CN101542022A - 电镀装置和方法 - Google Patents
电镀装置和方法 Download PDFInfo
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- CN101542022A CN101542022A CNA2007800439981A CN200780043998A CN101542022A CN 101542022 A CN101542022 A CN 101542022A CN A2007800439981 A CNA2007800439981 A CN A2007800439981A CN 200780043998 A CN200780043998 A CN 200780043998A CN 101542022 A CN101542022 A CN 101542022A
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- basal layer
- negative electrode
- electrolysis
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- 150000003657 tungsten Chemical class 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06124862.1 | 2006-11-28 | ||
| EP06124862 | 2006-11-28 |
Publications (1)
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|---|---|
| CN101542022A true CN101542022A (zh) | 2009-09-23 |
Family
ID=39047993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800439981A Pending CN101542022A (zh) | 2006-11-28 | 2007-11-26 | 电镀装置和方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20090301891A1 (pt) |
| EP (1) | EP2099954A1 (pt) |
| JP (1) | JP2010511103A (pt) |
| KR (1) | KR20090083489A (pt) |
| CN (1) | CN101542022A (pt) |
| BR (1) | BRPI0719665A2 (pt) |
| IL (1) | IL198594A0 (pt) |
| RU (1) | RU2009124293A (pt) |
| TW (1) | TW200829726A (pt) |
| WO (1) | WO2008065069A1 (pt) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102844470A (zh) * | 2010-01-26 | 2012-12-26 | 安美特德国有限公司 | 用于在化学和/或电化学处理系统中输送类板状基板的装置 |
| RU2536345C2 (ru) * | 2010-03-31 | 2014-12-20 | ЗетТиИ Корпорейшн | Устройство и способ конфигурации сигнализации зондирующих опорных сигналов |
| CN106488661A (zh) * | 2015-08-25 | 2017-03-08 | 宣浩卿 | 具有部分加强的移送辊的印刷电路板镀敷装置 |
| CN108430170A (zh) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | 一种电路板基板的制作方法 |
| CN113853523A (zh) * | 2019-03-20 | 2021-12-28 | 科罗拉多大学董事会 | 包括螯合金属的电化学储存装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101970720B (zh) * | 2008-03-13 | 2014-10-15 | 巴斯夫欧洲公司 | 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物 |
| US9700249B2 (en) * | 2008-04-15 | 2017-07-11 | Nonin Medical, Inc. | Non-invasive optical sensor |
| US20110204382A1 (en) * | 2008-05-08 | 2011-08-25 | Base Se | Layered structures comprising silicon carbide layers, a process for their manufacture and their use |
| EP2435346A4 (en) * | 2009-05-26 | 2012-12-12 | Wuxi Suntech Power Co Ltd | TRANSPORT ROLLER FOR THE TRANSPORT OF ARTKELN |
| DE102010042642B4 (de) | 2010-10-19 | 2013-12-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen |
| US20130255858A1 (en) * | 2012-04-03 | 2013-10-03 | Jun-Chung Hsu | Method of manufacturing a laminate circuit board |
| US9970297B2 (en) * | 2014-08-29 | 2018-05-15 | Rolls-Royce Corporation | Composite fan slider with nano-coating |
| KR20160140241A (ko) | 2015-05-29 | 2016-12-07 | 전자부품연구원 | 플라즈마 전해 기반의 시료 코팅 방법 |
| SG11202005062SA (en) | 2016-07-13 | 2020-06-29 | Alligant Scientific Llc | Electrochemical methods, devices and compositions |
| WO2022040334A1 (en) | 2020-08-18 | 2022-02-24 | Enviro Metals, LLC | Metal refinement |
| CN114481244B (zh) * | 2022-02-24 | 2022-08-23 | 广东盈华电子科技有限公司 | 一种电解铜箔耐高温抗氧化的表面处理工艺 |
| DE102022120646A1 (de) | 2022-08-16 | 2024-02-22 | Audi Aktiengesellschaft | Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4019877A (en) * | 1975-10-21 | 1977-04-26 | Westinghouse Electric Corporation | Method for coating of polyimide by electrodeposition |
| EP0437705B1 (de) * | 1989-12-23 | 1994-01-26 | Heraeus Elektrochemie GmbH | Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Ausbringung von Metall in Form eines Bandes aus einer Lösung sowie Verwendung der Vorrichtung |
| ATE125001T1 (de) * | 1991-04-12 | 1995-07-15 | Siemens Ag | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. |
| US5705219A (en) * | 1991-04-22 | 1998-01-06 | Atotech Deutschland Gmbh | Method for coating surfaces with finely particulate materials |
| DE4212567A1 (de) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten |
| US6599412B1 (en) * | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
| DE19633796B4 (de) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten |
| EP1541720A3 (en) * | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
| US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
| DE10043817C2 (de) * | 2000-09-06 | 2002-07-18 | Egon Huebel | Anordnung und Verfahren für elektrochemisch zu behandelndes Gut |
| DE10248965A1 (de) * | 2002-10-15 | 2004-04-29 | Simmerlein, Ewald Wilhelm | Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
| NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
| DE102005033784A1 (de) * | 2005-07-20 | 2007-01-25 | Viktoria Händlmeier | System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial |
| DE102005038449B4 (de) * | 2005-08-03 | 2010-03-25 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren |
| DE102005038450A1 (de) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten |
| US20090101511A1 (en) * | 2006-04-18 | 2009-04-23 | Rene Lochtman | Electroplating device and method |
| CA2647969A1 (en) * | 2006-04-18 | 2007-10-25 | Basf Se | Electroplating device and method |
-
2007
- 2007-10-24 TW TW096139950A patent/TW200829726A/zh unknown
- 2007-11-26 JP JP2009538691A patent/JP2010511103A/ja not_active Withdrawn
- 2007-11-26 RU RU2009124293/02A patent/RU2009124293A/ru not_active Application Discontinuation
- 2007-11-26 US US12/515,289 patent/US20090301891A1/en not_active Abandoned
- 2007-11-26 BR BRPI0719665-2A patent/BRPI0719665A2/pt not_active IP Right Cessation
- 2007-11-26 EP EP07847339A patent/EP2099954A1/de not_active Withdrawn
- 2007-11-26 WO PCT/EP2007/062805 patent/WO2008065069A1/de active Application Filing
- 2007-11-26 KR KR1020097013503A patent/KR20090083489A/ko not_active Application Discontinuation
- 2007-11-26 CN CNA2007800439981A patent/CN101542022A/zh active Pending
-
2009
- 2009-05-06 IL IL198594A patent/IL198594A0/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102844470A (zh) * | 2010-01-26 | 2012-12-26 | 安美特德国有限公司 | 用于在化学和/或电化学处理系统中输送类板状基板的装置 |
| RU2536345C2 (ru) * | 2010-03-31 | 2014-12-20 | ЗетТиИ Корпорейшн | Устройство и способ конфигурации сигнализации зондирующих опорных сигналов |
| CN106488661A (zh) * | 2015-08-25 | 2017-03-08 | 宣浩卿 | 具有部分加强的移送辊的印刷电路板镀敷装置 |
| CN106488661B (zh) * | 2015-08-25 | 2019-03-01 | Lg伊诺特有限公司 | 具有部分加强的移送辊的印刷电路板镀敷装置 |
| CN108430170A (zh) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | 一种电路板基板的制作方法 |
| CN113853523A (zh) * | 2019-03-20 | 2021-12-28 | 科罗拉多大学董事会 | 包括螯合金属的电化学储存装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008065069A1 (de) | 2008-06-05 |
| TW200829726A (en) | 2008-07-16 |
| BRPI0719665A2 (pt) | 2013-12-17 |
| US20090301891A1 (en) | 2009-12-10 |
| JP2010511103A (ja) | 2010-04-08 |
| RU2009124293A (ru) | 2011-01-10 |
| KR20090083489A (ko) | 2009-08-03 |
| IL198594A0 (en) | 2010-02-17 |
| EP2099954A1 (de) | 2009-09-16 |
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