CN101635289A - 小螺距焊垫结构 - Google Patents

小螺距焊垫结构 Download PDF

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CN101635289A
CN101635289A CN200910159911A CN200910159911A CN101635289A CN 101635289 A CN101635289 A CN 101635289A CN 200910159911 A CN200910159911 A CN 200910159911A CN 200910159911 A CN200910159911 A CN 200910159911A CN 101635289 A CN101635289 A CN 101635289A
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liner
weld pad
probe
chip
probe liner
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陈克明
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本发明公开了一种小螺距焊垫结构，其包括分别专用于连接第一、第二和第三探针衬垫的第一、第二和第三焊垫，其中第一焊垫、第二探针衬垫和第三焊垫基本上线性地排列，其中第二探针衬垫位于第一和第三焊垫之间。

Description

小螺距焊垫结构
技术领域
本发明一般涉及集成电路设计，且更具体地，涉及IC设计中的焊垫(bonding pad)结构。
背景技术
半导体IC芯片通过多种焊垫与外界联系，所述多种焊垫例如是信号焊垫和电源/接地(P/G)焊垫。除了焊垫，现代IC芯片还具有连接到相应焊垫的探针衬垫(probe pad)。该探针衬垫用作探针，以在晶片级测试期间与IC芯片接触。图1A和1B是常规版图中两个相邻衬垫的顶视图。该衬垫包括焊垫102[0:1]、探针衬垫104[0:1]以及位于焊垫102[0:1]和探针衬垫104[0:1]之下的铝衬垫[0:1]。参考图1A，在晶片级测试期间，两个探针尖110[0:1]分别与探针衬垫104[0:1]接触。当一个管芯通过该晶片测试时，其可以被封装为成品。在封装工艺中，金属线一端焊接到引脚，另一端焊接到焊垫。参考图1B，金属线124[0:1]在焊点122[0:1]处分别焊接到焊垫102[0:1]。
现代IC制造业所面对的挑战是晶体管的尺寸一直在迅速地缩小，且IC芯片中需要越来越多的衬垫，但是键合金属线之间的间距以及探针衬垫之间的间距不能跟上晶体管的缩小速度。同样地，所希望的是这样一种衬垫版图布置，其能够扩大焊垫之间的间距以及探针衬垫之间的间距，而又不增加被焊垫和探针衬垫所占据的总面积。
发明内容
本发明公开了一种集成电路(IC)芯片，其包括分别专用于连接第一、第二和第三探针衬垫的第一、第二和第三焊垫，其中第一焊垫、第二探针衬垫和第三焊垫基本上线性地排列，第二探针衬垫位于第一和第三焊垫之间。进一步地，第一探针衬垫、第二焊垫和第三探针衬垫基本上线性地排列，第二焊垫位于第一和第三探针衬垫之间。
本发明的结构和操作方法及其其它目的和优点将结合附图从特定实施例的以下描述中得到最好的理解。
附图说明
附图和本说明书的组成部分包括描述本发明的某些方面。本发明更清楚的观念以及本发明具有的部件和系统操作的更清楚的观念，将通过参考阐述于附图中的示例性的且非限制性的实施例而变得更容易理解，其中相同的附图标记(如果它们出现在一个以上的图中)表明相同的元件。通过参考这些附图的一个或多个，并结合这里提出的说明，将更好的理解本发明。
图1A和1B是常规版图中的两个相邻衬垫的顶视图。
图2是根据本发明的一个实施例排列的三对相邻衬垫的顶视图。
图3A和3B是如图2中所阐述的衬垫结构的截面图。
具体实施方式
本发明公开了一种具有在基本直线地交替设置的焊垫和探针衬垫的衬垫版图布置，使得在该基本直线方向中的两个焊垫之间的间距是两个螺距(pitch)，在上述基本直线方向上的两个探针衬垫之间的间距也是这样。这里的一个螺距是两相邻衬垫的中心之间的距离。
图2是根据本发明的一个实施例排列的三对相邻衬垫的顶视图。各对衬垫都具有一个焊垫202和一个探针衬垫204。该焊垫202和探针衬垫204通过铝衬垫200连接。在铝衬垫200[0]上，焊垫202[0]在左面，且探针衬垫204[0]在右面。在铝衬垫200[1]上，探针衬垫204[1]在左面，且焊垫202[1]在右面。在铝衬垫200[2]上，焊垫202[2]在左面，且探针衬垫204[2]在右面。可替换地，探针衬垫204[1]可以看作位于以第一垂直线性排列的两个焊垫202[0]和202[2]之间。因此，焊垫202[0]和202[2]之间的间距是两个螺距，即，焊垫202[0]和探针衬垫204[1]之间的一个螺距加上探针衬垫204[1]和焊垫202[2]之间的另一螺距。在第二垂直线性排列中，焊垫202[1]位于探针衬垫204[0]和204[2]之间。因此，探针衬垫204[0]和204[2]之间的间距也是两个螺距，即，探针衬垫204[0]和焊垫202[1]之间的一个螺距加上焊垫202[1]和探针衬垫204[2]之间的另一螺距。这里的线性排列不是必须意味着所有衬垫的中心都在一条直线上。当衬垫的外延基本地类似一条直线时，则认为该排列是线性的。实际上，因为键合和探针工艺完全不相关，所以探针衬垫204[1]无需与焊垫202[0]或焊垫202[2]直线排列。类似地，焊垫202[1]无需与探针衬垫204[0]或探针衬垫204[2]直线排列。典型地，焊垫202[0]和202[2]位于一条直线中，且探针衬垫204[0]和204[2]也位于一条直线中。本发明的实质是交替设置焊垫和探针衬垫，以便两个焊垫或两个探针衬垫之间的间距是两个螺距，而不是像常规衬垫版图中的一个螺距。
再次参考图2，根据在相同的铝衬垫200上设置的焊垫202和探针衬垫204的远近，焊垫202[0]和202[1]或探针衬垫204[0]和204[1]之间可以小于两个螺距。当在相同的铝衬垫200上设置的焊垫202和探针衬垫204远离设置时，焊垫202基本上位于具有至少两个螺距间距的两列中，且探针衬垫204基本上也位于具有至少两个螺距间距的两列中。因为器件或线路仍可形成在铝衬垫200之下，且更具体地，探针衬垫204无需铝衬垫200之下的用于更好粘附的额外的金属层，将相同的铝衬垫200的焊垫202和探针衬垫204之间远离设置的间距可以不增加管芯的尺寸。
图3A和3B是图2中所阐述的衬垫结构的截面图。参考图3A，铝衬垫层302位于探针或键合线接合且与芯片形成接触的位置。区域310和320分别表示焊垫和探针衬垫。铝衬垫层302从焊垫区域310连续延伸到探针衬垫区域320。金属层312位于铝衬垫层302之下，且在焊垫区域310中形成接触。接着，金属层312通过通孔和其他金属层(都未示出)连接到芯片的其余部分。在探针衬垫区域320之下的相同的金属层312[1]无需与铝衬垫层302接触，因此，金属层312[1]可以用作探针衬垫区域320之下的金属线路。
参考图3B，铝衬垫层352具有分别用于焊垫区域360和探针衬垫区域370的两个区域352[0]和352[1]。铝衬垫层352从焊垫区域360和探针衬垫区域370是非连续的。而是通过一个金属层362[0]在焊垫区域360和探针衬垫370之间形成一个连接，该金属层362[0]是连续的，且与焊垫铝层352[0]和探针衬垫铝层352[1]都接触。当焊垫区域360相对远离探针衬垫区域370时，通常使用图3B中所示的该结构。当探针衬垫铝层352[1]之下仍然有空间时，金属层362[1]可以铺设在那下面。金属层362[0]和362[1]属于同一金属层。
上述说明提供了多个不同的实施例或用于实现本发明的不同特征的实施例。所描述的部件和工艺的特定实施例有助于使本发明变得清楚。当然这些实施例仅仅是实施例，且不意欲限制权利要求中描述的本发明。
虽然这里所阐述和描述的本发明实施为一个或多个特定实例，但是这仍然不意欲限制到所示的细节，因为在不背离本发明的精神的情况下，且在权利要求的等价物的范畴和范围内，可以在其中做出不同的改进和结构的改变。因此，宽泛的理解附加的权利要求和符合后续权利要求中提出的本发明的范围是恰当的。

Claims (15)

1.一种集成电路(IC)芯片，包括分别专用于连接第一、第二和第三探针衬垫的第一、第二和第三焊垫，其中该第一焊垫、该第二探针衬垫和该第三焊垫基本上线性地排列，其中该第二探针衬垫位于该第一和该第三焊垫之间。
2.根据权利要求1的IC芯片，其中该第一、第二和第三焊垫和该第一、第二和第三探针衬垫包括一个金属衬垫层，优选地该金属衬垫层是铝层。
3.根据权利要求2的IC芯片，该第一焊垫和该第一探针衬垫通过该金属衬垫层连接。
4.根据权利要求1的IC芯片，进一步包括沉积在该衬垫层之下的至少一个互连金属层。
5.根据权利要求4的IC芯片，其中该第一焊垫和该第一探针衬垫通过该至少一个互连金属层连接。
6.根据权利要求4的IC芯片，进一步包括连接该衬垫层和该至少一个互连金属层的至少一个通孔。
7.根据权利要求1的IC芯片，其中该第一探针衬垫、该第二焊垫和该第三探针衬垫基本上线性地排列，其中第二焊垫位于第一和第三探针衬垫之间。
8.一种集成电路(IC)芯片，包括分别专用于连接第一、第二和第三探针衬垫的第一、第二和第三焊垫，其中该第一焊垫、该第二探针衬垫和该第三焊垫基本上线性地排列，该第二探针衬垫位于该第一和该第三焊垫之间，且该第一探针衬垫、该第二焊垫和该第三探针衬垫基本上线性地排列，该第二焊垫位于该第一和该第三探针衬垫之间。
9.根据权利要求8的IC芯片，其中该第一、第二和第三焊垫和该第一、第二和第三探针衬垫包括一个金属衬垫层，优选地该金属衬垫层是铝层。
10.根据权利要求9的IC芯片，该第一焊垫和该第一探针衬垫通过该金属衬垫层连接。
11.根据权利要求8的IC芯片，进一步包括沉积在该衬垫层之下的至少一个互连金属层。
12.根据权利要求11的IC芯片，其中该第一焊垫和该第一探针衬垫通过该至少一个互连金属层连接，或者IC芯片进一步包括连接该衬垫层和该至少一个互连金属层的至少一个通孔。
13.一种集成电路(IC)芯片，包括通过一个金属衬垫层而分别专用于连接第一、第二和第三探针衬垫的第一、第二和第三焊垫，其中该第一焊垫、该第二探针衬垫和该第三焊垫基本上线性地排列，该第二探针衬垫位于该第一和该第三焊垫之间。
14.根据权利要求13的IC芯片，进一步包括沉积在该金属衬垫层之下的至少一个互连金属层，或者进一步包括连接该金属衬垫层和该至少一个互连金属层的至少一个通孔。
15.根据权利要求13的IC芯片，其中该第一探针衬垫、该第二焊垫和该第三探针衬垫基本上线性地排列，该第二焊垫位于该第一和该第三探针衬垫之间。
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