11, in the 2nd mixture 2 contained organic compound for by carrying out separation circuit 12, the composition that takes out by mixed slurry 11.Operation afterwards is identical with the situation of the 1st embodiment.
The mixed slurry of preparing in the 2nd embodiment 11 can be the inorganic powder cataplasm 5 that obtains by above-mentioned the 1st embodiment, also can be the inorganic powder cataplasm 5 that obtains by the 2nd embodiment.Thus, repeat shear action and apply operation 3, therefore, can further improve the dispersiveness of gained inorganic powder cataplasm 5.
That is,, can exist the inorganic powder composition still to be in the situation of state of aggregation only implementing that the 1st mixture 1 is collided under the situation of the operation of mixing with the 2nd mixture 2, and as mentioned above, repeat shear action and apply operation 3, increase its number of repetition more, then dispersiveness is high more.In addition, the preferred number of repetition that shear action applies operation 3 is different according to the particle diameter of the composition of the inorganic powder cataplasm of wishing to get 5 or inorganic powder, therefore, preferably in advance gained inorganic powder cataplasm 5 is estimated, set number of repetition according to the kind of inorganic powder cataplasm 5.
As the inorganic powder cataplasm of making by manufacture method of the present invention, conductive paste is arranged typically, this conductive paste is used to form inner conductor, can Production Example such as monolithic ceramic electronic component such as laminated ceramic capacitor, laminated ceramic inductor, laminated ceramic LC parts, multilayer ceramic substrate.
Below, in order to confirm effect of the present invention, the experimental example of implementing is described.
In this experimental example, according to composition and the treatment conditions shown in the following table 1～table 7, the conductive paste of preparation sample 1～7.
(1) sample 1
Table 1
(2) sample 2
Table 2
(3) sample 3
Table 3
(4) sample 4
Table 4
(5) sample 5
Table 5
(6) sample 6
Table 6
(7) sample 7
Table 7
In table 1～table 7, " weight %/paste " shown in " interpolation ratio " hurdle is illustrated in the weight % in the gained conductive paste, and " weight %/powder " expression is with respect to the weight % that adds the powder composition.
In addition, " solubility parameter " calculates by the Fedors method." soda acid amount " measured by acid-base titration." weight average molecular weight " carried out the molecular weight distribution evaluation of gained solution and obtained with high-speed liquid chromatography by with oxolane (THF) dissolving.
The preparation order of the conductive paste of sample 1～7 is as described below.
In order to obtain the 1st mixture 1, shown in " the 1st mixture " hurdle of table 1～table 7, in the powder composition, add main solvent, in some sample, also add retarder thinner, dispersant, resin and/or additive, use shearing blender that it is mixed and stir.
On the other hand, in order to obtain the 2nd mixture, shown in " the 2nd mixture " hurdle of table 1～table 7, in main solvent, add dispersant, in some sample, also add retarder thinner, dispersant, resin and/or additive, use shearing blender that it is mixed and stir.
Then,, use the wet type high-pressure treatment apparatus, adopt the pressure shown in " processing pressure " hurdle in table 1～table 7 " treatment conditions ", pressurized jet the 2nd mixture for the 2nd mixture as above-mentioned acquisition is applied shearing force.
Then, after pressurized jet, the 2nd mixture is controlled to be the temperature shown in " mixture temperature " hurdle in table 1～table 7 " treatment conditions ", simultaneously and the collision of the 1st mixture, obtains conductive paste by heater or condensed water.
For " number of processes " in table 1～table 7 " treatment conditions " is sample more than 2 times, only be repeated below operation: filter as above-mentioned gained conductive paste according to the number of times shown in " number of processes ", separate the slurry that contains the inorganic powder composition thus, and contain solvent and organic compound ingredient but do not contain the solution of organic compound of inorganic powder composition, for solution of organic compound, apply shear action according to the condition identical, with solution of organic compound after the shear action and the above-mentioned slurry collision that contains the inorganic powder composition with above-mentioned situation.In addition, number of processes was managed by the processing time.For example, under the situation of desiring to carry out to handle for X time, carry out the processing time=processing in (conductive paste dosage)/(conductive paste processing speed) * processing time that X calculates.
In addition, in the sample shown in the table 77, do not carry out above-mentioned processing, only the 1st mixture is mixed with the 2nd mixture, then, mix stirring, obtain conductive paste with shearing blender.
Then, to mix with main solvent as the ethyl cellulose resin of resinous principle according to 20: 80 weight ratio in advance, obtain organic media, it is added in the conductive paste of each sample, mix, the content that obtains ethyl cellulose resin is the conductive paste of 2 weight %, uses shearing blender to mix then and stirs.
Then, under the state that heats up, conductive paste after the above-mentioned mixing stirring is adjusted into viscosity 0.5Pas or littler, and using mesh then is the membrane filter of 2 times of meshes of average 1 particle diameter of conductive metal powder of 10 μ m, 5 μ m, 3 μ m and terminal stage, adopts insufficient pressure 1.5kg/cm
2Pressure filtration, remove block.
At last, contain in the conductive paste after above-mentioned filtration treatment under the situation of retarder thinner, 2.0 * 10
-1Be heated to 40 ℃ under the reduced pressure of air pressure, remove retarder thinner after, to the conductive paste after the filtration treatment,, adopt insufficient pressure 1.5kg/cm with the membrane filter of 3 μ m
2Pressure filtration, remove block once more, obtain the conductive paste of each sample wanted.
In order to estimate the conductive paste of each sample of gained thus, be prepared as follows laminated ceramic capacitors.
That is, be on the dielectric ceramics raw cook of 2 μ m at thickness, print the conductive paste of each sample by the screen printing method, form filming that conductive paste by thickness 1 μ m constitutes.Wherein, observe the shape of filming, measure the film coated surface roughness by 3 dimension shape measuring apparatus.In its result shown in the table 8.
Then with the conductive paste drying, in order to obtain 450 layers stepped construction that the dielectric ceramics raw cook is stacked then, press attachedly, then section forms the flat shape of 3.2mm * 2.5mm, acquisition duplexer chip.Then under 280 ℃ of maximum temperatures, the duplexer chip carried out ungrease treatment after, in the hydrogen/nitrogen mist, under 1200 ℃ maximum temperature, fire, after firing, form outer electrode by coating and sintering, in each sample, obtain laminated ceramic capacitors.
To the laminated ceramic capacitors of 100 gained samples, measure static capacity by the LCR measuring appliance, calculate the poor short circuit rate.In its result shown in the table 8.For the poor short circuit rate shown in the table 8,,, then can be judged to be substandard products if be more than 10% as long as less than 10% then can be judged to be good product.
Table 8
| Specimen coding | Film coated surface roughness (nm) | The poor short circuit rate |
| ??1 | ??265 | ??7 |
| ??2 | ??235 | ??5 |
| ??3 | ??250 | ??7 |
| ??4 | ??155 | ??2 |
| ??5 | ??270 | ??8 |
| ??6 | ??255 | ??6 |
| ??7 | ??398 | ??75 |
As shown in Table 8, according to sample 1～6, print the flatness of filming and improve, the result can be suppressed at the poor short circuit rate of laminated ceramic capacitor below 10%.Can infer that its reason is the adsorbed state realization optimization of organic compound in the powder composition, the dispersiveness of powder composition is improved in the conductive paste.
On the contrary, in sample 7, compare, print the flatness of filming and worsen, and the poor short circuit rate significantly increases with sample 1～6.Can infer that this is that the dispersiveness of conductive paste reduces because the adsorbed state of organic compound in the powder composition is not good.
Claims (6)
1, a kind of manufacture method of inorganic powder cataplasm, it is characterized in that, thereby be the manufacture method that contains inorganic powder composition and inorganic powder cataplasm that can be by being adsorbed on the organic compound that improves this inorganic powder composition dispersiveness on the above-mentioned inorganic powder composition in solvent, this method has the operation that acquisition contains the 1st mixture of above-mentioned inorganic powder composition at least, obtain to contain at least above-mentioned solvent and above-mentioned organic compound but do not contain the operation of the 2nd mixture of above-mentioned inorganic powder composition, the operation that above-mentioned the 2nd mixture is paid the operation of shearing force and mixed above-mentioned the 1st mixture and above-mentioned the 2nd mixture subsequently.
2, the manufacture method of inorganic powder cataplasm as claimed in claim 1, it is characterized in that having the operation that preparation contains the operation of the mixture of above-mentioned inorganic powder composition, above-mentioned solvent and above-mentioned organic compound at least, isolated above-mentioned organic compound by said mixture at least; In addition, contained above-mentioned inorganic powder composition is by carrying out being isolated by said mixture the operation of above-mentioned organic compound in above-mentioned the 1st mixture, thereby remove residual composition behind the above-mentioned organic compound by said mixture, contained above-mentioned organic compound is by carrying out being isolated by said mixture the operation of above-mentioned organic compound, from the composition of said mixture taking-up in above-mentioned the 2nd mixture.
3, the manufacture method of inorganic powder cataplasm as claimed in claim 1 or 2 is characterized in that, contained above-mentioned inorganic powder composition is the state that disperses in solvent in above-mentioned the 1st mixture.
As the manufacture method of each described inorganic powder cataplasm of claim 1～2, it is characterized in that 4, above-mentioned inorganic powder composition contains the conductive metal powder that average grain diameter is 10～300nm.
As the manufacture method of each described inorganic powder cataplasm of claim 1～2, it is characterized in that 5, the weight average molecular weight of above-mentioned organic compound is 100～5000, the soda acid amount is 100～2000 μ mol/g.
6, as the manufacture method of each described inorganic powder cataplasm of claim 1～2, it is characterized in that, the operation that above-mentioned the 2nd mixture is applied shearing force comprises exerts pressure to above-mentioned the 2nd mixture, the operation that while is sprayed above-mentioned the 2nd mixture by the jet of stipulating, applied pressure is selected from 50～300MPa on above-mentioned the 2nd mixture.
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| CN104115237B (en) * | 2012-02-21 | 2018-09-07 | Jx日矿日石金属株式会社 | Metal paste mixing and its manufacturing method |
| JP6314728B2 (en) * | 2014-07-30 | 2018-04-25 | 住友金属鉱山株式会社 | Method for producing conductive paste and conductive paste obtained thereby |
| KR102152841B1 (en) * | 2018-11-30 | 2020-09-07 | 엘에스니꼬동제련 주식회사 | Method for producing the conductive paste reducing change of elapsed time in viscosity |
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| JPH02284638A (en) * | 1989-04-26 | 1990-11-22 | Tadahiro Omi | Feeder of high-performance process gas |
| WO2000004559A1 (en) * | 1998-07-17 | 2000-01-27 | Murata Manufacturing Co., Ltd. | Method for producing conductive composition and conductive composition |
| JP3642000B2 (en) * | 1999-06-25 | 2005-04-27 | 株式会社村田製作所 | Manufacturing method of conductive thick film paste, conductive thick film paste and multilayer ceramic electronic component |
| JP3675254B2 (en) * | 1999-10-05 | 2005-07-27 | 株式会社村田製作所 | Method for manufacturing ceramic slurry, ceramic green sheet and multilayer ceramic electronic component |
| JP2001114569A (en) * | 1999-10-20 | 2001-04-24 | Murata Mfg Co Ltd | Ceramic slurry composition, ceramic green sheet and production of multilayer ceramic electronic part |
| JP2002140931A (en) * | 2000-10-31 | 2002-05-17 | Furuya Kinzoku:Kk | Silver paste and its manufacturing method |
| US7183650B2 (en) * | 2001-07-12 | 2007-02-27 | Renesas Technology Corp. | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| JP2003253301A (en) | 2002-03-01 | 2003-09-10 | Murata Mfg Co Ltd | Method for manufacturing metal powder for conductive paste, metal powder for conductive paste, conductive paste, and multilayer ceramic electronic part |
| KR100586960B1 (en) | 2004-03-31 | 2006-06-07 | 삼성전기주식회사 | A Method for Preparing Conductive Paste Having Improved Dispersibility |
| JP2006263599A (en) | 2005-03-24 | 2006-10-05 | Toray Ind Inc | Apparatus for dispersing paste and method for producing paste |
| JP5309521B2 (en) * | 2006-10-11 | 2013-10-09 | 三菱マテリアル株式会社 | Electrode forming composition, method for producing the same, and electrode forming method using the composition |
| JP2009091515A (en) | 2007-10-11 | 2009-04-30 | Ricoh Co Ltd | Method for manufacturing paste, and paste |
| CN100566803C (en) * | 2008-04-24 | 2009-12-09 | 华南理工大学 | A kind of process for dispersing of nano iron particles |
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| CN109390073A (en) * | 2017-08-10 | 2019-02-26 | 株式会社则武 | Conductive paste |
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| JP5481811B2 (en) | 2014-04-23 |
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