CN101577686A - 等化器及具有该等化器的连接器 - Google Patents

等化器及具有该等化器的连接器 Download PDF

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CN101577686A
CN101577686A CNA2008103015003A CN200810301500A CN101577686A CN 101577686 A CN101577686 A CN 101577686A CN A2008103015003 A CNA2008103015003 A CN A2008103015003A CN 200810301500 A CN200810301500 A CN 200810301500A CN 101577686 A CN101577686 A CN 101577686A
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eqalizing cricuit
resistance
signal
electric capacity
connector
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CN101577686B (zh
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陈俊仁
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2008103015003A priority Critical patent/CN101577686B/zh
Priority to US12/168,541 priority patent/US7791429B2/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/01—Equalisers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Dc Digital Transmission (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)

Abstract

一种等化器，其包括一电阻及一电容，所述电阻与电容并联，所述电容的正极连接一印刷电路板的信号传输线，负极通过一终端电阻接地，所述等化器用于在信号接收端补偿信号在传输线中损耗的高频分量，改善印刷电路板的传输性能。本发明还涉及一种具有所述等化器的连接器，用于连接两种不同的电子装置。

Description

等化器及具有该等化器的连接器
技术领域
本发明涉及一种等化器及具有该等化器的连接器。
背景技术
在印刷电路板传输线中，随着信号的传输速度越来越高，信号的高频损耗也不断加大。目前，为了补偿信号的高频损耗，设计芯片时，通常在信号传送端采用预加强和解加强两种手段对信号处理。预加强通过增加信号的高频分量来补偿传输线中的高频损耗。解加强通过减少信号的低频分量，使经传输线后的信号低频分量与高频分量相对平衡，从而减少因频率分量差异过大所产生的抖动。然而，上述两种手段都会消耗一定的功率，而且它们的电磁辐射会随着信号传输速度的加快而加重。如何在印刷电路板的信号接收端采用一种合理的高频信号补偿装置以满足高速信号的传输要求，成为一个亟待解决的问题。
发明内容
鉴于以上内容，有必要提供一种位于信号接收端的高频信号补偿装置。
一种等化器，用于补偿信号在信号传输线中损耗的高频分量，其包括一电阻及一电容，所述电阻与电容并联，所述电容的正极连接所述信号传输线，负极通过一终端电阻接地。
一种连接器，用于连接一第一电子装置及一第二电子装置，所述连接器包括至少一等化器，所述等化器包括一电阻及一电容，所述电阻与电容并联，所述电容的正极连接所述第一电子装置，负极连接所述第二电子装置。
相较于现有技术，本发明等化器能在信号接收端补偿信号在印刷电路板传输线中传输的高频损耗，改善印刷电路板的传输性能。
附图说明
下面参照附图结合具体实施方式对本发明作进一步详细描述：
图1是本发明等化器的较佳实施方式的电路原理图。
图2A及图2B分别是信号经过不含有等化器的印刷电路板传输后及经过具有本发明等化器的印刷电路板传输后的仿真眼图。
图3A及图3B分别是信号经过不含有等化器的印刷电路板传输后及经过具有本发明等化器的印刷电路板传输后的仿真直方图。
图4是本发明连接器的较佳实施方式的示意图。
具体实施方式
请参照图1，本发明等化器的较佳实施方式包括一电阻R1和一电容C1，所述电容C1的正极连接传输线10，负极通过终端电阻R2接地，所述电容C1的正极与负极分别作为等化器20的输入端及输出端，所述电容C1的正极与负极上的电压分别标示为Vi及Vo，所述电阻R1与电容C1并联。
由以上各元件的连接关系，可以推导出本实施例中的频率响应为：
H ( s ) = V o ( s ) V i ( s ) = s * C 1 * R 1 * R 2 + R 2 s * C 1 * R 1 * R 2 + R 2 + R 1 - - - ( 1 )
其中s表示复频率jw，C1、R1及R2分别表示所述电容C1的容值、电阻R1及R2的阻值。从(1)式可以看出，s等于1/(R1*C1)时为此频率响应的零点，s等于(R2+R1)/(C1*R1*R2)时为此频率响应的极点。故，在所述电阻R2已知的情况下，结合所需要的低频增益及极点位置，便可以设计出符合要求的等化器。若所需要的低频增益为A分贝，则可得：
R 1 = R 2 * ( 1 - 10 A / 20 ) 10 A / 20 - - - ( 2 )
对于所述电容C1，其容值要使得所述极点(R2+R1)(C1*R2*R1)小于信号的主频率，若信号的主频率为F赫兹，则可得：
C 1 ≥ R 1 + R 2 2 πFR 1 R 2 - - - ( 3 )
需要指出的是，根据(3)式，虽然所述电容C1只有下限值，但其值愈大，零点1/(R1*C1)越小，所述等化器20的低频增益作用的频率范围愈窄。因此，所述电容C1的大小要合理选择，兼顾所述等化器20的零点1/(R1*C1)与极点(R2+R1)/(C1*R2*R1)。所述电阻R1与电容C1可分别设置为可变电阻及可变电容。
若对于一传输速度为5Gbps，主频率为2.5GHz的信号，所述电阻R2为100Ω，需要设计一个具有9.5dB的低频增益的等化器。由上述分析可知，所述极点(R2+R1)/(C1*R2*R1)要小于信号的主频率2.5GHz，则可得所述电阻R1及电容C1分别为：
R 1 = 100 Ω C 1 ≥ 2 pF - - - ( 4 )
本实施例中将C1设为5pF。请对比图2A及图2B，在信号接收端未使用等化器时，信号抖动较大，眼高较低；在信号接收端使用所述等化器20后，不仅减小了信号的抖动，还增加了眼高。由此可见，所述等化器20能补偿信号在印刷电路板传输线中的高频损耗，减少信号的抖动，改善印刷电路板的传输性能。请对比图3A及图3B，使用所述等化器20后，信号的抖动也有明显改善。
本发明还涉及一种具有上述等化器的连接器30。请参照图4，为了节省电路板的绕线空间，若干个等化器20内嵌于连接器30中。所述连接器30用于连接主机板及外接卡，所述连接器30包括若干连接主机板的引脚1及连接外接卡的引脚2，每一等化器20的电容C1的正极通过连接器的引脚1连接主机板，负极通过连接器的引脚2连接外接卡，每一等化器20的电阻R1与其电容C1并联。所述电阻R1与电容C1可分别设置为可变电阻及可变电容，便于根据不同的设计要求，灵活调整所述电阻R1的阻值与电容C1的容值。所述连接器30亦可为其他连接两种不同电子装置的连接器，其中等化器的数目亦可根据不同连接器的引脚数目及定义相应调整。
本发明等化器能在信号接收端补偿信号在印刷电路板传输线中传输的高频损耗，改善印刷电路板的传输性能。

Claims (6)

1.一种等化器，用于补偿信号在信号传输线中损耗的高频分量，其包括一电阻及一电容，所述电阻与电容并联，所述电容的正极连接所述信号传输线，负极通过一终端电阻接地。
2.如权利要求1所述的等化器，其特征在于：所述电阻为可变电阻。
3.如权利要求1所述的等化器，其特征在于：所述电容为可变电容。
4.一种连接器，用于连接一第一电子装置及一第二电子装置，所述连接器包括至少一等化器，所述等化器包括一电阻及一电容，所述电阻与电容并联，所述电容的正极连接所述第一电子装置，负极连接所述第二电子装置。
5.如权利要求4所述的连接器，其特征在于：所述等化器中的电阻为可变电阻。
6.如权利要求4所述的连接器，其特征在于：所述等化器中的电容为可变电容。
CN2008103015003A 2008-05-09 2008-05-09 等化器 Expired - Fee Related CN101577686B (zh)

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Cited By (3)

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CN102571366A (zh) * 2010-12-29 2012-07-11 瑞昱半导体股份有限公司 降低通信装置的耗电量的方法和相关装置
CN102571366B (zh) * 2010-12-29 2016-12-14 瑞昱半导体股份有限公司 降低通信装置的耗电量的方法和相关装置
CN109863589A (zh) * 2016-09-30 2019-06-07 英帆萨斯邦德科技有限公司 界面结构及其形成方法

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US9343393B2 (en) 2012-08-15 2016-05-17 Industrial Technology Research Institute Semiconductor substrate assembly with embedded resistance element
US10629577B2 (en) 2017-03-16 2020-04-21 Invensas Corporation Direct-bonded LED arrays and applications
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices

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US5717405A (en) * 1996-07-17 1998-02-10 Hughes Electronics Four-port phase and amplitude equalizer for feed enhancement of wideband antenna arrays with low sum and difference sidelobes
US6107896A (en) * 1998-05-01 2000-08-22 Berg Technology, Inc. Linear attenuation equalizer and method for designing same
CN101151801A (zh) * 2004-11-05 2008-03-26 美商内数位科技公司 常态化最小均方芯片级等化高级多样接收器
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Cited By (4)

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CN102571366A (zh) * 2010-12-29 2012-07-11 瑞昱半导体股份有限公司 降低通信装置的耗电量的方法和相关装置
CN102571366B (zh) * 2010-12-29 2016-12-14 瑞昱半导体股份有限公司 降低通信装置的耗电量的方法和相关装置
CN109863589A (zh) * 2016-09-30 2019-06-07 英帆萨斯邦德科技有限公司 界面结构及其形成方法
CN109863589B (zh) * 2016-09-30 2024-02-09 艾德亚半导体接合科技有限公司 界面结构及其形成方法

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