CN101598908A

CN101598908A - Decompression dry device

Info

Publication number: CN101598908A
Application number: CNA2009101457564A
Authority: CN
Inventors: 八寻俊一; 二俣雄亮
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2008-06-05
Filing date: 2009-06-05
Publication date: 2009-12-09
Also published as: JP5008147B2; JP2009295817A; TWI440116B; KR20090127059A; TW201007872A; KR101359751B1

Abstract

The invention provides a kind of substrate board treatment, can prevent that the pin that supports processed substrate is transferred on the substrate.Described substrate board treatment comprises: chamber (106), take in processed substrate (G); Decompressing unit (142) is to reducing pressure in the chamber (106); A plurality of lifter pins (128) are arranged on and support processed substrate (G) in the chamber (106) and from the below; Lifter pin lifting unit (126) is one group with a plurality of lifter pins (128), respectively the lifter pin (128) in each group of independent-lifting; Substrate temperature range detection unit (133) will be handled and the temperature of the substrate (G) that changes is divided into the temperature range of regulation detects along with drying under reduced pressure; Lifter pin temperature adjustment unit (131,132), to each lifter pin (128) in described group, the contact site with substrate (G) on the above-mentioned pin is set at set point of temperature, and the afore mentioned rules temperature is included in by in the detected temperature range in described substrate temperature range detection unit (133); And control module (133), lifter pin lifting unit (126) is carried out drive controlling.

Description

Decompression dry device

Technical field

The present invention relates to a kind of decompression dry device of under reduced pressure atmosphere, the processed substrate that is coated with treating fluid being implemented dried in order in photo-mask process, to form coated film.

Background technology

For example, at FPD (flat panel display: in the manufacturing plane flat-panel monitor), form circuit pattern by so-called photo-mask process, promptly, on processed substrates such as glass substrate, form after the film of regulation, coating forms resist film as the photoresist (hereinafter referred to as " resist ") for the treatment of fluid, make the resist film exposure accordingly with circuit pattern, and it is carried out development treatment.

In the formation operation of described resist film, behind the coating of substrates resist, carry out the drying under reduced pressure of coated film drying being handled by decompression.

In the past, as carrying out the device that such drying under reduced pressure is handled, have shown in the cut-open view of Figure 10 for example, patent documentation 1 disclosed drying under reduced pressure unit.

Drying under reduced pressure processing unit shown in Figure 10, lower chamber 61 and upper chamber 62 are close to, and form in inside to handle the space.In above-mentioned processing space, be provided with the mounting table 63 that is used for the processed substrate of mounting.Mounting table 63 is provided with a plurality of fixed pins 66 that are used for mounting substrate G.

In above-mentioned drying under reduced pressure processing unit, when the substrate G that is coated with resist on processed was moved into, substrate G was positioned on the mounting table 63 across fixed pin 66.

Then, upper chamber 62 is close to lower chamber 61, and substrate G is in the state in the processing space that is placed under the airtight conditions.

Next, the atmosphere of handling in the space is discharged from exhausr port 64, forms the reduced atmosphere of regulation.By making this decompression state keep official hour, the solvent of thinning agent (thinner) in the liquid against corrosion etc. is evaporated to a certain extent, the solvent in the liquid against corrosion is slowly emitted, and can non-confrontational erosion agent produce the drying that harmful effect ground promotes resist.

Patent documentation 1: TOHKEMY 2000-181079 communique

Summary of the invention

But in the past, in above-mentioned drying under reduced pressure was handled, if utilize the fixed pin supporting substrates, then the shape of the contact site of fixed pin can be transferred on the substrate, the therefore employing in the regional external application pin supporting that pixel is set to avoid the method for transfer printing influence more.

Yet, having produced in recent years can not be at pixel region with this problem of external support and following problem because chamfer shape is diversified, promptly, along with screen size maximizes, even support with the external application fixed pin at pixel region, flexibility also can become greatly, thereby the resist dried is produced harmful effect.

Therefore,, must in pixel region, support, in this case, require to adopt a kind of technology that can prevent the shotpin transfer printing with pin in order to solve these problems.

In addition, in described patent documentation 1 disclosed drying under reduced pressure is handled, by handle the temperature that mounting table 63 is adjusted in the back in the resist coating, control make substrate G not occurrence temperature change, thereby suppress the transfer printing of fixed pin 66 to substrate G.

Yet, in patent documentation 1 disclosed method, during substrate G is implemented the drying under reduced pressure processing, owing to utilize the same position of pin supporting substrates G, the position of contact plug and not the position of contact plug produce the difference of resist rate of drying, the danger that the pin transfer printing takes place is arranged.

In addition, even the temperature of substrate G does not change, the temperature of the pin of supporting substrates G also can reduce gradually along with the decompression in the chamber, and the temperature difference between pin and the substrate G enlarges, and the danger that transfer printing takes place is arranged.

The present invention makes under above-mentioned background, its objective is that providing a kind of carries out the dried of described treating fluid, the substrate board treatment of formation coated film to the processed substrate that is coated with treating fluid, the aforesaid substrate treating apparatus can prevent to support the pin of processed substrate to the substrate transfer printing.

In order to solve above-mentioned problem, decompression dry device of the present invention is the decompression dry device that coated film was handled, formed to a kind of drying under reduced pressure that the processed substrate that is coated with treating fluid is carried out described treating fluid, it is characterized in that, comprising: chamber is used to take in described processed substrate; Decompressing unit is to reducing pressure in the described chamber; A plurality of lifter pins are arranged on and support described processed substrate in the described chamber and from the below; The lifter pin lifting unit is one group with a plurality of described lifter pins, makes the lifter pin in each group carry out lifting respectively independently; Substrate temperature range detection unit will be handled and the temperature of the described substrate that changes is divided into the temperature range of regulation detects along with drying under reduced pressure; Lifter pin temperature adjustment unit, each lifter pin in described group is set at set point of temperature with on the described pin with contact site described substrate, and described set point of temperature is included in respectively by in the detected temperature range in described substrate temperature range detection unit; And control module, described lifter pin lifting unit is carried out drive controlling, described control module is according to carrying out drive controlling by the detected temperature range in described substrate temperature range detection unit to described lifter pin lifting unit, makes the described lifter pin that is adjusted to the set point of temperature that is included in the described temperature range with temperature support described processed substrate.

By said structure, carry out switching controls, make that the lifter pin of the processed substrate of supporting is that temperature is adjusted to the pin approximate with substrate temperature.In addition, follow this switching, the contact position of lifter pin and substrate is switched.

That is to say, during drying under reduced pressure is handled, even air pressure, temperature in the chamber change, also always can be by being adjusted into the lifter pin supporting substrates with the roughly the same temperature of substrate temperature, and the lifter pin same position of contact substrate for a long time not.Therefore, the influence of lifter pin can be reduced as far as possible, of the transfer printing of the lifter pin of supporting substrates can be prevented substrate to substrate.

In addition, preferably also comprise: the air pressure detecting unit that detects described chamber internal gas pressure; With store the air pressure of expression in the described chamber and the storage unit of the map table of the mutual relationship of described substrate temperature scope, described substrate temperature range detection unit is according to the detected chamber internal gas pressure of described air pressure detecting unit, with reference to described map table, the temperature range of regulation is exported as testing result.

By said structure, can easily export the substrate temperature scope according to detected air pressure.

Perhaps, also can adopt following structure, also comprise: the substrate temperature detecting unit that detects the temperature that is set at the processed substrate in the described chamber; The storage unit of map table of the substrate temperature scope of regulation will be divided into storing by the detected substrate temperature of described substrate temperature detecting unit; Described substrate temperature range detection unit, is exported the temperature range of regulation with reference to described map table according to the detected substrate temperature of described substrate temperature detecting unit as testing result.

Perhaps, also can adopt following structure, also comprise: the storage unit of map table that stores the mutual relationship of elapsed time that the expression drying under reduced pressure handles and described substrate temperature scope; In the elapsed time that described substrate temperature range detection unit is handled according to drying under reduced pressure,, the temperature range of regulation is exported as testing result with reference to described map table.

By said structure, can easily export the substrate temperature scope according to the elapsed time that drying under reduced pressure is handled.

According to the present invention, can obtain a kind of substrate board treatment, the aforesaid substrate treating apparatus is handled and the formation coated film the drying under reduced pressure that the processed substrate that is coated with treating fluid carries out described treating fluid, can prevent to support the pin of processed substrate to the substrate transfer printing.

Description of drawings

Fig. 1 is the vertical view that possesses the coating developing system of decompression dry device of the present invention.

Fig. 2 is the process flow diagram of processing substrate flow process of the coating developing system of presentation graphs 1.

Fig. 3 is the integrally-built vertical view of coated technique portion that the coating developing system of presentation graphs 1 is comprised.

Fig. 4 is the vertical view of the drying under reduced pressure unit that comprised of the coated technique portion of Fig. 3.

Fig. 5 is the cut-open view of drying under reduced pressure unit.

Fig. 6 is the local amplification view of drying under reduced pressure unit.

Fig. 7 is a form of schematically representing to be used for the map table of pin lifting control.

Fig. 8 is the process flow diagram of expression drying under reduced pressure unit action.

Fig. 9 is the action variation diagram of the lifter pin in the drying under reduced pressure unit.

Figure 10 is a cut-open view of representing the general configuration of drying under reduced pressure unit in the past.

Figure 11 is the chart that curve is passed in the decompression in the chamber that uses among the expression embodiment.

Symbol description

10 coating developing systems

30 coated technique portions

46 drying under reduced pressure unit (decompression dry device)

104 rolling conveyance paths

106 chambers

126 lift-pin mechanisms (lifter pin lifting unit)

128 lifter pins

128a sells main body

128b sells the top

129 pin unit

133 control device (control module, substrate temperature range detection unit)

133a storage part (storage unit)

135 baroceptors (air pressure detecting unit)

142 vacuum pumping hardwares (decompressing unit)

The G substrate

Embodiment

Below in conjunction with embodiments of the present invention, describe with reference to accompanying drawing.Fig. 1 is the vertical view that possesses the coating developing system of decompression dry device of the present invention.

Above-mentioned coating developing system 10 is arranged in the purge chamber, for example, the glass substrate of using with LCD is as processed substrate, in the LCD manufacture process, carry out in the photo-mask process cleaning, resist coating, preceding baking (prebake), develop and back baking a series of processing such as (postbake).Exposure-processed is undertaken by the exposure device 12 with the outside of the adjacent setting of said system.

Coating developing system 10 disposes the technology station (processstation) of growing crosswise (P/S) 16 at central part, disposes box station (cassettestation) (C/S) 14 and interface station (interface station) (I/F) 18 at its long side direction (directions X) both ends.

The port of taking out of box C is moved at box station (C/S) the 14th, and above-mentioned box C takes in polylith substrate G in the mode that multilayer stacks.Box station (C/S) 14 comprises: can be aligned to the box platform 20 that 4 box C carry out mounting on a direction (Y direction) of level, and the box C on the above-mentioned box platform 20 is carried out the transport mechanism 22 that the taking-up of substrate G is put into.Transport mechanism 22 comprise can supporting substrates G unit, for example carrying arm 22a, can on X, Y, four axles of Z, θ, move, make and carry out the handing-over of substrate G with adjacent technology station (P/S) 16 sides.

Each process part at technology station (P/S) 16 is according to arranged in order the going up on parallel and direction pair of opposite circuit A, the B that prolongs at system's long side direction (directions X) in level of technological process or operation.

That is to say, from the production line A of box station (C/S) 14 side direction interface stations (I/F) 18 sides, move into unit (IN PASS) 24, cleaning portion 26, the first thermal treatment portion 28, coated technique portion 30 and the second thermal treatment portion 32 along the first advection conveyance path 34, be configured to a row according to said sequence from upstream side.

Particularly, move into unit (IN PASS) 24 and constitute: receive untreatment base G from the transport mechanism 22 of box station (C/S) 14, substrate G is put into the first advection conveyance path 34 with the productive temp (tact) of regulation.

In cleaning portion 26, be disposed with excimers UV illumination unit (E-UV) 36 and scrub (scrub) cleaning unit (SCR) 38 from upstream side along the first advection conveyance path 34.

In the first thermal treatment portion 28, be disposed with absorbing unit (AD) 40 and cooling unit (COL) 42 from upstream side.In coated technique portion 30, be disposed with resist coating element (COT) 44 and as the drying under reduced pressure unit (VD) 46 of decompression dry device of the present invention from upstream side.

In the second thermal treatment portion 32, baking unit (PRE-BAKE) 48 and cooling unit (COL) 50 before upstream side is provided with.

Near the terminal point of the first advection conveyance path 34 the downstream that is positioned at the second thermal treatment portion 32 is provided with delivery unit (PASS) 52.

The substrate G that comes with the conveyance of advection mode on the first advection conveyance path 34 is sent to interface station (I/F) 18 from the delivery unit (PASS) 52 of above-mentioned terminal point.

On the other hand, from the production line B of the downstream portion of interface station (I/F) 18 side direction box stations (C/S) 14 sides, developing cell (DEV) 54, baking unit, back (POST-BAKE) 56, cooling unit (COL) 58, inspection unit (AP) 60 and take out of unit (OUT PASS) 62 and be configured to a row from upstream side according to said sequence along the second advection conveyance path 64.

Here, back baking unit (POST-BAKE) 56 and cooling unit (COL) 58 constitute the 3rd thermal treatment portion 66.Taking out of unit (OUT PASS) 62 is constituted as: receive the substrate G that has handled one by one successively from the second advection conveyance path 64, and be sent to the transport mechanism 22 at box station (C/S) 14.

In addition, being provided with auxiliary conveyance space 68 between two production line A, the B, can be that reciprocating moving device (shuttle) 70 of unit level ground mounting substrate G can move at twocouese on the production line direction (directions X) by not shown driving mechanism with 1.

In addition, interface station (I/F) 18 comprises carrying device 72, and above-mentioned carrying device 72 is used for and above-mentioned first and second

advection conveyance paths

34,64 and adjacent exposure device 12 handing-over substrate G.Around above-mentioned carrying device 72, dispose turning base (R/S) 74 and peripheral device 76.Turning base (R/S) the 74th, the platform (stage) that substrate G is rotated in surface level, be used for exposure device 12 handing-over time conversion rectangular substrate G towards.Peripheral device 76 is connected to marker (TITLER), peripheral exposure device (EE) etc. on the second advection conveyance path 64.

Fig. 2 represents the treatment step of the overall process that a substrate is handled in the above-mentioned coating developing system.At first, in box station (C/S) 14, transport mechanism 22 any one box C from the platform 20 takes out substrate G, the substrate G that takes out is moved into technology station (P/S) 16 production line A side move into unit (IN PASS) 24 (the step S1 of Fig. 2).Substrate G is moved or puts on the first advection conveyance path 34 from moving into unit (IN PASS) 24.

Be put to the substrate G of the first advection conveyance path 34, at first in cleaning portion 26 by excimers UV unit (E-UV) 36 and scrub cleaning unit (SCR) 38 and carry out ultraviolet cleaning treatment successively and scrub cleaning treatment (the step S2 of Fig. 2, S3).

Scrub the particle shape dirt that 38 couples of substrate G that move horizontally of cleaning unit (SCR) clean by carrying out brushing (brushing), the blowing cleaning removes substrate surface on advection conveyance path 34, after this implement flushing (rinse) and handle, use air knife (air knife) etc. to make substrate G drying at last.After a series of cleaning treatment in scrubbing cleaning unit (SCR) 38 finished, substrate G kept this state to descend along the first advection conveyance path 34, arrives the first thermal treatment portion 28.

In the first thermal treatment portion 28, substrate G at first carries out adsorption treatment by the vaporish HMDS of absorbing unit (AD) 40 usefulness, and processed face is carried out hydrophobization (the step S4 of Fig. 2).After above-mentioned adsorption treatment finished, substrate G was cooled to the substrate temperature (the step S5 of Fig. 2) of regulation by cooling unit (COL) 42.After this, substrate G descends along the first advection conveyance path 34, is moved into coated technique portion 30.

In coated technique portion 30, substrate G at first keeps the advection states to use gap nozzles (slit nozzle) to apply liquid against corrosion with non-rotating (spinless) method at upper surface of base plate (processed face) by resist coating element (COT) 44, and near the drying under reduced pressure unit (VD) the downstream 46 air drying accepting to be undertaken by decompression is handled (the step S6 of Fig. 2) at once then.

The substrate G that takes out of from coated technique portion 30 descends along the first advection conveyance path 34, arrives the second thermal treatment portion 32.In the second thermal treatment portion 32, baking before substrate G at first accepts in preceding baking unit (PRE-BAKE) 48 is as thermal treatment after the resist coating or the thermal treatment (the step S7 of Fig. 2) before the exposure.

By baking before above-mentioned, thereby residual solvent evaporation is removed in the resist film on the substrate G, and resist film is strengthened to the adaptation of substrate.Then, the substrate G substrate temperature (the step S8 of Fig. 2) that is cooled to stipulate by cooling unit (COL) 50.After this, substrate G is sent to the carrying device 72 at interface station (I/F) 18 from the delivery unit (PASS) 52 of the terminal point of the first advection conveyance path 34.

At interface station (I/F) 18, substrate G accepts for example direction conversion of 90 degree at turning base 74, moved into the peripheral exposure device (EE) of peripheral device 76 then, when this has accepted to be used in development, remove exposure, be sent to adjacent exposure device 12 (the step S9 of Fig. 2) then attached to the resist of substrate G periphery.

At exposure device 12, the circuit pattern of regulation is exposed on the resist on the substrate G.Then, the substrate G behind the end pattern exposure is at first moved into the marker (TITLER) of peripheral device 76 after exposure device 12 returns interface station (I/F) 18, and here Gui Ding information is recorded in the regulation position (the step S10 of Fig. 2) on the substrate.After this, substrate G is moved into the starting point of developing cell (DEV) 54 of the second advection conveyance path 64 of the production line B side at the technology station (P/S) 16 that is laid in from carrying device 72.

Like this, substrate G this time on the second advection conveyance path 64 to the conveyance of the downstream of production line B.In the developing cell that begins most (DEV) 54, substrate G is implemented development, flushing, dry this a series of development treatment (the step S11 of Fig. 2) during the advection conveyance.

At the be through with substrate G of a series of development treatment of developing cell (DEV) 54, keep this state by mounting to the second advection conveyance path 64, and keep this state successively by the 3rd thermal treatment portion 66 and inspection unit (AP) 60.In the 3rd thermal treatment portion 66, substrate G is baking after baking unit, back (POST-BAKE) 56 is accepted at first, as the thermal treatment after the development treatment (the step S12 of Fig. 2).

By above-mentioned back baking, be evaporated and be removed thereby remain in developer solution, cleaning fluid in the resist film of substrate G, the resist pattern is strengthened to the adaptation of substrate.Next, substrate G is cooled to the substrate temperature (the step S13 of Fig. 2) of regulation in cooling unit (COL) 58.At inspection unit (AP) 60, the resist pattern on the substrate G is carried out (the step S14 of Fig. 2) such as non-contacting live width inspection and membranous, thickness inspections.

Take out of unit (OUT PASS) 62 and receive the substrate G that has finished whole operations processing, be delivered to the transport mechanism 22 at box station (C/S) 14 from the second advection conveyance path 64.In box station (C/S) 14 sides, transport mechanism 22 is being received into any one (being generally original) box C (the step S15 of Fig. 2) from the substrate G that has handled that takes out of unit (OUT PASS) 62 receptions.

In this coating developing system 10, can use decompression dry device of the present invention to the drying under reduced pressure unit (VD) in the coating process 30 46.

Below, according to Fig. 3～Fig. 6, the structure and the effect of the drying under reduced pressure unit (VD) 46 in the coated technique portion 30 of preferred implementation of the present invention are described.

Fig. 3 is the integrally-built vertical view of expression coated technique portion 30.In addition, Fig. 4～Fig. 6 represents the structure of drying under reduced pressure unit (VD) 46, and Fig. 4 is a vertical view, and Fig. 5 is a cut-open view, and Fig. 6 is its local amplification view.

In Fig. 3, resist coating element (COT) 44 comprises: what constitute the part of the first advection conveyance path 34 (Fig. 1) or an interval floats formula platform 80; On above-mentioned 80, the substrate transferring mechanism 82 of aerial substrate G along director's edge direction (directions X) conveyance will be floated over; Supply with the resist nozzle 84 of liquid against corrosion to the upper surface of the substrate G of conveyance on platform 80; And the nozzle reset portion 86 that resist nozzle 84 is resetted at the intermittence that coating is handled.

Upper surface at platform 80 is provided with a plurality of gas ejection ports 88 of spraying regulation gas (for example air) upward, and the pressure owing to the gas that sprays from these gas ejection ports 88 makes substrate G float to certain altitude apart from platform (stage) upper surface.

Substrate transferring mechanism 82 comprises: clip pair of guide rails 90A, 90B that platform 80 extends along directions X; Can come and go the slide block 92 that moves along above-mentioned guide rail 90A, 90B; With can on the platform 80 removably the mode of the both side ends of supporting substrates G be arranged on substrate supporting parts (not shown) such as absorption layer on the slide block 92, this substrate transferring mechanism 82 makes slide block 92 move along conveyance direction (directions X) by directly entering travel mechanism (not shown), thereby carries out the conveyance of floating of substrate G on platform 80.

Resist nozzle 84 is strip nozzles, cross the top of platform 80 extends along the horizontal direction (Y direction) vertical with conveyance direction (directions X), in the coating position of regulation, the upper surface by the substrate G under it is the banded liquid against corrosion of discharging from the escape hole of slit-shaped.In addition, resist nozzle 84 can move along directions X integratedly with the nozzle support unit 94 of this nozzle of supporting, and can move between above-mentioned coating position and nozzle reset portion 86 in the lifting of Z direction.

The assigned position of nozzle reset portion 86 above platform 80 supported by pillar part 96, comprising: make resist nozzle 84 discharge starting (priming) handling part 98 of liquid against corrosion as being used to apply preparing in advance of processing; And be used to remove nozzle cleaning mechanism 102 attached near the resist the resist escape hole of resist nozzle 84.

In the resist coating element (COT) 44 that constitutes in the above described manner, at first, by the first thermal treatment portion 28 of prime, the substrate G that comes with the conveyance mode conveyance of for example rolling is moved into the portion that moves into of the front that is set on the platform 80, keeps and receives substrate G at the slide block 92 of this standby.On platform 80, substrate G is subjected to the pressure of the gas (air) that ejects from gas ejection ports 88, keeps float state with the posture of approximate horizontal.

Then, slide block 92 keeps substrate G on one side, move along conveyance direction (directions X) to drying under reduced pressure unit (VD) 46 sides on one side, substrate G is during by resist nozzle 84 following, be the banded liquid against corrosion of discharging by resist nozzle 84 to substrate G upper surface, on substrate G, form the liquid film of liquid against corrosion to the back-end at a face as carpeting from the substrate front end.

Applied the substrate G of liquid against corrosion like this, after this also on platform 80, floated conveyance, surpassed the rear end of platform 80 and transfer to the rolling conveyance path of hereinafter mentioning 104, removed the maintenance of slide block 92 there by slide block 92.Transfer to that the substrate G of rolling conveyance path 104 is as mentioned below after this to be moved and moved into the drying under reduced pressure unit (VD) 46 of back level in rolling conveyance mode on rolling conveyance path 104.

Describe drying under reduced pressure unit (VD) 46 below in detail as decompression dry device of the present invention.

As shown in Figure 3, on the extended line of the platform 80 of resist coating element (COT) 44 (downstream), be laid with the part that constitutes the first advection conveyance path 34 or the rolling conveyance path 104 in an interval.Above-mentioned rolling conveyance path 104 lays continuously in inside and outside (front and back) of the chamber 106 of drying under reduced pressure unit (VD) 46.

Specifically, the rolling conveyance path 104 of above-mentioned drying under reduced pressure unit (VD) 46 is by constituting with the lower part: what the conveyance upstream side of the chamber 106 that is laid in was promptly moved into side moves into side roll conveyance path 104a; Inside rolling conveyance path 104b in the chamber 106 is laid in; What be laid in that the conveyance downstream of chamber 106 promptly takes out of side takes out of side roll conveyance path 104c.

Each conveyance path 104a that rolls, 104b, 104c by each independent or shared conveyance drive division rotation respectively along many piece roller 108a, 108bs, the 108c of conveyance direction (directions X) with the appropriate intervals configuration, and in rolling conveyance mode with substrate G along conveyance direction (directions X) conveyance.Here, the effect of moving into side roll conveyance path 104a is: receive the substrate G that is taken out of from the platform 80 of resist coating element (COT) 44 as the continuity of floating conveyance, and send in rolling conveyance mode in the chamber 106 of drying under reduced pressure unit (VD) 46.

The effect of inner rolling conveyance path 104b is: sending in the chamber 106 from the substrate G rolling conveyance mode at the same rate of moving into side roll conveyance path 104a and sending here in rolling conveyance mode, and, the substrate G that finishes the drying under reduced pressure processing in chamber 106 is passed out to outside the chamber 106 in rolling conveyance mode.The effect of taking out of side roll conveyance path 104c is: the substrate G that has handled the rolling conveyance of sending the inside rolling conveyance path 104b in chamber 106 is at the same rate pulled out, and be sent to the handling part (the second thermal treatment portion 32) of back level.

To shown in Figure 5, the chamber 106 of drying under reduced pressure unit (VD) 46 forms more flat rectangular parallelepiped as Fig. 3, wherein has the space of can level taking in substrate G.On toward each other a pair of (upstream side and downstream) chamber sidewall on the conveyance direction (directions X) of above-mentioned chamber 106, be respectively arranged with and form the slit-shaped that can just make the size that substrate G advection passes through and move into mouthfuls 110 and take out of mouthfuls 112.In addition, gate mechanism 114,116 is installed on the outer wall of chamber 106, is used for that switch is above-mentioned moves into mouthfuls 110 and take out of mouthfuls 112.In addition, the upper surface part of chamber 106 can freely be loaded and unloaded when safeguarding.

In chamber 106, constitute the roller 108b of inner rolling conveying unit 104b, taking out of on mouthfuls 110, the 112 corresponding height and positions with moving into, separate proper spacing and be configured to a row on conveyance direction (directions X), part or all roller 108b is connected by suitable gear train with rotary driving sources such as motor 120 outside being arranged on chamber 106.

As shown in Figure 4, each roller 108b is as constituting with the barred body at the identical cylindrical portion of external diameter or the columnar portion contact substrate G back side, and its both ends are by left and right sides wall that is arranged on chamber 106 or near the bearing it (not shown) supporting and can rotate.The outer wall section of the chamber 106 that the turning axle 122 of gear train is connected is by seal member 124 sealings.

In addition, as shown in Figure 5, above-mentioned drying under reduced pressure unit (VD) 46 comprises: be used for a plurality of lifter pins 128 that approximate horizontal ground supporting substrates G moves up and down in chamber 106.With the configuration arranged in patterns of regulation, each lifter pin 128 respectively can be in the vertical direction lifting by corresponding elevating mechanism 126 (lifter pin lifting unit) in chamber 106 for a plurality of lifter pins 128.Elevating mechanism 126 for example can adopt, and cylinder drives or the ball screw type of drive.

Specifically, as Fig. 4, shown in Figure 5, the gap between 2 adjacent roller 180b disposes a plurality of lifter pins 128 along substrate transferring direction (directions X), is 3 in the present embodiment, and described lifter pin 128 respectively can be along the vertical direction lifting.

In addition, constitute pin unit 129 by above-mentioned 3 lifter pins 128 as one group.Above-mentioned pin unit 129, for example shown in Figure 4, be arranged with a plurality of unit (being arranged with 7 unit in the drawings respectively) along directions X and Y direction respectively, like this, in chamber 106, lifter pin 128 is the state of rectangular arrangement.

Each lifter pin 128 as shown in Figure 5, comprising: the bar-shaped pin main body 128a of straight line that carries out lifting action by elevating mechanism 126; With the pin top 128b that on vertical direction, gives prominence to upward from the upper end of above-mentioned pin main body 128a.

Pin main body 128a for example, constitutes the rigid body hollow tube that is made of stainless steel (SUS).In addition, pin top 128b is for example formed by PEEK (polyetheretherketone) resin of etc.ing, and being very thin, top is the shape of circle, substrate G is carried out a contact with minimum area support.

In addition, sell the diapire of main body 128a across seal member 134 airtight perforation chambers 106, and, as mentioned above, can pass through elevating mechanism 126 liftings.

In addition, each lifter pin 128, for example shown in Figure 6, in the 128b of pin top, has peltier-element 131, supply with predetermined electric current by 132 pairs of above-mentioned peltier-element 131 of current supply control module, adjust and make pin top 128b reach set point of temperature (that is, constituting lifter pin temperature adjustment unit) by peltier-element 131 and current supply control module 132.

Specifically, the pin top 128b that constitutes 3 lifter pins 128 respectively selling unit 129 is set to different temperature respectively.For example, if 3 lifter pins 128 are made as pin A, pin B, pin C as shown in Figure 6 respectively, it is identical with the initial temperature of glass substrate G then to sell A, is 23 ℃, and pin B is lower than 21 ℃ of this temperature, and selling C is lower 17 ℃, controls to make it keep separately temperature.

In addition, each sells the lifter pin 128 in the unit 129 owing to be implemented independently lifting drive controlling separately, and in each pin unit 129, it is outstanding upward with supporting glass substrate G to control any that make in 3 lifter pins 128.

That is to say, control, make that to each pin A in all pin unit 129 or pin B or pin C (lifter pin 128 that is equivalent to pin A or pin B or pin C) each self-corresponding elevating mechanism 126 carries out advancing (risings) or retreat (decline) driving the same one stroke of lifter pin 128 simultaneously on same opportunity.At this moment, for each pin A or pin B or pin C, can make the height alignment at pin top and be lower than between the down position of rolling conveyance path 104b and the lifting position that the pin top is higher than rolling conveyance path 104b at the pin top as shown in Figure 5 and carry out lifting moving.

In addition, be formed with exhausr port 138 in a place or the many places of the diapire of chamber 106.Via gas outlet 140, vacuum pumping hardware 142 (decompressing unit) is connected on the above-mentioned exhausr port 138.Each vacuum pumping hardware 142 has to be used to make in the chamber 106 from atmospheric pressure state and vacuumizes vacuum pump (not shown) with the decompression state of keeping the specified vacuum degree.In addition, be the deviation equalization between the exhaust capacity that makes above-mentioned a plurality of vacuum pumping hardware 142, also can connect each gas outlet 140 with gas outlet (not shown).

In addition, the both ends in chamber 106, promptly move into mouthfuls 110 and take out of mouthfuls 112 near than the low position of rolling conveyance path 104b, be provided with the cylindric nitrogen ejection portion 144 of extending along the Y direction.Above-mentioned nitrogen ejection portion 144, for example the porous matter hollow tube that is formed by sintering metal powder constitutes, and is connected on the nitrogen supply source (not shown) via pipe arrangement 146 (Fig. 4).After the drying under reduced pressure processing finished, chamber 106 was from the whole peripheral surface ejection nitrogen of pipe.

In addition, the substantial middle in chamber 106 is provided with the baroceptor 135 (air pressure detecting unit) that detects internal ambience air pressure.Above-mentioned baroceptor 135 for example can use according to the distortion of the change-detection diaphragm (barrier film) of electrostatic capacitance and obtains the plate manometer of pressure.

In addition, in drying under reduced pressure unit (VD) 46, be provided with the control device 133 (control module) that constitutes by computing machine that carries out its action control and memory storage etc., according to the computer program of operation, the elevating mechanism 126, vacuum pumping hardware 142, current supply control module 132 etc. of to gate mechanism 114,116, rotary driving source 120, respectively selling unit 129 carry out drive controlling respectively.

In addition, be output to above-mentioned control device 133 by above-mentioned baroceptor 135 detected signals, control device 133 is according to the pressure in the detected chamber, and drive controlling is respectively sold the elevating mechanism 126 of unit 129.

Specifically, control device 133, with reference to being stored in the map table that is mutually related among the storage part 133a (storage unit) that it had, between expression cavity indoor pressure and the substrate G temperature (temperature range) in advance, switch the lifter pin 128 that is adjusted to different temperatures respectively.

Lift an object lesson, storage part 133a in the control device 133 records according to detecting the map table T (with reference to Fig. 7) that draws in advance, its content is: " during the air pressure in chamber 106 is decompressed to 53088.5Pa from atmospheric pressure; the temperature of substrate G is in the first substrate temperature scope (for example more than 23 ℃; 25 ℃ of less thaies); during the air pressure in chamber 106 is decompressed to 293.9Pa from 53088.4Pa; the temperature of substrate G is in the second substrate temperature scope (for example more than 21 ℃; 23 ℃ of less thaies), during air pressure in chamber 106 was decompressed to 19.5Pa from 293.8Pa, the temperature of substrate G was in the 3rd substrate temperature scope (for example more than 17 ℃, 21 ℃ of less thaies) in ".

Control device 133 plays a role as substrate temperature range detection unit, and the atmospheric pressure value in the chamber of measuring according to baroceptor 135 106 with reference to the map table T of described storage part 133a record, detects the substrate temperature scope of the substrate G of this moment.

In addition, control device 133 is controlled, make and respectively sell in the unit 129, by any the lifter pin 128 supporting substrates G among pin A (23 ℃), pin B (21 ℃), the pin C (17 ℃), above-mentioned pin A (23 ℃), pin B (21 ℃), pin C (17 ℃) are adjusted to the set point of temperature that is included in the above-mentioned detected substrate temperature scope.

Below, the action of above-mentioned drying under reduced pressure unit (VD) 46 is described according to the lifter pin action variation diagram of the process flow diagram of Fig. 8 and Fig. 9.

The resist coating element (COT) 44 of upstream coated the substrate G of liquid against corrosion, transfer to and move on the side roll conveyance path 104a by the conveyance path that floats of advection conveyance from the platform 80.

Then, substrate G moves moving on the side roll conveyance path 104a in rolling conveyance mode, moves into mouthfuls 110 from it and enters the chamber 106 of drying under reduced pressure unit (VD) 46 (the step ST1 of Fig. 8).At this moment, by gate mechanism 114, move into mouth 110 and be set as opening.

Inner rolling conveyance path 104b also drives by rotary driving source 120 rotations and carries out moving with the rolling conveyance of the identical conveyance speed of the rolling conveyance action sequence unanimity of moving into side roll conveyance path 104a, as shown in Figure 5, sending into chamber 106 inside in rolling conveyance mode from moving into mouthful 110 substrate G that enter.At this moment, all elevating mechanisms 126 make all lifter pins 128 be lower than the down position standby of inner rolling conveyance path 104b conveyance face at each pin top.

Then, after substrate G arrives the position of the approximate centre in the chamber 106, stop in the rolling conveyance action of this inner rolling conveyance path 104b.Also can be meanwhile or stop to move into the rolling conveyance action of side roll conveyance path 104a before this.

Like this, resist coating element (COT) 44 coated the substrate G of liquid against corrosion, go up continuous rolling conveyance by moving into side roll conveyance path 104a and inner rolling conveyance path 104b, moved into the chamber 106 of drying under reduced pressure unit (VD) 46.After this, gate mechanism 114,116 moves at once, airtight respectively moving into mouth 110 and taking out of mouth 112, sealed chamber 106 of opening before.

On the other hand, after chamber 106 was sealed, vacuum pumping hardware 142 actions to carrying out vacuum exhaust in the chamber 106, made it reach specified vacuum degree (the step ST2 of Fig. 8).Like this, in chamber 106,, make that the liquid film against corrosion on the substrate G is efficiently moderately dry at normal temperatures by substrate G is placed reduced atmosphere.

In addition, constantly be transfused to control device 133 by baroceptor 135 detected electric signal, monitor by the air pressure in the control device 133 beginning chambers 106,, detect the substrate temperature scope (the step ST3 of Fig. 8) of the temperature of this moment substrate G as regulation according to detected atmospheric pressure value.In addition, the aforesaid substrate temperature range for example is any in first to the 3rd these three substrate temperature scopes, the first substrate temperature scope be comprise the substrate G that is moved into initial temperature for example more than 23 ℃, 25 ℃ of less thaies; The second substrate temperature scope is lower, for example is more than 21 ℃, 23 ℃ of less thaies; The 3rd substrate temperature scope for example is more than 17 ℃, 21 ℃ of less thaies.

In addition, by current supply control module 132 shown in Figure 6, in each lifter pin 128 of all pin unit 129, supply with predetermined electric current to the peltier-element 131 of pin top 128b, pin top 128b is adjusted to each pin predefined set point of temperature of A～C (the step ST4 of Fig. 8).Specifically, for example, the lifter pin 128 that is equivalent to pin A is set to 23 ℃ that are included in the above-mentioned first substrate temperature scope (initial temperature that comprises the substrate G that is moved into), the lifter pin 128 that is equivalent to pin B is set to 21 ℃ that are included in the lower above-mentioned second substrate temperature scope of temperature, and the lifter pin 128 that is equivalent to pin C is set to 17 ℃ that are included in lower above-mentioned the 3rd substrate temperature scope of temperature.

Then, in control device 133,, carry out the lifting control of lifter pin 128 according to the regulation algorithm of the computer program that moves.

That is to say that in all pin unit 129, among 3 lifter pins 128 (pin A, pin B, pin C), the elevating mechanism 126 that is equivalent to the lifter pin 128 of pin A drives, wherein above-mentioned pin A is set to 23 ℃ of initial temperatures that are similar to the substrate G that is moved into.Then, pin main body 128a rising prescribed stroke makes above-mentioned pin top arrive the height and position of the regulation of the conveyance face that surpasses inner rolling conveyance path 104b.

Like this, substrate G transfers to the pin top 128b of the lifter pin 128 that is equivalent to pin A at the conveyance path 104b that keeps rolling internally under the state of flat-hand position, shown in Fig. 9 (a), keep flat-hand position the roll top (the step ST5 of Fig. 8) of conveyance path 104b, inside of being picked up.

At this moment, the pin top 128b that contacts with substrate G with minimum area contact substrate G, and is set to the roughly the same temperature of temperature (about 23 ℃) with substrate G, and therefore, the vestige of pin top 128b can not be transferred on the substrate G.

Here, carry out drying under reduced pressure and handle, the air pressure decompression in the chamber and after dropping to first air pressure (for example 53088.4Pa), control device 132 is judged as substrate temperature and has transferred to the above-mentioned second substrate temperature scope (the step ST6 of Fig. 8).

Then, in all pin unit 129, drive the lifter pin 128 that is equivalent to pin B, make its pin top rise to the height and position of the regulation that surpasses inner rolling conveyance path 104b conveyance face, wherein, the temperature of pin B is adjusted to 21 ℃ that are included in the above-mentioned second substrate temperature scope.In addition, when the pin top 128b of pin B arrives the height and position of its regulation, the pin top 128b of pin A is descended.

Like this, the lifter pin 128 of supporting substrates G shown in Fig. 9 (b), switches to pin B (the step ST7 of Fig. 8) from pin A.At this moment, the pin top 128b that contacts with substrate G, at the position contact substrate G different with pin A, and its temperature is set to temperature roughly the same with the temperature (about 21 ℃) of the substrate G that descends of decompression in the chamber with minimum area, therefore, the vestige of pin top 128b can not be transferred on the substrate G.

Drying under reduced pressure is handled and to be proceeded, drop to second air pressure (for example 293.8Pa) in the chamber after, control device 132 is judged as substrate temperature and has transferred to above-mentioned the 3rd substrate temperature scope (the step ST8 of Fig. 8).

Then, in all pin unit 129, drive the lifter pin 128 that is equivalent to pin C, its pin top is risen on the height and position of the regulation that surpasses inner rolling conveyance path 104b conveyance face, wherein, the temperature of pin C is adjusted to 17 ℃ that are included in above-mentioned the 3rd substrate temperature scope.In addition, when the pin top 128b of pin C arrives the afore mentioned rules height and position, the pin top 128b of pin B is descended.

Like this, the lifter pin 128 of supporting substrates G shown in Fig. 9 (C), switches to pin C (the step ST9 of Fig. 8) from pin B.At this moment, the pin top 128b that contacts with substrate G, at the position contact substrate G different with pin B, and its temperature is set to temperature roughly the same with the temperature (about 17 ℃) of the substrate G that descends of decompression in the chamber with minimum area, therefore, the vestige of pin top 128b can not be transferred on the substrate G.

Drying under reduced pressure is handled and to be proceeded, drop to the 3rd air pressure (for example 19.5Pa) in the chamber after, control device 133 is judged as drying under reduced pressure and handles and finishes, makes the exhaust action of vacuum pumping hardware 142 stop (the step ST10 of Fig. 8).The ground that replaces, nitrogen ejection portion 144 nitrogen injection in chamber 106.Then, room pressure rises to after the atmospheric pressure, and gate mechanism 114,116 actions are opened and moved into mouth 110 and take out of mouth 112.

Before and after this, control device 132 drives the elevating mechanism 126 of the lifter pin 128 that is equivalent to pin C in all pin unit 129, its pin top is dropped to the height and position of position of readiness of regulation of the conveyance face below of inner rolling conveyance path 104b.By the down maneuver of above-mentioned elevating mechanism 126, substrate G transfers to inner rolling conveyance path 104b with flat-hand position from the pin top of lifter pin 128.

After this, at inside rolling conveyance path 104b with take out of and begin to roll the conveyance action on the rolling conveyance path 104c of side at once, the substrate G that has just accepted reduced pressure treatment takes out of from taking out of mouth 112 by the rolling conveyance, and former state is delivered to the second thermal treatment portion 32 (the step ST11 of Fig. 8) of back level in the advection mode.

In addition, also can carry out the above-mentioned G of treatment substrate take out of action in, will move in the chamber 106 from moving into mouthfuls 110 by the continuous rolling conveyance of moving on side roll conveyance path 104a and the inner rolling conveyance path 104b from the subsequent substrate G of resist coating element (COT) 44.

As mentioned above,, in drying under reduced pressure unit (VD) 46, the lifter pin 128 of supporting substrates G is carried out switching controls, be temperature and be adjusted to the pin that is similar to substrate temperature according to the embodiment of substrate board treatment of the present invention.In addition, follow this switching, the contact position of lifter pin 128 and substrate G is switched.

That is to say, in the drying under reduced pressure processing procedure, though air pressure, temperature variation in the chamber, also can be all the time by being adjusted to the roughly the same lifter pin of temperature and substrate temperature 128 supporting substrates G, and, the same position of the long-time contact substrate G of lifter pin 128 meetings.Therefore, can reduce the influence of 128 couples of substrate G of lifter pin as far as possible, prevent that the vestige of lifter pin 128 is transferred on the substrate G.

In addition, in the above-described embodiment, monitor the air pressure in the chamber 106, according to the air pressure and the mutual relationship (map table) between the substrate temperature scope of record are switched lifter pin 128 in advance.But also can adopt additive method, for example, radiation thermometer (substrate temperature detecting unit) directly measures the temperature of substrate G in chamber 106 by being set, according to the said determination temperature, switch lifter pin 128 with reference to map table (in this case, being meant the table that is used for substrate temperature is divided into regulation substrate temperature scope).

Perhaps also can be according to the map table that has write down the mutual relationship between effluxion and the substrate temperature scope in advance, along with effluxion switches lifter pin 128.

In addition, in the above-described embodiment, lifter pin temperature adjustment unit is made of peltier-element 131 and current supply control module 132, but be not limited only to said structure, lifter pin temperature adjustment unit can also adopt following structure: is set point of temperature by flowing warm water in the 128b of pin top with adjustment.

Embodiment

Next, decompression dry device of the present invention is described in conjunction with the embodiments.Present embodiment uses the decompression dry device with structure shown in the above-mentioned embodiment, experimentizes by actual, has verified its effect.

At first, in order to set the substrate temperature scope that is used for the fulcrum post switching controls, to carrying out in the chamber from the reduce pressure reduced pressure treatment of decompression desired value (19.5Pa) of atmospheric pressure, curve is passed in the decompression of trying to achieve in the chamber with the exhaust velocity (flow) of regulation.The result who obtains is shown in the chart of Figure 11.In Figure 11, transverse axis is elapsed time (sec), and the longitudinal axis is atmospheric pressure value (Pa).

As shown in figure 11, decompression from atmospheric pressure (100000Pa) to desired value (19.5Pa) is passed, during being pressed onto 53088.4Pa from atmosphere, and during from 53088.4Pa to 293.8Pa, during (19.5Pa), the decompression slope is different respectively from 293.8Pa to the desired value.

According to The above results, same with above-mentioned embodiment, air pressure in the chamber is decompressed to substrate temperature during the 53088.5Pa from atmospheric pressure is set at the first substrate temperature scope (more than 23 ℃, less than 25 ℃), air pressure in the chamber is decompressed to substrate temperature during the 293.8Pa from 53088.4Pa is set at the second substrate temperature scope (more than 21 ℃, less than 23 ℃), the air pressure in the chamber is decompressed to substrate temperature during the 19.5Pa from 293.8Pa is set at the 3rd substrate temperature scope (more than 17 ℃, less than 21 ℃).

In addition, the temperature that is used for the lifter pin of supporting substrates in the first substrate temperature scope is 23 ℃; The temperature that is used for the lifter pin of supporting substrates in the second substrate temperature scope is 21 ℃; The temperature that is used for the lifter pin of supporting substrates in the 3rd substrate temperature scope is 17 ℃.

In experiment, same with above-mentioned embodiment, move into the substrate that is coated with resist and carry out the drying under reduced pressure processing, on the other hand, the air pressure in the monitoring chamber detects the substrate temperature scope simultaneously, switches the lifter pin of supporting substrates.

Then, observe the contact position of the substrate of taking out of after lifter pin and drying under reduced pressure are handled, whether checking transfer printing has taken place.The transfer printing of lifter pin does not take place in results verification.

The result of above embodiment proves that decompression dry device of the present invention can prevent the transfer printing of the pin of supporting substrates.

Claims

1. the decompression dry device of coated film is handled, formed to the drying under reduced pressure that the processed substrate that is coated with treating fluid is carried out described treating fluid, it is characterized in that,

Comprise:

Chamber is used to take in described processed substrate;

Decompressing unit is to reducing pressure in the described chamber;

A plurality of lifter pins are arranged on and support described processed substrate in the described chamber and from the below;

The lifter pin lifting unit is one group with a plurality of described lifter pins, makes the lifter pin in each group carry out lifting respectively independently;

Substrate temperature range detection unit will be handled and the temperature of the described substrate that changes is divided into the temperature range of regulation detects along with drying under reduced pressure;

Lifter pin temperature adjustment unit, each lifter pin in described group is set at set point of temperature with on the described pin with contact site described substrate, and described set point of temperature is included in respectively by in the detected temperature range in described substrate temperature range detection unit; With

Control module carries out drive controlling to described lifter pin lifting unit,

Described control module is according to carrying out drive controlling by the detected temperature range in described substrate temperature range detection unit to described lifter pin lifting unit, makes the described lifter pin that is adjusted to the set point of temperature that is included in the described temperature range with temperature support described processed substrate.

2. decompression dry device as claimed in claim 1 is characterized in that,

Also comprise: the air pressure detecting unit that detects described chamber internal gas pressure; With store the air pressure of expression in the described chamber and the storage unit of the map table of the mutual relationship of described substrate temperature scope,

Described substrate temperature range detection unit, is exported the temperature range of regulation with reference to described map table according to the detected chamber internal gas pressure of described air pressure detecting unit as testing result.

3. decompression dry device as claimed in claim 1 is characterized in that,

Also comprise: the substrate temperature detecting unit that detects the temperature that is set at the processed substrate in the described chamber; To be divided into the storage unit of map table of the substrate temperature scope of regulation by the detected substrate temperature of described substrate temperature detecting unit with storing,

Described substrate temperature range detection unit, is exported the temperature range of regulation with reference to described map table according to the detected substrate temperature of described substrate temperature detecting unit as testing result.

4. decompression dry device as claimed in claim 1 is characterized in that,

Also comprise: store the storage unit of map table of the mutual relationship of elapsed time that the expression drying under reduced pressure handles and described substrate temperature scope,

In the elapsed time that described substrate temperature range detection unit is handled according to drying under reduced pressure,, the temperature range of regulation is exported as testing result with reference to described map table.