CN101626006A - 柔性键合铜丝及其制备方法 - Google Patents

柔性键合铜丝及其制备方法 Download PDF

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CN101626006A
CN101626006A CN200910017010A CN200910017010A CN101626006A CN 101626006 A CN101626006 A CN 101626006A CN 200910017010 A CN200910017010 A CN 200910017010A CN 200910017010 A CN200910017010 A CN 200910017010A CN 101626006 A CN101626006 A CN 101626006A
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林良
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YANTAI YESNO ELECTRONIC MATERIALS CO Ltd
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Abstract

本发明是一种柔性键合铜丝及其制备方法，由以下组分组成：Ce0.001％－0.005％，Pd 0.003％－0.005％，Pt 0.005％－0.009％，余量为Cu。通过采取多元掺杂合金，加入其他成分，降低铜的硬度，特别是成球硬度，减少对芯片的冲击力和破坏，降低键合能量，阻止了界面氧化物和裂纹的产生，保持其结合性能的稳定，从而提高了结合性能、导电性和抗氧化性；并通过控制熔铸、加工、热处理条件，进一步优化组织结构，保证得到合适的机械性能，能够满足不同的需要。

Description

柔性键合铜丝及其制备方法
(一)、技术领域
本发明涉及一种键合铜丝及其制备方法。
(二)、背景技术
键合丝(Bonding Wires)作为一个产品族(ProductFamily)是半导体封装的关键材料之一，它的功能是实现半导体芯片与引脚的电连接，起着芯片与外界的电流导入及导出作用。键合丝目前主要包括金丝、铝丝及铜丝，其中铝丝仅限于低档的玩具电路，金丝则占有中高产品，超过总的80％的份额，而铜丝则是近年来随着黄金价格的持续走高为替代金丝刚发展的新产品。铜丝存在易氧化和硬度较大的问题，由于键合技术的改进氧化问题基本得到解决，但因为硬度过大造成的芯裂是在某种程度上是造成键合失效的主要原因，故现在铜线的大批量应用还只限于低档产品。
(三)、发明内容
本发明所要解决的技术问题是，提供一种柔性键合铜丝及其制备方法，通过多元合金解决铜丝过硬的问题，同时大大提高其抗氧化性，并使其可以真正应用于集成电路等高级封装中，以部分或全部取代金丝。
本发明的技术方案如下。
一种柔性键合铜丝，其特征在于由以下组分组成：Ce 0.001％-0.005％，Pd0.003％-0.005％，Pt 0.005％-0.009％，余量为Cu。
所述的柔性键合铜丝的制备方法，其特征在于经过以下步骤制备而成：
1)、制作预合金和母合金：选定要加入的合金元素，用99.999％以上的高纯铜制作预合金和母合金；
2)、熔铸：将99.999％的高纯铜，加入各种合金，熔铸成圆棒；
3)、拉丝：将金棒通过拉丝机拉成丝线；
4)、退火；
5)、机械性能检测：检查产品是否符合要求的强度和延展性；
6)、绕线：将金丝分绕成不同长度的小轴。
作为连接导线，要求键合丝具有良好的导电性能，适宜的硬度和力学性能，以保证合适的成球和成弧性能；并要求有好的抗氧化性，通常情况下基本不氧化，以保证结合的可靠性。
在导电性方面，铜比金的电阻率都低，导电更好；在力学性能上，铜的刚性(强度)比金好，由于以上两点，可在高密度封装中用更细的铜丝代替金丝，如20um代替25um；但是，铜的抗氧化性不如金，硬度高于金丝，在压焊过程中可能造成成球和结合失效以及芯片开裂，这是存在的主要问题，不过根据材料学原理，这两点完全可以通过材料技术来解决，成分、结构和组织的综合作用决定了硬度等指标，其中化学成分是基础，即通过改善铜基材料的配比，可以完全解决这个问题。
本发明的积极效果在于，通过采取多元掺杂合金，加入其他成分，降低铜的硬度，特别是成球硬度，减少对芯片的冲击力和破坏，降低键合能量，阻止了界面氧化物和裂纹的产生，保持其结合性能的稳定，从而提高了结合性能、导电性和抗氧化性；并通过控制熔铸、加工、热处理条件，进一步优化组织结构，保证得到合适的机械性能，能够满足不同的需要。
(四)、具体实施方式
下面结合附图和具体实施例进一步说明本发明。
实施例一
原料配比：Ce 0.001％，Pd 0.005％，Pt 0.005％，以Cu配至100％。
制备方法：
1)、合金：选定要加入的合金元素，用99.999％以上的高纯铜制作预合金和母合金。
2)、熔铸：根据不同型号及客户的要求将99.999％的高纯铜，加入各种合金，熔铸成圆棒，并通过调整拉铸的速度、加热和冷却的温度等参数，以得到晶体尺寸合适、结构均匀的棒材；
3)、拉丝：将金棒通过拉丝机拉成不同直径的丝线，选择合适的加工变形，防止回复和再结晶软化。
4)、退火：根据客户的不同要求，设定不同的退火参数，消除应力，选择再结晶区域，并得到满足要求的机械性能；并通过氮氢保护，以防止和减少氧化。
5)、机械性能检测：检查产品是否符合要求的强度和延展性；
6)、绕线：根据客户的不同要求将丝线分绕成不同长度的小轴；
7)、最终检验：表面、直径、放线、应力、机械性能、长度等检测。
实施例二
原料配比：Ce 0.005％，Pd 0.003％，Pt 0.009％，以Cu配至100％。
制备方法：同实施例一。
实施例三
原料配比：Ce 0.003％，Pd 0.004％，Pt 0.007％，以Cu配至100％。
制备方法：同实施例一。
对实施例三成品进行检测，检测数据如表1、表2。
由表1可知，本发明的合金丝拉伸强度高于普通铜丝，接近金键合丝；本发明的合金丝球硬度低于普通铜丝，接近金键合丝。
由表2可知，本发明合金丝的各项机械性能，明显优于普通铜丝，能够满足集成电路等高级封装的键合要求。
表1主要性能对比
  抗拉强度TS/5％N/mm2   球硬度HV
  金丝4N   200-300   40-65
  普通铜丝   250-350   70-75
  本发明柔性铜丝   280-285   59--62
表2机械性能参数
Figure A20091001701000061
其中，表1球硬度的检测条件是：Dia：25um；Pressure：3g；Pressure Time：12s；M/C：Mitutoyo MVK-H3。
表1抗拉强度和表2断裂负荷和延伸率的检测条件是：Sample Length：10mm；Pull Speed：10mm/min；M/C：Istron 4301。

Claims (2)

1、一种柔性键合铜丝，其特征在于由以下组分组成：Ce 0.001％-0.005％，Pd 0.003％-0.005％，Pt 0.005％-0.009％，余量为Cu。
2、如权利要求1所述的柔性键合铜丝的制备方法，其特征在于经过以下步骤制备而成：
1)、制作预合金和母合金：选定要加入的合金元素，用99.999％以上的高纯铜制作预合金和母合金；
2)、熔铸：将99.999％的高纯铜，加入各种合金，熔铸成圆棒；
3)、拉丝：将金棒通过拉丝机拉成丝线；
4)、退火；
5)、机械性能检测：检查产品是否符合要求的强度和延展性；
6)、绕线：将金丝分绕成不同长度的小轴。
CN2009100170105A 2009-07-09 2009-07-09 柔性键合铜丝及其制备方法 Active CN101626006B (zh)

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CN102324392A (zh) * 2011-10-19 2012-01-18 广东佳博电子科技有限公司 一种防氧化的铜基键合丝的制备工艺
CN102660695B (zh) * 2012-04-17 2015-07-29 重庆材料研究院 一种铜丝及其制备屏蔽铜网的方法
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