JP2010511103A - 電着塗装方法および装置 - Google Patents

電着塗装方法および装置 Download PDF

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Publication number
JP2010511103A
JP2010511103A JP2009538691A JP2009538691A JP2010511103A JP 2010511103 A JP2010511103 A JP 2010511103A JP 2009538691 A JP2009538691 A JP 2009538691A JP 2009538691 A JP2009538691 A JP 2009538691A JP 2010511103 A JP2010511103 A JP 2010511103A
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JP
Japan
Prior art keywords
roller
base layer
substrate
cathode
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009538691A
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English (en)
Japanese (ja)
Other versions
JP2010511103A5 (pt
Inventor
ロホトマン，レネ
カクツン，ユルゲン
ヴァーグナー，ノルベルト
プフィスター，ユルゲン
ポール，ゲルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of JP2010511103A publication Critical patent/JP2010511103A/ja
Publication of JP2010511103A5 publication Critical patent/JP2010511103A5/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
JP2009538691A 2006-11-28 2007-11-26 電着塗装方法および装置 Withdrawn JP2010511103A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
PCT/EP2007/062805 WO2008065069A1 (de) 2006-11-28 2007-11-26 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (2)

Publication Number Publication Date
JP2010511103A true JP2010511103A (ja) 2010-04-08
JP2010511103A5 JP2010511103A5 (pt) 2011-01-27

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009538691A Withdrawn JP2010511103A (ja) 2006-11-28 2007-11-26 電着塗装方法および装置

Country Status (10)

Country Link
US (1) US20090301891A1 (pt)
EP (1) EP2099954A1 (pt)
JP (1) JP2010511103A (pt)
KR (1) KR20090083489A (pt)
CN (1) CN101542022A (pt)
BR (1) BRPI0719665A2 (pt)
IL (1) IL198594A0 (pt)
RU (1) RU2009124293A (pt)
TW (1) TW200829726A (pt)
WO (1) WO2008065069A1 (pt)

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CN101970720B (zh) * 2008-03-13 2014-10-15 巴斯夫欧洲公司 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
US9700249B2 (en) * 2008-04-15 2017-07-11 Nonin Medical, Inc. Non-invasive optical sensor
US20110204382A1 (en) * 2008-05-08 2011-08-25 Base Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
EP2435346A4 (en) * 2009-05-26 2012-12-12 Wuxi Suntech Power Co Ltd TRANSPORT ROLLER FOR THE TRANSPORT OF ARTKELN
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
CN101827444B (zh) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 一种测量参考信号的信令配置系统及方法
DE102010042642B4 (de) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (ko) 2015-05-29 2016-12-07 전자부품연구원 플라즈마 전해 기반의 시료 코팅 방법
KR101578640B1 (ko) * 2015-08-25 2015-12-17 선호경 부분 강화된 이송롤러를 구비한 pcb 도금장치
SG11202005062SA (en) 2016-07-13 2020-06-29 Alligant Scientific Llc Electrochemical methods, devices and compositions
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
BR112021018713A2 (pt) * 2019-03-20 2022-02-08 Scott Waters Dispositivos eletroquímicos de armazenamento compreendendo metais quelados
WO2022040334A1 (en) 2020-08-18 2022-02-24 Enviro Metals, LLC Metal refinement
CN114481244B (zh) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 一种电解铜箔耐高温抗氧化的表面处理工艺
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
EP0437705B1 (de) * 1989-12-23 1994-01-26 Heraeus Elektrochemie GmbH Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Ausbringung von Metall in Form eines Bandes aus einer Lösung sowie Verwendung der Vorrichtung
ATE125001T1 (de) * 1991-04-12 1995-07-15 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
EP1541720A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (de) * 2000-09-06 2002-07-18 Egon Huebel Anordnung und Verfahren für elektrochemisch zu behandelndes Gut
DE10248965A1 (de) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102005033784A1 (de) * 2005-07-20 2007-01-25 Viktoria Händlmeier System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method
CA2647969A1 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method

Also Published As

Publication number Publication date
WO2008065069A1 (de) 2008-06-05
TW200829726A (en) 2008-07-16
BRPI0719665A2 (pt) 2013-12-17
US20090301891A1 (en) 2009-12-10
RU2009124293A (ru) 2011-01-10
KR20090083489A (ko) 2009-08-03
IL198594A0 (en) 2010-02-17
EP2099954A1 (de) 2009-09-16
CN101542022A (zh) 2009-09-23

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