JP2003168873A - Hollow multilayer printed-wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a multilayer printed-wiring board thin by a method wherein hollow parts are formed on insulating adhesion layers interposed between a plurality of printed-wiring board blanks and a film wiring-board material, the permittivity of the insulating adhesion layers is reduced and the film wiring- board material is laminated. <P>SOLUTION: In the multilayer printed-wiring board, the film wiring-board material 12 in which a conductive foil 12b or a conductive foil 12b' to be used as a signal interconnection is formed at least on one face on the surface of a film board 12a is adhesion-bonded to be multilayered by a heating pressurization operation between the printed-wiring board materials 10 on which conductive foils 10b or conductive foils 10b' to be used as signal interconnections are formed at least on faces on one side on surfaces of insulating boards 10a via insulating adhesion layers 11 which display an adhesion function by a heating pressurization operation. In the hollow multilayer printed-wiring board, hollow parts 11 a are formed on the layers 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hollow multi-layered printed wiring board used in electronic circuits of electronic equipment and at locations where electronic circuits are connected to each other.

[0002]

2. Description of the Related Art The invention of Japanese Patent Application No. 2000-347426 previously filed by the same applicant as the applicant of the present invention includes a printed wiring board and an adhesive insulating substrate having a hollow structure which exhibits an adhesive function by heating and pressing. The multilayer printed wiring board is alternately laminated in multiple layers and the manufacturing method thereof.

[0003]

However, the above-mentioned Japanese Patent Application No. 20
The multilayer printed wiring board of the invention of No. 00-347426,
There is a problem that it is difficult to make the device thinner and smaller.
INDUSTRIAL APPLICABILITY The present invention provides a thin and miniaturized high-performance hollow multi-layer printed wiring board that can respond to high-speed transmission of electric signals between electronic components and can also meet the demand for higher packaging density of electronic components. It is intended to be provided.

[0004]

In order to achieve the above object, the invention according to claim 1 is such that a conductive foil 10b or a conductive foil 10b 'serving as a signal wiring is formed on at least one surface of an insulating substrate 10a. An insulating adhesive layer 11 that exerts an adhesive function by heating and pressing between the printed wiring board materials 10.
Is a multi-layer printed wiring board in which a conductive film 12b or a conductive foil 12b 'serving as a signal wiring is formed on at least one surface of the film substrate 12a via a film to bond the film wiring board material 12 in multiple layers by heating and pressing. The hollow multi-layer printed wiring board is characterized in that a hollow portion 11a is formed in the insulating adhesive layer 11.

The invention according to claim 2 is characterized in that a conductive foil 11b which can be connected to a ground conductive foil is formed on the inner peripheral wall of the hollow portion 11a of the insulating adhesive layer 11. It is the described hollow multilayer printed wiring board.

In the invention according to claim 3, a conductive foil 10b 'serving as a signal wiring of the printed wiring board material 10 and a conductive foil 12b' serving as a signal wiring of the film wiring board material 12 of the insulating adhesive layer 11 are provided. In the surrounding part, the hollow part 11
The hollow multilayer printed wiring board according to claim 1, wherein a is formed, and a conductive foil 11b that can be connected to a ground conductive foil is formed on the inner peripheral wall of the hollow portion 11a.

The invention according to claim 4 is the insulating substrate 1
Between the conductive foil 10b or the conductive foil 10b 'which becomes the signal wiring and the insulating film is formed on the surface of the conductive foil 10b' which becomes the signal wiring, on at least one surface of the surface 0a. A conductive foil 10b 'is applied to the surface of the printed wiring board material 10 by applying an adhesive agent that exerts an adhesive function by heat and pressure.
And the conductive foil 12b or the signal wiring on at least one surface of the film substrate 12a via the metal substrate material 13 in which the hollow portion 13a is formed in the portion surrounding the conductive foil 12b 'which becomes the signal wiring of the film wiring substrate material 12. The conductive foil 12b 'is formed, and the film wiring board material 12 on which the insulating film is formed is laminated on the surface of the conductive foil 12b' to be the signal wiring, and the adhesive bonding is performed in multiple layers by heating and pressing. It is a hollow multi-layer printed wiring board featuring.

The invention according to claim 5 is the insulating substrate 1
The printed wiring board material 10 having a conductive foil 10b or a conductive foil 10b 'serving as a signal wiring formed on at least one surface of the surface 0a is coated with an adhesive exhibiting an adhesive function by heat and pressure. A hollow portion 13a is formed in a portion surrounding the conductive foil 10b 'serving as the signal wiring of the material 10 and the conductive foil 12b' serving as the signal wiring of the film wiring board material 12, and the conductive foil serving as the signal wiring of the printed wiring board material 10. 10b 'and a portion of the film wiring board material 12 contacting the conductive foil 12b', the insulating portion 13
The film wiring board material 12 in which the conductive foil 12b or the conductive foil 12b 'serving as the signal wiring is formed on at least one surface of the film board 12a is laminated via the metal board material 13 provided with b, and heated and pressed. It is a hollow multilayer printed wiring board characterized in that it is adhesively bonded in multiple layers by.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a hollow multilayer printed circuit board according to the present invention will be described in detail below with reference to the drawings.

As shown in the cross-sectional view of FIG. 1 and the perspective view of FIG. 2 before adhesively bonding to the multilayer, the invention according to claim 1 has a conductive foil 1 on at least one surface of the insulating substrate 10a.
0b or a printed wiring board material 10 on which a conductive foil 10b 'to be a signal wiring is formed, an insulating adhesive layer 11 having a hollow portion 11a which exerts an adhesive function by heating and pressing is laminated. On top of the film substrate 12a, such as a polyimide film substrate, on at least one surface of which a conductive foil 12b or a conductive foil 12 serving as signal wiring is formed.
Laminating the film wiring board materials 12 having b'formed,
An insulating adhesive layer 11 similar to the above is laminated on the film wiring board material 12, a printed wiring board material 10 similar to the above is laminated on the insulating adhesive layer 11, and the whole thus laminated is heated. A hollow multilayer printed wiring board is manufactured by applying pressure.

By using such a hollow multilayer printed wiring board, that is, by forming the hollow portion 11a in the insulating adhesive layer 11, the dielectric constant of the insulating adhesive layer itself is εr = 3.5 to 4.8. On the other hand, since the dielectric constant of the hollow part (atmosphere) is εr = 1.0, if the value of the characteristic impedance of the multilayer printed wiring board is the same, the thickness of the insulating adhesive layer becomes low when the dielectric constant is low. Because it can be made thin,
Compared with the current multilayer printed wiring board, the multilayer printed wiring board of the present invention can be made thinner by several tens of percent. Furthermore, by stacking the film wiring board material 12 between the printed wiring board materials 10 with the insulating adhesive layer 11 having the hollow portion 11a interposed therebetween, the multilayer printed wiring board can be made thinner.

The insulating adhesive layer 1 having the hollow portion 11a
1 and a conductive foil 10b 'which is laminated on both sides of the printed wiring board material 10 and serves as signal wiring, and a conductive foil 12 which is formed on the film wiring board material 12 and serves as signal wiring.
b ', or the conductive foil to be the power supply wiring formed on the printed wiring board material 10 and the film wiring board material 1
Between the conductive foil 12b ', which will be the signal wiring formed in 2,
Alternatively, the capacitance between the conductive foil, which is the ground wiring formed on the printed wiring board material 10, and the conductive foil 12b ′, which is the signal wiring formed on the film wiring board material 12, becomes small, and the signal wiring There is no problem that the signal flowing through the conductive foil is delayed and it is impossible to cope with high-speed processing of the signal and improvement of the frequency characteristic of the signal. That is,
Supports high-speed transmission of electrical signals between electronic parts, and
It is possible to provide a thin and miniaturized high-performance hollow multilayer printed wiring board that can meet the demand for higher packaging density of electronic components.

The invention according to claim 2 is that, as shown in FIG. 3, a conductive foil 11b which can be connected to a ground conductive foil is formed on the inner peripheral wall of the hollow portion 11a of the insulating adhesive layer 11. It is a hollow multi-layer printed wiring board featuring. The invention according to claim 3 is, as shown in FIG. 3, a conductive foil 10b 'and a film wiring board material 12 of the insulating adhesive layer 11 which will be the signal wiring of the printed wiring board material 10.
The hollow portion 11a is formed in a portion surrounding the conductive foil 12b 'serving as the signal wiring, and the conductive foil 11b that can be connected to the ground conductive foil is formed on the inner peripheral wall of the hollow portion 11a. It is a hollow multilayer printed wiring board.

By using such a hollow multilayer printed wiring board, a conductive foil 1 which can be connected to the ground conductive foil 1
A conductive foil 10b 'and a film wiring board material 12 which are surrounded by 1b and serve as signal wiring of the printed wiring board material 10
The conductive foil 12b 'serving as the signal wiring of the
Since it is shielded by the conductive foil 11b formed on the inner peripheral wall of
It is possible to prevent noise from entering the conductive foils 10b 'and 12b' serving as the signal wiring from the outside and radiating signals from the conductive foils 10b 'and 12b' serving as the signal wiring to the outside.

The insulating substrate 10a of the printed wiring board material 10 may be Teflon (registered trademark), ceramic, BT resin, glass polyimide, polyimide, or glass epoxy resin material.

Further, the printed wiring board material 10 is
Conductive foil such as signal wiring (conductive foil serving as signal wiring), power supply wiring (conductive foil serving as power supply wiring), and ground conductive portion (conductive foil serving as ground wiring) on the conductive foil 10b of the insulating substrate 10a by a printed wiring technique. Are formed. Also,
The outermost surface layer of the hollow multi-layer printed wiring board is provided with a signal wire, a ground wire, a conductive foil to be a power wire, and the like.

In the insulating adhesive layer 11, a hollow portion 11a is formed on the insulating substrate by cutting with a cutting machine or punching with a press machine, and the upper and lower surfaces thereof are coated with an insulating epoxy film adhesive. Things. In addition, the insulating adhesive layer 11 may be formed by forming a hollow portion 11a on a prepreg substrate that exhibits an adhesive function by heating by cutting with a cutting machine or punching with a press machine.

The invention according to claim 4 is the insulating substrate 1
A printed wiring in which a conductive foil 10b or a conductive foil 10b 'to be a signal wiring is formed on at least one surface of the surface 0a, and an insulating film (not shown) is formed on the surface of the conductive foil 10b' to be a signal wiring. An adhesive that exerts an adhesive function by applying heat and pressure is applied onto the substrate material 10, and the conductive foil 10b 'which becomes the signal wiring of the printed wiring board material 10 and the conductive foil which becomes the signal wiring of the film wiring board material 12 are applied. A metal substrate material 13 having a hollow portion 13a formed in a portion surrounding 12b 'is laminated, and a conductive foil 12b is formed on the metal substrate material 13 on at least one surface of a film substrate 12a such as a polyimide film substrate.
Alternatively, a film wiring board material 12 is formed in which a conductive foil 12b 'to be a signal wiring is formed and an insulating film (not shown) is formed on the surface of the conductive foil 12b' to be a signal wiring. On the substrate material 12,
The same metal substrate material 13 as described above is laminated, the same printed wiring board material 10 as described above is laminated on this metal substrate material 13, and the whole thus laminated is heated and pressed to produce a hollow multilayer printed wiring board. To do.

The invention according to claim 5 is, as shown in FIG. 4, a printed wiring board material 10 in which a conductive foil 10b or a conductive foil 10b 'to be a signal wiring is formed on at least one surface of an insulating substrate 10a. A conductive foil 10b 'serving as a signal wiring of the printed wiring board material 10 and a conductive foil 12b serving as a signal wiring of a film wiring board material 12 which will be described later are coated with an adhesive that exerts an adhesive function by heating and pressing. A conductive foil 1 which has a hollow portion 13a formed in a portion surrounding the ′ and serves as a signal wiring of the printed wiring board material 10.
0b 'and conductive foil 12 of film wiring board material 12
A metal substrate material 13 provided with an insulating portion 13b is laminated on a portion in contact with b ', and a film substrate 12a such as a polyimide film substrate is laminated on the metal substrate material 13.
A film wiring board material 12 in which a conductive foil 12b or a conductive foil 12b 'which becomes a signal wiring is formed on at least one surface of the is laminated, and a metal board material 13 similar to the above is laminated on the film wiring board material 12. Then, on the metal substrate material 13, the same printed wiring board material 1 as described above is provided.
0 is laminated, and the whole thus laminated is heated and pressed to produce a hollow multilayer printed circuit board.

By using such a hollow multi-layered printed wiring board, the conductive foil 10b 'which becomes the signal wiring of the printed wiring board material 10 and the conductive foil 12b' which becomes the signal wiring of the film wiring board material 12 become the metal board. Material 1
Since it is surrounded and shielded by the hollow portion 13a of No. 3, noise is introduced into the conductive foils 10b 'and 12b' serving as the signal wiring from the outside, and a signal is radiated outside from the conductive foil serving as the signal wiring. There is no such thing.

Next, the printed wiring board material 10, the insulating adhesive layer 11, the film wiring board material 12, the insulating adhesive layer 11 and the printed wiring board material 10 are alternately stacked, and the printed wiring board material 10 and Metal board material 13, film wiring board material 12 and metal board material 13
An example will be described in which a plurality of printed wiring board materials 10 and a printed wiring board material 10 are alternately stacked and adhesively bonded in multiple layers.

As described above, the products alternately stacked are set between the heating plates of a thermocompression bonding press (not shown), and the temperature of the heating plates is kept at 130 ° C. for 20 to 30 minutes. Heat to 175 ° C. In this case, the temperature rise rate of the hollow multilayer printed wiring board is heated at 3 ° C./minute to maintain the temperature of the hollow multilayer printed wiring board at 160 ° C. or higher. The pressurizing condition during heating of the hollow multilayer printed wiring board is that the initial pressure is 1.0 MPa (10.0 k
Pressurized with gf / cm ² ) for 25 minutes, then 2.5MP
Pressurize to a (25.0 kgf / cm ² ). Pressurized pressure 2.5MPa (25.0kgf / cm at hot plate temperature 175 ° C)
² ) After holding the condition for 50 minutes or more, stop heating only,
After cooling under pressure, the pressure is released after cooling to complete the production of the hollow multilayer printed wiring board.

In order to prevent foaming of the multi-layer bonding adhesive part of the printed wiring board material, the temperature of the heating plate is 130 ° C. ± 5.
After holding for 20 to 30 minutes at ℃, the temperature of the heating plate is 175 ℃
Heat to. At that time, a vacuum is applied at the same time as the initial heating. The vacuum condition at that time was 13.3 KPa (100 Tor).
r), and after about 55 minutes, open to the atmosphere. It should be noted that it is not always necessary to make a vacuum state at the same time as the initial heating.

The printed wiring board material 10 and the film wiring board material 12 are connected to each other by an insulating adhesive layer 1 having a hollow portion 11a.
1 or the metal substrate material 13 having the hollow portion 13a, at the time of high temperature bonding, when the hollow portion 11a,
When the atmospheric pressure in 13a becomes high and high-temperature bonding cannot be performed, an atmospheric pressure adjusting valve or an atmospheric pressure adjusting pipe (both made of an insulating material) capable of adjusting the atmospheric pressure in the hollow portions 11a, 13a is used as the insulating adhesive layer. 11 or the metal substrate material 13. The pressure adjustment of the hollow portions 11a and 13a of the insulating adhesive layer 11 or the metal substrate material 13 can be performed by slitting the insulating adhesive layer 11 or the metal substrate material 13.

In the embodiment of each hollow multilayer printed wiring board described with reference to the drawings, the printed wiring board material 10, the insulating adhesive layer 11, and the film wiring board material 12 are shown in order to make the description easy to understand. , And the metal substrate material 13 are shown to be relatively thick, but it goes without saying that the actual product can be made thinner. Further, the adhesive may be insulative or conductive, and these adhesives may be selectively used when it is desired to insulate both surfaces of both adhesive members adhered via this adhesive or both surfaces of both adhesive members. Depending on when you want to conduct electricity.

[0026]

As described above, according to the first aspect of the present invention, since the hollow portion is formed in the insulating adhesive layer, the dielectric constant thereof can be lowered, and hence the insulating adhesive layer can be thinned. Further, by stacking the film wiring board materials through the insulating adhesive layer, the hollow multilayer printed wiring board can be made thinner. In addition, by laminating the printed wiring board material and the film wiring board material through the insulating adhesive layer forming the hollow portion, the printed wiring board material and the conductive foil to be the signal wiring formed on the film wiring board material are formed. There is no problem that the electrostatic capacitance becomes small, the signal flowing through the conductive foil that becomes each signal wiring is delayed, and it is not possible to cope with the high-speed processing of the signal and the improvement of the frequency characteristic of the signal. That is, a thin and miniaturized high-performance hollow multi-layer printed wiring board that can respond to high-speed transmission of electrical signals between electronic components and can also meet the demand for higher packaging density of electronic components You can

Further, as described above, the inventions according to claims 2 and 3 are characterized in that the conductive foil which can be connected to the ground conductive foil is formed on the inner peripheral wall of the hollow portion of the insulating adhesive layer. , A conductive foil which is a signal wiring of a printed wiring board material and a conductive foil which is a signal wiring of a film wiring board material, which is surrounded by a conductive foil which can be connected to the ground conductive foil, is formed on an inner peripheral wall of the hollow portion. Since it is shielded by the formed conductive foil, noise does not enter the conductive foil serving as the signal wiring from the outside, and no signal is radiated outside from the conductive foil serving as the signal wiring.

Further, as described above, in the inventions according to claims 4 and 5, the conductive foil serving as the signal wiring of the printed wiring board material and the conductive foil serving as the signal wiring of the film wiring board material are the metal. Since it is surrounded and shielded by the hollow portion of the substrate material, it is possible to prevent noise from entering the conductive foil serving as the signal wiring from the outside and radiating a signal from the conductive foil serving as the signal wiring to the outside. .

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a hollow multilayer printed wiring board of the invention according to claim 1.

FIG. 2 is a perspective view of the hollow multilayer printed wiring board of the invention according to claim 1 before being adhesively bonded to multiple layers.

FIG. 3 is a perspective view of the hollow multilayer printed wiring board of the invention according to claim 2 or claim 3 before being adhesively bonded to the multilayer.

FIG. 4 is a perspective view of the hollow multilayer printed wiring board of the invention according to claim 5 before being adhesively bonded to multiple layers.

[Explanation of symbols]

10 Printed wiring board material 10a insulating substrate 10b conductive foil 10b 'Conductive foil for signal wiring 11 Insulating adhesive layer 11a hollow part 11b conductive foil 12 Film wiring board material 12a film substrate 12b conductive foil 12b 'Conductive foil for signal wiring 13 Metal substrate material 13a hollow part 13b insulation part

Claims (5)

[Claims] 1. A conductive foil (10b) or a conductive foil (1) serving as a signal wiring on at least one surface of an insulating substrate (10a).
0b ') is formed between the printed wiring board materials (10), an insulating adhesive layer (11) that exerts an adhesive function by heating and pressing.
The conductive foil (12b) or the conductive foil (12b ') which becomes the signal wiring on at least one surface of the film substrate (12a)
A multilayer printed wiring board in which a film wiring board material (12) on which is formed is adhesively joined in multiple layers by heating and pressing, wherein a hollow portion (11a) is formed in the insulating adhesive layer (11). Hollow multilayer printed wiring board. 2. A hollow portion (11) of the insulating adhesive layer (11).
A conductive foil (11) that can be connected to a ground conductive foil is provided on the inner peripheral wall of a).
The hollow multilayer printed wiring board according to claim 1, wherein b) is formed into a film. 3. A conductive foil (10b '), which becomes the signal wiring of the printed wiring board material (10), of the insulating adhesive layer (11).
Also, a hollow portion (11a) is formed in a portion of the film wiring board material (12) surrounding the conductive foil (12b ') which serves as a signal wiring, and an inner conductive wall of the hollow portion (11a) is connected to a ground conductive foil. The hollow multilayer printed wiring board according to claim 1, wherein the conductive foil (11b) to be obtained is formed into a film. 4. A conductive foil (10b) or a conductive foil (1) which becomes a signal wiring on at least one surface of an insulating substrate (10a).
0b ') is formed, and between the printed wiring board materials (10) on which the insulating film is formed on the surface of the conductive foil (10b') which becomes the signal wiring, an adhesive function is exhibited by applying heat and pressure. The surface of the printed wiring board material (10) is coated with the agent, and the conductive foil (10b ') serving as the signal wiring of the printed wiring board material (10) and the conductive foil (12b') serving as the signal wiring of the film wiring board material (12) are hollow in a portion surrounding them. The metal substrate material (1
3), the conductive foil (12b) or the conductive foil (12b ') which becomes the signal wiring on at least one surface of the film substrate (12a).
And the conductive foil (1
A hollow multi-layer printed wiring board, characterized in that a film wiring board material (12) having an insulating film formed on the surface of (2b ') is laminated and adhesively bonded in multiple layers by heating and pressing. 5. A conductive foil (10b) or a conductive foil (1) which becomes a signal wiring on at least one surface of an insulating substrate (10a).
0b ') is formed on the printed wiring board material (10), and an adhesive that exerts an adhesive function by heating and pressing is applied,
Conductive foil (10b ') serving as signal wiring of the printed wiring board material (10) and film wiring board material (12)
A hollow portion (13a) is formed in a portion surrounding the conductive foil (12b ') which becomes the signal wiring, and the conductive foil (10b') and the film wiring board material (12) which become the signal wiring of the printed wiring board material (10). ), The conductive foil (12b) or the signal is provided on at least one surface of the film substrate (12a) through the metal substrate material (13) provided with the insulating portion (13b) in the portion in contact with the conductive foil (12b '). Conductive foil for wiring (12b ')
A hollow multi-layer printed wiring board, characterized in that the film wiring board material (12) on which the above is formed is laminated and adhesively joined in multiple layers by heating and pressing.