CN101536204B - 导电聚合物电极 - Google Patents
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Abstract
一种已知的形成有机半导体器件的方法使用将导电聚合物沉积在衬底上来形成电极或导电迹线并随后将电气材料例如,有机半导体施加到这些迹线的顶部。尽管导电聚合物起到将电子非常高效地注入半导体中的注入器的作用,但其不是良好的导体。这对于提供流向或来自半导体的电流,会引起不期望的低效率。更糟糕的是,导电性会随时间而劣变。这对于提供流向或来自半导体的电流,会引起不期望的低效率。更糟糕的是,导电性会随时间而劣变。通过将聚合物(7)印刷到承载在衬底(5)上的导电层(6),发现了此问题的解决方案。在导电聚合物未被聚合物保护的部分被去除的过程中,被印刷的聚合物(7)将起到抗蚀剂的作用。得到的器件受益于导电聚合物(7)良好的电子注入特性并借助下方的导电层(6)而受益于高效的传导。
Description
本发明涉及一种制造电气器件的方法,其中导电聚合物被沉积在衬底上以形成电极或导电迹线,以及电气材料,例如有机半导体,施加在这些迹线的顶部。
以这种方式制造的有机半导体器件是已知的,在专利说明WO01/20691中描述了这样的一个实例。在这种器件中,形成电极的导电聚合物起注入器的作用,将电子非常高效地注入半导体中。然而可惜的是,导电聚合物不是非常好的导电体。这对于提供流向或来自半导体的电流,会引起不期望的低效率。更糟糕的是,导电性会随时间而劣变。
本发明的目的在于克服上述的问题。
发明提供了一种制造电气器件的方法,其中导电聚合物施加在衬底上形成电极或导电迹线,所述方法的特征在于衬底承载导电层,在该导电层上印刷聚合物,以及特征在于在导电层未被聚合物保护的部分被去除的过程中,被印刷的聚合物将起到抗蚀剂的作用。
通过使用本发明,借助下方可以是金属的导电层,使在提供高效的电流传导的同时,受益于导电聚合物良好的电子注入特性成为了可能。另外,因为导电聚合物被用作为抗蚀剂,所以自动地实现了聚合物的图案和下方导体的精确的配准。
上述的电气材料优选为在例如二极管、发光二极管或晶体管中的半导体材料。然而,发明也可用在其他领域,例如伏打电池或电池(voltaic cellsor batteries)、太阳能电池、电致变色显示器和不同形式的传感器领域。
导电聚合物优选为聚(3,4-取代噻吩)盐,且可通过混合聚乙撑二氧噻吩(PEDOT)与聚苯乙烯磺酸盐而制得。
下方的导电层优选为金属。特别适合的金属为铝,因其具有高导电性并可廉价地由气相沉积在薄的合成塑料片上。然而,其他的金属,例如金是合适的,且对于一些用途来说,其较高的价格是可以接受的。金属的表面可受益于例如通过电晕放电的处理以提高其对导电聚合物的附着性。
对通常为金属的导电层的不需要的部分的去除优选地通过化学蚀刻来实现。对于一些金属,特别是铝,最好使用碱,例如氢氧化钠溶液来进行此去除的过程。这可能对导电聚合物的性质有不利影响,因此有可能需要通过施加酸来“刷新”聚合物。
聚合物的图案优选地通过印刷工艺,例如柔性版印刷来形成,在印刷工艺中施加聚合物的溶液以便只附着在选定的区域。这样印刷可以既快速又经济,并且不浪费材料。
现将参考附图,通过举例的方式来描述使用本发明的一种方式,所述附图是非常简要的图示,显示了使用根据本发明的工艺的半导体器件的制造。
参考附图,图中显示了一种柔性版印刷装置,其包括主辊1,聚合物层1A绕所述主辊缠绕,如浮雕般限定成品中电极的需要的图案的图像。此图像使用柔性版印刷领域中公知的方法形成。主辊与托辊(idler roller)2和网纹辊(anilox roller)3配合,网纹辊3用来给辊1施加测定量的溶液4。
溶液4是由聚乙撑二氧噻吩和聚苯乙烯磺酸盐的混合物组成的PEDOT PSS的水溶液。其按商品名称BAYTRON和HCSTARK可容易地买到(BAYTRON是拜尔公司(Bayer Aktiengesellschaft)的注册商标)。
薄的薄板(web)5(其厚度在附图中被非常夸大地显示)由廉价的合成塑料材料形成,承载气相沉积的铝层6。此金属层约30到40nm厚且具有平滑的表面,该表面已通过电晕放电处理以帮助附着PEDOT。金属化的薄板被输送通过在辊1和2之间形成的辊隙,使溶液的图案印刷到铝6上。在溶剂(在此情况下为水)蒸发后,薄板浸没在氢氧化钠的水溶液中。PEDOT图案起抗蚀剂的作用,允许氢氧化钠在未受其保护的区域蚀刻掉铝。结果产生如在图1的A处显示的电极的图案,各电极具有PEDOT上层7和金属下层8。
上述电极一般可具有2到50微米的迹线宽度,以及具有5到20微米的间隔。尽管只示出了一对这样的电极,这些电极被用于形成晶体管的源极和漏极电极,但应认识到薄板会形成有极大数目的这样的形成物,并且这些形成物可以相似也可不同。取决于产品的用途,这些形成物可以是电气分离的或可被电气连接而形成复杂电路。
参考附图上的位置C,印刷有机半导体的溶液以便在每对电极的光滑的表面的顶部以及电极之间的沟槽中形成约100nm厚的挡区(stack)9。此印刷操作是在低于100℃的低温下进行的,而这对下方的薄板5是无害的。在施加半导体材料后,施加约500nm厚的电介质层10以及最后施加导电栅极11,形成制成的晶体管。
Claims (14)
1.一种制造电气器件的方法,其中导电聚合物被施加在衬底上以形成电极或导电迹线,以及电气材料被施加在顶部,所述方法的特征在于所述衬底承载导电层,在所述导电层上印刷所述聚合物,以及特征在于在所述导电层未被所述聚合物保护的部分被去除的过程中,被印刷的所述聚合物将被用作为抗蚀剂。
2.如权利要求1所述的方法,其特征在于所述电气材料是半导体材料。
3.如权利要求2所述的方法,其特征在于所述电气器件是二极管或晶体管。
4.如权利要求3所述的方法,其特征在于所述二极管是发光二极管。
5.如权利要求1所述的方法,其特征在于所述电气器件是电池。
6.如权利要求5所述的方法,其特征在于所述电池是伏打电池。
7.如权利要求1所述的方法,其特征在于所述电气器件是太阳能电池。
8.如权利要求1所述的方法,其特征在于所述电气器件是电致变色显示器。
9.如权利要求1所述的方法,其特征在于所述电气器件是传感器。
10.如任一前述权利要求所述的方法,其特征在于所述导电层是金属。
11.如权利要求10所述的方法,其特征在于处理所述金属的表面以便提高与所述导电聚合物的附着性。
12.如权利要求1-9中任一项所述的方法,其特征在于使用碱性蚀刻剂去除所述导电层的所述部分,以及特征在于随后用酸处理所述导电聚合物以消除碱对所述导电聚合物的性质的任何不利影响。
13.如权利要求10所述的方法,其特征在于使用碱性蚀刻剂去除所述导电层的所述部分,以及特征在于随后用酸处理所述导电聚合物以消除碱对所述导电聚合物的性质的任何不利影响。
14.如权利要求11所述的方法,其特征在于使用碱性蚀刻剂去除所述导电层的所述部分,以及特征在于随后用酸处理所述导电聚合物以消除碱对所述导电聚合物的性质的任何不利影响。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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GB0607208.6 | 2006-04-11 | ||
GB0607208A GB2437329B (en) | 2006-04-11 | 2006-04-11 | Conductive polymer electrodes |
PCT/GB2007/001341 WO2007129001A1 (en) | 2006-04-11 | 2007-04-11 | Conductive polymer electrodes |
Publications (2)
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CN101536204A CN101536204A (zh) | 2009-09-16 |
CN101536204B true CN101536204B (zh) | 2011-03-09 |
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CN2007800131684A Expired - Fee Related CN101536204B (zh) | 2006-04-11 | 2007-04-11 | 导电聚合物电极 |
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US (1) | US8685260B2 (zh) |
EP (1) | EP2011174B1 (zh) |
CN (1) | CN101536204B (zh) |
AT (1) | ATE515805T1 (zh) |
GB (1) | GB2437329B (zh) |
WO (1) | WO2007129001A1 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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GB2437112B (en) * | 2006-04-11 | 2011-04-13 | Nicholas Jim Stone | A method of making an electrical device |
GB2480875B (en) * | 2010-06-04 | 2014-09-03 | Plastic Logic Ltd | Production of electronic switching devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1638155A1 (de) * | 2004-09-21 | 2006-03-22 | Samsung SDI Germany GmbH | Verbesserung der Leitfähigkeit einer Polymerelektrode durch Aufbringen einer darunterliegenden Metallschicht |
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JPS60211995A (ja) * | 1984-04-06 | 1985-10-24 | ダイセル化学工業株式会社 | 電極パタ−ン形成法 |
DE8909771U1 (de) * | 1989-08-14 | 1990-12-13 | Gerhard GmbH, 57586 Weitefeld | Wechseltank |
US6331356B1 (en) * | 1989-05-26 | 2001-12-18 | International Business Machines Corporation | Patterns of electrically conducting polymers and their application as electrodes or electrical contacts |
JP2976454B2 (ja) * | 1989-09-27 | 1999-11-10 | 凸版印刷株式会社 | 印刷方法 |
US5196376A (en) * | 1991-03-01 | 1993-03-23 | Polycon Corporation | Laser lithography for integrated circuit and integrated circuit interconnect manufacture |
CN1072737C (zh) * | 1995-10-17 | 2001-10-10 | 佳能株式会社 | 刻蚀方法 |
CA2394645A1 (en) * | 1999-06-11 | 2000-12-21 | Sydney Hyman | Image making medium |
DE60033012T2 (de) | 1999-09-10 | 2007-09-13 | Koninklijke Philips Electronics N.V. | Leitende struktur basierend auf poly-3,4-alkendioxythiophen (pedot) und polystyrolsulfonsäure (pss) |
EP1209253A3 (en) * | 2000-11-28 | 2004-02-25 | Shipley Co. L.L.C. | Process for treating adhesion promoted metal surfaces with epoxy resins |
US6596183B2 (en) * | 2001-05-11 | 2003-07-22 | Teng-Kuei Chen | Cutting-free method for making a hologram sticker and the structure of the sticker |
JP4294489B2 (ja) * | 2002-02-05 | 2009-07-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 感光性組成物 |
US20030151028A1 (en) * | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
US6866799B2 (en) * | 2002-05-09 | 2005-03-15 | Anuvu, Inc. | Water-soluble electrically conductive composition, modifications, and applications thereof |
EP1383179A2 (en) | 2002-07-17 | 2004-01-21 | Pioneer Corporation | Organic semiconductor device |
KR100950133B1 (ko) * | 2002-12-27 | 2010-03-30 | 엘지디스플레이 주식회사 | 인쇄방식에 의한 패턴형성방법 |
KR100909422B1 (ko) * | 2002-12-31 | 2009-07-24 | 엘지디스플레이 주식회사 | 액정표시소자의 패턴 및 그 형성방법 |
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KR101032338B1 (ko) * | 2003-02-06 | 2011-05-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치의 제작방법 |
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DE102004008784B3 (de) * | 2004-02-23 | 2005-09-15 | Infineon Technologies Ag | Verfahren zur Durchkontaktierung von Feldeffekttransistoren mit einer selbstorganisierten Monolage einer organischen Verbindung als Gatedielektrikum |
DE102004031719A1 (de) * | 2004-06-30 | 2006-01-19 | Infineon Technologies Ag | Verfahren zum Herstellen einer elektrisch funktionellen Schichtstruktur |
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GB2437112B (en) * | 2006-04-11 | 2011-04-13 | Nicholas Jim Stone | A method of making an electrical device |
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2006
- 2006-04-11 GB GB0607208A patent/GB2437329B/en not_active Expired - Fee Related
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2007
- 2007-04-11 EP EP07732384A patent/EP2011174B1/en not_active Not-in-force
- 2007-04-11 US US12/296,803 patent/US8685260B2/en not_active Expired - Fee Related
- 2007-04-11 CN CN2007800131684A patent/CN101536204B/zh not_active Expired - Fee Related
- 2007-04-11 AT AT07732384T patent/ATE515805T1/de not_active IP Right Cessation
- 2007-04-11 WO PCT/GB2007/001341 patent/WO2007129001A1/en active Application Filing
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EP1638155A1 (de) * | 2004-09-21 | 2006-03-22 | Samsung SDI Germany GmbH | Verbesserung der Leitfähigkeit einer Polymerelektrode durch Aufbringen einer darunterliegenden Metallschicht |
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EP2011174A1 (en) | 2009-01-07 |
GB2437329B (en) | 2011-03-09 |
US20090124090A1 (en) | 2009-05-14 |
US8685260B2 (en) | 2014-04-01 |
EP2011174B1 (en) | 2011-07-06 |
WO2007129001A1 (en) | 2007-11-15 |
CN101536204A (zh) | 2009-09-16 |
ATE515805T1 (de) | 2011-07-15 |
GB2437329A (en) | 2007-10-24 |
GB0607208D0 (en) | 2006-05-17 |
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