CN101553089B - Production technology of hollow-out double-sided flexible printed circuit board - Google Patents
Production technology of hollow-out double-sided flexible printed circuit board Download PDFInfo
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- CN101553089B CN101553089B CN2009100265124A CN200910026512A CN101553089B CN 101553089 B CN101553089 B CN 101553089B CN 2009100265124 A CN2009100265124 A CN 2009100265124A CN 200910026512 A CN200910026512 A CN 200910026512A CN 101553089 B CN101553089 B CN 101553089B
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Abstract
The invention discloses a production technology of a hollow-out double-sided flexible printed circuit board. The technology comprises the following steps: (1) double-sided board manufacture; (2) copper plating and guide hole manufacture; (3) circuit etching; (4) covering film pressing; (5) reinforcing; and (6) silk screen printing of ACP and characters, baking, assembling and finished product inspection. The production technology has the advantages of simple steps and high operability, and the hollow-out double-sided flexible printed circuit board produced by adopting the production technologyrealizes the combination of the hollow-out board and the double-sided board, thereby leading the thickness of the position of the welding point to be thinner, the thinnest position can achieve 0.07 m m, and the requirement of customers on reducing the thickness of partial positions (such as the positions of golden fingers) of the product can be satisfied.
Description
Technical field
The present invention relates to a kind of production technology of FPC, relate in particular to a kind of production technology that is applicable to the hollow-out double-sided flexible printed circuit board of handset touch panel.
Background technology
As everyone knows; Along with development of science and technology; The applying electronic product develops towards direction frivolous, multifunction gradually, and especially along with development of Communication Technique, mobile phone has become a part indispensable in people's daily life; And people require constantly to increase to the personalization of mobile phone, and the mobile phone that has a touch-screen also just comes out thereupon.Traditional P CB plate is a hardboard, because of itself characteristic is that hardboard is not bent, so; Will inevitably occupy certain space, can increase the weight of product simultaneously, more than two bad points restricted the strategy that product develops to frivolous, smart little direction; In addition, from view of production technology, handset touch panel adopts the technology of pressing the AG lead to realize being communicated with; What hardboard was too thick after can't realizing suppressing is smooth, and the step of generation is bigger, the situation of AG wire fracture can occur.In addition, the demand in market is exquisitenessization constantly, and general double-sided flexible printed circuit board also can be restricted because of the relation of its thickness, can not design more exquisite, the more reliable product of quality selectively.
Summary of the invention
In order to overcome the deficiency of prior art, the object of the present invention is to provide a kind of making to press the thinner and production technology simple hollow-out double-sided flexible printed circuit board of technology of screen position solder joint.
The present invention realizes through following technical scheme:
A kind of production technology of hollow-out double-sided flexible printed circuit board may further comprise the steps:
(1) make double sided board: substrate and bottom surface coverlay are cut into needed size, and four angular bits go out registration holes at the edge of substrate, and the bottom surface coverlay is also got out corresponding registration holes and solder joint exposed windows, then at 175～185 ℃ of temperature, pressure 110-130kg/cm
2The condition pressed in the bottom surface of substrate, the copper bar that one side is posted pure glue sticks on the bottom surface coverlay of substrate, 180 ± 5 ℃ of temperature,, pressure 120-130kg/cm
2The condition pressed and toast about 30min, form the double sided board combination;
(2) copper facing and make guide hole: the copper bar position at above-mentioned double sided board combination gets out guide hole, on the guide hole through conductive carbon on the electrochemical deposition, then with pressing one deck light-sensitive surface on the monolith substrate bottom surface; The identical registration holes of the film is labelled to the copper bar aspect, uses UV-irradiation, the light-sensitive surface polymerization forms the anti-plate circuit; Top layer does not make public, and removes unpolymerized light-sensitive surface then and exposes copper, with conductive copper on the guide hole inwall plating; Substrate surface and copper bar plated with copper are removed light-sensitive surface and cleaning then;
(3) circuit etching: the plate face of above-mentioned monolith substrate is pressed one deck light-sensitive surface; The identical registration holes of the required line pattern film is labelled on the plate face of monolith substrate, carries out UV-irradiation, the light-sensitive surface polymerization forms anti-etching circuit; Remove the unpolymerized light-sensitive surface in logicalnot circuit position then and expose residual copper; Erode the residual copper at logicalnot circuit position and make the solder joint both sides hollow out gap occur, the anti-etching light-sensitive surface after the removal polymerization, reduction circuit copper face; Carry out line maintenance and cleaning-drying at last, form required circuit;
(4) compacting coverlay: at the surface of substrate compacting layer of surface coverlay; Only expose outside the solder joint window, simultaneously copper bar place circuit is attached last layer copper bar coverlay, copper bar is carried out the high temperature compacting; Plate nickel-gold layer exposing solder joint window place then, product is cleaned and dry;
(5) reinforcing: paste the PI stiffening plate in plugging position, carry out the high temperature pressing then;
(6) silk-screen ACP, literal, baking, commentaries on classics are joined and product inspection.
Comprise also that in above-mentioned steps (5) back the solder joint position prints additional the step of ACP conducting resinl.
Substrate described in the above-mentioned steps (1) is a pure copper foil.
Bottom surface coverlay, surface coverage film and copper bar coverlay described in above-mentioned steps (1) and the step (4) is PI coverlay or polyester coverlay.
The invention has the beneficial effects as follows: production craft step of the present invention is simple, workable; The hollow-out double-sided flexible printed circuit board that utilizes production technology of the present invention to produce has been realized the combination of hollowed-out board and double sided board; Make that the thickness at solder joint position is thinner; Thinnest part can reach 0.07mm, can satisfy the client needs to reduce thickness to product local area (as: golden finger place) requirement.
Description of drawings
Fig. 1 is the structural representation of the hollow-out double-sided flexible printed circuit board of one embodiment of the invention.
Main Reference numeral implication is among the figure:
1, surface coverage film 2, substrate 3, bottom surface coverlay 4, copper bar
5, copper bar coverlay 6, guide hole 7, ACP conducting resinl
Embodiment
To combine accompanying drawing below, specify embodiment of the present invention:
Fig. 1 is the structural representation of the hollow-out double-sided flexible printed circuit board of one embodiment of the invention.
As shown in Figure 1, a kind of production technology of hollow-out double-sided flexible printed circuit board may further comprise the steps:
Make double sided board: substrate and bottom surface coverlay are cut into needed size, and four angular bits go out registration holes at the edge of substrate, and the bottom surface coverlay is also got out corresponding registration holes and solder joint exposed windows, then at 180 ℃ of temperature, pressure 120kg/cm
2The condition pressed in the bottom surface of substrate, the copper bar that one side is posted pure glue sticks on the bottom surface coverlay of substrate, at 180 ℃ of temperature, pressure 125kg/cm
2The condition pressed and toast about 30min, form the double sided board combination;
(2) copper facing and make guide hole: copper bar 4 positions at above-mentioned double sided board combination get out guide hole, on the guide hole through conductive carbon on the electrochemical deposition, then with pressing one deck light-sensitive surface on the monolith substrate bottom surface; The identical registration holes of the film is labelled to copper bar 4 aspects, uses UV-irradiation, the light-sensitive surface polymerization forms the anti-plate circuit; Top layer does not make public, and removes unpolymerized light-sensitive surface then and exposes copper, with conductive copper on the guide hole inwall plating; Substrate 2 surfaces and copper bar 4 plated with copper are removed light-sensitive surface and cleaning then;
(3) circuit etching: the plate face of above-mentioned monolith substrate is pressed one deck light-sensitive surface; The identical registration holes of the required line pattern film is labelled on the plate face of monolith substrate, carries out UV-irradiation, the light-sensitive surface polymerization forms anti-etching circuit; Remove the unpolymerized light-sensitive surface in logicalnot circuit position then and expose residual copper; Erode the residual copper at logicalnot circuit position and make the solder joint both sides hollow out gap occur, the anti-etching light-sensitive surface after the removal polymerization, reduction circuit copper face; Carry out line maintenance and cleaning-drying at last, form required circuit;
(4) compacting coverlay: at the surface of substrate 2 compacting layer of surface coverlay 1; Only expose outside the solder joint window, simultaneously copper bar 4 place's circuits are attached last layer copper bar coverlay 5, copper bar coverlay 5 is carried out the high temperature compacting; Plate nickel-gold layer exposing solder joint window place then, product is cleaned and dry;
(5) the solder joint position prints additional the ACP conducting resinl;
(6) reinforcing: paste PI stiffening plate (not shown) in plugging position, carry out the high temperature pressing then;
(7) character silk printing, baking, commentaries on classics are joined and product inspection.
Above-mentioned substrate 2 is a pure copper foil, and described bottom surface coverlay 3, surface coverage film 1 and copper bar coverlay 5 are PI coverlay or polyester coverlay.
Below disclose the present invention with preferred embodiment, so it is not in order to restriction the present invention, and all employings are equal to replacement or the technical scheme that obtained of equivalent transformation mode, all drop within protection scope of the present invention.
Claims (5)
1. the production technology of a hollow-out double-sided flexible printed circuit board may further comprise the steps:
(1) make double sided board: substrate and bottom surface coverlay are cut into needed size, and four angular bits go out registration holes at the edge of substrate, and the bottom surface coverlay is also got out corresponding registration holes and solder joint exposed windows, then at 175～185 ℃ of temperature, pressure 110-130kg/cm
2The condition pressed in the bottom surface of substrate, the copper bar that one side is posted pure glue sticks on the bottom surface coverlay of substrate, at 180 ± 5 ℃ of temperature, pressure 120-130kg/cm
2The condition pressed and toast about 30min, form the double sided board combination;
(2) copper facing and make guide hole: the copper bar position at above-mentioned double sided board combination gets out guide hole, on the guide hole through conductive carbon on the electrochemical deposition, then with pressing one deck light-sensitive surface on the monolith substrate bottom surface; The identical registration holes of the film is labelled to the copper bar aspect, uses UV-irradiation, the light-sensitive surface polymerization forms the anti-plate circuit; Top layer does not make public, and removes unpolymerized light-sensitive surface then and exposes copper, with conductive copper on the guide hole inwall plating; Substrate surface and copper bar plated with copper are removed light-sensitive surface and cleaning then;
(3) circuit etching: the plate face of above-mentioned monolith substrate is pressed one deck light-sensitive surface; The identical registration holes of the required line pattern film is labelled on the plate face of monolith substrate, carries out UV-irradiation, the light-sensitive surface polymerization forms anti-etching circuit; Remove the unpolymerized light-sensitive surface in logicalnot circuit position then and expose residual copper; Erode the residual copper at logicalnot circuit position and make the solder joint both sides hollow out gap occur, the anti-etching light-sensitive surface after the removal polymerization, reduction circuit copper face; Carry out line maintenance and cleaning-drying at last, form required circuit;
(4) compacting coverlay: at the surface of substrate compacting layer of surface coverlay; Only expose outside the solder joint window, simultaneously copper bar place circuit is attached last layer copper bar coverlay, copper bar is carried out the high temperature compacting; Plate nickel-gold layer exposing solder joint window place then, product is cleaned and dry;
(5) reinforcing:, carry out the high temperature pressing then at plugging position reinforcing plate;
(6) silk-screen ACP, literal, baking, commentaries on classics are joined and product inspection.
2. the production technology of hollow-out double-sided flexible printed circuit board according to claim 1 is characterized in that comprising also that in above-mentioned steps (4) back the solder joint position prints additional the step of ACP conducting resinl.
3. the production technology of hollow-out double-sided flexible printed circuit board according to claim 1 and 2 is characterized in that the substrate described in the above-mentioned steps (1) is a pure copper foil.
4. the production technology of hollow-out double-sided flexible printed circuit board according to claim 1 and 2 is characterized in that bottom surface coverlay, surface coverage film and the copper bar coverlay described in above-mentioned steps (1) and the step (4) is PI coverlay or polyester coverlay.
5. the production technology of hollow-out double-sided flexible printed circuit board according to claim 1 is characterized in that the described stiffening plate of above-mentioned steps (5) is the PI stiffening plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100265124A CN101553089B (en) | 2009-05-11 | 2009-05-11 | Production technology of hollow-out double-sided flexible printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100265124A CN101553089B (en) | 2009-05-11 | 2009-05-11 | Production technology of hollow-out double-sided flexible printed circuit board |
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| CN101553089A CN101553089A (en) | 2009-10-07 |
| CN101553089B true CN101553089B (en) | 2012-04-25 |
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| CN2009100265124A Active CN101553089B (en) | 2009-05-11 | 2009-05-11 | Production technology of hollow-out double-sided flexible printed circuit board |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN104320916A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Hollow-type double-sided flexible printed circuit board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
| US4975142A (en) * | 1989-11-07 | 1990-12-04 | General Electric Company | Fabrication method for printed circuit board |
| US6291779B1 (en) * | 1999-06-30 | 2001-09-18 | International Business Machines Corporation | Fine pitch circuitization with filled plated through holes |
| JP2003168873A (en) * | 2001-11-30 | 2003-06-13 | Genesis Technology Inc | Hollow multilayer printed-wiring board |
| JP2006173188A (en) * | 2004-12-13 | 2006-06-29 | Fujikura Ltd | Rigid-flex multilayer printed wiring board and its manufacturing method |
| CN2850203Y (en) * | 2005-12-05 | 2006-12-20 | 比亚迪股份有限公司 | Hollowed-out flexible circuitboard |
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
-
2009
- 2009-05-11 CN CN2009100265124A patent/CN101553089B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
| US4975142A (en) * | 1989-11-07 | 1990-12-04 | General Electric Company | Fabrication method for printed circuit board |
| US6291779B1 (en) * | 1999-06-30 | 2001-09-18 | International Business Machines Corporation | Fine pitch circuitization with filled plated through holes |
| JP2003168873A (en) * | 2001-11-30 | 2003-06-13 | Genesis Technology Inc | Hollow multilayer printed-wiring board |
| JP2006173188A (en) * | 2004-12-13 | 2006-06-29 | Fujikura Ltd | Rigid-flex multilayer printed wiring board and its manufacturing method |
| CN2850203Y (en) * | 2005-12-05 | 2006-12-20 | 比亚迪股份有限公司 | Hollowed-out flexible circuitboard |
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
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| CN101553089A (en) | 2009-10-07 |
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