CN101490204B - 用于提高氧化物移除速率的镓与铬离子 - Google Patents

用于提高氧化物移除速率的镓与铬离子 Download PDF

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Publication number
CN101490204B
CN101490204B CN2007800272644A CN200780027264A CN101490204B CN 101490204 B CN101490204 B CN 101490204B CN 2007800272644 A CN2007800272644 A CN 2007800272644A CN 200780027264 A CN200780027264 A CN 200780027264A CN 101490204 B CN101490204 B CN 101490204B
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CN
China
Prior art keywords
polishing composition
substrate
polishing
chromium
iii
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800272644A
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English (en)
Chinese (zh)
Other versions
CN101490204A (zh
Inventor
斯蒂芬·格鲁姆比尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
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Publication date
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Publication of CN101490204A publication Critical patent/CN101490204A/zh
Application granted granted Critical
Publication of CN101490204B publication Critical patent/CN101490204B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2007800272644A 2006-07-21 2007-07-10 用于提高氧化物移除速率的镓与铬离子 Expired - Fee Related CN101490204B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/491,055 2006-07-21
US11/491,055 US7501346B2 (en) 2006-07-21 2006-07-21 Gallium and chromium ions for oxide rate enhancement
PCT/US2007/015714 WO2008013668A1 (en) 2006-07-21 2007-07-10 Gallium and chromium ions for oxide removal rate enhancement

Publications (2)

Publication Number Publication Date
CN101490204A CN101490204A (zh) 2009-07-22
CN101490204B true CN101490204B (zh) 2012-12-26

Family

ID=38971976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800272644A Expired - Fee Related CN101490204B (zh) 2006-07-21 2007-07-10 用于提高氧化物移除速率的镓与铬离子

Country Status (9)

Country Link
US (1) US7501346B2 (https=)
EP (1) EP2069451B1 (https=)
JP (1) JP5357021B2 (https=)
KR (1) KR101265384B1 (https=)
CN (1) CN101490204B (https=)
IL (1) IL196221A (https=)
MY (1) MY145618A (https=)
TW (1) TWI393771B (https=)
WO (1) WO2008013668A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5364959B2 (ja) * 2009-03-27 2013-12-11 国立大学法人大阪大学 研磨方法及び研磨装置
CN104371551B (zh) * 2013-08-14 2018-01-12 安集微电子（上海）有限公司 一种碱性阻挡层化学机械抛光液
CN115851134B (zh) * 2022-10-27 2024-09-10 万华化学集团电子材料有限公司 一种高精度硅片抛光组合物及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114437A (en) * 1990-08-28 1992-05-19 Sumitomo Chemical Co., Ltd. Polishing composition for metallic material
CN1407050A (zh) * 2001-08-09 2003-04-02 不二见株式会社 研磨用组合物及用它的研磨方法

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US5230833A (en) 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
JPH0781132B2 (ja) * 1990-08-29 1995-08-30 株式会社フジミインコーポレーテッド 研磨剤組成物
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
TW455626B (en) * 1998-07-23 2001-09-21 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
FR2792643B1 (fr) * 1999-04-22 2001-07-27 Clariant France Sa Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique
US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US20020039839A1 (en) * 1999-12-14 2002-04-04 Thomas Terence M. Polishing compositions for noble metals
JP2001187876A (ja) 1999-12-28 2001-07-10 Nec Corp 化学的機械的研磨用スラリー
WO2001060940A1 (en) * 2000-02-16 2001-08-23 Rodel Inc Biocides for polishing slurries
JP2001269859A (ja) * 2000-03-27 2001-10-02 Jsr Corp 化学機械研磨用水系分散体
US6936541B2 (en) * 2000-09-20 2005-08-30 Rohn And Haas Electronic Materials Cmp Holdings, Inc. Method for planarizing metal interconnects
JP2003142435A (ja) 2001-10-31 2003-05-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP4083528B2 (ja) 2002-10-01 2008-04-30 株式会社フジミインコーポレーテッド 研磨用組成物
JP2004327952A (ja) * 2003-03-03 2004-11-18 Fujimi Inc 研磨用組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114437A (en) * 1990-08-28 1992-05-19 Sumitomo Chemical Co., Ltd. Polishing composition for metallic material
CN1407050A (zh) * 2001-08-09 2003-04-02 不二见株式会社 研磨用组合物及用它的研磨方法

Also Published As

Publication number Publication date
JP2009545134A (ja) 2009-12-17
JP5357021B2 (ja) 2013-12-04
EP2069451B1 (en) 2015-06-24
EP2069451A4 (en) 2011-04-27
CN101490204A (zh) 2009-07-22
IL196221A (en) 2011-12-29
KR101265384B1 (ko) 2013-05-20
EP2069451A1 (en) 2009-06-17
US20080020577A1 (en) 2008-01-24
TW200808947A (en) 2008-02-16
MY145618A (en) 2012-03-15
WO2008013668A1 (en) 2008-01-31
KR20090030316A (ko) 2009-03-24
US7501346B2 (en) 2009-03-10
IL196221A0 (en) 2009-09-22
TWI393771B (zh) 2013-04-21

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CF01 Termination of patent right due to non-payment of annual fee