CN101522844A - 特别用于电子元件和导线通道的结合的可热活化胶带 - Google Patents

特别用于电子元件和导线通道的结合的可热活化胶带 Download PDF

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Publication number
CN101522844A
CN101522844A CNA2007800374281A CN200780037428A CN101522844A CN 101522844 A CN101522844 A CN 101522844A CN A2007800374281 A CNA2007800374281 A CN A2007800374281A CN 200780037428 A CN200780037428 A CN 200780037428A CN 101522844 A CN101522844 A CN 101522844A
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CN
China
Prior art keywords
heat
adhesive tape
activatable adhesive
tape according
modified
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Pending
Application number
CNA2007800374281A
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English (en)
Chinese (zh)
Inventor
索斯滕·克拉温克尔
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Tesa SE
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Tesa SE
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Publication of CN101522844A publication Critical patent/CN101522844A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C08J5/128—Adhesives without diluent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Traffic Control Systems (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CNA2007800374281A 2006-10-06 2007-09-24 特别用于电子元件和导线通道的结合的可热活化胶带 Pending CN101522844A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006047738.3 2006-10-06
DE102006047738A DE102006047738A1 (de) 2006-10-06 2006-10-06 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen

Publications (1)

Publication Number Publication Date
CN101522844A true CN101522844A (zh) 2009-09-02

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Application Number Title Priority Date Filing Date
CNA2007800374281A Pending CN101522844A (zh) 2006-10-06 2007-09-24 特别用于电子元件和导线通道的结合的可热活化胶带

Country Status (9)

Country Link
US (1) US9273231B2 (https=)
EP (1) EP2079815B1 (https=)
JP (1) JP2010505978A (https=)
KR (1) KR101496787B1 (https=)
CN (1) CN101522844A (https=)
AT (1) ATE481459T1 (https=)
DE (2) DE102006047738A1 (https=)
TW (1) TWI453266B (https=)
WO (1) WO2008043660A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103348465A (zh) * 2010-11-12 2013-10-09 德莎欧洲公司 封装电子装置的粘合剂和方法
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8851356B1 (en) * 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
DE102008032568A1 (de) * 2008-07-11 2010-01-14 Tesa Se Verwendung einer Klebfolie mit einer einseitig mit einer Klebmasse ausgerüsteten Trägerfolie zur Abdeckung von Mikrotiterplatten
DE102008061840A1 (de) 2008-12-15 2010-06-17 Tesa Se Haftklebemasse
DE102008062130A1 (de) * 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036970A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
US10207261B2 (en) 2009-09-15 2019-02-19 Basf Se Photo-latent titanium catalysts
BR112012005909A2 (pt) 2009-09-15 2020-08-25 Basf Se compostos do catalisador de quelato de ti, formulação de catalisador de quelato de ti, uso do composto de catalisador de quelato de ti, ou da formulação de catalisador de quelato de ti, composição polimerizável, processo para a polimerização de compostos, uso da composição polimerizável, substrato revestido, e, composição polimerizada ou reticulada
JP5742346B2 (ja) * 2010-03-25 2015-07-01 ヤマハ株式会社 エポキシ樹脂系接着剤用硬化剤組成物および多孔質体用接着剤
DE102010043866A1 (de) * 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
RU2610090C9 (ru) 2011-04-05 2018-04-26 Басф Се Фотолатентные катализаторы на основе титан-оксо-хелатов
DE102011085354A1 (de) * 2011-10-27 2013-05-02 Tesa Se Haftklebmasse mit erhöhter Temperaturstabilität und Verwendung derselben für ein Klebeband
DE102012206265A1 (de) 2012-04-17 2013-10-17 Tesa Se Temperaturstabile vernetzbare Klebemasse mit Hart- und Weichblöcken
DE102012206273A1 (de) 2012-04-17 2013-10-17 Tesa Se Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere
JP2014040498A (ja) * 2012-08-21 2014-03-06 Panac Co Ltd 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法
JP6018461B2 (ja) * 2012-08-21 2016-11-02 パナック株式会社 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法、及び自己粘着性熱可塑性エラストマー組成物
KR101797723B1 (ko) * 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769254A (en) * 1971-08-27 1973-10-30 Nat Starch Chem Corp High strength pressure-sensitive adhesives
US3970608A (en) * 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
US4005247A (en) * 1975-10-30 1977-01-25 Ashland Oil, Inc. Pressure sensitive adhesive compositions
JPS57149369A (en) 1981-03-11 1982-09-14 Asahi Chem Ind Co Ltd Novel adhesive
US5349015A (en) * 1989-12-08 1994-09-20 Shell Oil Company Melt blending acid or anhydride-crafted block copolymer pellets with epoxy resin
DE60121965T2 (de) * 2000-06-01 2006-11-30 Kraton Polymers Research B.V. Funktionalisierte blockcopolymere enthaltende zusammensetzungen, die mit aluminiumacetylacetonaten vernetzt sind
DE10036802A1 (de) * 2000-07-28 2002-02-07 Tesa Ag Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(A)-P(B)-P(A)
US6353066B1 (en) * 2001-02-09 2002-03-05 Fina Technology, Inc. Method for producing copolymers in the presence of a chain transfer agent
US20040161564A1 (en) * 2003-02-14 2004-08-19 Truog Keith L. Dry paint transfer laminate
CA2516026A1 (en) 2003-02-14 2004-09-02 Avery Dennison Corporation Extrusion method of making a dry paint transfer laminate
DE102004007258A1 (de) 2003-12-22 2005-07-28 Tesa Ag Chemisch vernetzbare, durch Zug in Richtung der Verklebungsebene lösbare Klebestreifen
DE10361540A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Chemisch vernetzbare, durch Zug in Richtung der Verklebungsebene lösbare Klebestreifen
DE102004031188A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102004031189A1 (de) 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102004031190A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
KR101303246B1 (ko) 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
DE102005055769A1 (de) * 2005-11-21 2007-05-24 Tesa Ag Verfahren zur temporären Fixierung eines polymeren Schichtmaterials auf rauen Oberflächen
JP5085145B2 (ja) * 2006-03-15 2012-11-28 日東電工株式会社 両面粘着テープ又はシート、および液晶表示装置
DE102006023936A1 (de) * 2006-05-19 2007-11-22 Tesa Ag Maskierung von Fensterflanschen mit einem Klebeband mit einer Selbstklebemasse auf Basis vernetzter Vinylaromatenblockcopolymere

Cited By (3)

* Cited by examiner, † Cited by third party
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CN103348465A (zh) * 2010-11-12 2013-10-09 德莎欧洲公司 封装电子装置的粘合剂和方法
CN103348465B (zh) * 2010-11-12 2017-02-08 德莎欧洲公司 封装电子装置的粘合剂和方法
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片

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KR20090088873A (ko) 2009-08-20
WO2008043660A1 (de) 2008-04-17
EP2079815B1 (de) 2010-09-15
TWI453266B (zh) 2014-09-21
JP2010505978A (ja) 2010-02-25
DE502007005081D1 (de) 2010-10-28
ATE481459T1 (de) 2010-10-15
TW200817489A (en) 2008-04-16
DE102006047738A1 (de) 2008-04-10
US20100012271A1 (en) 2010-01-21
KR101496787B1 (ko) 2015-02-27
EP2079815A1 (de) 2009-07-22

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