CN101621092A - 一种发光二极管 - Google Patents
一种发光二极管 Download PDFInfo
- Publication number
- CN101621092A CN101621092A CN200810068273A CN200810068273A CN101621092A CN 101621092 A CN101621092 A CN 101621092A CN 200810068273 A CN200810068273 A CN 200810068273A CN 200810068273 A CN200810068273 A CN 200810068273A CN 101621092 A CN101621092 A CN 101621092A
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- CN
- China
- Prior art keywords
- emitting diode
- light
- pedestal
- groove
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100682734A CN101621092B (zh) | 2008-07-01 | 2008-07-01 | 一种发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100682734A CN101621092B (zh) | 2008-07-01 | 2008-07-01 | 一种发光二极管 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101621092A true CN101621092A (zh) | 2010-01-06 |
CN101621092B CN101621092B (zh) | 2010-11-10 |
Family
ID=41514220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100682734A Active CN101621092B (zh) | 2008-07-01 | 2008-07-01 | 一种发光二极管 |
Country Status (1)
Country | Link |
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CN (1) | CN101621092B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102064241A (zh) * | 2010-10-13 | 2011-05-18 | 上海衡世光电科技有限公司 | 无透镜的led灯及其封装方法 |
CN102185082A (zh) * | 2011-04-08 | 2011-09-14 | 深圳市华星光电技术有限公司 | 发光二极管构造及其制造方法 |
CN102324456A (zh) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | 一种大功率led封装结构 |
CN106057685A (zh) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | 封装方法及倒装芯片封装结构 |
CN110782800A (zh) * | 2019-11-21 | 2020-02-11 | 昆山国显光电有限公司 | 一种显示面板和显示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
CN2746538Y (zh) * | 2004-11-05 | 2005-12-14 | 江珏 | 大功率led发光二极管 |
CN1298059C (zh) * | 2004-11-29 | 2007-01-31 | 深圳市淼浩高新科技开发有限公司 | 一种镶嵌式功率型led光源的封装结构 |
CN201078631Y (zh) * | 2007-09-05 | 2008-06-25 | 昌鑫光电(东莞)有限公司 | 结构改良的白光发光二极管 |
CN201215811Y (zh) * | 2008-07-01 | 2009-04-01 | 深圳市九洲光电子有限公司 | 一种发光二极管 |
-
2008
- 2008-07-01 CN CN2008100682734A patent/CN101621092B/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102064241A (zh) * | 2010-10-13 | 2011-05-18 | 上海衡世光电科技有限公司 | 无透镜的led灯及其封装方法 |
CN102185082A (zh) * | 2011-04-08 | 2011-09-14 | 深圳市华星光电技术有限公司 | 发光二极管构造及其制造方法 |
CN102185082B (zh) * | 2011-04-08 | 2013-03-27 | 深圳市华星光电技术有限公司 | 发光二极管构造及其制造方法 |
CN102324456A (zh) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | 一种大功率led封装结构 |
CN106057685A (zh) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | 封装方法及倒装芯片封装结构 |
CN110782800A (zh) * | 2019-11-21 | 2020-02-11 | 昆山国显光电有限公司 | 一种显示面板和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101621092B (zh) | 2010-11-10 |
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Owner name: SHENZHEN JIUZHOU PHOTONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN JIUZHOU PHOTOELECTRON CO., LTD. Effective date: 20100917 |
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Free format text: CORRECT: ADDRESS; FROM: 518000 BUILDING 7, SHAERLANTIAN SCI-TECH PARK, DITANG ROAD, SHAJING TOWN, BAOAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 1, BUILDING 1, JIUZHOU INDUSTRIAL PARK, ZHENTANG ROAD 1, GUANGMING NEW DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE, 2/F |
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Effective date of registration: 20100917 Address after: 518000, Guangdong, Shenzhen Guangming New District, Tong Tong Road, Jiuzhou Industrial Park, building No. one or two Applicant after: Shenzhen Jiuzhou Optoelectronics Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Hall Dili Lu Sha two Lantian Science Park 7 Applicant before: Shenzhen Jiuzhou Photoelectron Co., Ltd. |
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