CN101573018A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101573018A
CN101573018A CNA2008100668436A CN200810066843A CN101573018A CN 101573018 A CN101573018 A CN 101573018A CN A2008100668436 A CNA2008100668436 A CN A2008100668436A CN 200810066843 A CN200810066843 A CN 200810066843A CN 101573018 A CN101573018 A CN 101573018A
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CN101573018B (zh
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周世文
陈俊吉
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

一种散热装置，包括一填充有相变化工作流体的导热筒体，还包括连接于导热筒体顶壁并与其连通的一壳体，一安装于壳体顶部的转动件及一驱动所述转动件转动的驱动件，所述驱动件部分收容于所述壳体内并与所述转动件连接，所述导热筒体内的工作流体受热变成气体，推动驱动件转动，驱动件进而驱动转动件转动以将所述气体冷却。上述散热装置内形成可由热能最终转变成机械能的能量循环回路，使发热电子元件产生的热能转变成对它进行辅助散热的机械能，从而有效利用能量的循环提高散热装置的散热效率。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是指一种冷却电子元件的散热装置。
背景技术
随着电子产业不断发展，电子元件(特别是中央处理器)运行速度和整体性能在不断提升。然而，它的发热量也随之增加，另一方面体积越来越小，发热也就更加集中，使得业界单纯使用金属实体传热的散热装置无法满足高端电子元件的散热需求。
现在常见的一种散热装置，包括一与热源接触的基座、设于基座上的若干等间距排列的散热鳍片及将基座与散热鳍片进一步导热连接的若干热管。为进一步提高散热效率通常会在该散热鳍片的顶端或一侧设置一辅助散热的风扇。然而，现在的散热装置基本上是一味地将热量排出系统外，且一般通过外接电源为风扇提供额外的电力，排出的热量不仅会使周围环境升温而危害环境，同时也是一种没有合理使用可循环能量而造成能量浪费的行为。
发明内容
本发明旨在提供一种将热能转换为机械能进行辅助散热的散热装置。
一种散热装置，包括一填充有相变化工作流体的导热筒体，还包括连接于导热筒体顶壁并与其连通的一壳体，一安装于壳体顶部的转动件及一驱动所述转动件转动的驱动件，所述驱动件部分收容于所述壳体内并与所述转动件连接，所述导热筒体内的工作流体受热变成气体，推动驱动件转动，驱动件进而驱动转动件转动以将所述气体冷却。
上述散热装置内形成可由热能最终转变成机械能的能量循环回路，使发热电子元件产生的热能转变成对它进行辅助散热的机械能，从而有效利用能量的循环提高散热装置的散热效率。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一优选实施例中散热装置组装视图。
图2是图1中散热装置的分解图。
图3是图1中散热装置的倒置分解图。
图4是图1中散热装置沿其轴面的剖视图。
具体实施方式
图1和2示出了本发明一优选实施例中的散热装置，该散热装置用于散发中央处理器等发热电子元件(图未示)产生的热量，该散热装置包括一导热体10、设置于导热体10上的一散热片组20、设置在导热体10顶部的一驱动件30、固定在导热体10顶部并将驱动件30下半部分罩于其内的一中空壳体40和位于壳体40上方并将驱动件30上半部分容置其内的一转动件50。
上述导热体10包括一基板12和向上竖直设置在基板12中央的一导热筒体14。该基板12大致呈矩形，其在各角落开设有供固定件(图未示)穿设以将散热装置固定到发热电子元件上的一固定孔120。该导热筒体14内设置有一腔体(未标号)，腔体内壁设置有毛细结构，且填充有适量的相变化工作流体。该导热筒体14具有一顶壁140，该顶壁140中心形成一向下凹陷的定位槽142，该顶壁140均匀对称地开设有若干通孔144。该通孔144呈弧形条状，靠近顶壁140周缘并沿顶壁140周向延伸。
上述散热片组20包括若干散热片22，每一散热片22靠近导热筒体14的一侧边缘垂直延伸有折边220，该折边220通过焊接或粘贴等方式贴设在导热筒体14的周面上，从而使所述散热片22呈放射状地分布在导热筒体14周缘。在其它实施例中，所述散热片22可以是一体地形成于导热筒体14周面上，并向外呈放射状延伸。
上述驱动件30包括一叶轮组32、位于叶轮组32正上方的一环形磁铁34和穿置在叶轮组32及环形磁铁34中心的一转轴36。该叶轮组32及环形磁铁34均关于转轴36成中心对称且它们之间形成有间隔。该叶轮组32具有一轮毂(未标号)及形成于轮毂外周壁的扇叶(未标号)。该转轴36穿设于所述轮毂顶壁且该转轴36的底端凸出叶轮组32的底部，以插入并定位在该导热筒体14顶壁140的定位槽142内。该转轴36的顶部凸出环形磁铁34的顶部，以便与底部配合定位该驱动件30。
请一并参阅图4，上述壳体40为一直径与导热筒体14相同的一扁圆柱形筒体，该壳体40具有一顶面42和与顶面42平行的底面44。该顶面42中心上开设有一穿孔420，供驱动件30的转轴36穿设。该壳体40底面44中心对应顶面42的穿孔420开设一透孔440，以供该转轴36的底端部穿过而插入导热筒体14顶壁140的定位槽142内。该壳体40底面44开设有与导热筒体14顶部的长弧形通孔144对应相同的若干通孔444。此外，上述壳体40并非一体形成，其顶面42是在驱动件30的转轴36穿置在其上的穿孔420内且驱动件30的叶轮组32套设在位于顶面42下方的转轴36上之后，再将顶面42通过焊接的方式连接到壳体40筒壁的顶端缘上且将驱动件30的叶轮组32封装在壳体40之内。
上述转动件50包括一转筒52、形成于转筒52周缘的若干扇叶522和贴设在转筒52内周壁的若干线圈54。该转筒52为开口向下的扁圆柱筒体，其直径略小于壳体的直径，转筒52的顶部中心开设一定位孔520。该定位孔520用于容置该驱动件30转轴36的顶端部分，以将该驱动件30定位。所述线圈54一般可由表面镀有绝缘膜的金属铜线数次环绕而成，所述线圈54关于转筒52中轴线成中心对称地固定在转筒52内壁，且线圈54内的空间正好容置驱动件30的环形磁铁34。
请一并参阅图4，上述散热装置处于组装状态时，上述散热片组20贴设在导热体10的导热筒体14外周面上，并由导热筒体14的外周面向外呈放射状延伸；所述壳体40的底面44通过焊接等方式与导热体10的导热筒体14顶部密封连接，且导热筒体14顶部和壳体40的底面44通孔144、444对应连通；该转动件50位于壳体40的正上方，驱动件30转轴36的顶端部穿置在转动件50顶面的定位孔520内，转轴36中间部穿置在壳体40顶面42的穿孔420内，转轴36的底端部穿过壳体40底面44的透孔440而插入并被限定在导热筒体14顶部的定位槽142内；该驱动件30的叶轮组32位于该壳体40内，该驱动件30的环形磁铁34容置在转动件50的线圈54环绕的空间内。
上述散热装置处于使用状态时，发热电子元件贴设在导热体10的基板12底部上，发热电子元件产生的热量直接被导热体10基板12底部吸收，并同时使位于导热筒体14底部的相变化工作流体受热蒸发成工作气体，工作气体受热膨胀急速上升，工作气体最后通过导热筒体14及壳体40的通孔144、440进入壳体40并撞击在驱动件30的叶轮组32的扇叶上，从而推动驱动件30旋转；工作气体或撞击在叶轮组32的扇叶上将热能转变成机械能，或遇到导热筒体14的筒壁，都将因为将热量传递出去而转变成相变化工作流体并通过腔体内的毛细结构回流到导热筒体14的底部以进行下一次循环；根据物理常识(法拉第电磁感应定律)可知，环形磁铁34在驱动件30的带动下旋转，使环形磁铁34周围磁场的磁线也跟着旋转，从而使转动件50的线圈54切割磁线而产生电流；线圈54里流通的电流在环形磁铁34的磁场内又将产生力的作用而使所述线圈54带动该转动件50旋转而产生吹向散热片组20的强制气流。
可见，上述散热装置内形成由热能最终转变成机械能的能量循环回路，使发热电子元件产生的热能转变成对它进行辅助散热的机械能，从而有效利用能量的循环提高散热装置的散热效率。

Claims (10)

1.一种散热装置，包括一填充有相变化工作流体的导热筒体，其特征在于：还包括连接于导热筒体顶壁并与其连通的一壳体，一安装于壳体顶部的转动件及一驱动所述转动件转动的驱动件，所述驱动件部分收容于所述壳体内并与所述转动件连接，所述导热筒体内的工作流体受热变成气体，推动驱动件转动，驱动件进而驱动转动件转动以将所述气体冷却。
2.如权利要求1所述的散热装置，其特征在于：所述驱动件具有一收容于所述壳体内的叶轮组、一安装于叶轮组定部并收容于转动件内的磁铁及一穿设所述叶轮组的转轴，所述转轴一端固定于导热筒体顶壁，另一端穿过所述壳体固定于转动件顶部。
3.如权利要求2所述的散热装置，其特征在于：所述转动件包括一转筒、形成于转筒周缘的若干扇叶及贴设于转动内周壁的若干线圈，所述线圈环绕所述磁铁，所述气体推动所述叶轮组转动进而带动磁铁旋转使线圈产生电流驱动所述转动件的扇叶旋转。
4.如权利要求3所述的散热装置，其特征在于：所述叶轮组具有一轮毂及形成于轮毂外周壁的扇叶，所述转轴穿设于所述轮毂顶壁。
5.如权利要求2所述的散热装置，其特征在于：所述导热筒体顶壁中心凹设有容置转轴底部的一定位槽。
6.如权利要求2所述的散热装置，其特征在于：所述壳体底面中心开设有供转轴底部穿过的一透孔，所述壳体顶面开设供转轴中间部穿置的一穿孔。
7.如权利要求2所述的散热装置，其特征在于：所述转筒顶面中心开设有供转轴顶端穿置并定位的一定位孔。
8.如权利要求1所述的散热装置，其特征在于：所述导热筒体外周面形成有若干散热鳍片，所述导热筒体安装于一基板上。
9.如权利要求1所述的散热装置，其特征在于：所述导热筒体顶壁及壳体的底面开设相互连通的通孔。
10.如权利要求9所述的散热装置，其特征在于：所述通孔关于导热筒体或壳体成中心对称，且所述通孔呈弧形条状，靠近顶壁或底面周缘并沿顶周向延伸。
CN2008100668436A 2008-04-28 2008-04-28 散热装置 Expired - Fee Related CN101573018B (zh)

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CN103002718A (zh) * 2012-10-30 2013-03-27 任立元 对流仿生散热器件
CN103260379A (zh) * 2012-02-21 2013-08-21 富瑞精密组件（昆山）有限公司 散热模组
CN109302826A (zh) * 2017-07-25 2019-02-01 国基电子（上海）有限公司 散热风扇及应用该散热风扇的电子装置
CN112402249A (zh) * 2020-12-02 2021-02-26 刘书海 一种存贮药瓶

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TW201144679A (en) * 2010-06-08 2011-12-16 zong-zhi Hou Autologous omni-directions circulating cooling device
TW201202647A (en) * 2010-07-08 2012-01-16 ming-hui Yao Heat conductive column featuring directional thermosiphon
CN103594437A (zh) * 2012-08-15 2014-02-19 黄贵明 用于电子组件的散热装置与具有此散热装置的led模块
US9384126B1 (en) 2013-07-25 2016-07-05 Sandisk Technologies Inc. Methods and systems to avoid false negative results in bloom filters implemented in non-volatile data storage systems
CN104977999B (zh) * 2015-06-16 2018-10-12 联想(北京)有限公司 一种散热系统及服务器
CN113758332B (zh) * 2021-09-17 2022-06-07 西安交通大学 一种浸没式液冷毛细芯能量转化自驱动相变散热装置

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403252A (en) * 1960-02-29 1968-09-24 Westinghouse Electric Corp Air processing apparatus and ion generator comprising an electromagnetic radiation source and a stable electron emitting photosensitive member
US3876410A (en) * 1969-12-24 1975-04-08 Ball Brothers Co Inc Method of applying durable lubricous coatings on glass containers
JPS5236610B2 (zh) * 1974-05-09 1977-09-17
US3953753A (en) * 1975-01-20 1976-04-27 Barrett Edward L Three phase alternators
US6039111A (en) * 1997-02-14 2000-03-21 Denso Corporation Cooling device boiling and condensing refrigerant
US6176101B1 (en) * 1997-06-18 2001-01-23 Gas Research Institute Flat-plate absorbers and evaporators for absorption coolers
US5796581A (en) * 1997-07-30 1998-08-18 International Business Machines Corporation Rotational joint for hinged heat pipe cooling of a computer
JPH11112158A (ja) * 1997-10-03 1999-04-23 Toshiba Corp 密閉型制御装置
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
WO2000052411A1 (fr) * 1999-03-04 2000-09-08 Ebara Corporation Echangeur de chaleur a plaques
US7472215B1 (en) * 1999-03-31 2008-12-30 International Business Machines Corporation Portable computer system with thermal enhancements and multiple power modes of operation
US20010050164A1 (en) * 1999-08-18 2001-12-13 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US20020046826A1 (en) * 2000-10-25 2002-04-25 Chao-Chih Kao CPU cooling structure
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
TW532738U (en) * 2001-03-27 2003-05-11 Foxconn Prec Components Co Ltd Heat sink assembly
JP3594238B2 (ja) * 2001-03-29 2004-11-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子機器用冷却装置及び電子機器
US7163740B2 (en) * 2001-06-02 2007-01-16 The Procter & Gamble Company Process for printing adhesives, adhesive articles and printing equipment
US6640882B2 (en) * 2001-07-31 2003-11-04 Agilent Technologies, Inc. Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
TW493460U (en) * 2001-08-21 2002-07-01 Franco C Manuel Composite-material-made handle of golf club
US6449152B1 (en) * 2001-11-06 2002-09-10 Jen-Cheng Lin Device for pressing a heat sink tightly against a CPU and positioning a fan over the heat sink
US6620366B2 (en) * 2001-12-21 2003-09-16 Cool Options, Inc. Method of making a capacitor post with improved thermal conductivity
CN1195196C (zh) * 2002-01-10 2005-03-30 杨洪武 集成式热管及其换热方法
JP2003246508A (ja) * 2002-02-22 2003-09-02 Fuji Photo Film Co Ltd 記録紙ロールホルダ装置
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6638033B2 (en) * 2002-03-28 2003-10-28 Chin-Wen Wang Magnetic-levitated cooling circulatory mechanism
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US6702002B2 (en) * 2002-06-03 2004-03-09 Chin-Wen Wang Hydronic pump type heat radiator
CN2562368Y (zh) * 2002-07-18 2003-07-23 俞建军 液体冷却散热装置
US6834713B2 (en) * 2002-07-18 2004-12-28 Delphi Technologies, Inc. Thermosiphon for electronics cooling with nonuniform airflow
TW577581U (en) * 2002-08-20 2004-02-21 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
TW551810U (en) * 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd Fan assembly
JP2004274942A (ja) * 2003-03-11 2004-09-30 Ind Technol Res Inst 磁流発電と冷却の装置及び方法
JP4122250B2 (ja) * 2003-03-31 2008-07-23 山洋電気株式会社 電子部品冷却装置
TW568299U (en) * 2003-04-01 2003-12-21 Delta Electronics Inc Heat dissipation module
TW575154U (en) * 2003-04-23 2004-02-01 Hon Hai Prec Ind Co Ltd Radiator having heat pipe
TWM240726U (en) * 2003-05-20 2004-08-11 Delta Electronics Inc Stator structure for single phase motor with radial windings
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
TW577969B (en) * 2003-07-21 2004-03-01 Arro Superconducting Technolog Vapor/liquid separated heat exchanging device
TWI229583B (en) * 2003-08-03 2005-03-11 Hon Hai Prec Ind Co Ltd Liquid-cooled heat sink device
CN2676128Y (zh) * 2003-12-11 2005-02-02 东莞莫仕连接器有限公司 导热装置
US6945314B2 (en) * 2003-12-22 2005-09-20 Lenovo Pte Ltd Minimal fluid forced convective heat sink for high power computers
US7267528B2 (en) * 2003-12-31 2007-09-11 Tek-Chain Development Inc. Plastic steel bearing for blade rotor shaft of cooling fan
TW200528011A (en) * 2004-02-13 2005-08-16 Asustek Comp Inc Heat sink device inside electrical apparatus
US7165413B2 (en) * 2004-07-09 2007-01-23 Symons Robert S Integrated liquid cooling device with immersed electronic components
US7162887B2 (en) * 2004-07-09 2007-01-16 Symons Robert S Integrated liquid cooling device for electronic components
US7571618B2 (en) * 2005-05-10 2009-08-11 University Of Maryland Compact heat exchanging device based on microfabricated heat transfer surfaces
CN1937211A (zh) * 2005-09-19 2007-03-28 建凖电机工业股份有限公司 散热装置
US20070119583A1 (en) * 2005-11-29 2007-05-31 Foster Jimmy G Sr Heat sink for distributing a thermal load
US7424906B2 (en) * 2006-04-19 2008-09-16 Delphi Technologies, Inc. High performance thermosiphon with internally enhanced condensation
US20070246195A1 (en) * 2006-04-19 2007-10-25 Bhatti Mohinder S Orientation insensitive thermosiphon with squirrel cage configuration
US20080060370A1 (en) * 2006-09-13 2008-03-13 Cummins Power Generation Inc. Method of cooling a hybrid power system
US7753662B2 (en) * 2006-09-21 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump therein
US7493940B2 (en) * 2006-10-10 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having mounting brackets
US7475718B2 (en) * 2006-11-15 2009-01-13 Delphi Technologies, Inc. Orientation insensitive multi chamber thermosiphon
JP2008191996A (ja) * 2007-02-06 2008-08-21 Hitachi Ltd ディスクアレイ装置および電子装置
US7980078B2 (en) * 2008-03-31 2011-07-19 Mccutchen Co. Vapor vortex heat sink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260379A (zh) * 2012-02-21 2013-08-21 富瑞精密组件（昆山）有限公司 散热模组
CN103260379B (zh) * 2012-02-21 2017-06-06 富瑞精密组件（昆山）有限公司 散热模组
CN103002718A (zh) * 2012-10-30 2013-03-27 任立元 对流仿生散热器件
CN109302826A (zh) * 2017-07-25 2019-02-01 国基电子（上海）有限公司 散热风扇及应用该散热风扇的电子装置
CN109302826B (zh) * 2017-07-25 2020-09-04 国基电子（上海）有限公司 散热风扇及应用该散热风扇的电子装置
CN112402249A (zh) * 2020-12-02 2021-02-26 刘书海 一种存贮药瓶

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